Miniature server heat dissipation structure

Abstract

The utility model relates to the field of heat dissipation structures of servers, in particular to a heat dissipation structure of a micro server, which comprises a shell, a mounting chamber is arranged in the shell, heat dissipation fins are arranged on the outer wall of the shell, the thickness of the heat dissipation fins is gradually reduced from one end close to the outer wall to the other end, and a CPU and a heat conduction piece are arranged in the mounting chamber. The heat conduction piece is arranged between the CPU and the side wall of the shell provided with the heat dissipation fins. The heat dissipation structure of the micro server has the advantages of being good in heat conduction effect and high in efficiency, not only balancing performance, but also reducing energy consumption, and guaranteeing working performance of equipment.

Description

Technical Field

[0001] The utility model relates to the field of server heat dissipation structures, in particular to a micro server heat dissipation structure. Background Art

[0002] The existing servers, whether rack-mounted, blade-mounted or tower-mounted, all use fans to force heat dissipation. This heat dissipation method consumes a lot of energy and is prone to failure. Rack-mounted and blade-mounted structures must also be operated in a computer room with constant temperature and humidity, which requires huge investment and increases energy consumption. Micro servers also generate heat during operation. For existing CPU heat dissipation structures, please refer to the Chinese utility model patent with application number 201922118994.8, entitled A High-efficiency and Low-cost Access Control Heat Dissipation Structure. Traditional heat dissipation structures have the problems of slow thermal conductivity and high cost. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a micro server heat dissipation structure to improve the heat conduction and heat dissipation efficiency of the CPU.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a micro server heat dissipation structure, comprising:

[0005] The shell has an installation chamber inside and heat dissipation fins on the outer wall. The thickness of the heat dissipation fins gradually decreases from one end close to the outer wall to the other end. The installation chamber has a CPU and a heat conductor, which is arranged between the CPU and the shell side wall with the heat dissipation fins.

[0006] Furthermore, the cross-sectional shape of the heat dissipation fin is an isosceles trapezoid.

[0007] Furthermore, one end of the heat dissipation fin away from the outer wall has a curved surface.

[0008] Furthermore, the angle between the side wall of the heat dissipation fin and the outer wall ranges from 1° to 5°.

[0009] Furthermore, the heat conductor includes a copper core layer and a graphene coating coated on the outside of the copper core layer.

[0010] Furthermore, the heat conducting member includes a first thermal grease layer, a graphene thermal grease layer and a second thermal grease layer which are stacked together, the first thermal grease layer is connected to the CPU, and the second thermal grease layer is connected to the inner wall of the shell.

[0011] Furthermore, it also includes an aluminum bracket, which is locked with the inner wall of the shell, and the heat conducting element is installed on the aluminum bracket.

[0012] The beneficial effects of the utility model are: a micro-server heat dissipation structure is provided with a heat conducting member inside the shell between the CPU and the inner wall of the shell, and heat dissipation fins are designed on the corresponding outer wall. The heat dissipation fins adopt a structure with a thick root and a thin wing tip according to calculation. Such a structure can more quickly and efficiently transfer the heat generated during the operation of the CPU to the base of the fin with a larger specific heat capacity through the heat conducting member, and then efficiently conduct it to the external environment atmosphere through the heat dissipation fins. Because the wing tip of the fin is thinner than the root, the smooth and effective air convection is ensured, the heat conduction effect is better and the efficiency is high, which not only balances the performance but also reduces the energy consumption, thereby ensuring the working performance of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of the heat dissipation structure of the micro server;

[0014] Figure 2 is a cross-sectional view of a heat dissipation structure of a micro server;

[0015] Description of labels:

[0016] 1. Shell; 2. Installation chamber; 3. Heat sink fins; 4. CPU; 5. Heat conducting parts. DETAILED DESCRIPTION

[0017] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in conjunction with the implementation modes and the accompanying drawings.

[0018] The utility model provides a micro server heat dissipation structure, which is applied in the heat dissipation design of a micro server CPU.

[0019] Please refer to Figure 1 to Figure 2 As shown, the micro server heat dissipation structure of the utility model includes:

[0020] The housing 1 has an installation chamber 2 inside and heat dissipation fins 3 on its outer wall. A CPU 4 and a heat conducting member 5 are arranged in the installation chamber 2 . The heat conducting member 5 is arranged between the CPU 4 and the side wall of the housing 1 with the heat dissipation fins 3 .

[0021] From the above description, it can be seen that the beneficial effects of the utility model are: the micro-server heat dissipation structure is provided with a heat conductor 5 between the CPU4 and the inner wall of the shell 1 inside the shell 1, and the heat dissipation fins 3 are designed on the corresponding outer wall. The heat dissipation fins 3 adopt a structure with a thick root and a thin wing tip according to calculation. Such a structure can more quickly and efficiently transfer the heat generated during the operation of the CPU4 through the heat conductor 5 to the base of the fin with a larger specific heat capacity, and then efficiently conduct it to the external environment atmosphere through the heat dissipation fins 3. Because the wing tip of the heat dissipation fin 3 is thinner than the root, the smooth and effective air convection is ensured, the heat conduction effect is better and the efficiency is high, which not only balances the performance but also reduces the energy consumption, thereby ensuring the working performance of the equipment.

[0022] In an optional embodiment, the cross-sectional shape of the heat dissipation fin 3 is an isosceles trapezoid.

[0023] It can be seen from the above description that the heat dissipation fin 3 adopts an isosceles trapezoidal cross-section design to have a higher heat dissipation efficiency.

[0024] In an optional embodiment, one end of the heat dissipation fin 3 away from the outer wall has a curved surface.

[0025] From the above description, it can be seen that the wing tips of the heat dissipation fins 3 are curved surfaces to maximize the heat dissipation area and further improve the heat dissipation efficiency.

[0026] In an optional embodiment, the angle between the side wall of the heat dissipation fin 3 and the outer wall ranges from 1° to 5°.

[0027] From the above description, it can be seen that when the angle between the side wall of the heat dissipation fin 3 and the outer wall of the housing 1 is within the range of 1° to 5°, the heat dissipation effect is optimal.

[0028] In an optional embodiment, the heat conductor 5 includes a copper core layer and a graphene coating coated on the outside of the copper core layer.

[0029] In an optional embodiment, the heat conducting member 5 includes a first thermal grease layer, a graphene thermal grease layer, and a second thermal grease layer which are stacked together, the first thermal grease layer is connected to the CPU 4 , and the second thermal grease layer is connected to the inner wall of the housing 1 .

[0030] In an optional embodiment, an aluminum bracket is further included, the aluminum bracket is locked with the inner wall of the shell 1, and the heat conducting member 5 is installed on the aluminum bracket.

[0031] It can be seen from the above description that the heat conducting member 5 is fixed by an aluminum bracket to ensure the stability of its installation structure.

[0032] Please refer to Figure 1 to Figure 2 As shown, the first embodiment of the utility model is: a micro server heat dissipation structure, comprising:

[0033] The shell 1 has an installation chamber 2 inside, and heat dissipation fins 3 on the outer wall. The thickness of the heat dissipation fins 3 gradually decreases from one end close to the outer wall to the other end. The installation chamber 2 has a CPU 4 and a heat conductor 5. The heat conductor 5 is arranged between the CPU 4 and the side wall of the shell 1 with the heat dissipation fins 3.

[0034] The cross-sectional shape of the heat sink fin 3 is an isosceles trapezoid. The end of the heat sink fin 3 away from the outer wall has a curved surface. The angle between the side wall of the heat sink fin 3 and the outer wall is in the range of 1° to 5°. The heat conductor 5 includes a copper core layer and a graphene coating coated on the outside of the copper core layer.

[0035] Please refer to Figure 1 to Figure 2As shown, the difference between the second embodiment of the utility model and the first embodiment is that it also includes an aluminum bracket, the aluminum bracket is locked with the inner wall of the housing 1, and the heat conductive member 5 is installed on the aluminum bracket. The heat conductive member 5 includes a first heat conductive silicone grease layer, a graphene heat conductive layer, and a second heat conductive silicone grease layer that are superimposed, the first heat conductive silicone grease layer is connected to the CPU 4, and the second heat conductive silicone grease layer is connected to the inner wall of the housing 1.

[0036] To sum up, the heat dissipation structure of the micro server of the present invention is provided with a heat conductive part between the CPU and the inner wall of the shell inside the shell, and heat dissipation fins are designed on the corresponding outer wall. The heat dissipation fins adopt a structure with a thick root and a thin wing tip according to calculation. Such a structure can more quickly and efficiently transfer the heat generated by the CPU operation process through the heat conductive part to the base of the fin with a larger specific heat capacity, and then efficiently conduct it to the external environment atmosphere through the heat dissipation fins. Because the wing tip of the fin is thinner than the root, the smooth and effective air convection is ensured, the heat conduction effect is better and the efficiency is high, which not only balances the performance but also reduces the energy consumption, thereby ensuring the working performance of the equipment.

[0037] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A micro server heat dissipation structure, characterized in that: include: The shell has an installation chamber inside and heat dissipation fins on the outer wall. The thickness of the heat dissipation fins gradually decreases from one end close to the outer wall to the other end. The installation chamber has a CPU and a heat conductor, which is arranged between the CPU and the shell side wall with the heat dissipation fins.

2. The micro server heat dissipation structure according to claim 1, characterized in that: The cross-section shape of the heat dissipation fin is an isosceles trapezoid.

3. The micro server heat dissipation structure according to claim 2, characterized in that: One end of the heat dissipation fin away from the outer wall has a curved surface.

4. The micro server heat dissipation structure according to claim 2, characterized in that: The included angle between the side wall of the heat dissipation fin and the outer wall ranges from 1° to 5°.

5. The micro server heat dissipation structure according to any one of claims 1 to 4, characterized in that: The heat conducting element comprises a copper core layer and a graphene coating coated on the outside of the copper core layer.

6. The micro server heat dissipation structure according to any one of claims 1 to 4, characterized in that: The heat conducting member comprises a first heat conducting silicone grease layer, a graphene heat conducting layer and a second heat conducting silicone grease layer which are stacked and arranged. The first heat conducting silicone grease layer is connected to the CPU, and the second heat conducting silicone grease layer is connected to the inner wall of the shell.

7. The micro server heat dissipation structure according to claim 1, characterized in that: The utility model also comprises an aluminum bracket, which is locked with the inner wall of the shell body, and the heat conducting element is installed on the aluminum bracket.

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