High-efficiency heat dissipation host equipment

Abstract

The utility model belongs to the technical field of host heat dissipation, and particularly relates to efficient heat dissipation host equipment. According to the utility model, from the two aspects of mechanical structure design and heat dissipation technology, heat generated by a heating component is uniformly and efficiently dissipated out through a double heat dissipation structure of the VC vapor chamber and the fan, so that efficient operation of a host is ensured. Besides, in the miniature case, through the design of a plugging structure, the hard disk can be quickly plugged, and the miniature case is simple in structure, convenient to disassemble and maintain, capable of being customized according to requirements and wide in application range.

Description

Technical Field

[0001] The utility model relates to the technical field of host heat dissipation, in particular to a host device with high-efficiency heat dissipation. Background Art

[0002] This section is intended to provide a background or context to the embodiments of the utility model recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.

[0003] Electronic products, especially computer hosts, often generate a lot of heat during operation, so heat dissipation is needed to keep the equipment running normally. Heat dissipation technology is one of the important technologies in the field of electronic equipment, which mainly deals with the heat generated by electronic equipment during operation. The development of heat dissipation technology mainly includes improving heat dissipation efficiency, improving the portability of heat dissipation devices, reducing the volume of heat dissipation devices, etc. Common heat dissipation technologies include air cooling, liquid cooling, heat pipes, etc. Among them, air cooling is a common heat dissipation method. Based on the principle of heat conduction, heat dissipation materials such as cooling fans or heat sinks are used to dissipate the generated heat into the surrounding air. VC heat dissipation refers to the heat dissipation method using VC materials (graphene or carbon nanotubes) as heat dissipation materials. Its advantages are good thermal conductivity, light weight, high strength, large heat dissipation area, etc. Heat dissipation technology is widely used, involving microprocessors, graphics cards, mobile phones, televisions and other fields. 2). Mechanical design: Mechanical design technology mainly designs mechanical structures to provide products with structural stability, operating performance and neat appearance support. Modern mechanical design technology mainly uses computer-aided design (CAD) and computer-aided manufacturing (CAM) technologies, which have been widely used in the field of mechanical design and manufacturing. The background technology of mechanical design includes material mechanics, mechanism, engineering drawing, mechanical design principles, etc. The focus of mechanical design is to improve the performance of the product, including strength, durability, weight, reliability and production cost. The application range of mechanical design is very wide, including agricultural machinery, automobiles, aircraft, electronic equipment, machine tools and other fields.

[0004] There are still some problems and disadvantages in the existing heat dissipation technology: (1) The air cooling technology has high noise and is not conducive to heat dissipation. Air cooling technology requires the use of cooling fans or heat sinks. These devices not only take up a certain amount of space, but also generate noise that affects the user experience. At the same time, pollutants such as dust and grease in the air will also have a certain heat dissipation effect on the equipment. VC material heat dissipation has high manufacturing cost and difficulty in preparation. VC material heat dissipation technology has the advantages of high thermal conductivity and good heat dissipation effect. However, due to its high material price, high production cost and other manufacturing difficulties, its practical application is limited. (2) The selection of heat dissipation materials: At present, heat dissipation technology is still mainly based on metal, plastic and VC materials. Among them, metal materials have good heat dissipation performance, but are not light enough and have limited corrosion resistance; plastic heat dissipation materials have low preparation costs, but have poor thermal conductivity and high temperature resistance. Therefore, how to choose heat dissipation materials is still a problem that needs to be solved. Problems and disadvantages of mechanical design: In terms of mechanical design, there may be the following problems: (1) Poor stability of large-scale mechanical design: In large-scale mechanical design, designers need to consider the stability of the system to reduce system instability and the losses caused by it. However, the cost issues caused by the design of the mechanical structure and the selection of materials must also be considered. (2) Difficulty in micro-machining: In the field of micro-mechanical design and manufacturing, the complexity of the extremely small structure must be taken into account, so the processing is difficult and the defect rate will increase accordingly. This may lead to problems such as long processing time and difficulty in ensuring processing accuracy. Utility Model Content

[0005] The purpose of the utility model is to provide a host device with efficient heat dissipation in view of the above problems, and to utilize air cooling to effectively solve the structural design of high-power chip heat dissipation within a limited space, thereby ensuring that the main control PCBA can work normally, and at the same time, to achieve faster hard disk plugging and unplugging in a micro chassis.

[0006] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is as follows.

[0007] A host device with high efficiency in heat dissipation comprises a casing and a heat-generating component and a heat-dissipating component arranged in the casing, the heat-dissipating component comprising a VC heat-diffusion plate and a fan, the VC heat-diffusion plate is arranged closely to the heat-generating component and is arranged in the casing in parallel with the side wall of the casing as a whole with the heat-generating component, the fan is located below the heat-generating component and the VC heat-diffusion plate, and is arranged parallel to the bottom of the casing, and is used for dissipating the heat generated by the heat-generating component in the casing.

[0008] In some embodiments, the heat generating component is a heat generating chip disposed on a PCBA board.

[0009] In some embodiments, the fan is fixed to the side wall of the casing via a fan fixing plate, and the fan is fixed to the fan fixing plate via screws.

[0010] In some embodiments, downward guide grooves are provided on opposite sides of the inner wall of the casing for plugging in the hard disk. The hard disk is plugged into the guide grooves through a hard disk tray, and lugs matching the guide grooves are provided on both sides of the hard disk tray.

[0011] In some embodiments, the guide grooves are arranged in parallel in multiple groups for plugging in multiple hard disks.

[0012] In some embodiments, the host device also includes a SATA bracket perpendicular to the guide groove, and a SATA connector is provided on the side of the SATA bracket facing the hard disk, and the SATA connector is opposite to the SATA interface of the hard disk in the guide groove, so that the hard disk is inserted through the guide groove and the SATA connector is inserted at the same time.

[0013] In some embodiments, the housing includes an upper cover, an inner frame, a middle frame, a bottom housing connected in sequence, and an outer housing disposed outside the inner frame.

[0014] In some embodiments, an interface baffle and a grille baffle are provided on the side of the inner frame, the interface baffle is used to connect to an external interface, and the grille baffle is used to dissipate heat.

[0015] In some embodiments, thermal grease is provided between the heat-generating component and the VC heat spreader.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] The utility model uses a dual heat dissipation structure of VC heat spreader and fan to evenly and efficiently dissipate the heat generated by the heat generating components from the aspects of mechanical structure design and heat dissipation technology, thereby ensuring the efficient operation of the host. In addition, the utility model realizes fast plugging and unplugging of hard disks in a micro-chassis through plug-in structure design, has a simple structure, is convenient to disassemble and repair, and can be customized according to needs, with a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0019] Figure 1 This is an exploded view of a host device with efficient heat dissipation according to an embodiment of the utility model;

[0020] Figure 2This is a schematic diagram of the inner frame assembly of a host device with efficient heat dissipation according to an embodiment of the utility model;

[0021] Figure 3 This is a schematic diagram of assembling a VC heat spreader of a host device with efficient heat dissipation according to an embodiment of the utility model;

[0022] Figure 4 This is a schematic diagram of the hard disk assembly structure of the host device with efficient heat dissipation according to the embodiment of the utility model;

[0023] Figure 5 This is a schematic diagram of the hard disk plug-in structure of the host device with efficient heat dissipation according to the embodiment of the utility model;

[0024] Figure 6 It is a cross-sectional view of the hard disk plug-in structure of the host device with efficient heat dissipation according to the embodiment of the utility model;

[0025] Figure 7 This is a schematic diagram of the housing assembly structure of a host device with efficient heat dissipation according to an embodiment of the utility model;

[0026] Figure 8 This is a schematic diagram of the assembly of the host device with efficient heat dissipation according to the embodiment of the utility model;

[0027] Fig. 9 This is another schematic diagram of the completed assembly of the host device with efficient heat dissipation according to the embodiment of the utility model.

[0028] In the attached figure, 1-inner frame, 2-SATA bracket, 3-VC heat sink, 4-PCBA board, 5-grille baffle, 6-interface baffle left, 7-interface baffle right, 8-fan fixing plate, 9-fan, 10-middle frame, 11-mesh plate, 12-bottom shell, 13-3.5-inch hard disk, 14-2.5-inch hard disk, 15-hard disk tray, 16-upper cover, 17-outer shell, 18-SATA cable, 19-screw, 20-circlip, 21-lug, 22-guide groove. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in combination with the embodiments and drawings. The schematic implementation mode and description of the utility model are only used to explain the utility model and are not intended to limit the utility model. It should be noted that the utility model is already in the actual development and use stage.

[0030] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc., of the present invention are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time. When an element is referred to as being "provided with" another element, it may be provided on the surface or inside of the element.

[0032] Unless explicitly stated otherwise, throughout the specification and claims, the term “comprise” or variations such as “include” or “comprising”, etc., will be understood to include the stated elements or components but not to exclude other elements or components.

[0033] The utility model mainly utilizes air cooling to effectively solve the structural design of high-power chip heat dissipation within a limited space, thereby ensuring that the main control PCBA can work normally, and at the same time, realizes the problem of faster hard disk plugging and unplugging in a micro chassis.

[0034] Heat dissipation technology and mechanical design technology are both very important technologies in the field of electronic equipment. However, there are still some problems and shortcomings in the existing technology: 1) Problems and shortcomings of heat dissipation technology: The currently commonly used air-cooling heat dissipation technology requires the use of cooling fans or heat sinks to dissipate heat into the surrounding air, which will cause some problems, such as high noise, poor heat dissipation, and special maintenance. Although VC materials have advantages in heat dissipation, the current production cost is high and the preparation is difficult to solve. 2) Problems and shortcomings of mechanical design: Although computer-aided design (CAD) and computer-aided manufacturing (CAM) technologies have been widely used in the field of mechanical design and manufacturing, there are still some problems in the mechanical structure design of certain application scenarios, such as the stability of large mechanical structures, micro-machining, and multi-material combinations. It should be noted that the above listed are only some general problems in heat dissipation technology and mechanical design technology, and there may be other specific problems in actual product development and production. The continuous evolution and innovation of technology requires continuous solutions to these problems to provide more efficient, reliable, lightweight, and energy-saving products.

[0035] Specifically, a host device with high heat dissipation efficiency is provided, wherein the whole Figure 8 and Fig. 9 As shown, the internal structure is as Figure 1 As shown, it includes a casing and a heating component and a heat dissipation component arranged in the casing, the heat dissipation component includes a VC heat spreader 3 and a fan 9, the VC heat spreader 3 is closely arranged on the heating component, and is arranged in the casing in parallel with the side wall of the casing as a whole with the heating component, the fan 9 is located below the heating component and the VC heat spreader 3, and is arranged parallel to the bottom of the casing, and is used to conduct heat generated by the heating component in the casing. The casing of this embodiment includes an upper cover 16, an inner frame 1, a middle frame 10, a bottom shell 12 connected in sequence, and an outer shell 17 arranged on the outside of the inner frame 1. In order to prevent foreign hair or debris from entering the main unit, a mesh plate 11 is also provided in the bottom shell 12 to isolate debris. The heating component and the heat dissipation component are arranged in the inner frame 1, and the outer shell 17 is wrapped around the circumference of the inner frame 1 to achieve isolation between the inside and outside of the main unit, as shown in FIG. Figure 7 As shown. The inner frame 1 is provided with an interface baffle and a grille baffle 5 on the side, and the interface baffle is used to connect the external interface. According to actual needs, the interface baffle can be provided on both the left and right sides of the inner frame 1, including a left interface baffle 6 and a right interface baffle 7.

[0036] In this embodiment, the middle frame 10 is made by an aluminum extrusion mold, the grid baffle, the interface baffle (left and right), the fan fixing plate 8 and the bottom shell 12 are made by a plastic mold, and the inner frame 1, the SATA bracket 2, the hard disk tray 15, the mesh plate 11 and other sheet metal parts are made by sheet metal stamping and bending technology. The VC heat spreader 3 has high thermal conductivity and good heat dissipation effect, so that it is assembled with the heating chip of the main control PCBA board 4, and it is ensured that the heating chip and the VC heat spreader 3 are tightly fitted together (using thermal conductive silicone grease in the middle for transition); the upper cover 16 is made into an opening design that meets safety regulations, and the fan 9 is placed below the VC heat spreader 3. Blowing from bottom to top can quickly exchange the hot air emitted by the heating element with the outside air, so that it can work normally and stably for a long time in a limited space.

[0037] In terms of heat dissipation, specifically, the fan 9 is fixed to the side wall of the inner frame 1 of the housing through the fan fixing plate 8 by screws 19, and the fan 9 is fixed to the fan fixing plate 8 by screws 19. The fan 9 is located below the VC heat spreader 3, and blowing air from bottom to top can more quickly exchange the hot air emitted by the heating element with the outside air, so that it can work normally and stably for a long time in a limited space.

[0038] Optionally, the heat generating component of this embodiment is a heat generating chip disposed on the PCBA board 4. The VC heat sink 3 is closely disposed on the heat generating chip and connected together by screws 19 and springs 20. The installation diagram is shown in FIG. Figure 3In order to better transfer heat, in some embodiments, thermal conductive silicone grease is used between the heat generating chip and the VC heat spreader 3. After the VC heat spreader 3 is closely arranged on the PCBA, it is arranged on the inner frame 1.

[0039] In terms of hard disk installation, the hard disk bracket and the main case are designed with a guide groove 22, through which the SATA connector can be accurately and quickly aligned to achieve fast plugging, unplugging, replacement and disassembly of the hard disk.

[0040] Specifically, the inner wall of the housing is provided with downward guide grooves 22 on opposite sides for inserting the hard disk. The hard disk is inserted into the guide grooves 22 through the hard disk tray 15. Figure 4 As shown, the hard disk is installed in the hard disk tray 15. In order to match the guide groove 22, the hard disk tray 15 is provided with lugs 21 that match the guide groove 22 on both sides. Figure 5 and Figure 6 As shown, in order to be able to assemble more hard disks, the guide slots 22 are optionally arranged in parallel in multiple groups for plugging in multiple hard disks. For example, a 3.5-inch hard disk 13 and a 2.5-inch hard disk 14 can be inserted. In order to facilitate the installation of the hard disk, the host device also includes a SATA bracket 2 perpendicular to the guide slots 22, and a SATA cable 18 is provided on the bracket. Figure 2 As shown, the SATA bracket 2 is located at the bottom of the inner frame 1, and a SATA connector is provided on the side of the SATA bracket 2 facing the hard disk, and the SATA connector is directly opposite to the SATA interface of the hard disk in the guide groove 22, so that the hard disk is inserted into the SATA connector at the same time after being inserted through the guide groove 22. In this way, when the hard disk tray 15 is inserted into the inner frame 1 through the guide groove 22, the hard disk can be just inserted into the SATA connector at the bottom of the inner frame 1, so there is no need to laboriously align the hard disk SATA interface with the bottom SATA connector for installation, which is convenient and quick, and the plugging and unplugging are accurate, thereby improving the installation efficiency and user experience.

[0041] It should be noted that, for the aforementioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0042] The above specific implementation methods further illustrate the purpose, technical solutions and beneficial effects of the utility model in detail. It should be understood that the above description is only the specific implementation method of the utility model and is not used to limit the protection scope of the utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A host device with high efficiency in heat dissipation, characterized in that: It includes a casing and a heat-generating component and a heat-dissipating component arranged in the casing. The heat-dissipating component includes a VC heat-diffusion plate and a fan. The VC heat-diffusion plate is closely arranged on the heat-generating component and is arranged in the casing in parallel with the side wall of the casing as a whole with the heat-generating component. The fan is located below the heat-generating component and the VC heat-diffusion plate, and is arranged parallel to the bottom of the casing for dissipating the heat generated by the heat-generating component in the casing.

2. The host device with high efficiency heat dissipation according to claim 1, characterized in that: The heat generating component is a heat generating chip arranged on the PCBA board.

3. The host device with high efficiency heat dissipation according to claim 2, characterized in that: The fan is fixed to the side wall of the casing through a fan fixing plate, and the fan is fixed to the fan fixing plate through screws.

4. The host device with high efficiency heat dissipation according to claim 1, characterized in that: The inner wall of the casing is provided with downward guide grooves on opposite sides for inserting the hard disk. The hard disk is inserted into the guide grooves through the hard disk tray. Both sides of the hard disk tray are provided with lugs matching the guide grooves.

5. The host device with high efficiency heat dissipation according to claim 4, characterized in that: The guide grooves are arranged in multiple groups in parallel for plugging in multiple hard disks.

6. The host device with high efficiency heat dissipation according to claim 5, characterized in that: The host device also includes a SATA bracket perpendicular to the guide groove, and a SATA connector is provided on the side of the SATA bracket facing the hard disk. The SATA connector is directly opposite to the SATA interface of the hard disk in the guide groove, so that the hard disk is inserted into the SATA connector at the same time after being inserted through the guide groove.

7. The host device with high efficiency heat dissipation according to claim 1, characterized in that: The housing comprises an upper cover, an inner frame, a middle frame, a bottom housing which are connected in sequence, and an outer housing arranged outside the inner frame.

8. The host device with high efficiency heat dissipation according to claim 7, characterized in that: An interface baffle and a grille baffle are provided on the side of the inner frame. The interface baffle is used to connect to an external interface, and the grille baffle is used for heat dissipation.

9. The host device with high efficiency heat dissipation according to claim 8, characterized in that: Thermal conductive silicone grease is provided between the heat generating component and the VC heat spreader.

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