Fabricated anti-load floor heating insulation board
By designing prefabricated anti-load floor heating insulation boards, and using multiple thermal support boards to increase the thermal conductivity surface, the thermal conductivity efficiency and uniformity problems caused by the concentration of thermal conductivity surfaces of the existing floor heating insulation boards are solved, and more efficient heating effects and longer service life are achieved.
Patent Information
- Application Number
- CN202421298381.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-07
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-06-07
AI Technical Summary
The existing floor heating insulation boards come into contact with the floor heating pipes through pipe placement grooves, and the thermal conductivity surface is concentrated at the same position of the insulation board, which affects the thermal conductivity efficiency of the floor heating pipes and the thermal conductivity uniformity of the insulation boards, and reduces the heating effect.
A prefabricated anti-load floor heating insulation board is designed, including insulation layer plate, thermal conduction plate and thermal support board. A pipe placement groove is provided at the bottom of the thermal conduction board, and a support plate placement groove is provided inside the insulation layer plate. The thermal support board is placed on the surface of the thermal conduction board. The thermal surface is increased by multiple thermal support boards to avoid the concentration of the thermal surface.
The thermal conductivity surface is increased by multiple thermal support plates, the thermal conductivity efficiency of floor heating pipes is improved, the heat is uniformly guided to the interior of the insulation layer plate, the heating effect of the insulation layer plate is improved, and the load resistance is enhanced through reinforcement ribs, and the service life is extended.
Smart Images

Figure CN222595410U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of floor heating insulation boards, in particular to an assembled load-resistant floor heating insulation board. Background Art
[0002] Floor heating refers to a heating method that uses hot water circulation pipes for heating. With the improvement of residential living conditions, most families in the north choose to use floor heating to heat their rooms.
[0003] The currently published patent: CN219060732U discloses a high-performance floor heating insulation board. The high-performance floor heating insulation board is provided with a support rod, an elastic clip plate, a clip groove and a limiting block. When in use, the elastic clip plate on one board body is inserted into the clip groove on the other board body. Since the limiting block is provided in the clip groove, the elastic clip plate can be restricted. In this way, not only can the two board bodies be quickly fixed together, but also the two board bodies can be quickly aligned.
[0004] Based on the above search, it is found that the above patent has the following problems when used: the high-performance floor heating insulation board is provided with support rods, elastic snap-in plates, snap-in grooves and limiting blocks. When in use, the staff can not only quickly fix the two plates together, but also quickly align the two plates, thereby speeding up the installation of the floor heating insulation board. However, this type of floor heating insulation board only conducts heat through the position where the pipe placement groove contacts the floor heating pipe, and the heat conduction surface is concentrated at the same position of the insulation board, which not only affects the heat conduction efficiency of the floor heating pipe, but also affects the uniformity of heat conduction of the insulation board, thereby reducing the heating effect of the insulation board. Utility Model Content
[0005] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and to provide an assembled load-resistant floor heating insulation board, which can solve the problem that the floor heating insulation board conducts heat only at the position where the pipe placement groove contacts the floor heating pipe, and the heat conduction surface is concentrated at the same position of the insulation board, which not only affects the heat conduction efficiency of the floor heating pipe, but also affects the uniformity of heat conduction of the insulation board, thereby reducing the heating effect of the insulation board.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an assembled load-resistant floor heating insulation board, including an insulation layer board, a heat-conducting plate is fixedly connected to the bottom of the insulation layer board, a pipe placement groove is opened at the bottom of the heat-conducting plate, a support plate placement groove is opened inside the insulation layer board, and a heat-conducting support plate is placed inside the support plate placement groove; through holes are evenly opened on the top of the insulation layer board.
[0007] Preferably, the heat-conducting support plate is fixedly connected to the surface of the heat-conducting plate.
[0008] Preferably, reinforcing ribs for increasing strength are placed inside the through hole.
[0009] Preferably, a thermal insulation layer is adhered to the top of the thermal insulation layer board.
[0010] Preferably, a moisture-proof layer is adhered to the surface of the thermal insulation layer.
[0011] Preferably, a conductive fiber layer is adhered to the surface of the moisture-proof layer.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] (1) The assembled anti-load floor heating insulation board conducts heat to the surface of the heat-conducting support plate through the heat-conducting plate, and conducts heat to the inside of the insulation layer plate through the heat-conducting support plate. The heat-conducting surface is increased by multiple heat-conducting support plates to avoid the heat-conducting surface being concentrated at the same position of the insulation layer plate. This not only improves the heat conduction efficiency of the floor heating pipe, but also can evenly conduct heat to the inside of the insulation layer plate, thereby improving the uniformity of heat conduction of the insulation layer plate and improving the heating effect of the insulation layer plate.
[0014] (2) After the installer installs the insulation layer on the surface of the heating pipe, the load-bearing capacity of the top of the insulation layer can be enhanced by reinforcing ribs, thereby improving the production quality of the floor heating insulation board, preventing the top of the floor heating insulation board from being damaged, and extending the service life of the floor heating insulation board. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments:
[0016] Figure 1 This is a schematic diagram of the overall structure of an assembled load-resistant floor heating insulation board of the utility model;
[0017] Figure 2 This is a schematic diagram of the bottom structure of the heat conducting plate of the utility model;
[0018] Figure 3 This is a schematic diagram of the bottom structure of the thermal insulation layer board of the utility model;
[0019] Figure 4 It is a schematic diagram of the surface structure of the heat conducting plate of the utility model.
[0020] Figure numerals: 1. Insulation layer plate; 2. Heat conducting plate; 3. Pipe placement groove; 4. Support plate placement groove; 5. Heat conducting support plate; 6. Through hole; 7. Reinforcement rib; 8. Insulation layer; 9. Moisture-proof layer; 10. Conductive fiber layer. DETAILED DESCRIPTION
[0021] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.
[0022] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0023] In the description of the present utility model, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0024] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.
[0025] See also Figure 1-4 The utility model provides a technical solution: an assembled load-resistant floor heating insulation board, including an insulation layer plate 1, a heat-conducting plate 2 is fixedly connected to the bottom of the insulation layer plate 1, a pipeline placement groove 3 is opened at the bottom of the heat-conducting plate 2, a support plate placement groove 4 is opened inside the insulation layer plate 1, a heat-conducting support plate 5 is placed inside the support plate placement groove 4, and the heat-conducting support plate 5 is made of aluminum foil to accelerate the heat conduction efficiency of the heat-conducting support plate 5, and the heat-conducting support plate 5 is fixedly connected to the surface of the heat-conducting plate 2.
[0026] When the assembled anti-load floor heating insulation board is in use, the installer installs the insulation layer plate 1 and the heat conducting plate 2 on the surface of the floor heating pipe through the pipe placement groove 3. At this time, the floor heating pipe can transfer heat to the surface of the heat conducting plate 2, and then conduct the heat to the surface of the heat conducting support plate 5 through the heat conducting plate 2, and then conduct the heat to the inside of the insulation layer plate 1 through the heat conducting support plate 5. The heat conducting surface is increased by multiple heat conducting support plates 5 to avoid the heat conducting surface being concentrated at the same position of the insulation layer plate 1. Not only the thermal conductivity efficiency of the floor heating pipe is improved, but also the heat can be evenly guided to the inside of the insulation layer plate 1, thereby improving the uniformity of thermal conductivity of the insulation layer plate 1 and improving the heating effect of the insulation layer plate 1.
[0027] The top of the thermal insulation layer board 1 is evenly provided with through holes 6 , and reinforcing ribs 7 for increasing strength are placed inside the through holes 6 .
[0028] After the installer installs the insulation layer board 1 on the surface of the heating pipe, the load resistance of the top of the insulation layer board 1 can be enhanced by reinforcing ribs 7, thereby improving the production quality of the floor heating insulation board, preventing the top of the floor heating insulation board from being damaged, and extending the service life of the floor heating insulation board.
[0029] Wherein, a thermal insulation layer 8 is adhered to the top of the thermal insulation layer board 1;
[0030] The thermal insulation layer 8 is composed of a first oblique mesh layer, a second oblique mesh layer, a down layer and a protective layer. The top of the first oblique mesh layer is fixedly connected to the bottom of the polyurethane foam layer. The polyurethane foam layer has the properties of low density, good elastic recovery, sound absorption, air permeability, and thermal insulation, which improves the thermal insulation performance of the floor heating insulation board.
[0031] The surface of the thermal insulation layer 8 is adhered with a moisture-proof layer 9;
[0032] The material of the moisture-proof layer 9 is a highly water-absorbent film, and the moisture-proof layer 9 can absorb the moisture inside the thermal insulation layer board 1 to keep the floor heating thermal insulation board dry.
[0033] The surface of the moisture-proof layer 9 is adhered with a conductive fiber layer 10 .
[0034] The conductive fiber layer 10 is chemical fiber, metal fiber, carbon fiber, etc. spun by mixing a conductive medium into a polymer. It has excellent static elimination and prevention performance far superior to antistatic fiber, preventing people's hair from adhering to the surface of the floor heating insulation board, making it convenient for people to clean the surface of the floor heating insulation board.
[0035] Working principle: When in use, the assembled load-resistant floor heating insulation board is installed on the surface of the floor heating pipe by installing the insulation layer plate 1 and the heat conducting plate 2 through the pipe placement groove 3. At this time, the floor heating pipe can transfer heat to the surface of the heat conducting plate 2, and then transfer the heat to the surface of the heat conducting support plate 5 through the heat conducting plate 2, and then transfer the heat to the inside of the insulation layer plate 1 through the heat conducting support plate 5. It not only improves the thermal conductivity of the floor heating pipe, but also can evenly guide the heat to the inside of the insulation layer plate 1. The load resistance of the top of the insulation layer plate 1 is enhanced by the reinforcing ribs 7, thereby improving the production quality of the floor heating insulation board, preventing the top of the floor heating insulation board from being damaged, and extending the service life of the floor heating insulation board.
[0036] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.
Claims
1. An assembled load-resistant floor heating insulation board, comprising an insulation layer board (1), characterized in that: A heat conducting plate (2) is fixedly connected to the bottom of the heat insulating layer plate (1), a pipe placement groove (3) is provided at the bottom of the heat conducting plate (2), a support plate placement groove (4) is provided inside the heat insulating layer plate (1), and a heat conducting support plate (5) is placed inside the support plate placement groove (4); The top of the thermal insulation layer plate (1) is evenly provided with through holes (6).
2. The assembled load-resistant floor heating insulation board according to claim 1 is characterized in that: The heat-conducting support plate (5) is fixedly connected to the surface of the heat-conducting plate (2).
3. The assembled load-resistant floor heating insulation board according to claim 1 is characterized in that: A reinforcing rib (7) is placed inside the through hole (6) to increase the strength.
4. The assembled load-resistant floor heating insulation board according to claim 1 is characterized in that: A thermal insulation layer (8) is adhered to the top of the thermal insulation layer board (1).
5. The assembled load-resistant floor heating insulation board according to claim 4 is characterized in that: A moisture-proof layer (9) is adhered to the surface of the thermal insulation layer (8).
6. The assembled load-resistant floor heating insulation board according to claim 5 is characterized in that: A conductive fiber layer (10) is adhered to the surface of the moisture-proof layer (9).
Citation Information
Patent Citations
High-performance floor heating insulation board
CN219060732U