Novel cavity heating plate

Abstract

The utility model discloses a novel cavity heating plate, which comprises a cavity, a heating plate and an auxiliary component, the cavity comprises an outer cavity and an inner cavity, the inner cavity is mounted in the outer cavity in an embedding manner, an inner supporting plate is mounted on a bottom wall plate of the inner cavity, and the inner supporting plate is of a hollow structure; the heating disc comprises a heating disc body, the upper end of the heating disc body is embedded in the hollow position of the inner supporting plate, and a heating plate is arranged on the heating disc body; the accessory assembly comprises a thermocouple and a cooling pipe. The aluminum heating plate only heats a silicon wafer needing to be sputtered, and has the advantages of being small in energy consumption and accurate in heating. The heating plate is independently controlled by a thermocouple, so that the temperature is more uniform and accurate; the heating disc is provided with a cooling water pipe, rapid cooling can be achieved after sputtering is completed, and the cooling time is short; an armored heating pipe is embedded in the heating disc, so that the service life is longer; and the heating disc is locally and precisely heated to avoid long-time heating of the cavity, so that the maintenance cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a novel cavity heating plate. Background Art

[0002] With the rapid development of my country's economic construction, the market demand for semiconductor components is increasing, which has led to the rapid development of the semiconductor processing industry.

[0003] A heating plate is provided inside the vacuum coating cavity, but the existing cavity heating plate has the following problems when used:

[0004] 1. The equipment is heated by halogen tubes, which consumes a lot of energy, disperses heat, and causes uneven heating;

[0005] 2. The temperature measurement method is to measure the temperature of the entire cavity, which results in uneven temperature and large temperature difference;

[0006] 3. The heating tube has a short service life;

[0007] 4. There is no cooling system in the cavity, and the cavity always maintains a high temperature state;

[0008] 5. The interior of the cavity is oxidized due to high temperature for a long time, which makes maintenance difficult and costly.

[0009] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0010] The purpose of the utility model is to provide a novel cavity heating plate, which can solve the problems existing in the use of the existing cavity heating plate.

[0011] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:

[0012] A novel cavity heating plate, comprising:

[0013] The cavity comprises an outer cavity and an inner cavity, wherein the inner cavity is installed in the outer cavity by means of inlay, an inner support plate is installed on the bottom wall plate of the inner cavity, and the inner support plate is arranged as a hollow structure; the cavity structure of the outer cavity is used to ensure the isolation of the internal sputtering from the external air, and the cavity structure of the inner cavity is used to limit the space for the sputtering of the silicon wafer.

[0014] The heating plate comprises a heating plate body, the upper end of which is embedded in the hollow of the inner support plate, and a heating plate is arranged on the heating plate body; the heating plate body is a heating main body, which is used to provide heat to the silicon wafer, and the heating plate enables the heat generated by the heating plate body to be transferred more evenly.

[0015] The accessory assembly includes a thermocouple and a cooling tube. A thermocouple base is provided at one end of the thermocouple. The thermocouple base is installed in the heating plate body. The cooling tube is provided as a coil and installed in the heating plate body. The thermocouple is used to directly detect the temperature of the heating plate body, so as to accurately feed back the temperature of the heating plate body to the temperature control system. The cooling tube is used to quickly cool the heating plate body after the heating of the heating plate body is stopped, so as to keep the temperature of the heating plate within a safe temperature.

[0016] In one or more embodiments of the utility model, the bottom wall plate of the inner cavity is set as a hollow structure, and the inner support plate is embedded in the hollow part of the bottom wall plate of the inner cavity. The bottom wall plate of the inner cavity is set as a hollow structure, so that the inner support plate is easy to install.

[0017] In one or more embodiments of the present invention, the heating plate body is made of aluminum. The heating plate body made of aluminum only heats the silicon wafer that needs to be sputtered, and has the characteristics of low energy consumption and precise heating.

[0018] In one or more embodiments of the utility model, the upper surface of the heating plate and the upper surface of the inner cavity of the inner support plate are arranged on the same horizontal plane, and an insulating sleeve is arranged between the heating plate and the inner support plate. The upper surface of the heating plate and the upper surface of the inner cavity of the inner support plate are arranged on the same horizontal plane, so that the heat transferred by the heating plate can heat the silicon wafer more efficiently. At the same time, an insulating sleeve is arranged between the heating plate and the inner support plate, so that the heating plate body and the cavity are insulated.

[0019] In one or more embodiments of the utility model, a heat insulation board is provided at the bottom of the heating plate body, and a support board is provided at the lower end of the heat insulation board. The heat insulation board is used to support the heating plate and reduce the heat loss of the heating plate from radiating downward, and the support board is used to support the heat insulation board.

[0020] In one or more embodiments of the utility model, a plurality of support rods are fixedly connected to the bottom wall plate of the outer cavity, and an adjusting screw is fixedly connected to the plurality of support rods. There are four support rods, and the four support rods are distributed at the four corners of the support plate.

[0021] In one or more embodiments of the utility model, the adjusting screw passes through the support plate, and the adjusting screw is provided with adjusting nuts on the side walls on both sides of the support plate. By passing the adjusting screw through the support plate, the height of the heating plate body can be adjusted through the support plate under the action of the adjusting nut, so that the surface of the heating plate body is level while ensuring that the upper surface of the heating plate and the upper surface of the inner cavity of the inner support plate are on the same level.

[0022] In one or more embodiments of the utility model, a first mounting plate is provided at one end of the thermocouple away from the thermocouple base, and the first mounting plate is mounted on the bottom wall plate of the outer cavity. The first mounting plate is used to fix the thermocouple on the outer cavity so that the thermocouple is stable when used.

[0023] In one or more embodiments of the utility model, a water inlet pipe is provided at one end of the cooling pipe, and a water return pipe is provided at the other end of the cooling pipe, and the ends of the water inlet pipe and the water return pipe away from the cooling pipe pass through the outer cavity and are placed outside the outer cavity. Cooling water can enter the cooling pipe through the water inlet pipe, so as to cool the heating plate body after suspending heating through the cooling pipe.

[0024] In one or more embodiments of the utility model, a second mounting plate is installed at one end of the water inlet pipe and the water return pipe outside the outer cavity, and the second mounting plate is installed on the bottom wall plate of the outer cavity. The second mounting plate is used to fix the water inlet pipe and the water return pipe on the outer cavity, so that the water inlet pipe and the water return pipe are stable when in use.

[0025] Compared with the prior art, the utility model has the following advantages:

[0026] 1. The aluminum heating plate only heats the silicon wafer that needs to be sputtered, with the characteristics of low energy consumption and precise heating;

[0027] 2. The heating plate has independent thermocouple temperature control, making the temperature more uniform and accurate;

[0028] 3. The heating plate is equipped with a cooling water pipe, which can be cooled quickly after sputtering, and the cooling time is short;

[0029] 4. The armored heating tube embedded in the heating plate has a longer service life;

[0030] 5. The local precise heating of the heating plate prevents the cavity from being heated for a long time, reducing the cost of maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 This is a front view of a new type of cavity heating plate in one embodiment of the utility model;

[0033] Figure 2 It is a three-dimensional diagram of a novel cavity heating plate in one embodiment of the utility model;

[0034] Figure 3 It is a cross-sectional view of a novel cavity heating plate in one embodiment of the utility model;

[0035] Figure 4 In one embodiment of the utility model Figure 3 The enlarged view of point A in the middle;

[0036] Figure 5 This is a schematic diagram of the structure inside the cavity in one embodiment of the utility model;

[0037] Figure 6 It is a schematic structural diagram of the inner support plate in one embodiment of the utility model.

[0038] Description of main reference numerals:

[0039] 1-cavity, 11-outer cavity, 12-inner cavity, 13-inner support plate, 2-heating plate, 21-heating plate body, 22-heating plate, 23-insulation plate, 24-support plate, 25-support rod, 26-adjusting screw, 27-insulating sleeve, 3-accessory components, 31-thermocouple, 32-thermocouple base, 33-first mounting plate, 34-cooling pipe, 35-water inlet pipe, 36-water return pipe, 37-second mounting plate. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0041] like Figure 1 to Figure 3 As shown, a new cavity heating plate in an embodiment of the utility model includes a cavity 1, a heating plate 2 and an auxiliary component 3.

[0042] like Figure 1 to Figure 3 As shown, the cavity 1 includes an outer cavity 11 and an inner cavity 12. The inner cavity 12 is installed in the outer cavity 11 in an inlaid manner. An inner support plate 13 is installed on the bottom wall of the inner cavity 12. The inner support plate 13 is set to a hollow structure. The cavity structure of the outer cavity 11 ensures that the internal sputtering is isolated from the external air, and the cavity structure of the inner cavity 12 limits the space for sputtering of the silicon wafer.

[0043] like Figure 2 and Figure 3As shown, the bottom wall plate of the inner cavity 12 is set as a hollow structure, and the inner support plate 13 is embedded in the hollow part of the bottom wall plate of the inner cavity 12. The bottom wall plate of the inner cavity 12 is set as a hollow structure, so that the inner support plate 13 is easy to install.

[0044] like Figure 1 to Figure 4 As shown, the heating plate 2 includes a heating plate body 21, the upper end of the heating plate body 21 is embedded in the hollow part of the inner support plate 13, and a heating plate 22 is arranged on the heating plate body 21; the heating plate body 21 is a heating body, which is used to provide heat to the silicon wafer, and the heating plate 22 enables the heat generated by the heating plate body 21 to be transferred more evenly.

[0045] Preferably, the heating plate body 21 is made of aluminum. The heating plate body 21 made of aluminum only heats the silicon wafer to be sputtered, and has the characteristics of low energy consumption and precise heating.

[0046] like Figure 3 Combination Figure 4 As shown, the upper surface of the heating plate 22 and the upper surface of the inner cavity of the inner support plate 13 are arranged on the same horizontal plane, and an insulating sleeve 27 is arranged between the heating plate 22 and the inner support plate 13. The upper surface of the heating plate 22 and the upper surface of the inner cavity of the inner support plate 13 are arranged on the same horizontal plane, so that the heat transferred by the heating plate 22 can heat the silicon wafer more efficiently. At the same time, an insulating sleeve 27 is arranged between the heating plate 22 and the inner support plate 13, so that the heating plate body 21 is insulated from the cavity 1.

[0047] like Figure 3 Combination Figure 4 As shown, a heat insulation board 23 is provided at the bottom of the heating plate body 21, and a support board 24 is provided at the lower end of the heat insulation board 23. The heat insulation board 23 is used to support the heating plate 22 while reducing the heat radiation loss of the heating plate 22 downward, and the support board 24 is used to support the heat insulation board 23.

[0048] like Figure 3 Combination Figure 4 As shown, a plurality of support rods 25 are fixedly connected to the bottom wall plate of the outer cavity 11, and an adjusting screw 26 is fixedly connected to each of the plurality of support rods 25. Four support rods 25 are provided, and the four support rods 25 are distributed at the four corners of the support plate 24.

[0049] like Figure 3 Combination Figure 4As shown, the adjusting screw 26 passes through the support plate 24, and the adjusting screw 26 is provided with adjusting nuts on the side walls on both the upper and lower sides of the support plate 24. By passing the adjusting screw 26 through the support plate 24, the height of the heating plate body 21 can be adjusted through the support plate 24 under the action of the adjusting nut, so that the surface of the heating plate body 21 is level while ensuring that the upper surface of the heating plate 22 and the upper surface of the inner cavity of the inner support plate 13 are on the same level.

[0050] like Figure 3 to Figure 6 As shown, the accessory component 3 includes a thermocouple 31 and a cooling tube 34. A thermocouple base 32 is provided at one end of the thermocouple 31. The thermocouple base 32 is installed in the heating plate body 21. The cooling tube 34 is provided as a coil and installed in the heating plate body 21. The thermocouple 31 is used to directly detect the temperature of the heating plate body 21, so as to accurately feed back the temperature of the heating plate body 21 to the temperature control system. The cooling tube 34 is used to quickly cool the heating plate body 21 after the heating of the heating plate body 21 is stopped, so as to keep the temperature of the heating plate within a safe temperature.

[0051] like Figures 4 to 6 A first mounting plate 33 is provided at one end of the thermocouple 31 away from the thermocouple base 32, and the first mounting plate 33 is mounted on the bottom wall of the outer cavity 11. The first mounting plate 33 is used to fix the thermocouple 31 on the outer cavity 11, so that the thermocouple 31 is stable when used.

[0052] like Figure 4 and Figure 5 As shown, a water inlet pipe 35 is provided at one end of the cooling pipe 34, and a water return pipe 36 is provided at the other end of the cooling pipe 34. The ends of the water inlet pipe 35 and the water return pipe 36 away from the cooling pipe 34 pass through the outer cavity 11 and are placed outside the outer cavity 11. Cooling water can enter the cooling pipe 34 through the water inlet pipe 35, so as to cool the heating plate body 21 after suspending heating through the cooling pipe 34.

[0053] like Figure 4 and Figure 5 As shown, a second mounting plate 37 is installed at one end of the water inlet pipe 35 and the water return pipe 36 placed outside the outer cavity 11, and the second mounting plate 37 is installed on the bottom wall plate of the outer cavity 11. The second mounting plate 37 is used to fix the water inlet pipe 35 and the water return pipe 36 on the outer cavity 11, so that the water inlet pipe 35 and the water return pipe 36 are stable when used.

[0054] Working principle: the heating plate 21 is made of aluminum, so that the heating plate only heats the silicon wafer that needs sputtering, and has the characteristics of low energy consumption and precise heating; the heating plate 21 adopts an independent thermocouple 31 for temperature control, and the thermocouple 31 feeds back the temperature of the heating plate 21 to the temperature control system, and the temperature control system adjusts the power of the heating plate 21 to make the temperature more uniform and accurate; the heating plate 21 has its own cooling pipe 34, which can be quickly cooled after sputtering is completed, shortening the cooling time; the armored heating pipe is embedded in the heating plate 21 to extend the service life; at the same time, the local precise heating of the heating plate 21 avoids long-term heating of the cavity, reducing the cost of maintenance.

[0055] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0056] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A new type of cavity heating plate, characterized in that: include: The cavity comprises an outer cavity and an inner cavity, wherein the inner cavity is installed in the outer cavity by means of inlay, an inner support plate is installed on the bottom wall plate of the inner cavity, and the inner support plate is set as a hollow structure; The heating plate comprises a heating plate body, the upper end of which is embedded in the hollow of the inner support plate, and a heating plate is arranged on the heating plate body; The auxiliary component comprises a thermocouple and a cooling tube. A thermocouple base is arranged at one end of the thermocouple, and the thermocouple base is installed in the heating plate body. The cooling tube is arranged as a coil and installed in the heating plate body.

2. A novel cavity heating plate according to claim 1, characterized in that: The bottom wall plate of the inner cavity is configured as a hollow structure, and the inner support plate is embedded in the hollow portion of the bottom wall plate of the inner cavity.

3. A novel cavity heating plate according to claim 1, characterized in that: The heating plate body is made of aluminum.

4. A novel cavity heating plate according to claim 1, characterized in that: The upper surface of the heating plate and the upper surface of the inner cavity of the inner support plate are arranged on the same horizontal plane, and an insulating sleeve is arranged between the heating plate and the inner support plate.

5. The novel cavity heating plate according to claim 1 is characterized in that: A heat insulation board is arranged at the bottom of the heating plate body, and a support board is arranged at the lower end of the heat insulation board.

6. A novel cavity heating plate according to claim 5, characterized in that: A plurality of support rods are fixedly connected to the bottom wall plate of the outer cavity, and an adjusting screw is fixedly connected to each of the plurality of support rods.

7. A novel cavity heating plate according to claim 6, characterized in that: The adjusting screw rod passes through the supporting plate, and the side walls of the adjusting screw rod located on the upper and lower sides of the supporting plate are both provided with adjusting nuts.

8. The novel cavity heating plate according to claim 1, characterized in that: A first mounting plate is disposed at one end of the thermocouple away from the thermocouple base, and the first mounting plate is mounted on the bottom wall plate of the outer cavity.

9. The novel cavity heating plate according to claim 1, characterized in that: A water inlet pipe is arranged at one end of the cooling pipe, and a water return pipe is arranged at the other end of the cooling pipe. The ends of the water inlet pipe and the water return pipe away from the cooling pipe pass through the outer cavity and are arranged outside the outer cavity.

10. A novel cavity heating plate according to claim 9, characterized in that: A second mounting plate is installed at one end of the water inlet pipe and the water return pipe outside the outer cavity, and the second mounting plate is installed on the bottom wall plate of the outer cavity.

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