Surface-mounted ceramic packaging device

Abstract

The utility model provides a surface-mounted ceramic packaging device. The surface-mounted ceramic packaging device comprises pins and a metal disc, comprising a ceramic body, the side wall of the ceramic body is provided with a plurality of grooves, the bottom of each groove is provided with a bonding pad and a through hole, and the through holes are located in the bonding pads; the through holes are larger than the pins, and the thickness of the metal disc is smaller than the depth of the groove; brazing is facilitated, the brazed ceramic packaging device is sealed, the metal disc is located at the fixed position, and the qualified rate of the device is increased.

Description

Technical Field

[0001] The utility model relates to a ceramic packaging device, in particular to a surface mounted ceramic packaging device. Background Art

[0002] The existing SMD is provided with a through hole. During packaging, the pin is passed through the through hole, and then the solder and the metal plate are placed to perform the brazing operation. In this way, the pin is fixed to the through hole and the through hole is sealed by the metal plate. However, the size of the pin cannot be completely consistent with the through hole of the ceramic, and there must be a certain gap. Otherwise, the ceramic will be broken due to thermal expansion and contraction during the brazing process. Before the brazing operation, the pin, solder and metal plate need to be manually placed on the ceramic body, and then transferred to the brazing furnace for brazing. During the movement, there is shaking, which makes the metal plate move. The welded ceramic package device is not beautiful, and there may be a situation where the metal plates of the two pins are too close to each other, resulting in failure. The pin is fixed on the metal plate, and the strength of the pin after fixing is often unqualified. In addition, due to the gap between the pin and the through hole, if the through hole is simply sealed by the metal plate, only one angle of the metal plate needs to be without solder, which will result in the inability to seal the through hole, resulting in packaging failure. In addition, the metal plate will protrude from the ceramic body, which is inconvenient for users to use. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a surface mounted ceramic packaging device, which is easy to braze, so that the ceramic packaging device is sealed after brazing, and the metal disk is located in a fixed position, thereby improving the qualified rate of the device.

[0004] The utility model is implemented as follows: a surface mounted ceramic packaging device, including pins and a metal plate; including a ceramic body, a plurality of grooves are provided on the side wall of the ceramic body, a soldering pad and a through hole are provided at the bottom of each of the grooves, and the through hole is located in the soldering pad; the through hole is larger than the pin, and the thickness of the metal plate is less than the depth of the groove.

[0005] Furthermore, a metallization layer is provided on the inner side wall of the through hole.

[0006] Furthermore, the through hole is located in the middle of the pad.

[0007] The utility model has the advantages that: during the brazing operation, the lead and the metal plate will not be displaced during the movement process, the qualified rate of the device obtained after brazing is greatly improved, and the solder enters the through hole, making the lead more firm and the sealing of the device higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

[0009] Figure 1 The utility model is a side view of a ceramic body of a surface mounted ceramic packaging device.

[0010] Figure 2 yes Figure 1 A-A' section view. DETAILED DESCRIPTION

[0011] See also Figure 1 and Figure 2 As shown, the utility model is a surface-mounted ceramic packaging device, including a pin (not shown in the figure), a metal disk (not shown in the figure), and a ceramic body 1, wherein a plurality of grooves 11 are provided on the side wall of the ceramic body 1, and a soldering pad 12 and a through hole 13 are provided at the bottom of each of the grooves 11, wherein the through hole 13 is located in the soldering pad 12; the through hole 13 is larger than the pin, so that the pin can be inserted into the through hole 13 conveniently, and the ceramic body 1 will not be broken during the brazing process; the thickness of the metal disk is less than the depth of the groove 11, and the groove 11 is slightly larger than the metal disk, which makes the ceramic packaging device more beautiful after brazing, and the groove 11 ensures that the metal disk will not be displaced during the brazing process, and the pin will not be displaced either.

[0012] In this embodiment, preferably, a metallization layer 131 is provided on the inner wall of the through hole 13. Through this arrangement, during the brazing process, the solder can flow into the through hole, so that the gap between the through hole 13 and the pin is filled, which makes the pin more firmly fixed and the airtightness of the packaged device is better.

[0013] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0014] Although the specific implementation methods of the present invention are described above, those skilled in the art should understand that the specific embodiments described are only illustrative and are not intended to limit the scope of the present invention. Equivalent modifications and changes made by those skilled in the art in accordance with the spirit of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. A surface mount ceramic package device, comprising a pin and a metal plate; characterized in that: It comprises a ceramic body, a plurality of grooves are arranged on the side wall of the ceramic body, a soldering pad and a through hole are arranged at the bottom of each groove, and the through hole is located in the soldering pad; the through hole is larger than the pin, and the thickness of the metal plate is smaller than the depth of the groove.

2. A surface mount ceramic package device as claimed in claim 1, characterized in that: A metallization layer is provided on the inner side wall of the through hole.

3. A surface mount ceramic package device as claimed in claim 1, characterized in that: The through hole is located in the middle of the pad.

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