Cleaning equipment

Abstract

The utility model discloses cleaning equipment which comprises a rinsing bath, a slow lifting bath and a water-saving bath, the rinsing bath is used for rinsing a semiconductor by using a first liquid, the slow lifting bath is used for introducing a second liquid to carry out slow lifting cleaning on the rinsed semiconductor, the temperature of the second liquid is higher than that of the first liquid, the slow lifting bath is provided with an overflow port, and the overflow port is communicated with the water-saving bath. The water-saving tank is communicated with the overflow port and the washing tank, the water-saving tank is used for receiving the second liquid discharged from the overflow port and introducing the second liquid into the washing tank, and the washing tank is also used for washing the semiconductor by using the second liquid. By the adoption of the scheme, the utilization rate of the second liquid can be increased, and the production cost of semiconductor cleaning is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a cleaning device. Background Art

[0002] Semiconductor cleaning is a process in the semiconductor manufacturing process, which aims to remove impurities and contaminants on the surface of the semiconductor to ensure the quality and performance of semiconductor devices. Semiconductor cleaning can be divided into two types: wet cleaning and dry cleaning. Wet cleaning usually uses a wet tank machine. The slow pull tank of the wet tank machine uses deionized water to slowly pull and clean the semiconductor. The deionized water overflows from the overflow port during the operation of the slow pull tank and will be directly discharged into the sewage treatment system. The amount of deionized water used is large and the utilization rate is low. At the same time, the cost of deionized water is high, which increases the production cost of semiconductor cleaning. Utility Model Content

[0003] The embodiment of the utility model discloses a cleaning device, which can improve the utilization rate of the second liquid and reduce the production cost of semiconductor cleaning.

[0004] In order to achieve the above-mentioned purpose, the embodiment of the utility model discloses a cleaning device, comprising:

[0005] A water washing tank, the water washing tank is used to wash the semiconductor with a first liquid;

[0006] A slow pull-up tank, the slow pull-up tank is used to introduce a second liquid to perform slow pull-up cleaning on the semiconductor after water washing, the temperature of the second liquid is higher than the temperature of the first liquid, and the slow pull-up tank is provided with an overflow port; and

[0007] A water-saving tank is connected to the overflow port and the water-washing tank. The water-saving tank is used to receive the second liquid discharged from the overflow port and pass the second liquid into the water-washing tank. The water-washing tank is also used to use the second liquid to wash the semiconductor.

[0008] As an optional implementation, in an embodiment of the present utility model, the height direction of the cleaning device is a first direction, and the water-saving tank is located below the overflow port along the first direction.

[0009] As an optional embodiment, in an embodiment of the present utility model, the slow pulling trough includes a first trough body and a second trough body, the second trough body is arranged above the first trough body along the first direction and is connected to the first trough body, the second trough body is extended along the second direction and protrudes from the first trough body, the second direction is perpendicular to the first direction, and the overflow port is arranged at the part of the second trough body protruding from the first trough body.

[0010] As an optional implementation, in an embodiment of the utility model, the second trough body has a first inclined surface, the first inclined surface is located at the part of the second trough body protruding from the first trough body, the first inclined surface gradually tilts downward along the first direction in the direction away from the first trough body, and the overflow port is arranged on the first inclined surface.

[0011] As an optional embodiment, in an embodiment of the utility model, the portion of the second groove body protruding from the first groove body along the second direction is arranged around the first groove body, and the bottom surface of the portion of the second groove body protruding from the first groove body along the second direction is inclined relative to a plane perpendicular to the first direction, and the first inclined surface is a partial surface of the bottom surface of the second groove body.

[0012] As an optional embodiment, in an embodiment of the utility model, the cleaning equipment includes a first liquid inlet pipeline and a second liquid inlet pipeline, the first liquid inlet pipeline is connected to the water washing tank and the slow pulling tank, the first liquid inlet pipeline is used to pass the first liquid into the water washing tank and the slow pulling tank, the second liquid inlet pipeline is connected to the slow pulling tank, and the second liquid inlet pipeline is used to pass the second liquid into the slow pulling tank.

[0013] As an optional implementation, in an embodiment of the utility model, the first liquid inlet pipeline includes a first main pipeline, a first branch pipeline, a second branch pipeline and a third branch pipeline, the first main pipeline is used to introduce the first liquid, the first branch pipeline and the second branch pipeline are respectively connected to the first main pipeline and the water washing tank, the third branch pipeline is connected to the first main pipeline and the slow pull tank, the second liquid inlet pipeline includes a second main pipeline, a fourth branch pipeline and a fifth branch pipeline, the second main pipeline is used to introduce the second liquid, the fourth branch pipeline and the fifth branch pipeline are respectively connected to the second main pipeline and the slow pull tank.

[0014] As an optional implementation, in an embodiment of the utility model, the cleaning equipment also includes a pumping device, which is connected to the water-saving tank and the water-washing tank, and is used to pump the second liquid in the water-saving tank to the water-washing tank.

[0015] As an optional implementation, in an embodiment of the utility model, the cleaning equipment also includes a heat exchanger and a water storage device, the heat exchanger is arranged in the water-saving tank, the heat exchanger is used to pass the first liquid, the heat exchanger is connected to the water storage device, the heat exchanger is used to make the second liquid in the water-saving tank transfer heat to the first liquid in the heat exchanger, and is used to pass the first liquid after heat exchange into the water storage device.

[0016] As an optional embodiment, in an embodiment of the utility model, the cleaning equipment also includes a heating device, which is arranged in the water storage device, and the heating device is used to heat the first liquid in the water storage device to form the second liquid. The water storage device is connected to the slow pull tank to supply the second liquid to the slow pull tank.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] In the cleaning equipment provided by the embodiment of the utility model, the second liquid in the slow pull-up tank that has been used for slow pull-up cleaning of semiconductors will be discharged from the overflow port. By setting a water-saving tank, the second liquid discharged from the overflow port will be received by the water-saving tank, and the second liquid stored in the water-saving tank will be passed into the water washing tank, thereby realizing the secondary utilization of the second liquid discharged from the slow pull-up tank, improving the utilization rate of the second liquid, and reducing the production cost of semiconductor cleaning. In addition, since the second liquid in the slow pull-up tank that has been used for slow pull-up cleaning of semiconductors has a low degree of contamination, and the water washing tank has a low requirement for the purity of the liquid, the water washing tank uses the first liquid and the second liquid overflowing from the slow pull-up tank to wash the semiconductor, and the second liquid in the slow pull-up tank that has been used for slow pull-up cleaning of semiconductors is reused for the second time, and the cleaning effect of the water washing tank on washing semiconductors will not be affected. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a structural schematic diagram of the cleaning device disclosed in the embodiment of the present application;

[0021] Figure 2 It is a structural schematic diagram of the cleaning device disclosed in the embodiment of the present application from another perspective;

[0022] Figure 3 It is a schematic diagram of the structure of the slow pull trough disclosed in the embodiment of the present application;

[0023] Figure 4 It is a schematic diagram of the structure of the cleaning equipment disclosed in the embodiment of the present application (only the slow pull tank, water-saving tank, heat exchanger, water storage device and heating device are shown).

[0024] Icons: 1. Cleaning equipment; 10. Washing tank; 11. Slow pulling tank; 11a. First tank body; 11b. Second tank body; 110. Overflow port; 111. Bottom surface; 111a. First slope; 12. Water-saving tank; 13. Pumping device; 14. First valve; 15. First liquid inlet pipeline; 15a. First main pipeline; 15b. First branch pipeline; 150. First flow meter; 15c. Second branch pipeline; 15d. Third branch pipeline; 16. Second liquid inlet pipeline; 16a. Second main pipeline; 16b. Fourth branch pipeline; 160. Second flow meter; 16c. Fifth branch pipeline; 17. Heat exchanger; 18. Water storage device; 19. Heating device; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] The technical solution of the utility model will be further described below in conjunction with embodiments and drawings.

[0027] See also Figure 1 The embodiment of the utility model discloses a cleaning device 1, including a water washing tank 10, a slow pulling tank 11 and a water saving tank 12. The water washing tank 10 is used to wash the semiconductor with a first liquid, and the slow pulling tank 11 is used to introduce a second liquid to perform slow pulling cleaning on the washed semiconductor. The temperature of the second liquid is higher than that of the first liquid. The slow pulling tank 11 is provided with an overflow port 110. The water saving tank 12 is connected to the overflow port 110 and the water washing tank 10. The water saving tank 12 is used to receive the second liquid discharged from the overflow port 110 and introduce the second liquid into the water washing tank 10. The water washing tank 10 is also used to wash the semiconductor with the second liquid.

[0028] In the cleaning device 1 provided by the embodiment of the utility model, the second liquid in the slow pull-up tank 11 that has been used for slow pull-up cleaning of semiconductors will be discharged from the overflow port 110. By setting the water-saving tank 12, the second liquid discharged from the overflow port 110 will be received by the water-saving tank 12, and the second liquid stored in the water-saving tank 12 is passed into the water washing tank 10, thereby realizing the secondary utilization of the second liquid discharged from the slow pull-up tank 11, improving the utilization rate of the second liquid, and reducing the production cost of semiconductor cleaning. In addition, since the second liquid in the slow pull-up tank 11 that has been used for slow pull-up cleaning of semiconductors has a low degree of contamination, and the water washing tank 10 has a low requirement for the purity of the liquid, therefore, the water washing tank 10 uses the first liquid and the second liquid overflowing from the slow pull-up tank 11 to wash the semiconductor, and the second liquid in the slow pull-up tank 11 that has been used for slow pull-up cleaning of semiconductors is reused for the second time, and will not affect the cleaning effect of the water washing tank 10 on the semiconductor.

[0029] In actual production, the washing tank 10 and the slow pulling tank 11 of the cleaning equipment 1 both use deionized water to clean semiconductors. The washing tank 10 has no special requirements for the temperature of the deionized water, and usually uses deionized water at room temperature. The slow pulling tank 11 requires high-temperature deionized water (usually 60°C-70°C). Therefore, the first liquid and the second liquid in the present application are both deionized water, and the difference lies mainly in the temperature, that is, the temperature of the second liquid is higher than that of the first liquid.

[0030] In some embodiments, the height direction of the cleaning device 1 is the first direction X, and the water-saving tank 12 is located below the overflow port 110 along the first direction X.

[0031] In this way, by arranging the water-saving tank 12 below the overflow port 110 along the first direction X, the second liquid overflowing from the overflow port 110 of the slow pull tank 11 can flow into the water-saving tank 12 under the action of gravity, without the need for an additional power device (such as a pump, etc.), thereby reducing the energy consumption of the cleaning equipment 1.

[0032] In some embodiments, the cleaning device 1 further includes a pumping device 13 , which is connected to the water-saving tank 12 and the water-washing tank 10 , and is used to pump the second liquid in the water-saving tank 12 to the water-washing tank 10 .

[0033] In this way, by providing the pumping device 13, the pumping device 13 can provide power for the liquid in the water-saving tank 12, so that the second liquid in the water-saving tank 12 is pumped to the water-washing tank 10, thereby supplying the second liquid to the water-washing tank 10. In addition, by providing power for the second liquid by the pumping device 13, it is easy to control the second liquid. For example, when the water-washing tank 10 needs to be washed with water, the pumping device 13 is turned on to supply the second liquid to the water-washing tank 10, or the flow rate of the second liquid supplied to the water-washing tank 10 can be controlled by adjusting the power of the pumping device 13.

[0034] Optionally, the pumping device 13 may be an electric pump, a pneumatic diaphragm pump, etc., which may be selected according to actual conditions and is not specifically limited in this embodiment.

[0035] In some embodiments, a first valve 14 is provided between the pumping device 13 and the water washing tank 10, and the first valve 14 is used to control the on-off state between the pumping device 13 and the water washing tank 10. In this way, when it is necessary to supply the second liquid to the water washing tank 10, the first valve 14 is opened, the pumping device 13 is connected to the water washing tank 10, and the pumping device 13 can pump the second liquid in the water-saving tank 12 to the water washing tank 10. When it is not necessary to supply the second liquid to the water washing tank 10, the second valve is closed, and the pumping device 13 is disconnected from the water washing tank 10.

[0036] Optionally, the first valve 14 may be a solenoid valve or a manual valve, etc., which may be selected according to actual conditions and is not specifically limited in this embodiment.

[0037] In some embodiments, the cleaning equipment 1 includes a first liquid inlet pipeline 15 and a second liquid inlet pipeline 16, the first liquid inlet pipeline 15 is connected to the water washing tank 10 and the slow pulling tank 11, the first liquid inlet pipeline 15 is used to pass the first liquid into the water washing tank 10 and the slow pulling tank 11, the second liquid inlet pipeline 16 is connected to the slow pulling tank 11, and the second liquid inlet pipeline 16 is used to pass the second liquid into the slow pulling tank 11.

[0038] In this way, the first liquid can be supplied to the water washing tank 10 through the first liquid inlet pipeline 15, so that the water washing tank 10 uses the first liquid to wash the semiconductor. The second liquid can be supplied to the slow pull tank 11 through the second liquid inlet pipeline 16, so that the slow pull tank 11 can slowly pull and clean the semiconductor, and when the temperature of the second liquid supplied by the second liquid inlet pipeline 16 is high and exceeds the temperature of the second liquid required by the slow pull tank 11, the first liquid inlet pipeline 15 can supply the first liquid to the slow pull tank 11 to reduce the temperature of the second liquid in the slow pull tank 11, so that the second liquid in the slow pull tank 11 can meet the temperature required for the slow pull cleaning of the semiconductor.

[0039] In some embodiments, the first liquid inlet pipeline 15 includes a first main pipeline 15a, a first branch pipeline 15b, a second branch pipeline 15c and a third branch pipeline 15d. The first main pipeline 15a is used to introduce the first liquid. The first branch pipeline 15b and the second branch pipeline 15c are respectively connected to the first main pipeline 15a and the water washing tank 10. The third branch pipeline 15d is connected to the first main pipeline 15a and the slow pulling tank 11. The second liquid inlet pipeline 16 includes a second main pipeline 16a, a fourth branch pipeline 16b and a fifth branch pipeline 16c. The second main pipeline 16a is used to introduce the second liquid. The fourth branch pipeline 16b and the fifth branch pipeline 16c are respectively connected to the second main pipeline 16a and the slow pulling tank 11.

[0040] In this way, the first liquid can be supplied to the washing tank 10 through the first main pipeline 15a and the first branch pipeline 15b, and the first liquid can also be supplied to the washing tank 10 through the first main pipeline 15a and the second branch pipeline 15c. On the one hand, the flow rate of the first liquid supply can be controlled by adjusting the on-off of the two branch pipelines, and on the other hand, it can also be avoided that the first liquid cannot be supplied to the washing tank 10 when one branch pipeline is damaged. The first liquid can be supplied to the slow pull tank 11 through the first main pipeline 15a and the third branch pipeline 15d. The second liquid can be supplied to the slow pull tank 11 through the second main pipeline 16a and the fourth branch pipeline 16b, and the second liquid can also be supplied to the slow pull tank 11 through the second main pipeline 16a and the fifth branch pipeline 16c. On the one hand, the flow rate of the second liquid supply can be controlled by adjusting the on-off of the two branch pipelines, and on the other hand, it can also be avoided that the second liquid cannot be supplied to the slow pull tank 11 when one branch pipeline is damaged.

[0041] In some embodiments, a first flow meter 150 is provided on the first branch pipe 15b, and a second flow meter 160 is provided on the fourth branch pipe 16b. The flow rate of the first liquid supplied to the water washing tank 10 through the first branch pipe 15b can be controlled by the first flow meter 150, and the flow rate of the second liquid supplied to the slow pull tank 11 through the fourth branch pipe 16b can be controlled by the second flow meter 160. In actual production, the first branch pipe 15b is a normally open pipe, which continuously supplies the first liquid to the water washing tank 10 at a certain flow rate, and the second branch pipe 15c is a normally closed pipe, which is opened when the water washing tank 10 is equipped with a tank to shorten the tank preparation time of the water washing tank 10. Similarly, the fourth branch pipe 16b is a normally open pipe, which continuously supplies the second liquid to the slow pull tank 11 at a certain flow rate, and the fifth branch pipe 16c is a normally closed pipe, which is opened when the slow pull tank 11 is equipped with a tank to shorten the tank preparation time of the slow pull tank 11.

[0042] Please also read Figure 2 and Figure 3In some embodiments, the slow pulling groove 11 includes a first groove body 11a and a second groove body 11b. The second groove body 11b is arranged above the first groove body 11a along the first direction X and is connected to the first groove body 11a. The second groove body 11b extends along the second direction Y and protrudes from the first groove body 11a. The second direction Y is perpendicular to the first direction X. The overflow port 110 is arranged at the portion of the second groove body 11b protruding from the first groove body 11a.

[0043] In this way, the first tank body 11a can store a certain volume of the second liquid, and when the liquid level of the second liquid is higher than the first tank body 11a, that is, when part of the second liquid is located in the tank body, this part of the liquid will overflow from the overflow port 110 of the second tank body 11b, and the overflow port 110 is arranged at the part of the second tank body 11b protruding from the first tank body 11a, which can facilitate the throttling groove to receive the second liquid overflowing from the overflow port 110.

[0044] Optionally, the second direction Y may indicate a direction perpendicular to the first direction X, in which case the bottom surface 111 of the second trough body 11b protrudes from the first trough body 11a on only one side; the second direction Y may indicate multiple directions perpendicular to the first direction X, in which case the bottom surface 111 of the second trough body 11b protrudes from the first trough body 11a on multiple sides; the second direction Y may indicate all directions perpendicular to the first direction X, in which case the bottom surface 111 of the second trough body 11b protrudes from the first trough body 11a all around.

[0045] In some embodiments, the second trough body 11b has a first inclined surface 111a, which is located at a portion of the second trough body 11b protruding from the first trough body 11a. The first inclined surface 111a gradually slopes downward along the first direction X away from the first trough body 11a, and the overflow port 110 is provided on the first inclined surface 111a.

[0046] In this way, the first slope 111a can guide the second liquid, so that the second liquid higher than the first tank body 11a can flow along the first slope 111a under the action of gravity, which is conducive to the second liquid higher than the first tank body 11a overflowing from the overflow port 110.

[0047] In some embodiments, the portion of the second groove body 11b protruding from the first groove body 11a along the second direction Y is arranged around the first groove body 11a, and the bottom surface 111 of the portion of the second groove body 11b protruding from the first groove body 11a along the second direction Y is inclined relative to the plane perpendicular to the first direction X, and the first inclined surface 111a is a partial surface of the bottom surface 111 of the second groove body 11b. In this embodiment, the second direction Y refers to all directions perpendicular to the first direction X, Figure 2 and Figure 3 The second direction Y shown in FIG. 1 is only an example of one of the second directions Y.

[0048] In this way, the bottom surface 111 of the second trough body 11b protruding from the first trough body 11a along the second direction Y forms a slope, so that the second liquid higher than the first trough body 11a can flow along the bottom surface 111 of the second trough body 11b under the action of gravity, thereby increasing the area of ​​the slope and making it more conducive for the second liquid higher than the first trough body 11a to overflow from the overflow port 110.

[0049] See also Figure 4 , Figure 4 The dotted line in the figure indicates that the water storage device 18 is connected to the slow pull tank 11. In some embodiments, the cleaning device 1 further includes a heat exchanger 17 and a water storage device 18. The heat exchanger 17 is disposed in the water-saving tank 12. The heat exchanger 17 is used to pass the first liquid. The heat exchanger 17 is connected to the water storage device 18. The heat exchanger 17 is used to transfer heat from the second liquid in the water-saving tank 12 to the first liquid in the heat exchanger 17, and is used to pass the first liquid after heat exchange into the water storage device 18. In this embodiment, the heat exchanger 17 is connected to the first main pipeline 15a.

[0050] In this way, the second liquid in the water-saving tank 12 can transfer heat to the first liquid, increase the temperature of the first liquid, and store the first liquid through the water storage device 18, so as to recover part of the heat of the second liquid and improve the energy utilization rate of the cleaning equipment 1.

[0051] Optionally, the heat exchanger 17 may be a capillary heat exchanger 17 to improve the efficiency of heat transfer from the second liquid in the water-saving tank 12 to the first liquid in the heat exchanger 17 .

[0052] Since the slow pull tank 11 requires high-temperature deionized water (usually 60°C-70°C), the cleaning device 1 usually needs to be provided with a heating device 19 to heat the deionized water, which consumes more energy. In particular, when the number of slow pull tanks 11 is large or the specifications of the slow pull tanks 11 are large, higher temperature deionized water (for example, 90°C) is required, which consumes more energy and brings a greater load to the heating device 19. Based on this, in some embodiments, the cleaning device 1 also includes a heating device 19, which is arranged in the water storage device 18. The heating device 19 is used to heat the first liquid in the water storage device 18 to form a second liquid. The water storage device 18 is connected to the slow pull tank 11 to supply the second liquid to the slow pull tank 11.

[0053] In this way, by recovering part of the heat of the second liquid, the temperature of the first liquid in the water storage device 18 is increased, which can reduce the load of the heating device 19 and the energy consumed by the heating device 19, thereby improving the energy utilization rate of the cleaning device 1.

[0054] Alternatively, if Figure 4As shown, the heating device 19 and the water storage device 18 can be integrally arranged, for example, the heating device 19 and the water storage device 18 are integrally arranged as an electric water heater, or the heating device 19 and the water storage device 18 can be separately arranged, for example, the heating device 19 is an electric heating rod, and the water storage device 18 is a water storage tank.

[0055] The cleaning equipment disclosed in the embodiment of the utility model is introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation mode of the utility model. The description of the above embodiments is only used to help understand the cleaning equipment of the utility model and its core idea. At the same time, for general technicians in this field, according to the idea of ​​the utility model, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. A cleaning device, characterized in that: include A water washing tank, the water washing tank is used to wash the semiconductor with a first liquid; A slow pull-up tank, the slow pull-up tank is used to introduce a second liquid to perform slow pull-up cleaning on the semiconductor after water washing, the temperature of the second liquid is higher than the temperature of the first liquid, and the slow pull-up tank is provided with an overflow port; and A water-saving tank is connected to the overflow port and the water-washing tank. The water-saving tank is used to receive the second liquid discharged from the overflow port and pass the second liquid into the water-washing tank. The water-washing tank is also used to use the second liquid to wash the semiconductor.

2. The cleaning device according to claim 1, characterized in that: The height direction of the cleaning device is a first direction, and the water-saving tank is located below the overflow port along the first direction.

3. The cleaning device according to claim 2, characterized in that: The slow pulling trough includes a first trough body and a second trough body, the second trough body is arranged above the first trough body along the first direction and is connected to the first trough body, the second trough body is extended along the second direction and protrudes from the first trough body, the second direction is perpendicular to the first direction, and the overflow port is arranged at the part of the second trough body protruding from the first trough body.

4. The cleaning device according to claim 3, characterized in that: The second trough body has a first inclined surface, the first inclined surface is located at a portion of the second trough body protruding from the first trough body, the first inclined surface gradually slopes downward along the first direction in a direction away from the first trough body, and the overflow port is arranged on the first inclined surface.

5. The cleaning device according to claim 4, characterized in that: The portion of the second groove body protruding from the first groove body along the second direction is arranged around the first groove body, and the bottom surface of the portion of the second groove body protruding from the first groove body along the second direction is inclined relative to a plane perpendicular to the first direction, and the first inclined surface is a partial surface of the bottom surface of the second groove body.

6. The cleaning device according to any one of claims 1 to 5, characterized in that: The cleaning equipment includes a first liquid inlet pipeline and a second liquid inlet pipeline, the first liquid inlet pipeline is connected to the water washing tank and the slow pulling tank, the first liquid inlet pipeline is used to pass the first liquid into the water washing tank and the slow pulling tank, the second liquid inlet pipeline is connected to the slow pulling tank, and the second liquid inlet pipeline is used to pass the second liquid into the slow pulling tank.

7. The cleaning device according to claim 6, characterized in that: The first liquid inlet pipeline includes a first main pipeline, a first branch pipeline, a second branch pipeline and a third branch pipeline. The first main pipeline is used to introduce the first liquid. The first branch pipeline and the second branch pipeline are respectively connected to the first main pipeline and the water washing tank. The third branch pipeline is connected to the first main pipeline and the slow pull tank. The second liquid inlet pipeline includes a second main pipeline, a fourth branch pipeline and a fifth branch pipeline. The second main pipeline is used to introduce the second liquid. The fourth branch pipeline and the fifth branch pipeline are respectively connected to the second main pipeline and the slow pull tank.

8. The cleaning device according to any one of claims 1 to 5, characterized in that: The cleaning equipment further includes a pumping device, which is connected to the water-saving tank and the water-washing tank, and is used to pump the second liquid in the water-saving tank to the water-washing tank.

9. The cleaning device according to any one of claims 1 to 5, characterized in that: The cleaning equipment also includes a heat exchanger and a water storage device. The heat exchanger is arranged in the water-saving tank. The heat exchanger is used to pass the first liquid. The heat exchanger is connected to the water storage device. The heat exchanger is used to transfer heat from the second liquid in the water-saving tank to the first liquid in the heat exchanger, and to pass the first liquid after heat exchange into the water storage device.

10. The cleaning device according to claim 9, characterized in that: The cleaning device also includes a heating device, which is arranged in the water storage device and is used to heat the first liquid in the water storage device to form the second liquid. The water storage device is connected to the slow pull tank to supply the second liquid to the slow pull tank.

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