Wafer feeding multi-posture position adjusting mechanism and wafer detection equipment

Abstract

The utility model relates to a wafer feeding multi-posture position adjusting mechanism and wafer detection equipment. The wafer feeding multi-posture position adjusting mechanism comprises a wafer bearing platform, a first driving mechanism and a second driving mechanism, the wafer bearing table is used for bearing a wafer; the first driving mechanism is used for driving the wafer bearing table to rotate around a first axis, the second driving mechanism is used for driving the wafer bearing table to rotate around a second axis, and the first axis is perpendicular to the second axis; and the first driving mechanism is matched with the second driving mechanism, so that the wafer on the wafer bearing table is parallel to the wafer adsorption surface of the manipulator. According to the technical scheme of the utility model, because the first driving mechanism is matched with the second driving mechanism, the wafer on the wafer bearing table can be parallel to the wafer adsorption surface of the manipulator, so that the parallelism between the wafer adsorption surface and the wafer on the wafer bearing table can be improved, and errors caused by part processing and assembling can be eliminated; and the wafer adsorption stability of the manipulator is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a wafer loading multi-posture position adjustment mechanism and wafer detection equipment. Background Art

[0002] Wafer materials are generally single crystal silicon or silicon carbide. Wafers of different specifications are thin and fragile, so high requirements are placed on wafer handling. In the automatic loading mechanism, a vacuum adsorption manipulator is often used to take and place wafers from the wafer carrier. The manipulator has a wafer adsorption surface, and the manipulator adsorbs the wafer through the wafer adsorption surface. In order to improve the stability of the manipulator adsorbing the wafer, high requirements are placed on the parallelism between the wafer adsorption surface of the manipulator and the wafer. Utility Model Content

[0003] In view of this, the utility model provides a wafer loading multi-posture position adjustment mechanism and a wafer detection device. The main technical problem to be solved is: how to improve the parallelism between the wafer adsorption surface and the wafer on the wafer supporting platform, and improve the stability of the robot arm adsorbing the wafer.

[0004] In order to achieve the above purpose, the utility model mainly provides the following technical solutions:

[0005] The embodiment of the utility model provides a wafer loading multi-posture position adjustment mechanism, which comprises: a wafer carrying platform, a first driving mechanism and a second driving mechanism;

[0006] The wafer carrying platform is used to carry the wafer;

[0007] The first driving mechanism is used to drive the wafer carrier to rotate around a first axis, and the second driving mechanism is used to drive the wafer carrier to rotate around a second axis, and the first axis is perpendicular to the second axis; the first driving mechanism cooperates with the second driving mechanism to make the wafer on the wafer carrier parallel to the wafer adsorption surface of the robot.

[0008] In some embodiments, the wafer loading multi-posture position adjustment mechanism further includes a first frame;

[0009] The wafer carrier is rotatably arranged on the first frame via a first rotating shaft, and the axis of the first rotating shaft is the first axis;

[0010] The first driving mechanism includes a first screw rod, which is threadedly connected to the first frame. The first screw rod is used to push the wafer supporting platform to rotate around the first axis when driven to rotate.

[0011] In some embodiments, the wafer loading multi-posture position adjustment mechanism further includes a movable block, the movable block is rotatably arranged on the first frame through a second rotating shaft, and the axis of the second rotating shaft is the second axis; the wafer carrier is arranged on the movable block through the first rotating shaft, so as to be rotatably arranged on the first frame through the movable block;

[0012] The second driving mechanism includes a second screw rod, which is rotatably disposed on the first frame, and is used for pushing the wafer carrier to rotate forward around the second axis when the second screw rod is driven to rotate.

[0013] In some embodiments, the second driving mechanism further includes a third screw, which is rotatably disposed on the first frame, and is used for pushing the wafer carrier to reverse around the second axis when the third screw is driven to rotate.

[0014] In some embodiments, a leveling frame is provided on the wafer carrying platform, and the wafer carrying platform is connected to the first rotating shaft through the leveling frame;

[0015] The first screw rod, the second screw rod and the third screw rod are all used for driving the wafer carrying platform to rotate by pushing the leveling frame.

[0016] In some embodiments, a protective member is provided on the first frame, a position avoidance hole is provided on the movable block, and the protective member passes through the position avoidance hole;

[0017] The protective member is used to abut against the hole wall of the avoidance hole when the movable block falls, so as to provide support for the movable block.

[0018] In some embodiments, the wafer loading multi-posture position adjustment mechanism further includes a second frame;

[0019] The first frame and the second frame are connected by screws, the first frame is provided with screw holes, the second frame is provided with threaded holes, and the screws are used to pass through the screw holes and be threadedly connected in the threaded holes;

[0020] Among them, the screws and the screw holes have a gap in the first direction so that the position of the first frame can be adjusted relative to the second frame in the first direction; the first direction is horizontal and perpendicular to the direction in which the robot forks the wafer on the wafer carrier.

[0021] An embodiment of the utility model further provides a wafer inspection device, which may include any one of the wafer loading multi-posture position adjustment mechanisms described above.

[0022] By means of the above technical solution, the utility model of a wafer loading multi-posture position adjustment mechanism and a wafer detection device has at least the following beneficial effects:

[0023] 1. Due to the cooperation between the first driving mechanism and the second driving mechanism, the wafer on the wafer carrier can be made parallel to the wafer adsorption surface of the robot, thereby improving the parallelism between the wafer adsorption surface and the wafer on the wafer carrier, eliminating the errors caused by parts processing and assembly; and improving the stability of the robot adsorbing the wafer.

[0024] 2. Both the first driving mechanism and the second driving mechanism can independently drive the wafer carrier to rotate, so as to avoid affecting the position of the wafer carrier in other directions when adjusting one direction.

[0025] 3. Reduce adjustment difficulty, improve stability, and facilitate mass replication.

[0026] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0028] Figure 1 It is a structural schematic diagram of a wafer loading multi-posture position adjustment mechanism provided by an embodiment of the utility model;

[0029] Figure 2 yes Figure 1 The enlarged schematic diagram of point A in the middle;

[0030] Figure 3 yes Figure 1 The enlarged schematic diagram of point B in the middle;

[0031] Figure 4 It is a structural schematic diagram of another perspective of a wafer loading multi-posture position adjustment mechanism provided by one embodiment of the utility model;

[0032] Figure 5 yes Figure 4 The enlarged schematic diagram of the center C;

[0033] Figure 6 yes Figure 4 Enlarged schematic diagram of point D in the middle.

[0034] Figure numerals: 1. first frame; 2. robot; 3. wafer carrier; 4. movable block; 5. second frame; 6. first rotating shaft; 7. protective member; 8. second screw; 9. third screw; 10. first screw; 21. wafer adsorption surface; 30. material box; 31. leveling frame; 41. second rotating shaft; 101. screw through hole; 401. avoidance hole. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0037] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0038] like Figures 1 to 6 As shown, an embodiment of the utility model proposes a wafer loading multi-posture position adjustment mechanism, which includes a wafer carrier 3, a first drive mechanism and a second drive mechanism. The wafer carrier 3 is used to carry wafers. The first drive mechanism is used to drive the wafer carrier 3 to rotate around a first axis, and the second drive mechanism is used to drive the wafer carrier 3 to rotate around a second axis. The first axis is perpendicular to the second axis. Among them, the first drive mechanism cooperates with the second drive mechanism to make the wafer on the wafer carrier 3 parallel to the wafer adsorption surface 21 of the robot 2.

[0039] In the above example, due to the cooperation between the first driving mechanism and the second driving mechanism, the wafer on the wafer carrier 3 can be made parallel to the wafer adsorption surface 21 of the robot 2, thereby improving the parallelism between the wafer adsorption surface 21 and the wafer on the wafer carrier 3, eliminating errors caused by parts processing and assembly, and improving the stability of the robot 2 in adsorbing the wafer.

[0040] In some embodiments, Figure 1 As shown, the aforementioned wafer loading multi-posture position adjustment mechanism may include a material box 30 , in which the wafer is placed, and the wafer carrying table 3 is used to carry the material box 30 , so as to carry the wafer through the material box 30 .

[0041] It should be noted here that both the first driving mechanism and the second driving mechanism can independently drive the wafer carrier 3 to rotate, so as to avoid affecting the position of the wafer carrier 3 in other directions when adjusting one direction.

[0042] In order to realize the function of the aforementioned first driving mechanism, as Figure 1 and Figure 2 As shown, the aforementioned wafer loading multi-position adjustment mechanism may include a first frame 1. The aforementioned wafer carrier 3 is rotatably arranged on the first frame 1 through a first rotating shaft 6. The axis of the first rotating shaft 6 is the aforementioned first axis. Figure 5 As shown, the aforementioned first driving mechanism includes a first screw rod 10, which is threadedly connected to the first frame 1, and the first screw rod 10 is used to push the wafer carrier 3 to rotate around the first axis when driven to rotate.

[0043] In the above example, when the first screw 10 is rotated forward, the first screw 10 performs linear motion on the first frame 1, and the first screw 10 can contact the wafer carrier 3 through its end, and push the wafer carrier 3 to rotate around the first axis. When the first screw 10 is reversed, the wafer carrier 3 can be reversed under the action of its own gravity to contact the end of the first screw 10. In this way, the purpose of driving the wafer carrier 3 to rotate forward and reverse around the first axis by the first screw 10 can be achieved.

[0044] In order to realize the function of the aforementioned second driving mechanism, as Figure 1 and Figure 2 As shown, the aforementioned wafer loading multi-position adjustment mechanism may include a movable block 4, which is rotatably arranged on the first frame 1 through a second rotating shaft 41, and the axis of the second rotating shaft 41 is the aforementioned second axis. The aforementioned wafer carrier 3 is arranged on the movable block 4 through a first rotating shaft 6, so as to be rotatably arranged on the first frame 1 through the movable block 4. Figure 3As shown, the aforementioned second driving mechanism may include a second screw 8, which is rotatably disposed on the first frame 1, and is used to push the wafer carrier 3 to rotate forward around the second axis when driven to rotate.

[0045] In the above example, when the second screw 8 is rotated, the second screw 8 makes a linear motion on the first frame 1, and the second screw 8 can abut against the wafer carrier 3 through its end and push the wafer carrier 3 to rotate forward around the second axis.

[0046] In some embodiments, Figure 3 As shown, the aforementioned second driving mechanism may further include a third screw 9, which is rotatably disposed on the first frame 1. The third screw 9 is used to push the wafer carrier 3 to reverse around the second axis when driven to rotate.

[0047] In the above example, when the third screw 9 is rotated, the third screw 9 makes a linear motion on the first frame 1, and the third screw 9 can abut against the wafer carrier 3 through its end and push the wafer carrier 3 to reverse around the second axis.

[0048] It should be noted here that: when the third screw 9 pushes the wafer carrier 3 to reverse around the second axis, the second screw 8 needs to be screwed so that the second screw 8 can avoid the reverse rotation of the wafer carrier 3 around the second axis. Similarly, when the second screw 8 pushes the wafer carrier 3 to rotate forward around the second axis, the third screw 9 needs to be screwed so that the third screw 9 can avoid the forward rotation of the wafer carrier 3 around the second axis.

[0049] In some embodiments, Figures 1 to 5 As shown, the wafer carrier 3 may be provided with a leveling frame 31, and the wafer carrier 3 is connected to the first rotating shaft 6 through the leveling frame 31. The first screw 10, the second screw 8 and the third screw 9 are all used to drive the wafer carrier 3 to rotate by pushing the leveling frame 31.

[0050] In the above example, the first screw 10, the second screw 8 and the third screw 9 all indirectly push the wafer carrier 3 to rotate by pushing the leveling frame 31, which facilitates the setting of the first screw 10, the second screw 8 and the third screw 9. It reduces the difficulty of adjustment, improves stability, and facilitates mass replication.

[0051] like Figure 2 As shown, the aforementioned first frame 1 may be provided with a protective member 7, and the aforementioned movable block 4 is provided with a position avoidance hole 401, and the protective member 7 passes through the position avoidance hole 401. The protective member 7 is used to abut against the hole wall of the position avoidance hole 401 when the movable block 4 falls, so as to provide support for the movable block 4.

[0052] In the above example, when the second rotating shaft 41 breaks, the movable block 4 will fall. At this time, the avoidance hole 401 on the movable block 4 will be hung on the protective part 7, which can prevent the movable block 4 from falling to the ground, thereby improving the safety of the movable block 4 and the wafer carrier 3 thereon.

[0053] In some embodiments, Figure 4 and Figure 6 As shown, the aforementioned wafer loading multi-posture position adjustment mechanism may include a second frame 5. The aforementioned first frame 1 and the second frame 5 are connected by screws, and a screw through hole 101 is provided on the first frame 1, and a threaded hole is provided on the second frame 5. The screw is used to pass through the screw through hole 101 and be threadedly connected in the threaded hole. Among them, there is a gap between the screw and the screw through hole 101 in the first direction, so that the position of the first frame 1 can be adjusted relative to the second frame 5 in the first direction. The first direction is horizontal and perpendicular to the direction in which the robot 2 forks the wafer on the wafer carrier 3.

[0054] In a specific application example, the aforementioned threaded hole can be an M8 threaded hole, and the aforementioned screw through hole 101 can be an M10 hole. In this way, when the screw is loosened, the position of the wafer carrier table 3 loading box 30 can be adjusted in the first direction through the first frame 1, so that the position of the wafer carrier table 3 loading box 30 corresponds to the position of the robot 2, which is convenient for the robot 2 to fork the wafer in the material box 30 and avoid interference and collision with the material box 30 when the robot 2 is loading.

[0055] The wafer loading multi-posture position adjustment mechanism of the utility model optimizes the freedom of the installation mechanism to improve the adjustment efficiency of the adsorption robot 2. The separate design enables more independent control of the direction when placing and taking the wafer, avoiding the change of a single direction affecting the change of the overall posture. The stability is improved and the adjustment is simple and efficient.

[0056] The embodiment of the utility model also provides a wafer inspection device, which can include any of the above-mentioned wafer loading multi-posture position adjustment mechanisms. Among them, because the wafer inspection device adopts the above-mentioned wafer loading multi-posture position adjustment mechanism, the first drive mechanism cooperates with the second drive mechanism to make the wafer on the wafer carrier 3 parallel to the wafer adsorption surface 21 of the manipulator 2, thereby improving the parallelism between the wafer adsorption surface 21 and the wafer on the wafer carrier 3, eliminating the errors caused by parts processing and assembly; and improving the stability of the manipulator 2 adsorbing the wafer.

[0057] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A wafer loading multi-posture position adjustment mechanism, characterized in that: include: A wafer carrying platform (3), a first driving mechanism and a second driving mechanism; The wafer carrying platform (3) is used for carrying wafers; The first driving mechanism is used to drive the wafer carrier (3) to rotate around a first axis, and the second driving mechanism is used to drive the wafer carrier (3) to rotate around a second axis, and the first axis is perpendicular to the second axis; the first driving mechanism cooperates with the second driving mechanism to make the wafer on the wafer carrier (3) parallel to the wafer adsorption surface (21) of the robot (2).

2. The wafer loading multi-posture position adjustment mechanism according to claim 1, characterized in that: Also includes a first frame (1); The wafer carrier (3) is rotatably arranged on the first frame (1) via a first rotating shaft (6), and the axis of the first rotating shaft (6) is the first axis; The first driving mechanism comprises a first screw rod (10), the first screw rod (10) being threadedly connected to the first frame (1), and the first screw rod (10) being used for pushing the wafer carrier (3) to rotate around the first axis when driven to rotate.

3. The wafer loading multi-posture position adjustment mechanism according to claim 2, characterized in that: It also comprises a movable block (4), the movable block (4) being rotatably arranged on the first frame (1) via a second rotating shaft (41), the axis of the second rotating shaft (41) being the second axis; the wafer carrier (3) being arranged on the movable block (4) via the first rotating shaft (6), so as to be rotatably arranged on the first frame (1) via the movable block (4); The second driving mechanism comprises a second screw (8), the second screw (8) being rotatably arranged on the first frame (1), and the second screw (8) being used for pushing the wafer carrier (3) to rotate forward around the second axis when driven to rotate.

4. The wafer loading multi-posture position adjustment mechanism according to claim 3, characterized in that: The second driving mechanism further comprises a third screw (9), wherein the third screw (9) is rotatably arranged on the first frame (1), and the third screw (9) is used for pushing the wafer carrier (3) to reverse around the second axis when driven to rotate.

5. The wafer loading multi-posture position adjustment mechanism according to claim 4, characterized in that: A leveling frame (31) is provided on the wafer carrying platform (3), and the wafer carrying platform (3) is connected to the first rotating shaft (6) via the leveling frame (31); The first screw rod (10), the second screw rod (8) and the third screw rod (9) are all used to drive the wafer carrying platform (3) to rotate by pushing the leveling frame (31).

6. The wafer loading multi-posture position adjustment mechanism according to any one of claims 3 to 5, characterized in that: The first frame (1) is provided with a protective member (7), the movable block (4) is provided with a position avoidance hole (401), and the protective member (7) passes through the position avoidance hole (401); The protective member (7) is used to abut against the hole wall of the avoidance hole (401) when the movable block (4) falls, so as to provide support for the movable block (4).

7. The wafer loading multi-posture position adjustment mechanism according to any one of claims 2 to 5, characterized in that: Also includes a second frame (5); The first frame (1) and the second frame (5) are connected by screws, the first frame (1) is provided with a screw through hole (101), the second frame (5) is provided with a threaded hole, and the screw is used to pass through the screw through hole (101) and be threadedly connected in the threaded hole; There is a gap between the screw and the screw through hole (101) in the first direction, so that the position of the first frame (1) relative to the second frame (5) in the first direction can be adjusted; the first direction is horizontal and perpendicular to the direction in which the robot (2) forks the wafer on the wafer carrier (3).

8. A wafer inspection device, characterized in that: It comprises the wafer loading multi-posture position adjustment mechanism described in any one of claims 1 to 7.

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