Jet device for wet process of integrated circuit

Abstract

The utility model relates to the technical field of circuit wet process jet flow, and discloses an integrated circuit wet process jet flow device which comprises an orifice plate and a nozzle, one side of the nozzle is provided with threads, and the middle of the nozzle is provided with a hole. In the utility model, after the long-range nozzle type pressure chamber is guided in, the phenomena that the flow field range is insufficient and the mass transfer effect is influenced can be eliminated, the quality is improved, the whole orifice plate needs to be replaced as long as a plurality of local holes of the short-range orifice plate are damaged and deformed, and as the cost of thin hole drilling is higher, only the clamping type long-range nozzle pressure chamber with a damaged nozzle needs to be replaced, so that the cost is reduced. And the use cost is low, the whole plate needs to be detached to pass through the holes by using needles when the holes are blocked in a short-range orifice plate, and the maintenance is inconvenient.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit wet process jet flow, in particular to an integrated circuit wet process jet flow device. Background Art

[0002] The wet process is an indispensable part of integrated circuit manufacturing. It involves the use of chemical solutions to clean, etch, deposit and other processes on the chip. The jet device is an important tool for implementing these wet processing steps. The main function of the jet device is to achieve uniform treatment of the chip surface by precisely controlling the spraying of chemical solutions. The most common type is the short-range orifice plate type. However, if a few holes of the short-range orifice plate are damaged or deformed, the entire orifice plate must be replaced. Because the cost of drilling fine holes is high, when the short-range orifice plate is found to be clogged, the entire plate must be disassembled and a needle must be used to drill the hole. Maintenance is inconvenient and the downtime is long. For this reason, an integrated circuit wet process jet device is proposed. Utility Model Content

[0003] The utility model aims to solve the shortcomings of the prior art and proposes a wet process jet device for integrated circuits.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solution: an integrated circuit wet process jet device includes an orifice plate and a nozzle, a screw thread is provided on one side of the nozzle, and a hole is provided in the middle of the nozzle.

[0005] As a further description of the above technical solution:

[0006] The orifice plate is provided with a plurality of thread grooves, and the thread teeth are threadedly connected in the thread grooves.

[0007] As a further description of the above technical solution:

[0008] The aperture of the orifice plate is 2.5 to 3.5 mm.

[0009] As a further description of the above technical solution:

[0010] The thickness of the orifice plate is 45 to 55 mm.

[0011] The utility model has the following beneficial effects:

[0012] 1. In the utility model, after the long-range nozzle pressure chamber is introduced, it is expected to eliminate the phenomenon of insufficient flow field range, which affects the mass transfer effect and improves the quality. For the short-range orifice plate type, as long as a few holes are damaged or deformed, the entire orifice plate must be replaced. Because the cost of drilling fine holes is high, the cost of using the plug-in long-range nozzle pressure chamber, which only needs to replace individual damaged nozzles, is low. For the short-range orifice plate type, when the hole is found to be blocked, the entire plate must be disassembled and a needle must be used to drill the hole, which is inconvenient for maintenance.

[0013] 2. In the utility model, a method of jet-type electroplating is performed by replacing a thin plate drilling-type pressure chamber with a long nozzle to eliminate the problem that the jet effect greatly reduces the resistance under the liquid surface, thereby improving the mass transfer effect. When the machine downtime is long and the long-range nozzle hole is blocked, only the problematic nozzle needs to be removed and replaced with a spare part. It is relatively convenient and saves downtime, and can be widely used in various wafer wet processes such as electroplating and etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structure of the integrated circuit wet process jet device proposed by the utility model;

[0015] Figure 2 A partial schematic diagram of the integrated circuit wet process jet device proposed by the utility model

[0016] Figure 3 A partial schematic diagram of the integrated circuit wet process jet device proposed by the utility model

[0017] Figure 4 It is a schematic diagram of drilling holes in a thin plate without the integrated circuit wet process jet device proposed by the utility model.

[0018] Legend:

[0019] 1. Orifice plate; 2. Nozzle; 3. Screw thread; 4. Thread groove; 5. Hole. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Reference Figure 1-Figure 2 The utility model provides an embodiment: an integrated circuit wet process jet device, including an orifice plate 1, a nozzle 2, a screw thread 3 is provided on one side of the nozzle 2, and a hole 5 is provided in the middle of the nozzle 2. The jet-type electroplating method is performed by replacing the thin plate drilling type pressure chamber with a long nozzle 2 to eliminate the problem of greatly weakening the resistance of the jet effect under the liquid surface, and improve the mass transfer effect. After the long-range nozzle type pressure chamber is introduced, it is expected to eliminate the phenomenon of insufficient flow field range and affecting the mass transfer effect, and improve the quality. For the short-range orifice plate type, as long as a few holes are damaged and deformed, the entire orifice plate must be replaced. Because the cost of fine hole drilling is relatively high, the cost of using the plug-in long-range nozzle pressure chamber that only needs to replace individual damaged nozzles is relatively low. When the short-range orifice plate type finds that the hole is blocked, the entire plate must be disassembled and a needle must be used to pierce the hole, which is inconvenient for maintenance.

[0022] A plurality of thread grooves 4 are arranged on the orifice plate 1, and the screw teeth 3 are threadedly connected in the thread grooves 4. The aperture of the orifice plate 1 is 2.5 to 3.5 mm, and the plate thickness of the orifice plate 1 is 45 to 55 mm. The jet-type electroplating method is performed by replacing the thin plate drilling-type pressure chamber with a long nozzle 2 to eliminate the trouble of greatly weakening the resistance of the jet effect under the liquid surface, thereby enhancing the mass transfer effect. When the machine downtime is long and the long-range nozzle-type hole is blocked, only the problem nozzle needs to be removed and replaced with a spare part. It is relatively convenient and saves downtime, and can be widely used in various wafer wet processes such as electroplating and etching applications.

[0023] Working principle: The screw thread 3 on the nozzle 2 is screwed into the inner thread groove 4 of the orifice plate 1, and then put into the device for use. When the long nozzle 2 receives the command of the control system, it will start to generate high-pressure and high-speed liquid flow. These liquid flows are sprayed onto the surface of the integrated circuit at a preset angle and speed to complete the process operations such as cleaning, etching or deposition. The long nozzle 2 replaces the thin plate drilling type pressure chamber for jet electroplating. The feature of the present invention is that the long nozzle 2 replaces the thin plate drilling type pressure chamber for jet electroplating to eliminate the trouble of greatly reducing the resistance of the jet effect under the liquid surface and enhance the mass transfer effect. After implementation, the following benefits can be achieved: the jet device is usually equipped with a high-precision control system, which can accurately adjust the flow rate, pressure and temperature of the jet liquid to meet the needs of different processes; the jet device can adapt to integrated circuits of different sizes and shapes, as well as different materials and process requirements. By replacing the nozzle and adjusting the jet parameters, flexible processing of different integrated circuits can be achieved; the jet device usually adopts an efficient liquid circulation system and energy-saving design, which can reduce energy consumption and operating costs, while improving production efficiency.

[0024] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit wet process jet device, comprising an orifice plate (1) and a nozzle (2), characterized in that: A screw thread (3) is provided on one side of the nozzle (2), a hole (5) is provided in the middle of the nozzle (2), a plurality of screw thread grooves (4) are provided on the orifice plate (1), and the screw thread (3) is threadedly connected in the screw thread groove (4).

2. The integrated circuit wet process jet device according to claim 1, characterized in that: The aperture of the orifice plate (1) is 2.5 to 3.5 mm.

3. The integrated circuit wet process jet device according to claim 1, characterized in that: The thickness of the orifice plate (1) is 45 to 55 mm.

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