Wafer cleaning machine

Abstract

The utility model discloses a wafer cleaning machine, which relates to the technical field of wafer cleaning and comprises a cleaning shell, a mechanical shaft on one side of the cleaning shell is connected with a control display screen, a cleaning mechanism is arranged in the cleaning shell, and the cleaning mechanism adjusts the angle of equipment for cleaning according to the diameter of a wafer. According to the wafer cleaning device, the cleaning device is arranged in the cleaning shell, so that multi-angle cleaning of wafers with different diameters is achieved, the wafer cleaning strength is improved, a sealing mechanism is arranged on the outer side of the cleaning shell, the opening size of the sealing mechanism is adjusted according to the wafer cleaning requirement, and then the wafers are taken conveniently or the interior of the cleaning shell is cleaned conveniently. The side shielding box doors are of two sets of hinge connection structures, when the wafers need to be put in, only one set of the side shielding box doors needs to be opened, the wafers can be conveniently and rapidly taken, and the opening angles of the side shielding box doors are controlled according to the use requirements and the cleaning requirements of the different types of wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning machine. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor integrated circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. The silicon crystal rod is then ground, polished, and sliced ​​to form a silicon wafer.

[0003] There are four common wafer diameter sizes, namely 2 inches (50.8mm), 4 inches (100mm), 6 inches (150mm) and 8 inches (200mm). However, during the operation of the wafer cleaning machine, due to the differences in wafer diameters, the brush has a fixed operating range, which affects the cleanliness of wafers with different diameters during the cleaning process. In addition, when cleaning wafers, the existing wafer cleaning machine has an open structure, which affects the efficiency of wafer cleaning and subsequent drying processing. Summary of the invention

[0004] The purpose of the utility model is to provide a wafer cleaning machine to solve the above-mentioned defects caused by the prior art.

[0005] A wafer cleaning machine comprises a cleaning shell, a mechanical axis on one side of the cleaning shell is connected to a control display screen, a cleaning mechanism is arranged inside the cleaning shell, the cleaning mechanism adjusts the angle of a cleaning device according to the diameter of the wafer, thereby meeting the multi-angle cleaning requirements for wafers of different diameters and facilitating the intensity of wafer cleaning, a closing mechanism is arranged on the outside of the cleaning shell, the opening size of the closing mechanism is adjusted according to the wafer cleaning requirements, thereby facilitating the wafer taking or cleaning the inside of the cleaning shell.

[0006] Preferably, the cleaning mechanism includes a brush roller, a side bracket, a spray pipe, a single-axis stepper motor, a brush frame and a servo motor. The side bracket is installed inside the cleaning shell, and multiple groups of spray pipes are installed below the side bracket. An electric turntable is arranged directly below the spray pipe, and a brush frame is arranged on the other side of the electric turntable. A single-axis stepper motor is connected to one side of the brush frame, and a servo motor is installed on the other side of the brush frame. The output end of the servo motor is connected to the brush roller.

[0007] Preferably, the servo motor is connected to the brush roller via a brush frame arranged on one side.

[0008] Preferably, the closing mechanism includes a side shielding door, a glass panel and a hinge, the top of the cleaning shell is connected to the hinge, the other side of the hinge is connected to the side shielding door, and the outer side of the side shielding door is connected through the glass panel.

[0009] Preferably, an electric turntable is provided inside the cleaning shell.

[0010] Preferably, a negative pressure suction cup is connected through the upper surface of the electric turntable.

[0011] Compared with the prior art, the utility model has the following advantages:

[0012] 1. The side shielding door is a two-group hinge connection structure. When the wafer needs to be put in, only one group of the side shielding doors needs to be opened to facilitate quick wafer retrieval. The opening angle can be controlled according to the usage requirements for different types of wafers and cleaning requirements. When the cleaning shell needs to be cleaned, the entire side shielding door can be pulled to rotate and open the hinge at the connection end of the side shielding door and the cleaning shell, effectively cleaning the interior of the cleaning shell in all directions.

[0013] 2. The brush frame is driven to rotate by a single-axis stepper motor, and the angle of the brush roller is adjusted to adjust the cleaning force. When cleaning wafers of different diameters, the cleaning angle and force of the wafer are adjusted by adjusting the inclination angle of the brush frame and the brush roller to ensure the uniformity of wafer cleaning. The speed of the brush roller is controlled by a servo motor to avoid damage to the wafer due to excessive cleaning force. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model.

[0015] Figure 2 It is a schematic diagram of the side structure of the cleaning shell in the utility model.

[0016] Figure 3 It is a schematic diagram of the internal structure of the cleaning shell in the utility model.

[0017] Figure 4 It is a schematic structural diagram of the brush frame itself in the utility model.

[0018] Figure 5 It is a schematic diagram of the structure of the electric turntable itself in the utility model.

[0019] in:

[0020] 1. Cleaning shell; 2. Cleaning mechanism; 3. Brush roller; 4. Control display screen; 5. Side shielding door; 6. Glass panel; 7. Closing mechanism; 8. Side bracket; 9. Spray pipe fittings; 10. Electric turntable; 11. Hinge; 12. Single-axis stepping motor; 13. Brush frame; 14. Servo motor; 15. Negative pressure suction cup. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] like Figures 1 to 5 As shown, the wafer cleaning machine includes a cleaning shell 1, a mechanical axis on one side of the cleaning shell 1 is connected to a control display screen 4, a cleaning mechanism 2 is arranged inside the cleaning shell 1, the cleaning mechanism 2 adjusts the angle of the cleaning equipment according to the diameter of the wafer, so as to meet the multi-angle cleaning of wafers of different diameters, and facilitates the cleaning force of the wafers, and a closing mechanism 7 is arranged on the outside of the cleaning shell 1, according to the cleaning requirements of the wafer, the opening size of the closing mechanism 7 is adjusted, so as to facilitate the wafer taking or cleaning of the inside of the cleaning shell 1.

[0023] In this embodiment, the cleaning mechanism 2 includes a brush roller 3, a side bracket 8, a spray pipe 9, a single-axis stepper motor 12, a brush frame 13 and a servo motor 14. The side bracket 8 is installed inside the cleaning shell 1, and multiple groups of spray pipes 9 are installed below the side bracket 8. An electric turntable 10 is arranged directly below the spray pipe 9, and a brush frame 13 is arranged on the other side of the electric turntable 10. One side of the brush frame 13 is connected to the single-axis stepper motor 12, and the other side of the brush frame 13 is installed with a servo motor 14. The output end of the servo motor 14 is connected to the brush roller 3, and clean water and cleaning liquid are sprayed respectively through multiple groups of spray pipes 9 to improve the cleaning cleanliness of the wafer.

[0024] In this embodiment, the servo motor 14 is connected to the brush roller 3 via a brush frame 13 provided on one side, and the brush frame 13 is rotated by the servo motor 14 to adjust the angle of the brush frame 13 .

[0025] In this embodiment, the closing mechanism 7 includes a side shielding door 5, a glass panel 6 and a hinge 11. The top of the cleaning shell 1 is connected to the hinge 11, and the other side of the hinge 11 is connected to the side shielding door 5. The outer side of the side shielding door 5 is penetrated by the glass panel 6. By opening the side shielding door 5, one side of the cleaning shell 1 can be opened to different sizes.

[0026] In this embodiment, an electric turntable 10 is disposed inside the cleaning housing 1 , and the cleaning position of the wafer is adjusted by the electric turntable 10 .

[0027] In this embodiment, a negative pressure suction cup 15 is connected through the upper surface of the electric turntable 10, and the wafer is adsorbed by the negative pressure suction cup 15, thereby improving the convenience of fixing wafers with different diameters.

[0028] In actual application, this wafer cleaning machine includes the following work contents:

[0029] Step 1: During use, the operator holds the side shielding door 5 to separate the side shielding door 5 from the cleaning shell 1, places the wafer to be cleaned on the surface of the electric turntable 10, opens the negative pressure suction cup 15, uses the negative pressure suction cup 15 to adsorb the surface of the wafer, then pulls the side shielding door 5 in the opposite direction, rotates the side shielding door 5 on the outside of the hinge 11, shields one side of the cleaning shell 1, and connects the spray pipe 9 provided at the bottom end of the side bracket 8 with the infusion pipe;

[0030] Step 2: The operator first sprays the surface of the wafer through the spray pipe 9, and according to the direction of the wafer, turns on the single-axis stepper motor 12, drives the brush frame 13 to rotate by the single-axis stepper motor 12, switches the angle of the brush frame 13, so that the brush roller 3 contacts the surface of the wafer, and turns on the servo motor 14, drives the brush roller 3 to rotate by the servo motor 14, brushes the surface of the wafer, and at the same time, the cleaning liquid is continuously sprayed on the surface of the wafer for washing;

[0031] Step 3: When cleaning the wafer, the electric turntable 10 is used to rotate the wafer, the cleaning position of the wafer is adjusted, and the brush frame 13 is driven to rotate by the single-axis stepper motor 12, the angle of the brush roller 3 is adjusted, the cleaning force is adjusted, the control display screen 4 mainly displays the pressure and rotation speed, and the rotation angle of the single-axis stepper motor 12 is controlled and adjusted. The operator observes the cleaning condition of the wafer through the glass panel 6.

[0032] Therefore, the embodiments disclosed above are only illustrative in all aspects and are not exclusive. All changes within the scope of the present invention or within the scope equivalent to the present invention are included in the present invention.

Claims

1. Wafer cleaning machine, characterized by: The cleaning shell (1) comprises a cleaning shell (1), a mechanical shaft on one side of the cleaning shell (1) is connected to a control display screen (4), a cleaning mechanism (2) is arranged inside the cleaning shell (1), the cleaning mechanism (2) adjusts the angle of a cleaning device according to the diameter of a wafer, thereby meeting the requirements of multi-angle cleaning of wafers of different diameters, and facilitating adjustment of the intensity of wafer cleaning, a closing mechanism (7) is arranged outside the cleaning shell (1), and the opening size of the closing mechanism (7) is adjusted according to the requirements of wafer cleaning, thereby facilitating wafer removal or cleaning the inside of the cleaning shell (1); The cleaning mechanism (2) comprises a brush roller (3), a side bracket (8), a spray pipe (9), a single-axis stepping motor (12), a brush frame (13) and a servo motor (14); the side bracket (8) is installed inside the cleaning housing (1); a plurality of spray pipes (9) are installed below the side bracket (8); an electric turntable (10) is arranged directly below the spray pipe (9); a brush frame (13) is arranged on the other side of the electric turntable (10); one side of the brush frame (13) is connected to the single-axis stepping motor (12); the other side of the brush frame (13) is installed with a servo motor (14); the output end of the servo motor (14) is connected to the brush roller (3); The closing mechanism (7) comprises a side shielding door (5), a glass panel (6) and a hinge (11); the top end of the cleaning shell (1) is connected to the hinge (11); the other side of the hinge (11) is connected to the side shielding door (5); and the outer side of the side shielding door (5) is connected through the glass panel (6).

2. The wafer cleaning machine according to claim 1, characterized in that: The servo motor (14) is connected to the brush roller (3) via a brush frame (13) arranged on one side.

3. The wafer cleaning machine according to claim 1, characterized in that: An electric turntable (10) is arranged inside the cleaning housing (1).

4. The wafer cleaning machine according to claim 1, characterized in that: A negative pressure suction cup (15) is connected through the upper surface of the electric rotating disk (10).

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