Compression-resistant chip capacitor

Abstract

The utility model relates to the technical field of chip capacitors, and discloses a compression-resistant chip capacitor, which comprises a capacitor main body, pins are arranged on two sides of the lower end of the capacitor main body; the aluminum oxide ceramic liner is arranged outside the capacitor main body, and slots are formed in the two sides of the upper end of the exterior of the aluminum oxide ceramic liner; the compression-resistant cover is arranged outside the aluminum oxide ceramic inner container, the compression-resistant cover is made of a stainless steel material, and insertion strips are arranged on the left side and the right side of the interior of the compression-resistant cover; the supporting bottom ring is arranged at the lower end of the pressure-resistant cover, and a plurality of triangular supporting blocks which are annularly and uniformly distributed are mounted on one side of the upper end of the exterior of the supporting bottom ring; and the heat conduction pad is arranged in the compression-resistant cover at the upper end of the capacitor main body. According to the utility model, the aluminum oxide ceramic inner container is arranged outside the chip capacitor and is matched with the pressure-resistant cover structure, so that the chip capacitor has the pressure-resistant characteristic.

Description

Technical Field

[0001] The utility model relates to the technical field of chip capacitors, in particular to a pressure-resistant chip capacitor. Background Art

[0002] Chip capacitors, also known as SMD capacitors, are a type of surface mount capacitor. Specifically, it is made of ceramic dielectric diaphragms with printed electrodes (inner electrodes) stacked in a dislocated manner, sintered at high temperature once to form a ceramic chip, and then sealed with a metal layer (outer electrode) at both ends of the chip to form a monolithic structure, so it is also called a monolithic capacitor. Its structure usually includes two metal electrodes and an insulating medium sandwiched in between. When the voltage in the circuit changes, the chip capacitor will absorb or release electrical energy, playing a role in smoothing voltage fluctuations.

[0003] For example, the Chinese authorized patent with announcement number CN216084625 U (a chip capacitor) includes a main body, a positive electrode pin is fixedly connected to the lower surface of the main body, a negative electrode pin is fixedly connected to the lower surface of the main body, and a base is arranged on the lower surface of the main body.

[0004] The existing chip capacitors have a simple structure and are composed of chip capacitors and metal terminals. Therefore, they cannot withstand pressure well during use. When pressure acts on the chip capacitors, it is easy to cause the chip capacitors to deform or cause the packaging of the chip capacitors to be damaged, causing the contents of the chip capacitors to leak, thereby causing a circuit short circuit and causing losses. Therefore, a pressure-resistant chip capacitor is proposed. Utility Model Content

[0005] In view of the deficiencies of the prior art, the utility model provides a pressure-resistant chip capacitor to solve the problem of the chip capacitor being damaged by pressure deformation mentioned in the above background technology.

[0006] To achieve the above purpose, the utility model provides the following technical solution: a pressure-resistant chip capacitor, comprising:

[0007] A capacitor body, wherein pins are arranged on both sides of the lower end of the capacitor body;

[0008] An aluminum oxide ceramic liner is arranged outside the capacitor body, and slots are arranged on both sides of the upper end of the outer side of the aluminum oxide ceramic liner;

[0009] The pressure-resistant cover is arranged outside the aluminum oxide ceramic inner liner, and the pressure-resistant cover is made of stainless steel. Inserts are arranged on both the left and right sides of the pressure-resistant cover, and the inserts are adapted to the slots;

[0010] A support bottom ring is arranged at the lower end of the pressure-resistant cover, and the support bottom ring is fixedly connected to the pressure-resistant cover, and a plurality of triangular support blocks evenly distributed along a ring are installed on one side of the outer upper end of the support bottom ring, and the triangular support blocks are fixedly connected to the support bottom ring and the pressure-resistant cover;

[0011] The thermal pad is arranged inside the pressure-resistant cover at the upper end of the capacitor body, and is used for heat conduction and buffering.

[0012] Preferably, an annular groove is provided on the outside of the capacitor body, and the annular groove is integrally formed with the capacitor body, and the annular groove is used for limiting the disassembly and assembly of the alumina ceramic inner tank.

[0013] Preferably, spring pieces are provided on both the left and right sides of the lower end of the inner part of the alumina ceramic liner, and the spring pieces are fixedly connected to the alumina ceramic liner, and the spring pieces have automatic reset properties for easy disassembly and assembly.

[0014] Preferably, an anti-skid pad is provided on one side of the outer portion of the spring sheet, and the anti-skid pad is fixedly connected to the spring sheet, so that the anti-skid pad has an anti-skid effect and improves the stability of the connection between the spring sheet and the annular groove.

[0015] Preferably, the spring piece is matched with the annular groove, and the spring piece is inserted into the annular groove for limiting position.

[0016] Preferably, a plurality of first heat dissipating fins distributed equidistantly are provided on one side of the upper end of the outer portion of the pressure-resistant cover, and the first heat dissipating fins are fixedly connected to the pressure-resistant cover, and the first heat dissipating fins are used to dissipate heat from the top of the pressure-resistant cover.

[0017] Preferably, a plurality of second heat dissipation fins evenly distributed in a ring shape are provided on one side of the outside of the pressure-resistant cover, and the second heat dissipation fins are fixedly connected to the pressure-resistant cover, and the second heat dissipation fins are used to dissipate heat around the outside of the pressure-resistant cover.

[0018] Compared with the prior art, the utility model provides a pressure-resistant chip capacitor, which has the following beneficial effects:

[0019] The utility model provides the first layer of protection for the capacitor body through the aluminum oxide ceramic liner. At the same time, the aluminum oxide ceramic liner has insulation properties and good thermal conductivity, so that heat can be transferred to the external pressure-resistant cover. The pressure-resistant cover is made of stainless steel, which improves the corrosion resistance and pressure resistance of the capacitor body. The pressure-resistant cover and the capacitor body are adhered and fixed by a thermal pad. The supporting bottom ring at the bottom of the pressure-resistant cover contacts the upper end of the circuit board, which increases the contact area and further improves the stability and protection. At the same time, the triangular support block improves the deformation resistance of the pressure-resistant cover. In summary, the problems raised in the background technology are solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional diagram of the overall structure of the utility model;

[0021] Figure 2 This is a cross-sectional view of the internal structure of the capacitor body and the pressure-resistant cover of the utility model;

[0022] Figure 3 For the utility model Figure 2 A partial enlarged view of area A.

[0023] In the figure: 1. Capacitor body; 2. Ring groove; 3. Pin; 4. Aluminum oxide ceramic liner; 5. Slot; 6. Spring clip; 7. Anti-skid pad; 8. Pressure-resistant cover; 9. Support bottom ring; 10. Triangular support block; 11. Insert; 12. Thermal pad; 13. First heat sink fin; 14. Second heat sink fin. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] The utility model provides a technical solution, a pressure-resistant chip capacitor, please refer to Figure 1 , Figure 2 and Figure 3 ,include:

[0026] A capacitor body 1, with pins 3 disposed on both sides of the lower end of the capacitor body 1;

[0027] The aluminum oxide ceramic liner 4 is arranged outside the capacitor body 1, and slots 5 are arranged on both sides of the upper end of the outer side of the aluminum oxide ceramic liner 4;

[0028] The pressure-resistant cover 8 is arranged outside the aluminum oxide ceramic inner liner 4. The pressure-resistant cover 8 is made of stainless steel. Inserts 11 are arranged on both sides of the inside of the pressure-resistant cover 8, and the inserts 11 are matched with the slots 5.

[0029] A support bottom ring 9 is arranged at the lower end of the pressure-resistant cover 8, and the support bottom ring 9 is fixedly connected to the pressure-resistant cover 8. A plurality of triangular support blocks 10 evenly distributed along a ring are installed on one side of the outer upper end of the support bottom ring 9, and the triangular support blocks 10 are fixedly connected to the support bottom ring 9 and the pressure-resistant cover 8;

[0030] The thermal pad 12 is disposed inside the pressure-resistant cover 8 at the upper end of the capacitor body 1 .

[0031] When in use, the aluminum oxide ceramic liner 4 serves as the first layer of protection for the capacitor body 1. At the same time, the aluminum oxide ceramic liner 4 has insulation properties and good thermal conductivity, so that heat can be transferred to the external pressure-resistant cover 8. The pressure-resistant cover 8 is made of stainless steel, which improves the corrosion resistance and pressure resistance of the capacitor body 1. The pressure-resistant cover 8 is fixed to the capacitor body 1 through the thermal pad 12. The support bottom ring 9 at the bottom of the pressure-resistant cover 8 contacts the upper end of the circuit board, which increases the contact area and further improves the stability and protection. At the same time, the triangular support block 10 improves the deformation resistance of the pressure-resistant cover 8. It should be noted that in order to save space and highlight the innovative elements of this patent, this solution is based on the existing chip capacitor and improves its related structures, such as the capacitor body 1, aluminum oxide ceramics, springs 6, thermal pads 12, heat sink fins and other conventional structures, which are not repeated in this patent.

[0032] See also Figure 2 and Figure 3 A ring groove 2 is arranged outside the capacitor body 1, and the ring groove 2 is integrally formed with the capacitor body 1, and the ring groove 2 is used for disassembly and assembly limiting of the aluminum oxide ceramic inner tank 4.

[0033] See also Figure 2 and Figure 3 Shrapnel 6 is arranged on both sides of the lower end of the inner part of the aluminum oxide ceramic liner 4, and the shrapnel 6 is fixedly connected to the aluminum oxide ceramic liner 4, and the shrapnel 6 has automatic reset function for easy disassembly and assembly.

[0034] Please refer to the figure, an anti-skid pad 7 is provided on one side of the outer portion of the spring piece 6, and the anti-skid pad 7 is fixedly connected to the spring piece 6, and the anti-skid pad 7 has an anti-skid effect, thereby improving the stability of the connection between the spring piece 6 and the annular groove 2.

[0035] See also Figure 2 and Figure 3 The spring piece 6 is matched with the annular groove 2, and the spring piece 6 is inserted into the annular groove 2 for limiting.

[0036] See also Figure 1 and Figure 2 A plurality of equidistantly distributed first heat dissipating fins 13 are arranged on one side of the outer upper end of the pressure-resistant cover 8 , and the first heat dissipating fins 13 are fixedly connected to the pressure-resistant cover 8 , and the first heat dissipating fins 13 are used to dissipate heat from the top of the pressure-resistant cover 8 .

[0037] See also Figure 1 and Figure 2 A plurality of second heat dissipating fins 14 evenly distributed along a ring are arranged on one side of the outside of the pressure-resistant cover 8, and the second heat dissipating fins 14 are fixedly connected to the pressure-resistant cover 8, and the second heat dissipating fins 14 are used to dissipate heat around the outside of the pressure-resistant cover 8.

[0038] This solution: the aluminum oxide ceramic liner 4 serves as the first layer of protection for the capacitor body 1. At the same time, the aluminum oxide ceramic liner 4 has insulation properties and good thermal conductivity so that heat can be transferred to the external pressure-resistant cover 8. The pressure-resistant cover 8 is made of stainless steel, which improves the corrosion resistance and pressure resistance of the capacitor body 1. The pressure-resistant cover 8 and the capacitor body 1 are adhered and fixed by a thermal pad 12. The supporting bottom ring 9 at the bottom of the pressure-resistant cover 8 contacts the upper end of the circuit board, which increases the contact area and further improves the stability and protection. At the same time, the triangular support block 10 improves the deformation resistance of the pressure-resistant cover 8. The first heat dissipation fins 13 and the second heat dissipation fins 14 make it easy to dissipate the pressure cover 8. The spring clips 6 and the anti-slip pads 7 make it convenient and quick to disassemble and assemble the aluminum oxide ceramic liner 4 and the capacitor body 1. The aluminum oxide ceramic liner 4 can be retained when the capacitor body 1 is replaced, reducing the cost of use.

[0039] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0040] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A pressure-resistant chip capacitor, characterized in that: include: A capacitor body (1), wherein pins (3) are provided on both sides of the lower end of the capacitor body (1); An aluminum oxide ceramic liner (4) is arranged outside the capacitor body (1), and slots (5) are arranged on both sides of the upper end of the outer side of the aluminum oxide ceramic liner (4); A pressure-resistant cover (8) is arranged outside the aluminum oxide ceramic inner container (4), the pressure-resistant cover (8) is made of stainless steel, and insert strips (11) are arranged on both left and right sides of the pressure-resistant cover (8), and the insert strips (11) are adapted to the slots (5); A support bottom ring (9) is arranged at the lower end of the pressure-resistant cover (8), and the support bottom ring (9) is fixedly connected to the pressure-resistant cover (8); a plurality of triangular support blocks (10) evenly distributed along a ring shape are installed on one side of the outer upper end of the support bottom ring (9), and the triangular support blocks (10) are fixedly connected to the support bottom ring (9) and the pressure-resistant cover (8); The heat conducting pad (12) is arranged inside the pressure-resistant cover (8) at the upper end of the capacitor body (1).

2. A pressure-resistant chip capacitor according to claim 1, characterized in that: An annular groove (2) is provided on the outside of the capacitor body (1), and the annular groove (2) and the capacitor body (1) are integrally formed.

3. A pressure-resistant chip capacitor according to claim 2, characterized in that: Shrapnel (6) is provided on both left and right sides of the lower end of the inner part of the aluminum oxide ceramic liner (4), and the shrapnel (6) is fixedly connected to the aluminum oxide ceramic liner (4).

4. The pressure-resistant chip capacitor according to claim 3, characterized in that: An anti-skid pad (7) is provided on one side of the outer portion of the spring sheet (6), and the anti-skid pad (7) is fixedly connected to the spring sheet (6).

5. The pressure-resistant chip capacitor according to claim 3, characterized in that: The spring sheet (6) is matched with the annular groove (2).

6. The pressure-resistant chip capacitor according to claim 1, characterized in that: A plurality of first heat dissipation fins (13) distributed at equal intervals are arranged on one side of the upper end of the outer portion of the pressure-resistant cover (8), and the first heat dissipation fins (13) are fixedly connected to the pressure-resistant cover (8).

7. The pressure-resistant chip capacitor according to claim 1, characterized in that: A plurality of second heat dissipation fins (14) evenly distributed in a ring shape are arranged on one side of the outside of the pressure-resistant cover (8), and the second heat dissipation fins (14) are fixedly connected to the pressure-resistant cover (8).

Images