Cutting fluid supply device and cutting fluid circulation system
By designing the cutting liquid supply device and using the container's trough body and module combination, the problem of poor circulation of the cutting liquid in the wire mesh is solved, and the reasonable supplementation and circulation management of the cutting liquid is realized, and the utilization rate and cutting quality of the cutting liquid are improved.
Patent Information
- Application Number
- CN202420466826.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-11
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-03-11
AI Technical Summary
In the prior art, the circulation of wire mesh cutting fluid is poor, which makes it difficult to properly adjust the amount of cutting fluid supplement, which can easily cause waste or affect the cutting quality.
A cutting liquid supply device is designed, and the reasonable replenishment and circulation management of the cutting liquid is achieved by dividing the container into a first tank body and a second tank body, and setting up an overflow channel, a liquid replenishment assembly, a liquid delivery assembly and a silicon powder concentration acquisition module.
Through this device, the number of cycles of the cutting liquid can be effectively increased, the cutting quality can be ensured, and the cutting liquid can be saved and utilization can be improved.
Smart Images

Figure CN222589251U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of wire cutting, and in particular relates to a cutting liquid supply device and a cutting liquid circulation system. Background Art
[0002] Wire cutting machine is a kind of equipment that uses diamond wire to cut hard and brittle materials. Wire cutting machine generally includes main roller, wire net and cutting fluid circulation system. The cutting fluid circulation system is used to spray cooling on wire net or workpiece to prevent overheating during cutting process.
[0003] The existing cutting fluid circulation system generally includes a cutting fluid supply device, a filter tank, a heat exchanger, a three-way assembly and a spray assembly. The spray assembly sprays at the cutting area, and the sprayed cutting fluid can flow back to the cutting fluid supply device. The cutting fluid supply device can be recycled and then pumped to the filter tube by the pumping assembly for filtration. The filtered cutting fluid enters the heat exchanger for heat exchange, then enters the three-way assembly, and finally returns to the spray assembly for continued spraying, thus completing the cycle. However, with the trend of thinning and fine-line slicing, the number of cycles in the cutting fluid increases, and the concentration of silicon powder is also getting higher and higher, resulting in the need to replenish more cutting fluid in the cycle. Excessive replenishment of cutting fluid is likely to cause waste of cutting fluid, while too little replenishment of cutting fluid is likely to cause an increase in silicon powder concentration, affecting the cutting quality. Therefore, it is difficult to achieve a reasonable allocation of the amount of cutting fluid replenished and the concentration of silicon powder in the cutting fluid.
[0004] Based on the above content, the technical problem to be solved by this application is: how to optimize the circulation of cutting fluid. Summary of the invention
[0005] The purpose of the utility model is to solve the above problems existing in the prior art and propose a cutting liquid supply device and a cutting liquid circulation system to solve the problem of poor circulation of wire mesh cutting liquid in the prior art. The technical effect of the application scheme is that the amount of cutting liquid can be reasonably supplemented to improve the cutting liquid circulation effect.
[0006] The purpose of the utility model can be achieved through the following technical solutions: A cutting liquid supply device, comprising: a container, the container comprising: a first tank body, the first tank body is provided with a liquid inlet and a first liquid discharge component, the liquid inlet is used to receive a first liquid, and the first liquid discharge component can control the first tank body to discharge the first liquid; a second tank body, the second tank body is arranged at one side of the first tank body, and an overflow channel is provided between the second tank body and the first tank body, and the overflow channel can allow the first liquid of the first tank body to overflow to the second tank body; a liquid replenishment component, the liquid replenishment component is arranged on the second tank body, and is used to replenish the second liquid into the second tank body; a liquid delivery component, the liquid delivery component is arranged at one side of the liquid delivery component, and the liquid delivery component leads to the outside of the container to form a liquid delivery pipeline, so as to deliver the first liquid and / or the second liquid of the second tank body into the liquid delivery pipeline; and a silicon powder concentration acquisition module, the silicon powder concentration acquisition module is arranged in the second tank body and / or on the liquid delivery pipeline to obtain silicon powder concentration information of the liquid, and the silicon powder concentration acquisition module is communicatively connected with the first liquid discharge component and / or the liquid replenishment component. Based on the silicon powder concentration information, the first drainage component performs a drainage operation and / or the liquid replenishing component performs a liquid replenishing operation.
[0007] In the above-mentioned cutting liquid supply device, an overflow component is provided between the first trough body and the second trough body, and the overflow component is movable to flexibly adjust the overflow amount of the overflow channel.
[0008] In the above-mentioned cutting liquid supply device, the overflow component includes: a first barrier member, which is arranged between the first trough body and the second trough body; a second barrier member, which is movably arranged relative to the first barrier member, and the second barrier member is adapted to movably adjust its position relative to the first barrier member based on the silicon powder concentration information.
[0009] In the above-mentioned cutting liquid supply device, a liquid level detection module is provided in the second tank body, and the liquid level detection module is used to detect and obtain the liquid level information in the second tank body, and the liquid level detection module is in communication connection with the liquid replenishing component and / or the overflow component. Based on the liquid level information, the liquid replenishing component performs a corresponding liquid replenishing operation, and / or the overflow component is activated to adjust the overflow amount of the overflow channel.
[0010] In the above-mentioned cutting liquid supply device, a stirring component is provided in the second tank body, and the stirring component acts in the second tank body. Based on the silicon powder concentration information, the stirring component performs a corresponding stirring operation.
[0011] In the above-mentioned cutting liquid supply device, the first trough body is at least partially transparent, and a visual detection unit is provided on the outside of the first trough body. The visual detection unit captures an image of the first liquid in the first trough body to detect and estimate the amount of silicon powder deposited in the first liquid. Based on the amount of silicon powder deposited, the first drainage component performs a corresponding drainage operation.
[0012] In the above-mentioned cutting liquid supply device, a second drainage component is provided on the second tank body, and the second drainage component controls the second tank body to communicate with or block the outside of the container. Based on the silicon powder concentration information, the second drainage component performs corresponding drainage operations.
[0013] In the above-mentioned cutting liquid supply device, a first filter component is provided below the liquid inlet, and the first filter component filters the first liquid.
[0014] Another object of the present utility model is to provide a cutting liquid circulation system, including the cutting liquid supply device, and also including: a second filter component, the second filter component is connected to the liquid delivery component; a heat exchange component, the heat exchange component is connected to the second filter component; a three-way component, the three-way component is connected to the heat exchange component; and a spray component, the spray component is connected to the three-way component, and the spray component is arranged above the cutting liquid supply device.
[0015] In the above-mentioned cutting liquid circulation system, at least one silicon powder concentration acquisition module is provided between the cutting liquid supply device, the second filter assembly, the heat exchange assembly, the three-way assembly and the spray assembly.
[0016] Compared with the prior art, the utility model has at least the following beneficial effects:
[0017] 1. By dividing the container into a first tank body and a second tank body, the silicon powder in the same container is prevented from increasing significantly with the increase of the number of cycles. The first tank body can filter most of the silicon powder in the first liquid, so that the cutting liquid overflowing to the second tank body is relatively clean. The relatively clean cutting liquid in the second tank body is then supplied to the outside of the container by the liquid delivery component, thereby ensuring that the cutting quality is not affected and effectively increasing the number of cycles of the cutting liquid;
[0018] 2. By setting up a silicon powder concentration acquisition module, the entire cutting liquid supply device is provided with a silicon powder concentration monitoring function, which can cooperate with the liquid replenishment component to more flexibly adjust the silicon powder concentration of the liquid in the second tank, or discharge the liquid in the first tank in time, thereby saving liquid replenishment and preventing the cutting quality of the workpiece from being affected;
[0019] 3. By setting an overflow component between the first tank body and the second tank body, the overflow volume of the overflow channel can be flexibly adjusted in accordance with the silicon powder concentration information, thereby controlling the replenishment component to replenish a small and appropriate amount of replenishment, and a better balance ratio can be achieved between the overflow volume and the replenishment volume, thereby ultimately improving the utilization rate of the cutting fluid;
[0020] 4. By setting up a liquid level detection module to detect the liquid level in the second tank, the overflow component and the liquid replenishing component can be coordinated to perform corresponding operations to adjust the liquid level in the second tank so that it is always in a healthier liquid level range, providing a more stable liquid supply environment for the liquid delivery component. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a three-dimensional structural schematic diagram of the cutting fluid supply device of the utility model;
[0022] Figure 2 This is a schematic diagram of the three-dimensional structure of the hidden part of the outer shell of the cutting fluid supply device of the utility model. Figure 1 ;
[0023] Figure 3 This is a schematic diagram of the three-dimensional structure of the hidden part of the outer shell of the cutting fluid supply device of the utility model. Figure 2 ;
[0024] Figure 4 This is a simplified structural diagram of the overflow component of the utility model that can be adjusted to two states. Figure 1 ;
[0025] Figure 5 This is a simplified structural diagram of the overflow component of the utility model that can be adjusted to two states. Figure 2 ;
[0026] Figure 6 It is a three-dimensional structural schematic diagram of the stirring assembly of the utility model;
[0027] Figure 7 It is a three-dimensional structural schematic diagram of the cutting fluid circulation system of the utility model;
[0028] Figure 8 It is a three-dimensional structural schematic diagram of the three-way assembly of the utility model;
[0029] Fig. 9 It is a schematic diagram of the signal path of the controller and each component or module of the utility model;
[0030] In the figure, 100, container; 110, first tank body; 111, liquid inlet; 112, first liquid discharge component; 113, first filter component; 120, second tank body; 121, second liquid discharge component; S, liquid delivery pipeline; 130, overflow channel; 140, overflow component; 141, first barrier; 142, second barrier; 143, drive unit; 200, liquid replenishment component; 300, liquid delivery component; 400, silicon powder concentration acquisition module; 500, liquid level detection module; 600, stirring component; 610, stirring motor; 620, stirring rod; 630, stirring bracket; 631, accommodating chamber; 640, ultrasonic vibration unit; 700, visual detection unit; 800, second filter component; 900, heat exchange component; 1000, three-way component; 1100, spray component. DETAILED DESCRIPTION
[0031] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.
[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0035] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0036] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.
[0037] See also Figure 1 and Figure 2The cutting liquid supply device of the present application includes a container 100 and a silicon powder concentration acquisition module 400. Among them, the container 100 includes a first tank body 110 and a second tank body 120. The first tank body 110 is provided with a liquid inlet 111 and a first liquid discharge component 112. The liquid inlet 111 is used to receive the first liquid. The first liquid discharge component 112 can control the first tank body 110 to discharge the first liquid; the second tank body 120 is arranged on one side of the first tank body 110, and an overflow channel 130 is provided between the second tank body 120 and the first tank body 110. The overflow channel 130 can allow the first liquid of the first tank body 110 to overflow to the second tank body 120. The second tank body 120 is also provided with a liquid replenishment component 200. and a liquid delivery component 300, the liquid replenishment component 200 can replenish the second liquid to the second tank body 120, the liquid delivery component 300 leads to the outside of the container 100 to form a liquid delivery pipeline S, so as to deliver the first liquid and / or the second liquid of the second tank body 120 into the liquid delivery pipeline S; the silicon powder concentration acquisition module 400 is arranged in the second tank body 120 and / or on the liquid delivery pipeline S to obtain the silicon powder concentration information of the liquid, and the silicon powder concentration acquisition module 400 is communicated with the first liquid discharge component 112 and / or the liquid replenishment component 200, as Fig. 9 Based on the silicon powder concentration information, the first draining component 112 performs a draining operation and / or the replenishing component 200 performs a replenishing operation.
[0038] It can be understood that by dividing the container 100 into a first tank body 110 and a second tank body 120, the liquid inlet 111 of the first tank body 110 is used to receive the first liquid, and the first liquid is at least a cutting liquid used once in the cutting area. Therefore, the first liquid contains more silicon powder, and the silicon powder can fall and settle in the first tank body 110, and the cleaner upper layer of the first liquid can enter the second tank body 120 through the overflow channel 130. The silicon powder concentration of the first liquid entering the second tank body 120 is low, and can be pumped to the liquid path outside the container 100 by the liquid delivery component 300 of the second tank body 120 until it is pumped to the cutting area, and then the cutting liquid used twice or more is recovered by the liquid inlet 111. Exemplarily, the liquid delivery component 300 can be a water pump.In addition, since it is difficult to meet the liquid supply demand in the second tank body 120 with only the overflowing first liquid, the present application also provides a liquid replenishing component 200 to replenish the second tank body 120 with a relatively clean second liquid. The first liquid and the second liquid are mixed and transported by the liquid delivery component 300, that is, the liquid supply demand is met. It should be noted that the amount of liquid replenishment has a certain correlation with the cutting quality. When the amount of the second liquid replenished in the second tank body 120 is small, it means that the second tank body 120 needs to receive more first liquid overflowing from the first tank body 110, and the silicon powder concentration of the first liquid is relatively high. For higher silicon powder concentrations, after multiple cycles, even in the overflow layer, the silicon powder concentration of the final pumped liquid will still increase after mixing, which can easily affect the cutting quality of the workpiece. If the amount of the second liquid added to the second tank body 120 is large, it means a large amount of waste of cutting liquid. Based on this, the present application adds a silicon powder concentration acquisition module 400, through which the silicon powder concentration in the second tank body 120 is obtained, and a standard concentration is set for the silicon powder concentration in the second tank body 120. When the actual silicon powder concentration detected is greater than or equal to the set standard concentration, it is necessary to increase the amount of liquid replenishment to obtain the silicon powder concentration in the second tank body 120. Lowering the actual silicon powder concentration in the second tank body 120 also means that the actual silicon powder concentration in the first tank body 110 is higher. The first liquid discharge component 112 can optionally discharge part or all of the first liquid in the first tank body 110 to reduce the silicon powder concentration of the first liquid overflowing from the overflow channel 130 next time. When the detected actual silicon powder concentration is less than the set standard concentration, it is not necessary to replenish the liquid, nor is it necessary to perform a liquid discharge operation on the first liquid discharge component 112 in the first tank body 110, and it is sufficient to wait for overflow. The first liquid discharge component 112 includes a first liquid discharge pipe and The first proportional valve can effectively control the discharge amount of the first liquid discharged from the first drainage pipe. The refilling assembly 200 may include a refilling pipe and a second proportional valve. The refilling pipe is connected to an external cutting liquid source, and the second proportional valve controls the refilling amount of the refilling pipe; wherein, a signal receiver is provided on the proportional valve and the refilling pipe, and the silicon powder concentration acquisition module 400 is connected to the proportional valve and / or the refilling pipe through a controller. The controller is responsible for receiving and processing information from the silicon powder concentration acquisition module 400, and controlling the first drainage assembly and / or the refilling assembly to perform corresponding operations. It should be noted that when the silicon powder concentration acquisition module 400 is on the liquid delivery pipeline S of the liquid delivery assembly 300, obtaining the liquid silicon powder concentration of the pipeline is equivalent to obtaining the liquid silicon powder concentration in the second tank 120. To sum up, the setting of the first tank body 110 is equivalent to adding a more continuous filtering structure, which filters a large amount of silicon powder and can effectively increase the circulation times of the first liquid; the setting of the silicon powder concentration acquisition module 400 provides a silicon powder concentration monitoring function for the entire cutting liquid supply device, and can cooperate with the liquid replenishing component 200 to more flexibly adjust the silicon powder concentration of the liquid in the second tank body 120, thereby saving cutting fluid while preventing the cutting quality from being affected.
[0039] See also Figure 1 In some embodiments, the first tank body 110 of the present application is at least partially transparent, and a visual inspection unit 700 is provided on the outside of the first tank body 110. The visual inspection unit 700 captures an image of the first liquid in the first tank body 110 to detect and estimate the amount of silicon powder deposited in the first liquid. Based on the amount of silicon powder deposited, the first liquid discharge component 112 performs a corresponding liquid discharge operation. It can be understood that the visual inspection unit 700 is disposed on the outside of the first tank body 110 to avoid being damaged by the friction of the silicon powder in the first tank body 110. Due to the deposition of silicon powder in the first tank body 110, the distribution of silicon powder between liquid layers is relatively different. Therefore, by setting the visual inspection unit 700 to capture an image from the transparent part of the outside of the first tank body 110, the amount of silicon powder deposited is estimated and determined according to the color difference information of the image, so as to control the first liquid discharge component 112 to perform corresponding operations, such as level control of the liquid discharge amount and liquid discharge speed.
[0040] Continue to refer to Figure 1 In some embodiments, a second drainage component 121 is provided on the second tank body 120, and the second drainage component includes a second proportional valve or a pinch valve, and a signal receiver. The signal receiver of the second drainage component is connected to the silicon powder concentration module through a controller. The controller receives the silicon powder concentration information of the silicon powder concentration module, and based on the silicon powder concentration information, the controller controls the second drainage component 121 to perform the corresponding drainage operation. It can be understood that when the silicon powder concentration information obtained exceeds a certain value, and the rehydration component 200 cannot replenish the liquid in time to reduce the silicon powder concentration in the second tank body 120, such as when the liquid level of the second tank body 120 exceeds a certain value, the second drainage component 121 will start the drainage, thereby providing sufficient rehydration space for the rehydration component 200 so that the rehydration component 200 can replenish the liquid normally, thereby reducing the liquid silicon powder concentration in the second tank body 120. In some embodiments, the second drainage component 121 can use a pinch valve instead of the second proportional valve.
[0041] See also Figure 2 In some embodiments, a first filter assembly 113 is provided below the liquid inlet 111, and the first filter assembly 113 filters the first liquid. It is understandable that before the first liquid enters the first tank body 110, it needs to be pre-screened by the first filter assembly 113, and silicon powder or other larger particles with larger particles are placed on the first filter assembly 113, and only smaller silicon powder particles can enter the first tank body 110 through the first filter assembly 113. Exemplarily, the first filter assembly includes a filter screen (not shown in the figure), and the filter screen is plugged into the container 100.
[0042] join Figure 3In the cutting liquid supply device of the present application, an overflow assembly 140 is provided between the first tank body 110 and the second tank body 120. The overflow assembly 140 is movable to adjust the overflow amount of the overflow channel 130. The overflow assembly 140 includes a signal receiver, which is in communication connection with an external controller and a silicon powder concentration acquisition module 400. The controller receives silicon powder concentration information from the silicon powder concentration acquisition module 400 and sends corresponding execution information to the signal receiver of the overflow assembly 140 to control the overflow assembly 140 to adjust the overflow amount of the overflow channel 130. It can be understood that, when the silicon powder concentration acquisition module 400 acquires a lower silicon powder concentration, in order to reduce the waste of cutting liquid, the liquid replenishing component 200 will not replenish or only replenish a small amount of the second liquid, and most of the cutting liquid supply pressure is given to the first liquid overflowing from the first tank body 110. In the normal overflow state, the overflow amount of the first liquid is small and it is difficult to stably supply a large flow. Based on this, the present application sets an overflow component 140 between the first tank body 110 and the second tank body 120 to adjust the overflow amount of the overflow channel 130 according to the liquid silicon powder concentration information in the second tank body 120. That is, when the liquid silicon powder concentration in the second tank body 120 is low, the overflow component 140 increases the overflow amount of the overflow channel 130, and when the liquid silicon powder concentration in the second tank body 120 is high, the overflow component 140 reduces the overflow amount of the overflow channel 130 and can even close the overflow channel 130 to prevent overflow.
[0043] Please refer to Figure 2 and Figure 3In some embodiments, a liquid level detection module 500 is provided in the second tank body 120 of the present application, and the liquid level detection module 500 is used to detect and obtain the liquid level information in the second tank body 120. The liquid level detection module is communicated with the fluid replenishment component and / or the overflow component through a controller. Based on the liquid level information sent by the liquid level detection module 500 to the controller, the fluid replenishment component 200 performs a corresponding fluid replenishment operation, and / or the overflow component 140 is activated to adjust the overflow amount of the overflow channel 130. It is understandable that the supply of cutting fluid needs to be continuous and stable, and this continuity and stability is based on the sufficient storage capacity of liquid in the second tank body 120, that is, the minimum liquid level height and the maximum liquid level height need to be set in the second tank body 120. When the acquired liquid level information indicates that the actual liquid level height in the second tank body 120 is lower than the set minimum liquid level height, it indicates that the liquid delivery component 300 is difficult to maintain a stable supply of cutting fluid. Therefore, the fluid replenishment component 200 needs to increase the fluid replenishment volume / increase the fluid replenishment speed in time, or the overflow component 140 is activated to increase the overflow volume of the overflow channel 130, thereby ensuring that the liquid delivery component 300 can stably supply cutting fluid. When the acquired liquid level information indicates that the actual liquid level height in the second tank body 120 is higher than the set maximum liquid level height, it indicates that the second tank body 120 is about to be full or the liquid in the second tank body 120 is about to overflow to the first tank body 110. At this time, the fluid replenishment component 200 needs to reduce the fluid replenishment amount / reduce the fluid replenishment speed / stop the fluid replenishment in time, or the overflow component 140 is activated to reduce the overflow amount of the overflow channel 130, or even close the overflow channel 130 to provide a stable liquid supply environment.
[0044] See also Figure 3-Figure 5The overflow assembly 140 of the present application includes a first barrier 141, a second barrier 142, a signal receiver (not shown in the figure) and a driving unit 143. The first barrier 141 is arranged between the first trough body 110 and the second trough body 120, and the second barrier 142 is movably arranged relative to the first barrier 141. The signal receiver is communicatively connected with a controller and a silicon powder concentration acquisition module 400. Based on the silicon powder concentration information, the controller sends a command to the signal receiver to control the driving unit 143 to drive the second barrier 142 to movably adjust its position relative to the first barrier 141. Exemplarily, in some embodiments, the first barrier 141 is vertically placed in the container 100 to divide the container 100 into the first tank body 110 and the second tank body 120. The first barrier 141 blocks most of the first liquid from entering the second tank body 120. The driving unit 143 drives the second barrier 142 to be rotatably connected / slidably connected to the first barrier 141. The second barrier 142 rotates / slides to change the minimum height of the overflow channel 130 or the overflow area of the overflow channel 130, thereby achieving the control of the overflow amount. In some embodiments, the driving unit 143 drives the second barrier 142 to be set on the first barrier 141 in a telescopic manner, which can also change the minimum height or overflow area of the overflow channel 130. In some embodiments, both the first barrier 141 and the second barrier 142 can be movable, and the joint movement of the two can also adjust the overflow amount.
[0045] See also Figure 6In some embodiments, a stirring assembly 600 is provided in the second tank body 120, and the stirring assembly 600 acts in the second tank body 120. Based on the silicon powder concentration information, the stirring assembly 600 performs a corresponding stirring operation. It can be understood that since the first liquid overflowing from the first tank body 110 to the second tank body 120 has a higher silicon powder concentration than the second liquid replenished by the liquid replenishing assembly 200, after the two liquids are mixed in the second tank body 120, the silicon powder concentration of each layer of the liquid is not uniform. When the liquid delivery assembly 300 delivers the liquid, it delivers it in the order of the liquid layers, and does not homogenize the liquid, which easily causes the silicon powder concentration of part of the liquid delivered to the cutting area to not meet the cutting requirements, thereby affecting the cutting quality. Therefore, in order to avoid affecting the cutting quality, the stirring assembly 600 is provided to homogenize the liquid in the second tank body 120. In particular, when the obtained silicon powder concentration information indicates that the silicon powder concentration is high, the power of the stirring component 600 is configured to be high power, when the obtained silicon powder concentration information indicates that the silicon powder concentration is normal, the power of the stirring component 600 is configured to be low power, and when the obtained silicon powder concentration information indicates that the silicon powder concentration is low, the power of the stirring component 600 is configured to be ultra-low power or the stirring operation is turned off. Exemplarily, the stirring component 600 includes a stirring motor 610 and a stirring rod 620, the output shaft of the stirring motor 610 is connected to the stirring rod 620, the stirring rod 620 is provided with a stirring bracket 630, the stirring bracket 630 is provided with a receiving chamber 631, and the receiving chamber 631 contains an ultrasonic vibration unit 640, the stirring motor 610 drives the stirring rod 620 to rotate, the stirring rod 620 rotates to drive the stirring bracket 630 to rotate, and when the stirring bracket 630 rotates and stirs, the ultrasonic vibration unit 640 generates ultrasound to improve the mixing effect of the liquid and make the distribution of the silicon powder more uniform.
[0046] join Figure 7 The cutting liquid circulation system of the present application includes a cutting liquid supply device, a second filter assembly 800, a heat exchange assembly 900, a three-way assembly 1000 and a spray assembly 1100. Among them, the second filter assembly 800 is connected to the liquid delivery assembly 300, the heat exchange assembly 900 is connected to the second filter assembly 800, the three-way assembly 1000 is connected to the heat exchange assembly 900, the spray assembly 1100 is connected to the three-way assembly 1000, and the spray assembly 1100 is arranged above the cutting liquid supply device. It can be understood that the second filter assembly 800 is used to perform secondary filtration on the cutting liquid delivered by the liquid delivery assembly 300, the heat exchange assembly 900 is used for heat exchange, the three-way assembly 1000 is used to control the circulation of the cutting liquid, and the spray assembly 1100 is used to spray the cutting liquid to the cutting area, and finally the cutting liquid falling from the cutting area is received by the liquid inlet 111 of the cutting liquid supply device to complete the whole cycle.
[0047] join Figure 8In the cutting liquid circulation system of the present application, there is at least one silicon powder concentration acquisition module 400 between the cutting liquid supply device, the second filter component 800, the heat exchange component 900, the three-way component 1000 and the spray component 1100. It can be understood that at least one silicon powder concentration acquisition module 400 for monitoring the silicon powder concentration is required in the liquid path between each device, module or component, so as to ensure that the cutting liquid entering the cutting area meets the concentration requirements. Preferably, the silicon powder concentration acquisition module 400 is arranged on the three-way component 1000, so as to facilitate the circulation of the cutting liquid according to the silicon powder concentration information.
[0048] Working principle: Before cutting, the liquid replenishing component 200 supplies a clean second liquid into the second tank body 120. When the liquid level detection module 500 detects that the liquid level in the second tank body 120 is higher than the set minimum liquid level height, the liquid delivery component 300 can be turned on to deliver the liquid. The liquid delivery component 300 delivers the liquid in the second tank body 120 into the second filter component 800, and then the second filter component 800 delivers the liquid into the heat exchange component 900 for heat exchange. The liquid after heat exchange is then delivered to the three-way component 1000, and the three-way component 1000 passes the liquid into the spray component 1100. The spray component 1100 sprays the liquid to the cutting area. The liquid used in the cutting area is converted into the first liquid. The first liquid enters from the feed port of the cutting liquid supply device below, and is initially filtered through the first filter component 113 into the first tank body 110 to screen out large particles of silicon powder. The upper layer of the first liquid in the first tank body 110 is a relatively clean liquid, and the lower layer is a small silicon powder deposition layer. The upper layer of the first liquid enters the second tank body 120 through the overflow channel 130, and is stirred by the stirring component 600 in the second tank body 120, so that the first liquid is mixed with the second liquid, and the silicon powder concentration acquisition module 400 obtains the silicon powder concentration of the second tank body 120. When the silicon powder concentration is high, the overflow component 140 is activated to reduce the overflow of the overflow channel 130, and increase the replenishment amount of the liquid replenishment component 200, and increase the stirring power of the stirring component 600, so as to quickly reduce the silicon powder concentration of the liquid in the second cavity. On the contrary, the overflow component 140 is activated to increase the overflow of the overflow channel 130, and reduce the replenishment amount of the liquid replenishment component 200, and reduce the stirring power of the stirring component 600, so as to prevent the waste of replenishment; finally, the liquid delivery component 300 delivers the mixed liquid to the second filter component 800, thereby entering the second cycle. Finally, after the entire workpiece is cut, the cutting fluid in the first trough 110 is drained through the first drainage component 112, and the cutting fluid in the second trough 120 is drained through the second drainage component 121, waiting for the next workpiece to be cut, and then the fluid replenishing component 200 is used again to replenish the fluid.
[0049] Beneficial effect: By dividing the container 100 into a first tank body 110 and a second tank body 120, it is prevented that the silicon powder in the same container 100 increases significantly with the increase of the number of cycles. The first tank body 110 can filter most of the silicon powder in the first liquid, so that the cutting liquid overflowing to the second tank body 120 is relatively clean, and then the relatively clean cutting liquid in the second tank body 120 is supplied to the outside of the container 100 for use by the liquid delivery component 300, thereby ensuring that the cutting quality is not affected and the number of cycles of the cutting liquid can be effectively increased; by setting a silicon powder concentration acquisition module 400, a silicon powder concentration monitoring function is provided for the entire cutting liquid supply device, which can cooperate with the liquid replenishment component 200 to more flexibly adjust the silicon powder concentration of the liquid in the second tank body 120, or discharge the liquid in the first tank body 110 in time, thereby saving liquid replenishment and Prevent the cutting quality of the workpiece from being affected; by setting an overflow component 140 between the first trough body 110 and the second trough body 120, the overflow amount of the overflow channel 130 can be flexibly adjusted in conjunction with the silicon powder concentration information, thereby controlling the refill component 200 to replenish a smaller and appropriate amount of refill, and a better balance ratio can be achieved between the overflow amount and the refill amount, ultimately improving the utilization rate of the cutting fluid; by setting a liquid level detection module 500 to detect the liquid level in the second trough body 120, the overflow component 140 and the refill component 200 can be coordinated to perform corresponding operations to adjust the liquid level in the second trough body 120, so that it is always in a healthier liquid level range, providing a more stable liquid supply environment for the liquid delivery component 300; by setting a stirring component 600, based on the silicon powder concentration information, more effective stirring power is provided, which is more energy-saving and environmentally friendly.
[0050] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.
Claims
1. A cutting fluid supply device, characterized in that: include: A container (100), the container (100) comprising: A first tank body (110), wherein the first tank body (110) is provided with a liquid inlet (111) and a first liquid discharge assembly (112), wherein the liquid inlet (111) is used to receive a first liquid, and the first liquid discharge assembly (112) can control the first tank body (110) to discharge the first liquid; a second tank body (120), the second tank body (120) being arranged on one side of the first tank body (110), an overflow channel (130) being provided between the second tank body (120) and the first tank body (110), the overflow channel (130) being capable of allowing the first liquid in the first tank body (110) to overflow into the second tank body (120); a liquid replenishing assembly (200), the liquid replenishing assembly (200) being arranged on the second tank body (120) and being used for replenishing the second liquid into the second tank body (120); a liquid delivery component (300), the liquid delivery component (300) being arranged on one side of the liquid replenishing component (200), and the liquid delivery component (300) leading to the outside of the container (100) to form a liquid delivery pipeline (S), so as to deliver the first liquid and / or the second liquid of the second tank (120) into the liquid delivery pipeline (S); as well as A silicon powder concentration acquisition module (400), the silicon powder concentration acquisition module (400) is arranged in the second tank (120) and / or on the liquid delivery pipeline (S) to obtain silicon powder concentration information of the liquid, and the silicon powder concentration acquisition module (400) is communicatively connected with the first liquid discharge component (112) and / or the liquid replenishment component (200).
2. The cutting liquid supply device according to claim 1, characterized in that: An overflow component (140) is provided between the first tank body (110) and the second tank body (120), and the overflow component (140) is movable to adjust the overflow amount of the overflow channel (130).
3. The cutting liquid supply device according to claim 2, characterized in that: The overflow assembly (140) comprises: a first blocking member (141), wherein the first blocking member (141) is disposed between the first tank body (110) and the second tank body (120); A second barrier (142), wherein the second barrier (142) is movably arranged relative to the first barrier (141), and the overflow channel (130) is formed between the first barrier (141) and the second barrier (142), or the overflow channel (130) is formed on the top of the second barrier (142).
4. The cutting liquid supply device according to claim 2, characterized in that: A liquid level detection module (500) is provided in the second tank body (120), and the liquid level detection module (500) is used to detect and obtain liquid level information in the second tank body (120), and the liquid level detection module (500) is communicatively connected with the liquid replenishing component (200) and / or the overflow component (140).
5. The cutting liquid supply device according to claim 1, characterized in that: A stirring assembly (600) is provided in the second tank body (120) for stirring the liquid in the second tank body (120).
6. The cutting liquid supply device according to claim 1, characterized in that: The first tank body (110) is at least partially transparent, and a visual detection unit (700) is provided on the outside of the first tank body (110) for capturing an image of the first liquid in the first tank body (110).
7. The cutting liquid supply device according to claim 1, characterized in that: The second tank body (120) is provided with a second liquid discharge component (121), and the second liquid discharge component (121) controls the second tank body (120) to communicate with or block the outside of the container.
8. The cutting liquid supply device according to claim 1, characterized in that: A first filter assembly (113) is provided below the liquid inlet (111), and the first filter assembly (113) is used to filter the first liquid.
9. A cutting fluid circulation system, characterized in that: The cutting liquid supply device according to any one of claims 1 to 8 further comprises: A second filter assembly (800), the second filter assembly (800) being connected to the liquid delivery assembly (300); A heat exchange component (900), wherein the heat exchange component (900) is connected to the second filter component (800); A three-way assembly (1000), the three-way assembly (1000) being connected to the heat exchange assembly (900); and A spray assembly (1100), the spray assembly (1100) is connected to the three-way assembly (1000), and the spray assembly (1100) is arranged above the cutting liquid supply device.
10. The cutting fluid circulation system according to claim 9, characterized in that: At least one silicon powder concentration acquisition module (400) is provided between the cutting liquid supply device, the second filter assembly (800), the heat exchange assembly (900), the three-way assembly (1000) and the spray assembly (1100).