Adjustable IC board heating mechanism
By designing an adjustable IC board heating mechanism, including a heating seat, a guide assembly and a sliding clamp with built-in heating components, the problem of existing equipment being difficult to adapt to different types and sizes of IC boards, achieving flexibility and efficient heating of the equipment.
Patent Information
- Application Number
- CN202420907551.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-04-28
Smart Images

Figure CN222582605U_ABST
Abstract
Description
Technical Field
[0001] The utility model discloses an adjustable IC board heating mechanism, belonging to the technical field of electronic engineering. Background Art
[0002] IC board heating equipment is a device used to regulate and control the temperature of integrated circuit (IC) boards. They usually use various heating elements and temperature sensors, as well as corresponding control circuits, to achieve precise control of IC board temperature. These devices can provide different heating powers and temperature ranges as needed to adapt to different types of IC boards and working environments.
[0003] Some existing IC board heating devices may be designed for IC boards of a specific type or size during use, and therefore may not be effective when adapted to different types of IC boards. Utility Model Content
[0004] In view of the deficiencies in the prior art, the utility model aims to provide an adjustable IC board heating mechanism to solve the problems of the prior art.
[0005] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:
[0006] An adjustable IC board heating mechanism comprises: a heating seat with a built-in heating component, a heating port being arranged above the heating seat;
[0007] A group of guide assemblies symmetrically arranged above the heating seat, and a group of clamping members slidably mounted on the guide assemblies;
[0008] The two clamping members are slid on the guide assembly to adjust the distance, and the IC board is clamped and fixed by the two clamping members.
[0009] As a further improvement, the guide assembly includes a group of positioning rods symmetrically installed above the heating seat, and a guide rod connecting two positioning rods in the same group, and the clamping member is slidably installed on two guide rods in different groups.
[0010] As a further improvement, the heating port is located in the middle position above the heating seat, and an isolation net is provided above the heating port, and the isolation net is embedded and fixed on the heating seat.
[0011] As a further improvement, a placement groove is opened inwardly and obliquely upward on one side of the two clamping members, and the edge of the IC board is received by the placement groove.
[0012] As a further improvement, an anti-skid sheet is embedded at the bottom of the placement groove, and the anti-skid sheet abuts against the bottom of the edge of the IC board.
[0013] As a further improvement, the inner side of the placement groove is further provided with a triangular groove, and the triangular groove matches the angle of the edge of the IC board.
[0014] As a further improvement, the clamping member includes a first clamping strip, through holes are provided on both sides of the first clamping strip, magnetic rings are embedded inside the through holes, and the magnetic rings are fitted with the guide rod.
[0015] As a further improvement, the clamping member includes a second clamping strip, a group of first bolts are arranged on both sides of the short side of the second clamping strip, the first bolts are arc structures facing the guide rod, and the bolts are threadedly connected to the second clamping strip.
[0016] As a further improvement, the clamping member includes a third clamping strip, a through groove is provided inside the extended side direction of the third clamping strip, a group of abutment rods are movably installed inside the through groove, a second bolt is threadedly installed on the top of the third clamping strip, a group of push rods are provided below the second bolt, and the end of the push rod abuts against one end of the abutment rod;
[0017] A bearing is arranged between the second bolt and the split push rod, the lower section of the second bolt is welded to the inner ring of the bearing, and the top end of the split push rod is welded to the outer ring of the bearing.
[0018] As a further improvement, a block is provided inwardly extending from the through groove, a spring is fixedly sleeved on the outer ring of the abutment rod, one end of the spring abuts against the block, a gasket is provided at the end of the abutment rod, and the gasket fits against the outer side of the guide rod.
[0019] The beneficial effects of the utility model are:
[0020] The utility model allows the heating source to be in close contact with the heated object through the heating seat with the built-in heating component, thereby ensuring heating efficiency and heating uniformity. The heating port above the heating seat may be used to heat the air or heat through a specific radiation method, which is helpful for comprehensive heating of the IC board.
[0021] By arranging a guide component above the heating seat, in order to guide and support the clamping member, it is ensured that the clamping member can be aligned with the IC board and effectively fixed.
[0022] The clamping members mounted on the guide assembly can clamp IC boards of different sizes and shapes. The sliding performance of the clamping members allows the user to adjust the spacing between the clamping members according to the size of the IC board, which provides great flexibility for handling IC boards of different sizes.
[0023] The above design enables the device to adapt to various sizes and types of IC boards without being limited to a single size or type. The ability to quickly adjust the clamping parts can reduce the adjustment time of the device and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0025] Figure 1 It is a three-dimensional structural schematic diagram of an adjustable IC board heating mechanism of the utility model.
[0026] Figure 2 yes Figure 1 Enlarged structural diagram at A in the middle.
[0027] Figure 3 It is a schematic diagram of the cross-sectional structure of a first clamping strip of the utility model.
[0028] Figure 4 It is a schematic diagram of another implementation structure of an adjustable IC board heating mechanism of the utility model.
[0029] Figure 5 It is a schematic diagram of the cross-sectional structure of a second clamping strip of the utility model.
[0030] Figure 6 It is a structural schematic diagram of another embodiment of an adjustable IC board heating mechanism of the utility model.
[0031] Figure 7 It is a schematic diagram of the cross-sectional structure of a third clamping strip of the utility model.
[0032] 1. Heating seat; 2. Heating port; 3. Positioning rod; 4. Guide rod; 5. Isolation net; 61. First clamping strip; 62. Placement groove; 63. Anti-slip sheet; 64. Triangular sink groove; 611. Magnetic ring; 66. Second clamping strip; 661. First bolt; 67. Third clamping strip; 671. Through groove; 672. Abutment rod; 673. Second bolt; 674. Splitting rod; 675. Bearing; 676. Block; 677. Gasket; 678. Spring; 679. Block. DETAILED DESCRIPTION
[0033] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents the selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model.
[0034] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0035] Some existing IC board heating devices may be designed for IC boards of a specific type or size during use, and therefore may not be effective when adapted to different types of IC boards.
[0036] Reference Figure 1-3 As shown, an adjustable IC board heating mechanism comprises:
[0037] A heating seat 1 with a built-in heating component, wherein a heating port 2 is provided above the heating seat 1;
[0038] A group of guide components symmetrically arranged above the heating seat 1, and a group of clamping members slidably mounted on the guide components;
[0039] The two clamping members are slid on the guide assembly to adjust the distance, and the IC board is clamped and fixed by the two clamping members.
[0040] The heating base 1 with built-in heating components allows the heating source to be in close contact with the heated object, ensuring heating efficiency and heating uniformity. The heating port 2 above the heating base 1 may be used to heat the air or heat through a specific radiation method, which helps to fully heat the IC board (not shown in the figure).
[0041] By arranging a guide assembly above the heating seat 1, in order to guide and support the clamping member, it is ensured that the clamping member can be aligned with the IC board and effectively fixed.
[0042] The clamping members mounted on the guide assembly can clamp IC boards of different sizes and shapes. The sliding performance of the clamping members allows the user to adjust the spacing between the clamping members according to the size of the IC board, which provides great flexibility for handling IC boards of different sizes.
[0043] The above design enables the device to adapt to various sizes and types of IC boards without being limited to a single size or type. The ability to quickly adjust the clamping parts can reduce the adjustment time of the device and improve production efficiency.
[0044] The guide assembly includes a group of positioning rods 3 symmetrically installed above the heating seat 1, and guide rods 4 connecting two positioning rods 3 in the same group, and the clamping member is slidably installed on two guide rods 4 in different groups.
[0045] A screw is rotatably mounted at the bottom of the positioning rod 3 , and the positioning rod 3 is mounted on the heating seat 1 through the screw thread.
[0046] When fine adjustment of the height is required, the screw rod at the bottom of the positioning rod 3 can be rotated to finely adjust the positioning rod 3 upward.
[0047] The heating port 2 is located in the middle of the upper portion of the heating seat 1 . An isolation net 5 is provided above the heating port 2 . The isolation net 5 is embedded and fixed on the heating seat 1 .
[0048] The combination of the positioning rod 3 and the guide rod 4 can achieve accurate positioning and fine-tuning of the clamping part. The screw design at the bottom of the positioning rod 3 makes the adjustment process more convenient and accurate. The user can fine-tune the height of the positioning rod 3 by turning the screw to ensure that the distance and position between the IC board and the heating source are in the optimal state.
[0049] The guide rod 4 is slidably mounted on the guide rod 4 through the clamping member, and the guide rod 4 is connected to the heating seat 1 through the positioning rod 3. This structure can provide a stable clamping and fixation to ensure that the IC board will not move or loosen during the heating process, thereby ensuring the uniformity and stability of heating.
[0050] The heating port 2 is located in the middle of the upper part of the heating seat 1, and the isolation net 5 is located above the heating port 2. Such a design can effectively isolate the heat transfer between the heating source and the IC board, avoid excessive heat loss or concentration, and improve the efficiency and uniformity of heating. At the same time, the fixed design of the isolation net 5 also ensures its stability and reliability, avoiding the falling of debris and direct contact with the heating source when accidentally touched.
[0051] The heating source can be a common resistance heating element, which generates heat by energizing the resistance heating element to heat the IC board. This heating method is simple and reliable, and can achieve a higher heating temperature and heating rate. Since the heating source is a common component of IC board heating equipment, it will not be described in detail here.
[0052] A placement groove 62 is provided on one side of the two clamping members in an obliquely upward direction, and the edge of the IC board is received through the placement groove 62. The edge of the IC board can be effectively received and fixed through the placement groove 62 provided in the obliquely upward direction of the clamping members. This clamping method ensures that the IC board will not move or shake during the heating process, thereby ensuring the stability and uniformity of heating.
[0053] The bottom of the placement groove 62 is embedded with an anti-skid sheet 63, and the anti-skid sheet 63 abuts against the bottom edge of the IC board. The anti-skid sheet 63 at the bottom of the placement groove 62 can effectively abut against the bottom edge of the IC board, increasing the friction between the clamping member and the IC board, further ensuring the stability and safety of the IC board during the heating process, and preventing it from sliding or falling.
[0054] In this embodiment, the anti-slip sheet 63 is made of rubber.
[0055] In order to adapt to the special-shaped IC board, the inner side of the placement groove 62 is further provided with a triangular recessed groove 64, and the triangular recessed groove 64 matches the angle of the edge of the IC board.
[0056] By matching the angle of the edge of the special-shaped IC board (not shown in the figure) with the triangular recessed groove 64 provided on the inner side of the placement groove 62, this design can ensure the precise alignment between the IC board and the clamping member. The matching design of the triangular recessed groove 64 can better adapt to IC boards of different shapes and sizes, and improve the accuracy and stability of clamping.
[0057] Due to the close contact and firm clamping between the IC board and the clamping member, the thermal stress during the heating process is effectively dispersed and reduced, which helps to protect the quality of the IC board and extend its service life.
[0058] The clamping member includes a first clamping strip 61, and through holes are provided on both sides of the first clamping strip 61. A magnetic ring 611 is embedded inside the through hole, and the magnetic ring 611 is in contact with the guide rod 4. In this embodiment, the guide rod 4 is a metal guide rod 4, which can be attracted to the magnetic ring 611.
[0059] The first clamping strip 61 is provided with through holes and embedded magnetic rings 611 on both sides, and this design allows the clamping piece to be easily slid and fixed on the guide rod 4. The magnetic attraction between the metal guide rod 4 and the magnetic ring 611 makes it easier and more accurate to adjust the position of the clamping piece on the guide rod 4, and the user can easily make fine adjustments to meet the clamping requirements of different IC boards.
[0060] And the close fit between the magnetic ring 611 and the guide rod 4 ensures good contact and stable clamping between the clamping member and the guide rod 4. This magnetic attraction design provides a strong clamping force to ensure the stability and safety of the IC board during the heating process.
[0061] The magnetic attraction between the magnetic ring 611 and the metal guide rod 4 reduces the friction of the clamping member on the guide rod 4, thereby reducing the wear of the clamping member and the guide rod 4 and extending their service life. Due to the characteristics of the metal guide rod 4, the clamping member can move freely on the guide rod 4 to adapt to IC boards of different sizes and shapes. This flexibility enables the clamping mechanism to adapt to a variety of heating applications and IC board clamping requirements.
[0062] Example 2
[0063] Reference Figure 4-5 As shown, this embodiment is basically the same as embodiment 1, except that the clamping member includes a second clamping strip 66, and a group of first bolts 661 are arranged on both sides of the short side of the second clamping strip 66. The first bolts 661 are in an arc structure toward the guide rod 4, and the bolts are threadedly connected to the second clamping strip 66.
[0064] When in use, after the two second clamping bars 66 are adjusted to match the position of the IC board, the first bolt 661 is rotated so that the arc structure on one side of the bolt abuts against the side of the guide rod 4 to fix the second clamping bars 66.
[0065] A set of first bolts 661 are arranged on both sides of the short side of the second clamping bar 66, so that the clamping member can achieve fine adjustment of the position of the IC board by tightening or loosening the bolts. The user can accurately determine the position of the second clamping bar 66 relative to the IC board by adjusting the position of the bolts according to the size and shape of the IC board, thereby achieving accurate clamping of the IC board.
[0066] When the two second clamping bars 66 are adjusted to match the position of the IC board, by rotating the first bolt 661 , the arc structure on one side of the bolt can be tightly abutted against the side of the guide rod 4 , thereby fixing the second clamping bars 66 .
[0067] Moreover, the process of adjusting and fixing the clamping member is simple and intuitive, and can be completed by simply turning the first bolt 661. This operation mode is not only convenient and fast, but also can be adjusted during the heating process to meet the clamping requirements at different stages.
[0068] Example 3
[0069] Reference Figure 6-7As shown, this embodiment is basically the same as the embodiment 1, except that the clamping member includes a third clamping strip 67, a through groove 671 is provided inside the extended side direction of the third clamping strip 67, a group of abutment rods 672 are movably installed inside the through groove 671, a second bolt 673 is threadedly installed on the top of the third clamping strip 67, a group of push rods 674 are provided below the second bolt 673, and the end of the push rod 674 abuts against one end of the abutment rod 672;
[0070] The through slot 671 and the movably mounted abutment rod 672 inside the third clamping strip 67 enable the clamping member to have a larger clamping range and flexibility. By adjusting the second bolt 673, the up and down movement of the split push rod 674 can be controlled, thereby adjusting the position of the abutment rod 672, and achieving precise positioning of the guide rod 4 and adjustment of the clamping force.
[0071] A bearing 675 is provided between the second bolt 673 and the split push rod 674. The lower section of the second bolt 673 is welded to the inner ring of the bearing 675, and the top of the split push rod 674 is welded to the outer ring of the bearing 675. In this embodiment, the split push rod 674 is made of memory metal, which has good elasticity and durability, can maintain a stable clamping effect for a long time, and increases the service life and reliability of the clamp.
[0072] By disposing the bearing 675 , the second bolt 673 will not drive the split push rod 674 to rotate when rotating.
[0073] When in use, the second bolt 673 is rotated to push the split push rod 674 downward, so that the split push rod 674 further pushes the abutment rod 672 to compress the spring 678 and moves toward both sides until it abuts against the guide rod 4 to limit the guide rod 4. This operation method is simple and intuitive, and at the same time ensures the stability and controllability of the clamping process.
[0074] When the second bolt 673 is reset, the abutment rod 672 can be reset by the push of the spring 678 .
[0075] When installing the abutment rod 672 , the blocking blocks 679 on both sides of the through-slot 671 can be removed, and then the abutment rod 672 can be inserted into the through-slot 671 .
[0076] A clamping block 676 is provided inside the through slot 671 and extends inwardly. A spring 678 is fixedly sleeved on the outer ring of the abutting rod 672 , and one end of the spring 678 abuts against the clamping block 676 .
[0077] A gasket 677 is provided at the end of the abutment rod 672, and the gasket 677 is glued to the end of the abutment rod 672. The gasket 677 is fitted to the outer side of the guide rod 4. In this embodiment, the gasket 677 and the block 679 are made of rubber material. Good contact between the abutment rod 672 and the guide rod 4 is ensured, the friction between the clamping member and the guide rod 4 is increased, and the stability and safety of the clamping are further improved.
[0078] It should be noted that the equipment structure and drawings of the utility model mainly describe the principle of the utility model. In terms of the technology of the design principle, the settings of the power mechanism, power supply system and control system of the device are not fully described. On the premise that the technical personnel in this field understand the principle of the above utility model, the details of the power mechanism, power supply system and control system can be clearly known. The control method of the application document is automatic control through a controller, and the control circuit of the controller can be realized by simple programming by the technical personnel in this field;
[0079] The standard parts used therein can all be purchased from the market and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the structures and principles of the components known to technical personnel in this field can be known by these technical personnel through technical manuals or through conventional experimental methods.
[0080] The above description is only the preferred implementation of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. An adjustable IC board heating mechanism, characterized in that: include: A heating seat (1) with a built-in heating component, wherein a heating port (2) is arranged above the heating seat (1); A group of guide components symmetrically arranged above the heating seat (1), and a group of clamping members slidably mounted on the guide components; The two clamping members are slid on the guide assembly to adjust the distance, and the IC board is clamped and fixed by the two clamping members.
2. The adjustable IC board heating mechanism according to claim 1, characterized in that: The guide assembly comprises a group of positioning rods (3) symmetrically mounted above the heating seat (1), and a guide rod (4) connecting two positioning rods (3) in the same group, and the clamping member is slidably mounted on two guide rods (4) in different groups.
3. The adjustable IC board heating mechanism according to claim 1, characterized in that: The heating port (2) is located in the middle of the upper portion of the heating seat (1), and an isolation net (5) is provided above the heating port (2), and the isolation net (5) is embedded and fixed on the heating seat (1).
4. The adjustable IC board heating mechanism according to claim 1, characterized in that: A placement groove (62) is provided inwardly and obliquely upward on one side of the two clamping members, and the edge of the IC board is received through the placement groove (62).
5. The adjustable IC board heating mechanism according to claim 4, characterized in that: An anti-slip sheet (63) is embedded at the bottom of the placement groove (62), and the anti-slip sheet (63) abuts against the bottom of the edge of the IC board.
6. The adjustable IC board heating mechanism according to claim 4, characterized in that: The inner side surface of the placement groove (62) is also provided with a triangular recessed groove (64), and the triangular recessed groove (64) matches the included angle of the edge of the IC board.
7. The adjustable IC board heating mechanism according to claim 2, characterized in that: The clamping member comprises a first clamping strip (61), through holes are provided on both sides of the first clamping strip (61), a magnetic ring (611) is embedded in the inner side of the through hole, and the magnetic ring (611) is in contact with the guide rod (4).
8. The adjustable IC board heating mechanism according to claim 2, characterized in that: The clamping member comprises a second clamping strip (66), a group of first bolts (661) are arranged on both sides of the short side of the second clamping strip (66), the first bolts (661) are in an arc structure on the side facing the guide rod (4), and the bolts are threadedly connected to the second clamping strip (66).
9. The adjustable IC board heating mechanism according to claim 2, characterized in that: The clamping member comprises a third clamping strip (67), a through groove (671) is arranged inside the extended side direction of the third clamping strip (67), a group of abutment rods (672) are movably installed inside the through groove (671), a second bolt (673) is threadedly installed on the top of the third clamping strip (67), a group of push rods (674) are arranged below the second bolt (673), and the end of the push rod (674) abuts against one end of the abutment rod (672); A bearing (675) is provided between the second bolt (673) and the split push rod (674); the lower section of the second bolt (673) is welded to the inner ring of the bearing (675), and the top end of the split push rod (674) is welded to the outer ring of the bearing (675).
10. The adjustable IC board heating mechanism according to claim 9, characterized in that: A clamping block (676) is provided inwardly extending from the inside of the through groove (671); a spring (678) is fixedly sleeved on the outer ring of the abutment rod (672); one end of the spring (678) abuts against the clamping block (676); a gasket (677) is provided at the end of the abutment rod (672); and the gasket (677) is in contact with the outer side of the guide rod (4).