Portable refrigeration cup

Abstract

The utility model relates to a portable refrigeration cup, and aims to solve the technical problem that the refrigeration effect on a semiconductor refrigeration assembly is improved by adopting a mode that a heat pipe is arranged at the center in a cup body and a heat strip is arranged on an inner cavity shell in the cup body in the conventional similar products. The refrigeration cup is characterized in that at least one heat transfer unit A extending out and located in the center of a cup cavity is arranged at the bottom in the cup cavity of a cup body of the refrigeration cup, a heat pipe is arranged in the middle of the heat transfer unit A, multiple sets of semiconductor refrigeration assemblies are distributed on the outer wall of the heat pipe at intervals around the circumference, and the hot ends of the semiconductor refrigeration assemblies are in heat conduction connection with the outer wall of the heat pipe; the cold end of the semiconductor refrigeration assembly is in heat conduction connection with a heat conduction pipe, a cavity between the heat pipe and the heat conduction pipe except the semiconductor refrigeration assembly is filled with heat insulation glue, the heat conduction pipe is in sealed connection with an inner cavity shell of the cup body, and a section of heat pipe at the bottom of the cup body is in heat conduction connection with a heat dissipation unit B; and a heat insulation material and another plurality of groups of semiconductor refrigeration assemblies are arranged between the inner cavity shell in the cup body and the cup body.

Description

Technical Field

[0001] The utility model relates to a cup, which is a portable refrigeration cup. Background Art

[0002] A cup is a special vessel for holding water, and a cooling cup is a cup used for cooling. It is generally cooled by embedding high-tech semiconductor cooling chips. It has a simple appearance and a small size, is easy to carry, and can cool liquids such as cola, beer, and tea. As disclosed in the Chinese patent literature, the application number is 202322288419.9, the authorization announcement date is 2024.03.08, and the utility model name is "Portable Semiconductor Refrigeration Water Cup". The cooling water cup includes a cup cover, a cup body, and a base. The cup body includes an outer shell and an inner liner arranged inside and outside, and the reserved gap between the two is used as a cold air flow channel; a hollow cavity is formed in the base, a partition is arranged in the hollow cavity, and a semiconductor post is arranged on the partition through the mounting port. The cavity space on the cooling surface side of the semiconductor post is used as a cooling circulation chamber, and a drainage fan is also arranged in the cooling circulation chamber; the cavity space on the heating surface side of the semiconductor post is used as a heat dissipation circulation chamber, and a heat dissipation fan is also arranged in the heat dissipation chamber. However, the above-mentioned products and similar products rarely use a heat pipe in the center of the cup body and a heat strip in the inner cavity and outer shell of the cup body to improve the cooling effect of the semiconductor refrigeration assembly, accelerate the heat dissipation and cooling speed of the liquid in the cup body, and there is a problem of slow cooling speed. Summary of the invention

[0003] In order to overcome the above shortcomings, the purpose of the utility model is to provide a portable refrigeration cup in the art, which can solve the technical problem that the existing similar products rarely use the heat pipe arranged in the center of the cup body, and the heat strip arranged in the inner cavity and outer shell of the cup body to improve the refrigeration effect of the semiconductor refrigeration assembly, accelerate the heat dissipation and cooling speed of the liquid in the cup body, and have a slow refrigeration speed. The purpose is achieved through the following technical solutions.

[0004] A portable refrigeration cup comprises a cup body, a cup cover, a base, a heat transfer unit A, a heat dissipation unit B and a control unit C, wherein the control unit C comprises a circuit board, the circuit board is provided with a battery pack, and the control unit C is arranged in the cup cover or in the base of the cup body; a heat dissipation unit B is arranged in the base of the cup body, and a heat dissipation hole is arranged on the outer diameter of the base corresponding to the heat dissipation unit B or the cup body communicated with the base, and the cup cover is arranged at the upper end of the cup body; the key points of its structural design are that at least one heat transfer unit A extending out and located at the center of the cup cavity is arranged at the bottom of the cup cavity of the cup body, a heat pipe is arranged in the middle of the heat transfer unit A, and multiple groups of semiconductor refrigeration assemblies are alternately arranged on the outer wall of the heat pipe around the circumference, the hot end of the semiconductor refrigeration assembly is thermally connected to the outer wall of the heat pipe, the cold end of the semiconductor refrigeration assembly is thermally connected to the heat pipe, and the cavity between the heat pipe and the heat pipe is filled with heat insulating glue except for the semiconductor refrigeration assembly part, the heat pipe is sealed and connected to the inner cavity shell of the cup body, and a section of the heat pipe at the bottom of the cup body is thermally connected to the heat dissipation unit B.

[0005] The semiconductor refrigeration assembly is an arc-shaped patch that is equidistantly and symmetrically arranged on both sides of the outer diameter of the heat pipe. The hot end at the bottom of the semiconductor refrigeration assembly is thermally connected to the outer wall of the heat pipe, and the cold end at the top of the semiconductor refrigeration assembly is thermally connected to the heat pipe. The gap between the semiconductor refrigeration assemblies at the outer diameter of the heat pipe is sealed by filling with insulating glue, and the heat pipe and the heat pipe are connected as a whole.

[0006] The top of the heat pipe is a spherical dome, and the top of the heat pipe corresponding to the top of the heat pipe is a circular end surface. The above structure improves the heat circulation at the top of the heat pipe, and the top of the heat pipe and the top of the heat pipe are further connected as one by filling with thermal insulation glue.

[0007] A heat insulating material is arranged between the inner cavity shell in the cup body and the cup body. The above structure further improves the heat preservation and insulation effect.

[0008] The thermal insulation material is provided with gap holes with equally spaced openings, a heat bar with a semi-cylindrical protrusion on one side facing outward is provided in the gap hole, multiple groups of semiconductor refrigeration assemblies are alternately distributed in the gap hole inside the heat bar, the hot end of the semiconductor refrigeration assembly is thermally connected to the outer wall of the inner cavity shell, the cold end of the semiconductor refrigeration assembly is thermally connected to the heat bar, and the cavity between the heat bar and the inner cavity shell is filled with thermal insulation glue except for the semiconductor refrigeration assembly. The above structure facilitates further accelerating the cooling of the liquid in the cup body through the cooperation of the heat bar and the heat pipe, and the above heat pipe can also be omitted, and cooling can be achieved through the heat bar structure.

[0009] An inner cavity shell is arranged between the cup body and the heat insulating material. The above structure facilitates further heat insulation inside the cup body.

[0010] The inner cavity shell between the cup body and the insulation material, or the outer diameter of the insulation material in the cup body below the inner cavity shell is provided with fins. The heat strip of the insulation material is a semicircular protrusion outward, so that the inner diameter groove of the fin is connected with its shape correspondingly.

[0011] A temperature sensor is provided on the surface of the inner cavity shell, and the temperature sensor is connected to the control unit C. Thus, the real-time temperature of the inner cavity shell can be known through the temperature sensor.

[0012] The heat dissipation unit B includes a heat sink and a fan, and a section of another heat pipe in the cup cavity extends out from the bottom of the cup body and is thermally connected to the heat sink. The above structure can also omit the heat sink as needed, and the heat pipe is directly connected to the fan housing to dissipate heat directly through the fan.

[0013] The base of the cup body is a cup seat, or the base of the cup body is a cavity protruding from the bottom of the cup body, and a bottom cover is provided at the cavity opening of the cavity at the bottom of the cup body; a handle is provided on one side of the outer diameter of the cup body, or the handle is provided on one side of the outer diameter where the cup body and the cup seat are connected as one.

[0014] The utility model has reasonable structural design, is easy to carry, has good refrigeration effect, small temperature fluctuation, higher heat exchange efficiency, faster liquid cooling and refrigeration, is suitable for large-scale promotion and use, and has various structural forms; it is suitable for use as a portable refrigeration cup and further improvement of similar products. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional structural schematic diagram of the first embodiment of the utility model.

[0016] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure.

[0017] Figure 3 yes Figure 1 Schematic diagram of part of the explosion structure.

[0018] Figure 4 yes Figure 3 Schematic diagram of the exploded structure of the heat pipe components.

[0019] Figure 5 yes Figure 4 Schematic diagram of the structure of the heat pipe after assembly, the dotted line is the heat pipe structure inside the heat pipe.

[0020] Figure 6 It is a schematic cross-sectional structural diagram of embodiment 2 of the present utility model.

[0021] Figure 7 yes Figure 1 Schematic diagram of the three-dimensional structure of the cup lid in the open state, in which the dotted line is the outer part of the inner cavity shell in the cup body.

[0022] Figure 8 yes Figure 7 Schematic diagram of the bottom structure, in which the cup holder and the heat dissipation unit B are omitted and the dotted lines are fins.

[0023] Fig. 9 yes Figure 7 Schematic diagram of the structure of the insulation material, fins and fan combination in the cup body.

[0024] Serial numbers and names of the accompanying drawings: 1. cup body, 2. cup cover, 3. bottom cover, 4. insulation material, 401, heat strip, 5. inner cavity shell, 6. heat pipe, 7. semiconductor refrigeration assembly, 8. insulation glue, 9. heat pipe, 10. cup cavity, 11. radiator, 12. fan, 13. cup holder, 14. inner cavity shell, 15. fins, 16. handle. DETAILED DESCRIPTION

[0025] Now, in conjunction with the accompanying drawings, the structure and use of the utility model are further described. Figure 1-Figure 5 In the first embodiment shown, the refrigeration cup includes a cup body 1, a cup cover 2, a base, a heat transfer unit A, a heat dissipation unit B and a control unit C. The control unit C includes a circuit board, and the circuit board is provided with a battery pack. The control unit C is arranged in the cup cover or in the base of the cup body. The base of the cup body is provided with a heat dissipation unit B, and the base corresponding to the heat dissipation unit B is provided with a heat dissipation hole. The cup cover is arranged at the upper end of the cup body. At least one heat transfer unit A extending out and located at the center of the cup cavity is arranged at the bottom of the cup cavity 10 of the cup body, and a heat pipe 9 is arranged in the middle of the heat transfer unit A. The outer wall of the heat pipe is provided with multiple groups of semiconductor refrigeration assemblies 7 alternately distributed around the circumference. The hot end of the semiconductor refrigeration assembly is thermally connected to the outer wall of the heat pipe, and the cold end of the semiconductor refrigeration assembly is thermally connected to the heat pipe 6. The cavity between the heat pipe and the heat pipe is filled with heat insulating glue 8 except for the semiconductor refrigeration assembly part. The heat pipe is sealed and connected to the inner cavity shell 5 of the cup body, and a section of the heat pipe at the bottom of the cup body is thermally connected to the heat dissipation unit B. The semiconductor refrigeration assembly is an arc-shaped patch equidistantly and symmetrically arranged on both sides of the outer diameter of the heat pipe. The hot end at the bottom of the semiconductor refrigeration assembly is thermally connected to the outer wall of the heat pipe, and the cold end at the top of the semiconductor refrigeration assembly is thermally connected to the heat pipe. The gap between the semiconductor refrigeration assemblies at the outer diameter of the heat pipe is filled with insulation glue and sealed, and the heat pipe and the heat pipe are connected as a whole. The top of the heat pipe is a spherical dome, and the top of the heat pipe corresponding to the top of the heat pipe is a circular end face; an insulating material 4 is provided between the inner cavity shell in the cup body and the cup body; a temperature sensor is provided on the surface of the inner cavity shell, and the temperature sensor is connected to the control unit C. The heat dissipation unit B includes a radiator 11 and a fan 12, and a section of another section of the heat pipe in the cup cavity extends out of the bottom of the cup body and is thermally connected to the radiator. The base of the above-mentioned cup body is a cavity protruding from the bottom of the cup body, and the cavity opening of the cavity at the bottom of the cup body is provided with a bottom cover 3.

[0026] In summary, the first embodiment of the refrigeration cup has the following characteristics: 1), the refrigeration cup includes a cup body 1, a cup cover 2, a bottom cover 3, a heat transfer unit A, a heat dissipation unit B and a control unit C; 2), the cup body 1, the cup cover 2 is arranged at the upper end of the cup body 1, and the bottom cover 3 is arranged at the lower end of the cup body 1; the cup body 1 includes an inner cavity shell 5, and an insulating material 4 is arranged between the inner cavity shell 5 and the cup body 1; the inner cavity shell 5 forms a cup cavity 10 for holding liquid; at least one heat transfer unit A is built in the cup cavity 10, and the heat transfer unit A passes through the cup cavity 10 and is connected to the heat dissipation unit B by heat conduction from the bottom; 3), a heat pipe 9 is arranged in the middle of the heat transfer unit A, and a plurality of groups of semiconductor refrigeration assemblies 7 are alternately distributed around the circumference of the outer wall of the heat pipe 9, the hot end of the semiconductor refrigeration assembly 7 is thermally connected to the outer wall of the heat pipe 9, and the cold end of the semiconductor refrigeration assembly 7 is thermally connected to the heat pipe 6, and the cavity between the heat pipe 9 and the heat pipe 6 is filled with the semiconductor refrigeration assembly. 7 is filled with insulating glue 8, and the heat pipe 6 is sealed and connected to the inner cavity shell 5; 4), a part of the heat pipe 9 of the heat transfer unit A is arranged in the cup cavity 10 of the cup body 1, and a part extends from the bottom of the cup cavity 10, and is thermally connected to the radiator 11 at the heat dissipation unit B at the bottom of the cup body 1; the heat pipe 9 is divided into two sections, one section is in the cup cavity 10, and the other section is thermally connected to the radiator 11 at the bottom of the cup body 1, and the heat pipe 9 passes through the cup cavity 10 and forms a seal so that the two sections do not interfere with each other; 5), the heat dissipation unit B includes a radiator 11 and a fan 12, which are arranged at the bottom of the cup body 1, and the lower port at the bottom of the cup body is provided with a bottom cover 3; 6), a temperature sensor is provided on the surface of the inner cavity shell 5, and the temperature sensor is connected to the control unit C to control the working condition of the semiconductor refrigeration assembly 7; 7), the control unit C is arranged in the cup cover 2, or in the base of the cup body 1, and is equipped with a battery pack.

[0027] The specific operation of using the refrigeration cup is as follows: pour liquid into the cup cavity 10, the semiconductor refrigeration assembly 7 starts working, and the cold end contacts the heat pipe 6 to keep the surface temperature of the heat pipe 6 low, and exchanges heat with the liquid in the cup cavity 10 to keep the liquid in the cup cavity 10 at a certain low temperature. According to the working principle of semiconductor refrigeration and the principle of conservation of energy, the other end of the semiconductor refrigeration assembly 7 is the hot end, and the hot end is thermally connected to the heat pipe 9 to transfer the heat to the heat pipe 9. The heat pipe 9 then conducts the heat to the radiator 11 at the bottom that contacts the heat pipe 9, and then the heat is brought to the air through the fan 12, realizing the entire heat transfer and heat dissipation cycle.

[0028] According to the structural characteristics of the above-mentioned embodiment 1, Figure 6-Figure 9The second embodiment shown is based on the first embodiment. The insulation material of the refrigeration cup is provided with gap holes with equally spaced openings. A heat strip 401 with a semi-cylindrical protrusion on one side facing outward is provided in the gap hole. Multiple groups of semiconductor refrigeration assemblies are alternately distributed in the gap hole inside the heat strip. The hot end of the semiconductor refrigeration assembly is thermally connected to the outer wall of the inner cavity shell, and the cold end of the semiconductor refrigeration assembly is thermally connected to the heat strip. The cavity between the heat strip and the inner cavity shell is filled with insulation glue except for the semiconductor refrigeration assembly. An inner cavity shell 14 is provided between the cup body and the insulation material. The inner cavity shell between the cup body and the insulation material, or the outer diameter of the insulation material in the cup body below the inner cavity shell is provided with fins 15. The base of the cup body is a cup seat 13, and a handle 16 is provided on one side of the outer diameter of the cup body and the cup seat. The heat strip of the second embodiment cooperates with the heat pipe to further accelerate the cooling of the liquid in the cup body, or the heat pipe is omitted, and the liquid in the cup body is cooled by the heat strip structure.

[0029] In summary, the refrigeration cup is not only easy to carry, but also can reduce the temperature of the liquid more quickly, with small temperature fluctuations, long storage time and good reliability. At the same time, due to its higher heat exchange efficiency, lower fan noise, flexibility and convenience, it is suitable for large-scale promotion and use.

Claims

1. A portable refrigeration cup, comprising a cup body (1), a cup cover (2), a base, a heat transfer unit A, a heat dissipation unit B and a control unit C, wherein the control unit C comprises a circuit board, the circuit board is provided with a battery pack, the control unit C is arranged in the cup cover, or in the base of the cup body; the base of the cup body is provided with a heat dissipation unit B, the base corresponding to the heat dissipation unit B or the cup body connected with the base is provided with a heat dissipation hole on its outer diameter, and the cup cover is arranged at the upper end of the cup body; characterized in that The cup cavity (10) of the cup body (1) is provided with at least one heat transfer unit A extending out from and located at the center of the cup cavity, a heat pipe (9) is provided in the middle of the heat transfer unit A, and a plurality of groups of semiconductor refrigeration assemblies (7) are arranged alternately around the circumference of the outer wall of the heat pipe, the hot end of the semiconductor refrigeration assembly is thermally connected to the outer wall of the heat pipe, the cold end of the semiconductor refrigeration assembly is thermally connected to the heat pipe (6), the cavity between the heat pipes is filled with insulating glue (8) except for the semiconductor refrigeration assembly part, the heat pipe is sealed and connected to the inner cavity shell (5) of the cup body, and a section of the heat pipe at the bottom of the cup body is thermally connected to the heat dissipation unit B.

2. The portable refrigeration cup according to claim 1, characterized in that The semiconductor refrigeration assembly (7) is an arc-shaped patch symmetrically arranged on both sides of the outer diameter of the heat pipe (9), the hot end at the bottom of the semiconductor refrigeration assembly is thermally connected to the outer wall of the heat pipe, and the cold end at the top of the semiconductor refrigeration assembly is thermally connected to the heat pipe (6). The gap between the semiconductor refrigeration assemblies at the outer diameter of the heat pipe is sealed by filling with thermal insulation glue (8), and the heat pipe and the heat pipe are connected as a whole.

3. The portable refrigeration cup according to claim 1, characterized in that The top of the heat pipe (9) is in the form of a spherical dome, and the top of the heat conducting pipe (6) corresponding to the top of the heat pipe is in the form of a circular end surface.

4. The portable refrigeration cup according to claim 1, characterized in that A heat insulating material (4) is provided between the inner cavity shell (5) in the cup body (1) and the cup body.

5. The portable refrigeration cup according to claim 4, characterized in that The thermal insulation material (4) is provided with gap holes with equally spaced openings, a heat strip (401) with a semi-cylindrical protrusion on one side facing outward is provided in the gap hole, and multiple groups of semiconductor refrigeration assemblies (7) are alternately distributed in the gap holes inside the heat strip, the hot end of the semiconductor refrigeration assembly is thermally connected to the outer wall of the inner cavity shell (5), the cold end of the semiconductor refrigeration assembly is thermally connected to the heat strip, and the cavity between the heat strip and the inner cavity shell, except for the semiconductor refrigeration assembly part, is filled with thermal insulation glue (8).

6. The portable refrigeration cup according to claim 5, characterized in that An inner cavity shell (14) is provided between the cup body (1) and the heat insulating material (4).

7. The portable refrigeration cup according to claim 5, characterized in that The inner cavity shell (14) between the cup body (1) and the heat insulating material (4), or the outer diameter of the heat insulating material in the cup body below the inner cavity shell, is provided with fins (15).

8. The portable refrigeration cup according to claim 1, characterized in that A temperature sensor is provided on the surface of the inner cavity shell (5), and the temperature sensor is connected to the control unit C.

9. The portable refrigeration cup according to claim 1, characterized in that The heat dissipation unit B comprises a radiator (11) and a fan (12); a section of another section of the heat pipe (9) in the cup cavity (10) extends out of the bottom of the cup body (1) and is heat-conductingly connected to the radiator.

10. The portable refrigeration cup according to claim 1, characterized in that The base of the cup body (1) is a cup seat (13), or the base of the cup body is a cavity protruding from the bottom of the cup body, and a bottom cover (3) is provided at the cavity opening of the cavity at the bottom of the cup body; a handle (16) is provided on one side of the outer diameter of the cup body, or the handle is provided on one side of the outer diameter where the cup body and the cup seat (13) are connected as one body.

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