Ball grid array packaging structure

Abstract

In the ball grid array packaging structure provided by the utility model, the back surface of the substrate is provided with the first back surface groove, the second electronic element is installed on the back surface of the substrate and is located in the first back surface groove, the front surface of the second electronic element faces the substrate and is electrically connected with the substrate, and the back surface of the second electronic element is back to the substrate. The plurality of solder balls are arranged on the back surface of the substrate and located on the side edge of the first back surface groove, the height of the solder balls is smaller than or equal to that of the second electronic element, and the height of the solder balls and the height of the second electronic element are the sizes of the solder balls and the second electronic element in the direction perpendicular to the back surface of the substrate respectively; the solder balls protrude out of the plane where the back surface of the second electronic component is located in the direction away from the substrate. In this way, the ball grid array packaging structure can be kept low in thickness while the second electronic element with the high height is used, solder balls with the small size can be used as the pins, the distance between the solder balls can be shortened, and the pin outlet mode of the packaging structure is more flexible.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a ball grid array packaging structure. Background Art

[0002] With the development of system-in-package (SiP) technology and the increasingly urgent demand for miniaturization, double-sided packaging has gradually replaced single-sided packaging in module products such as power amplifiers (PA) to meet the demand for miniaturization.

[0003] In the existing ball grid array packaging structure, in order to reduce the overall thickness, it is necessary to use thinner chip devices in the packaging structure, but thinner chip devices will affect the cost and performance to a certain extent. In addition, in the existing double-sided packaging technology, if the back device has a certain thickness, the back solder ball as the pin needs to be higher than the height of the back device to form a conductive connection; and the high solder ball is easy to short after reflow, so that the solder balls need to have a larger spacing, which will affect the design of the pin method. Utility Model Content

[0004] One of the purposes of the utility model is to provide a ball grid array packaging structure, which can maintain a lower thickness of the ball grid array packaging structure while using thicker chip devices, and can reduce the spacing between solder balls serving as pins, making the pin output method of the packaging structure more flexible.

[0005] In order to achieve the above-mentioned purpose, the ball grid array packaging structure provided by the utility model includes a substrate, a second electronic component and a plurality of solder balls; the substrate has a front side and a back side relative to each other, and the back side of the substrate has a first back side groove; the second electronic component is mounted on the back side of the substrate and is located in the first back side groove, the front side of the second electronic component faces the substrate and is electrically connected to the substrate, and the back side of the second electronic component faces away from the substrate; a plurality of solder balls are arranged on the back side of the substrate and are located on the side of the first back side groove, the height of the solder balls is less than or equal to the height of the second electronic component, the height of the solder balls and the height of the second electronic component are respectively the dimensions of the solder balls and the second electronic component in a direction perpendicular to the back side of the substrate, and the solder balls protrude from the plane where the back side of the second electronic component is located in a direction away from the substrate.

[0006] Optionally, the back surface of the second electronic component protrudes out of the first back surface groove or the back surface of the second electronic component is flush with the back surface of the substrate.

[0007] Optionally, the front side of the second electronic component has a plurality of bumps, and the bumps are welded on the bottom surface of the first back side groove; and a bottom filling layer is filled in the gap between the second electronic component and the bottom surface of the first back side groove.

[0008] Optionally, the ball grid array packaging structure also includes a second plastic packaging layer formed on the back side of the substrate, the second plastic packaging layer fills the first back groove and at least wraps the side wall of the second electronic component, the second plastic packaging layer wraps the side wall of the bottom filling layer and surrounds the solder ball, and the solder ball protrudes out of the second plastic packaging layer away from the surface of the substrate.

[0009] Optionally, the ball grid array packaging structure further includes a first electronic component, and the first electronic component is mounted on the front side of the substrate.

[0010] Optionally, a plurality of the first electronic components are mounted on the front side of the substrate; a front groove is provided on the front side of the substrate, and at least a portion of the first electronic components are mounted in the front groove.

[0011] Optionally, a first plastic packaging layer is formed on the front side of the substrate, and the first plastic packaging layer at least wraps the side wall of the first electronic component.

[0012] Optionally, the ball grid array packaging structure also includes an electromagnetic shielding layer and a plurality of conductive pillars; the electromagnetic shielding layer covers the side walls of the first plastic packaging layer and a surface away from the substrate; one end of the conductive pillar is connected to the substrate and the other end is connected to the electromagnetic shielding layer.

[0013] Optionally, the back side of the substrate has a second back side groove; a third electronic component is installed on the back side of the substrate, and the third electronic component is installed in the second back side groove; the height of the third electronic component is less than or equal to the height of the second electronic component.

[0014] Optionally, the second electronic component is a chip or a passive device.

[0015] In the ball grid array packaging structure provided by the utility model, a substrate has a relative front and back side, the back side of the substrate has a first back side groove, a second electronic component is mounted on the back side of the substrate and is located in the first back side groove, the front side of the second electronic component faces the substrate and is electrically connected to the substrate, the back side of the second electronic component faces away from the substrate, a plurality of solder balls are arranged on the back side of the substrate and are located on the side of the first back side groove, the height of the solder balls is less than or equal to the height of the second electronic component, the height of the solder balls and the height of the second electronic component are respectively the dimensions of the solder balls and the second electronic component in a direction perpendicular to the back side of the substrate, and the solder balls protrude from the plane where the back side of the second electronic component is located in a direction away from the substrate, so that the ball grid array packaging structure can maintain a low thickness while using a second electronic component with a higher height, and solder balls with smaller sizes can also be used as pins, which helps to reduce the spacing between the solder balls, making the pin-out method of the packaging structure more flexible. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figures 1 to 8 A schematic diagram of a ball grid array packaging structure provided in different embodiments of the present invention.

[0017] Figures 9 to 14 A schematic diagram of the manufacturing process of a ball grid array packaging structure provided in one embodiment of the present application.

[0018] Explanation of the reference numerals: 100-substrate; 101-metal layer; 102-dielectric layer; 103-first back groove; 104-second back groove; 105-front groove; 201-first electronic component one; 202-first electronic component two; 203-first electronic component three; 204-first electronic component four; 205-conductive column; 300-first plastic layer; 400-solder ball; 501-second electronic component; 501a-bump; 502-third electronic component; 601-bottom filling layer; 602-second plastic layer; 701-electromagnetic shielding layer. DETAILED DESCRIPTION

[0019] The ball grid array packaging structure proposed by the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the utility model will become clearer. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model.

[0020] refer to Figures 1 to 8As shown, the ball grid array packaging structure provided by the utility model includes a substrate 100, a second electronic component 501 and a plurality of solder balls 400; the substrate 100 has a front side and a back side opposite to each other, and the back side of the substrate 100 has a first back side groove 103; the second electronic component 501 is mounted on the back side of the substrate 100 and is located in the first back side groove 103, the front side of the second electronic component 501 faces the substrate 100 and is electrically connected to the substrate 100, and the back side of the second electronic component 501 faces away from the substrate 100; the plurality of solder balls 400 are arranged on the back side of the substrate 100 and are located on the side of the first back side groove 103, the height of the solder balls 400 is less than or equal to the height of the second electronic component 501, the height of the solder balls 400 and the height of the second electronic component 501 are respectively the dimensions of the solder balls 400 and the second electronic component 501 in a direction perpendicular to the back side of the substrate 100, and the solder balls 400 protrude from the plane where the back side of the second electronic component 501 is located in a direction away from the substrate 100.

[0021] The utility model installs the second electronic component 501 with a higher height in the first back groove 103 on the back side of the substrate 100, so that the thickness of the ball grid array packaging structure can be kept relatively low, and there is no need to make the height of the solder ball 400 greater than the height of the second electronic component 501, so that smaller solder balls can be used as pins, and the spacing between the solder balls can be reduced, making the pin output method of the packaging structure more flexible.

[0022] Specifically, refer to Fig. 9 As shown, the substrate 100 may include a plurality of interconnected metal layers 101 and a dielectric layer 102 isolating the plurality of metal layers 101, and portions of the metal layers 101 on the top surface and the metal layers 101 on the bottom surface of the substrate 100 are exposed from the dielectric layer 102 as pads of the substrate 100, and the pads may be used to mount electronic components and realize electrical connection between the electronic components and the substrate 100. Exemplarily, the substrate 100 includes but is not limited to a printed circuit board.

[0023] In some embodiments of the present application, the back of the second electronic component 501 may protrude from the first back groove 103, or the back of the second electronic component 501 may be flush with the back of the substrate 100. In the present application, the second electronic component 501 is an electronic component with a relatively large height; illustratively, the second electronic component 501 is the electronic component with the largest height on the front and back of the substrate 100, but is not limited thereto. The second electronic component 501 may be a chip or a passive device, the chip may be a bare chip or a packaged chip packaging structure, the chip may be a Si chip or a GaAs chip, etc., and the passive device may be a capacitor, an inductor, or a resistor, etc.

[0024] It should be noted that electronic components with small height (or thin thickness) have higher costs and lower performance to a certain extent. The present application does not require the height of the second electronic component 501 to be less than the depth of the first back groove 103, which reduces the height restriction of the packaging structure on the electronic components, helps to reduce costs and improve the performance of the ball grid array packaging structure.

[0025] refer to Figure 1 As shown, the front side of the second electronic component 501 may have a plurality of bumps 501a, and the second electronic component 501 may be soldered on the bottom surface of the first back side groove 103 through the bumps 501a. Exemplarily, the bumps 501a may be solder balls, copper pillars, or a combination structure including copper pillars. Preferably, the bumps 501a are solder balls, and solder balls may be arranged on the surface of the chip body of the second electronic component 501 to form the bumps 501a. The height of the bumps 501a formed in this way may be relatively small, which helps to reduce the height of the second electronic component 501 and helps to keep the ball grid array package structure at a relatively low thickness. Exemplarily, when solder balls are used as the bumps 501a, the height of the bumps 501a may be 20 μm to 30 μm, but is not limited thereto.

[0026] refer to Figure 2 As shown, in some embodiments of the present application, the gap between the second electronic component 501 and the bottom surface of the first back groove 103 is filled with a bottom filling layer 601, which can improve the packaging reliability of the second electronic component 501 and the reliability of the packaging structure. Exemplarily, the bottom filling layer 601 can be a non-conductive paste (NCP) layer or a non-conductive film (NCF) layer.

[0027] refer to Figure 1 and Figure 2 As shown, the ball grid array package structure includes a first electronic component, which is mounted on the front side of the substrate 100. The front side of the substrate 100 may be mounted with a plurality of first electronic components, such as first electronic component 1 201, first electronic component 202, first electronic component 3 203, and first electronic component 4 204, but is not limited thereto.

[0028] Exemplarily, one of the first electronic components 201 can be a flip chip (FC); the second first electronic component 202 can be a wire bonding (WB) type chip; the third first electronic component 203 can be a filter chip, and the third first electronic component 203 can have a cavity required for the resonator of the filter chip to work between the front side facing the substrate 100 and the substrate 100; the fourth first electronic component 204 can be a passive device, such as a resistor, capacitor or inductor.

[0029] Exemplarily, the first electronic component one 201, the first electronic component three 203 and the first electronic component four 204 can be soldered on the front surface of the substrate 100 by solder paste; the first electronic component two 202 can be attached to the front surface of the substrate 100 by adhesive.

[0030] refer to Figure 1 As shown, a first plastic encapsulation layer 300 may be formed on the front side of the substrate 100, and the first plastic encapsulation layer 300 at least wraps the side wall of each first electronic component. Exemplarily, in some embodiments, the first plastic encapsulation layer 300 may cover the side wall of each first electronic component and the surface away from the substrate 100; in some embodiments, the first plastic encapsulation layer 300 may expose a portion of the surface of the first electronic component away from the substrate to reduce the overall thickness of the package structure.

[0031] like Figure 1 and Figure 2 As shown, in some embodiments of the present application, a plastic encapsulation layer may not be formed on the back side of the substrate 100, which can save part of the back side packaging process and help save costs.

[0032] like Figure 3 As shown, in some embodiments of the present application, the ball grid array packaging structure may also include a second plastic packaging layer 602 formed on the back side of the substrate 100, the second plastic packaging layer 602 may fill the first back groove 103 and at least wrap the side wall of the second electronic component 501, the second plastic packaging layer 602 wraps the side wall of the bottom filling layer 601 and surrounds the solder ball 400, and the solder ball 400 protrudes from the second plastic packaging layer 602 away from the surface of the substrate 100.

[0033] Exemplarily, the second plastic encapsulation layer 602 may wrap the sidewalls of the second electronic component 501 and expose the backside of the second electronic component 501 to reduce the thickness of the packaging structure. The second plastic encapsulation layer 602 may also cover the sidewalls and backside of the second electronic component 501.

[0034] like Figure 4 As shown, the ball grid array packaging structure also includes an electromagnetic shielding layer 701 and a conductive column 205; the electromagnetic shielding layer 701 can cover the side wall of the first plastic encapsulation layer 300 and the surface away from the substrate 100, and can also cover the side wall of the substrate 100; the conductive column 205 can penetrate the first plastic encapsulation layer 300 and the number can be multiple, one end of the conductive column 205 is connected to the substrate 100 and the other end is connected to the electromagnetic shielding layer 701, so that the multiple first electronic components on the front of the substrate 100 can be electromagnetically shielded in different cavities. Exemplarily, the conductive column 205 can be a copper column welded on the front of the substrate 100; the conductive column 205 can also be a metal wire formed by vertical bonding.

[0035] like Figure 5As shown, when a second plastic packaging layer 602 is formed on the back side of the substrate 100 , the electromagnetic shielding layer 701 may also cover the side wall of the second plastic packaging layer 602 .

[0036] refer to Figure 6 As shown, in some embodiments of the present application, the back side of the substrate 100 may have a second back side groove 104; a third electronic component 502 may be installed on the back side of the substrate 100, and the third electronic component 502 may be installed in the second back side groove 104, so that even if the height of the third electronic component 502 is relatively large, the thickness of the ball grid array packaging structure can be kept relatively low, and more devices can be accommodated while realizing more functions, without adding additional process flows, thereby achieving cost reduction.

[0037] In the present application, the height of the third electronic component 502 is less than or equal to the height of the second electronic component 501. The second electronic component 501 may be the electronic component with the largest height in the packaging structure. The third electronic component 502 may be a chip or a passive device.

[0038] In some embodiments of the present application, Figure 7 and Figure 8 As shown, a front groove 105 may be provided on the front side of the substrate 100, and at least a portion of the first electronic components may be installed in the front groove 105, wherein the first electronic component installed in the front groove 105 may be the largest one in height among the plurality of first electronic components, which helps to reduce the thickness of the packaging structure.

[0039] refer to Figure 7 and Figure 8 As shown, the number of the front grooves 105 can be multiple and can be set as needed. Since the height of the wire-bonded chip and the filter chip is relatively large, in order to effectively reduce the height of the packaging structure, the second first electronic component 202 and the third first electronic component 203 can be installed in the corresponding front grooves 105.

[0040] Exemplarily, the ball grid array packaging structure includes but is not limited to a power amplifier module.

[0041] The present application also provides a method for manufacturing the above-mentioned ball grid array packaging structure. Figures 9 to 14 A schematic diagram of the manufacturing process of a ball grid array packaging structure provided in an embodiment of the present application. Figures 9 to 14 A method for manufacturing a ball grid array package structure is described.

[0042] like Fig. 9 As shown, a substrate 100 is provided. The substrate 100 has a front side and a back side opposite to each other. The back side of the substrate 100 has a first back side groove 103 .

[0043] In this embodiment, Fig. 9 As shown, the back side of the substrate 100 is only formed with a first back side groove 103, but it is not limited thereto. Figure 7 As shown, a second back groove 104 may be formed on the back side of the substrate 100 ; and a front groove 105 may be formed on the front side of the substrate 100 .

[0044] The front groove and the back groove of the substrate 100 may be pre-formed in the substrate as groove structures, or may be prepared by milling or laser processing after lamination.

[0045] like Fig.10 As shown, the first electronic component is mounted on the front side of the substrate 100. The front side of the substrate 100 may be mounted with a plurality of first electronic components, such as first electronic component 1 201, first electronic component 202, first electronic component 3 203 and first electronic component 4 204, but not limited thereto.

[0046] Exemplarily, one of the first electronic components 201 can be a flip chip (FC); the second first electronic component 202 can be a wire bonding (WB) type chip; the third first electronic component 203 can be a filter chip, and the third first electronic component 203 can have a cavity required for the resonator of the filter chip to work between the front side facing the substrate 100 and the substrate 100; the fourth first electronic component 204 can be a passive device, such as a resistor, capacitor or inductor.

[0047] Among them, for the first electronic component of the wire bonding type, after it is mounted on the front surface of the substrate 100, it is still necessary to perform wire bonding to achieve electrical connection between it and the substrate 100.

[0048] refer to Fig.10 As shown, the conductive pillar 205 can also be set on the front side of the substrate 100 to achieve cavity shielding of multiple first electronic components. Exemplarily, the conductive pillar 205 can be a copper pillar, and the conductive pillar 205 can be installed on the front side of the substrate 100 by welding; the conductive pillar 205 can also be a metal wire, and can be set on the front side of the substrate 100 by vertical bonding. It should be noted that the height of the conductive pillar 205 is not less than the height of all the first electronic components.

[0049] like Fig.11 As shown, a first plastic encapsulation layer 300 is formed on the front side of the substrate 100 , and the first plastic encapsulation layer 300 covers the side wall of the first electronic component and the surface away from the substrate 100 .

[0050] like Fig.12As shown, part of the thickness of the first plastic encapsulation layer 300 is removed by grinding or the like to expose the end surface of the conductive pillar 205 away from the substrate. In other embodiments, the first plastic encapsulation layer 300 may expose part of the surface of the first electronic component away from the substrate to reduce the overall thickness of the package structure.

[0051] like Fig.13 As shown, the second electronic component 501 is mounted in the first back groove 103 on the back of the substrate 100, the front side of the second electronic component 501 faces the substrate 100 and is electrically connected to the substrate 100, and the back side of the second electronic component 501 faces away from the substrate 100. In this embodiment, the back side of the second electronic component 501 may protrude from the first back groove 103. In other embodiments, the back side of the second electronic component 501 may be flush with the back side of the substrate 100.

[0052] In some embodiments, reference Figure 6 As shown, in the step of installing the second electronic component 501 in the first back surface groove 103, the third electronic component 502 may also be installed in the second back surface groove 104 on the back surface of the substrate.

[0053] Afterwards, refer to Fig.13 As shown, an underfill layer 601 may be formed between the second electronic component 501 and the substrate 100 , and the underfill layer 601 fills the gap between the second electronic component 501 and the substrate 100 .

[0054] In some embodiments, the bottom filling layer 601 may be a non-conductive adhesive layer. The method for forming the bottom filling layer 601 may include: applying a non-conductive adhesive material at the bottom of the first back groove 103; mounting the second electronic component 501 with the front side facing downward in the first back groove 103 and squeezing the non-conductive adhesive material, and the bumps on the front side of the second electronic component 501 are electrically connected to the substrate 100; and curing the non-conductive adhesive material to form the bottom filling layer 601. It should be noted that since the first back groove 103 is formed on the back side of the substrate 100, the non-conductive adhesive material can be directly applied to the bottom of the first back groove 103, and there is no need to design an additional dispensing port, which can save design space, and the first back groove 103 can limit the flow area of ​​the non-conductive adhesive material, which can reduce the impact of overflow on product reliability.

[0055] In some embodiments, the bottom filling layer 601 may be a non-conductive film layer. The process of forming the bottom filling layer 601 may include: attaching a non-conductive film to the front side of the wafer, the non-conductive film covering the bumps on the surface of the wafer; dicing the wafer to form a single second electronic component 501; mounting the second electronic component 501 face-down in the first back side groove 103 of the substrate 100 and squeezing the non-conductive film on the front side of the second electronic component 501, the non-conductive film on the front side of the second electronic component 501 serving as the bottom filling layer 601. The formation of the bottom filling layer 601 in this way does not require the additional design of a dispensing port, which can save design space and also reduce the impact of overflowing glue on product reliability.

[0056] In some embodiments of the present application, Figure 1 As shown, an underfill layer may not be formed between the second electronic component 501 and the substrate 100 .

[0057] refer to Fig.13 As shown, after the second electronic component 501 is mounted on the back of the substrate 100, the solder ball 400 is arranged on the back of the substrate 100. In this embodiment, after the solder ball 400 is arranged on the back of the substrate 100, a second plastic encapsulation layer 602 is formed on one side of the back of the substrate 100, and the second plastic encapsulation layer 602 covers the solder ball 400 and the second electronic component 501.

[0058] like Fig.14 As shown, the second plastic encapsulation layer 602 is ground to remove part of the thickness and part of the height of the solder ball 400, so as to reduce the size of the solder ball finally formed and reduce the thickness of the package structure. Exemplarily, the second plastic encapsulation layer 602 can be ground to expose the back of the second electronic component 501, and then the grinding can be continued to remove part of the thickness of the second electronic component 501 to further reduce the thickness of the package structure. For example, the thickness of the second electronic component 501 removed can be 50μm to 70μm. In this process, part of the thickness of the second plastic encapsulation layer 602 and part of the thickness of the solder ball 400 are also removed at the same time.

[0059] In some embodiments, after grinding of the second plastic layer 602 is completed, laser grooving may be used to remove a portion of the second plastic layer 602 around the solder ball 400 so that the maximum diameter of the solder ball 400 is exposed to facilitate subsequent re-balling.

[0060] refer to Figure 3 As shown, a reflow process is performed to remelt the remaining solder balls 400 to form solder balls 400 with smaller diameters. The re-formed solder balls 400 protrude out of the second plastic packaging layer 602 so as to be subsequently welded with other components.

[0061] After the solder balls 400 are reformed into smaller sizes, a sawing process may be performed, if necessary, to obtain individual package units.

[0062] refer to Figure 5 As shown, an electromagnetic shielding layer 701 can be formed on the surface of the first plastic packaging layer 300 of a single packaging unit. The electromagnetic shielding layer 701 can cover the side walls of the first plastic packaging layer 300 and the surface away from the substrate 100, and can also cover the side walls of the substrate 100 and the side walls of the second plastic packaging layer 602. The electromagnetic shielding layer 701 is also connected to the end of the conductive column 205, so that the multiple first electronic components on the front side of the substrate 100 can be electromagnetically shielded in different cavities.

[0063] In some other embodiments, Figure 4 As shown, after the solder balls 400 are formed, they can be cut directly to obtain single package units, and then an electromagnetic shielding layer 701 is formed on the surface of the first plastic packaging layer 300 .

[0064] In the ball grid array packaging structure provided by the utility model, the substrate 100 has a front side and a back side opposite to each other, the back side of the substrate 100 has a first back side groove 103, the second electronic component 501 is mounted on the back side of the substrate 100 and is located in the first back side groove 103, the front side of the second electronic component 501 faces the substrate 100 and is electrically connected to the substrate 100, the back side of the second electronic component 501 faces away from the substrate 100, a plurality of solder balls 400 are arranged on the back side of the substrate 100 and are located on the side of the first back side groove 103, and the height of the solder balls 400 is less than or equal to the height of the second electronic component The height of the second electronic component 501 is as follows: the height of the solder ball 400 and the height of the second electronic component 501 are respectively the dimensions of the solder ball 400 and the second electronic component 501 in a direction perpendicular to the back side of the substrate 100, and the solder ball 400 protrudes out of the plane where the back side of the second electronic component 501 is located in a direction away from the substrate 100. In this way, the thickness of the ball grid array packaging structure can be kept low while using the second electronic component 501 with a higher height. Smaller solder balls can also be used as pins, which helps to reduce the spacing between the solder balls and makes the pin-out method of the packaging structure more flexible.

[0065] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of rights of the utility model. Any technical personnel in this field can make possible changes and modifications to the technical solution of the utility model by using the methods and technical contents disclosed above without departing from the spirit and scope of the utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model are within the protection scope of the technical solution of the utility model.

Claims

1. A ball grid array packaging structure, characterized in that: include: A substrate having a front side and a back side opposite to each other, wherein the back side of the substrate has a first back side groove; A second electronic component is mounted on the back side of the substrate and is located in the first back side groove, the front side of the second electronic component faces the substrate and is electrically connected to the substrate, and the back side of the second electronic component faces away from the substrate; as well as A plurality of solder balls are arranged on the back side of the substrate and located on the side of the first back side groove, the height of the solder balls is less than or equal to the height of the second electronic component, the height of the solder balls and the height of the second electronic component are respectively the dimensions of the solder balls and the second electronic component in a direction perpendicular to the back side of the substrate, and the solder balls protrude from the plane where the back side of the second electronic component is located in a direction away from the substrate.

2. The ball grid array package structure according to claim 1, wherein: The back surface of the second electronic component protrudes out of the first back surface groove or the back surface of the second electronic component is flush with the back surface of the substrate.

3. The ball grid array package structure according to claim 1, wherein: The front surface of the second electronic component has a plurality of bumps, and the bumps are welded on the bottom surface of the first back surface groove; and the gap between the second electronic component and the bottom surface of the first back surface groove is filled with a bottom filling layer.

4. The ball grid array package structure according to claim 3, characterized in that: The ball grid array packaging structure also includes a second plastic packaging layer formed on the back side of the substrate, the second plastic packaging layer fills the first back groove and at least wraps the side wall of the second electronic component, the second plastic packaging layer wraps the side wall of the bottom filling layer and surrounds the solder ball, and the solder ball protrudes out of the second plastic packaging layer away from the surface of the substrate.

5. The ball grid array package structure according to claim 1, wherein: The ball grid array package structure further includes a first electronic component mounted on the front side of the substrate.

6. The ball grid array package structure according to claim 5, characterized in that: A plurality of the first electronic components are mounted on the front side of the substrate; a front groove is provided on the front side of the substrate, and at least a portion of the first electronic components are mounted in the front groove.

7. The ball grid array package structure according to claim 5, characterized in that: A first plastic packaging layer is formed on the front side of the substrate, and the first plastic packaging layer at least wraps the side wall of the first electronic component.

8. The ball grid array package structure according to claim 7, characterized in that: The ball grid array packaging structure also includes an electromagnetic shielding layer and a plurality of conductive pillars; the electromagnetic shielding layer covers the side wall of the first plastic packaging layer and a surface away from the substrate; one end of the conductive pillar is connected to the substrate and the other end is connected to the electromagnetic shielding layer.

9. The ball grid array package structure according to claim 1, wherein: The back side of the substrate has a second back side groove; the back side of the substrate is installed with a third electronic component, and the third electronic component is installed in the second back side groove; the height of the third electronic component is less than or equal to the height of the second electronic component.

10. The ball grid array package structure according to claim 1, wherein: The second electronic component is a chip or a passive device.

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