Turnover device for semiconductor chip

Abstract

The utility model relates to the technical field of semiconductor chip production, and discloses a turnover device for a semiconductor chip, which comprises a base, a cam ring and a turnover part, the cam ring is fixedly arranged on the base, the turnover part is rotatably arranged on the base, and the turnover part is in sliding fit with the cam ring. The overturning amplitude of the chip can be changed according to actual use requirements; and by arranging the overturning part, the chip can be cleaned in all directions while the chip is overturned, so that the cleanness of the surface of the chip is ensured, and subsequent processing is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, in particular to a flipping device for semiconductor chips. Background Art

[0002] A semiconductor chip flipping device is a device used to flip a chip from one direction to another, usually used in chip processing, testing or packaging. The cleanliness of the chip surface is crucial to its performance. Cleaning the chip surface can ensure good electrical contact and maintain stable signal transmission. It can effectively manage heat, prevent overheating and heat conduction problems, enhance device reliability and reduce the risk of failure. It also provides a good foundation for subsequent processing.

[0003] The Chinese utility model patent with announcement number CN204834572U in the prior art book provides an automatic flipping device for a semiconductor chip material tube; it includes a feeding device, a separating device and a flipping device, the feeding device pushes the chip material tube to the top, the separating device picks it up and transports it to the flipping device, the latter holds and flips the chip material tube, and the image acquisition component is used to determine its direction.

[0004] The prior art cannot change the amplitude of chip flipping according to actual needs, has a limited scope of use, cannot clean the chip during the flipping process, and is not convenient for subsequent processing. Utility Model Content

[0005] The utility model aims to provide a flipping device for semiconductor chips, which can adjust the flipping degree of the chips and clean the chips during flipping.

[0006] The utility model is realized through the following technical scheme: a flipping device for semiconductor chips comprises a base, a cam ring and a flipping part, wherein the cam ring is fixedly arranged on the base, the flipping part is rotatably arranged on the base, the flipping part and the cam ring are slidably matched, the flipping part comprises a flipping fixing frame and a flipping fixing frame 2 which are rotatably arranged on the base, a flipping fixing frame 1 is fixedly arranged on the flipping fixing frame 2, a flipping block is fixedly arranged on the flipping fixing frame, a flipping rotating rod is rotatably arranged on the flipping block, a flipping vacuum adsorption pen and a flipping gear are fixedly arranged on the flipping rotating rod, a flipping tube is rotatably arranged on the flipping tube, a flipping screw is threadedly connected to the flipping tube, a flipping sliding ball is fixedly arranged on the flipping screw, the flipping sliding ball and the cam ring are slidably matched, a flipping semi-toothed ring 1 is fixedly arranged on the flipping tube, and the flipping semi-toothed ring 1 is meshed with the flipping gear; the flipping tube is fixedly connected to the flipping fixing frame 1 through a flipping reset spring, and the flipping fixing frame 2 and the flipping fixing frame are slidably arranged on the flipping fixing ring of the output shaft of the flipping cylinder.

[0007] In order to better realize the utility model, further, a flip half-tooth ring 2 is fixedly provided at the other end of the flip tube, and the flip half-tooth ring 2 is meshed with a flip half-gear fixedly provided on the flip rotating rod. A flip protrusion 2 is fixedly provided on the flip half-gear, and the flip protrusion 2 is slidably matched with a flip protrusion 1 fixedly provided on the flip annular nozzle. The flip annular nozzle is connected to the flip rotating rod through a spline, and a flip spring is fixedly provided between the flip annular nozzle and the flip vacuum adsorption pen.

[0008] In order to better realize the utility model, further, a plurality of gas exhaust channels are arranged on the flip annular nozzle, and a flip cleaning air pump is fixedly arranged on the flip annular nozzle.

[0009] In order to better realize the utility model, further, the flip cylinder is fixedly arranged on the base.

[0010] In order to better implement the utility model, further, the surface of the cam ring that slides with the flip sliding ball is an inclined surface.

[0011] In order to better realize the utility model, further, the flip tube and the flip sliding ball are made of stainless steel, and the flip sliding ball is spherical.

[0012] Compared with the prior art, the utility model has the following advantages and beneficial effects:

[0013] (1) The present invention can change the flipping amplitude of the chip according to actual usage requirements by providing a flipping part.

[0014] (2) The utility model provides a flipping part, which can clean the chip in all directions while flipping the chip, thereby ensuring the cleanliness of the chip surface and facilitating subsequent processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention is further described in conjunction with the following drawings and embodiments. All the concepts and innovations of the present invention should be regarded as the disclosed contents and the protection scope of the present invention.

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0017] Figure 2 It is a schematic diagram of the overall structure of the utility model from a front view angle.

[0018] Figure 3 It is a schematic diagram of the overall structure of the utility model from a side view angle.

[0019] Figure 4 The local structure of the turning part of the utility model is shown in FIG. Figure 1 .

[0020] Figure 5The local structure of the turning part of the utility model is shown in FIG. Figure 2 .

[0021] Figure 6 The local structure of the turning part of the utility model is shown in FIG. Figure 3 .

[0022] Among them: 1-flip part; 2-base; 3-cam ring; 101-flip vacuum adsorption pen; 102-flip spring; 103-flip rotating rod; 104-flip gear; 105-flip block; 106-flip semi-tooth ring one; 107-flip semi-tooth ring two; 108-flip screw; 109-flip sliding ball; 110-flip tube; 111-flip cleaning air pump; 112-flip annular nozzle; 113-flip semi-gear; 114-flip convex block one; 115-flip convex block two; 116-flip reset spring; 117-flip fixed frame one; 118-flip fixed frame two; 119-flip fixed ring; 120-flip cylinder; 121-flip fixed frame. DETAILED DESCRIPTION

[0023] Embodiment 1:

[0024] like Figure 1 , Figure 4 , Figure 5 , Figure 6 As shown, a flipping device for semiconductor chips includes a base 2, a cam ring 3, and a flipping part 1. The cam ring 3 is fixedly arranged on the base 2, and the flipping part 1 is rotatably arranged on the base 2. The flipping part 1 and the cam ring 3 are slidably matched. The flipping part 1 includes a flipping fixing frame 121 and a flipping fixing frame 118 which are rotatably arranged on the base 2. The flipping fixing frame 117 is fixedly arranged on the flipping fixing frame 118. A flipping block 105 is fixedly arranged on the flipping block 105. A flipping rotating rod 103 is rotatably arranged on the flipping rotating rod 103. A flipping vacuum adsorption pen 101 and a flipping vacuum adsorption pen 101 are fixedly arranged on the ... The turning gear 104 and the turning block 105 are rotatably provided with a turning tube 110, and a turning screw 108 is threadedly connected to the turning tube 110, and a turning sliding ball 109 is fixedly provided on the turning screw 108, and the turning sliding ball 109 is slidably matched with the cam ring 3, and a turning half-toothed ring 106 is fixedly provided on the turning tube 110, and the turning half-toothed ring 106 is meshed with the turning gear 104; the turning tube 110 is fixedly connected to a turning fixing frame 117 through a turning reset spring 116, and a turning fixing frame 2 118 and a turning fixing frame 121 are slidably provided on the turning fixing ring 119 of the output shaft of the turning cylinder 120.

[0025] like Figures 1 to 6As shown, a second flip half-toothed ring 107 is fixedly provided at the other end of the flip tube 110, and the second flip half-toothed ring 107 is meshed with a flip half-gear 113 fixedly provided on the flip rotating rod 103, and a second flip protrusion 115 is fixedly provided on the flip half-gear 113, and the flip protrusion 115 is slidably matched with a flip protrusion 114 fixedly provided on the flip annular nozzle 112, and the flip annular nozzle 112 is connected to the flip rotating rod 103 through a spline, and a flip spring 102 is fixedly provided between the flip annular nozzle 112 and the flip vacuum adsorption pen 101; a plurality of gas discharge channels are provided on the flip annular nozzle 112, and a flip cleaning air pump 111 is fixedly provided on the flip annular nozzle 112; the flip cylinder 120 is fixedly provided on the base 2; a side of the cam ring 3 that slides with the flip sliding ball 109 is an inclined surface; the flip tube 110 and the flip sliding ball 109 are made of stainless steel, and the flip sliding ball 109 is spherical.

[0026] Based on the specific structure of the flip vacuum adsorption pen 101 and the flip cleaning air pump 111 described in the utility model, it can be combined with commercially available products such as vacuum adsorption pens and centrifugal air pumps in the prior art. The improvement of the utility model does not lie in this, so it will not be repeated.

[0027] Embodiment 2:

[0028] like Figures 1 to 6As shown, the utility model discloses a flipping device for semiconductor chips, and its working principle is as follows: the device is placed at a desired position, a flip vacuum adsorption pen 101 adsorbs the chip to be flipped, and the flip cylinder 120 is turned on. The flip cylinder 120 drives the flip fixing ring 119 to move, and the flip fixing ring 119 drives the flip fixing frame 2 118, the flip fixing frame 1 17, the flip fixing frame 121, and the flip block 105 to rotate. When the flip fixing frame 2 118, the flip fixing frame 1 17, the flip fixing frame 121, and the flip block 105 rotate, the flip sliding ball 109 is fitted with the inclined surface on the cam ring 3 under the action of the flip reset spring 116, and the inclined surface on the cam ring 3 causes the flip tube 110 to rotate. When the flip tube 110 rotates, it drives the flip semi-toothed ring 2 107 and the flip block 105 to rotate. The rotating half-toothed ring 106 rotates, and the flipping half-toothed ring 106 rotates to drive the flip rotating rod 103 and the flip vacuum adsorption pen 101 to rotate through the flipping gear 104, thereby realizing the flipping of the chip on the flip vacuum adsorption pen 101; at the same time, the flipping half-toothed ring 107 rotates to drive the flipping protrusion 115 to rotate through the flipping half-gear 113, and when the flipping protrusion 115 rotates, it pushes the flipping protrusion 114 to make the flipping annular nozzle 112 move up and compress the flip spring 102, so that the hole on the flipping annular nozzle 112 is aligned with the chip adsorbed on the flip vacuum adsorption pen 101, and the flip cleaning air pump 111 starts to work, compresses the air and blows the compressed air to the chip on the flip vacuum adsorption pen 101 through the hole on the flipping annular nozzle 112, so as to clean it and facilitate the subsequent processing of the chip.

[0029] The operator can manually turn the flip screw 108 to change the relative position of the flip sliding ball 109 and the inclined surface on the cam ring 3 to adjust the flip amplitude of the flip vacuum adsorption pen 101, thereby adjusting the flip amplitude of the chip on the flip vacuum adsorption pen 101.

[0030] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any simple modification or equivalent change made to the above embodiment based on the technical essence of the present invention shall fall within the protection scope of the present invention.

Claims

1. A turning device for a semiconductor chip, comprising a base (2) and a cam ring (3), characterized in that: The invention also comprises a flipping part (1), wherein the cam ring (3) is fixedly arranged on the base (2), the flipping part (1) is rotatably arranged on the base (2), the flipping part (1) and the cam ring (3) are slidably matched, the flipping part (1) comprises a flipping fixing frame (121) rotatably arranged on the base (2), and a second flipping fixing frame (118), the second flipping fixing frame (118) is fixedly arranged with a first flipping fixing frame (117), the flipping fixing frame (121) is fixedly arranged with a flipping block (105), the flipping block (105) is rotatably arranged with a flipping rotating rod (103), the flipping rotating rod (103) is fixedly arranged with a flipping vacuum adsorption pen (101) and a flipping gear (104), and the flipping part (112) comprises a flipping fixing frame (121) rotatably arranged on the base (2). A flip tube (110) is rotatably arranged on the block (105), a flip screw (108) is threadedly connected to the flip tube (110), a flip sliding ball (109) is fixedly arranged on the flip screw (108), the flip sliding ball (109) is slidably matched with the cam ring (3), a flip semi-toothed ring 1 (106) is fixedly arranged on the flip tube (110), and the flip semi-toothed ring 1 (106) is meshed with the flip gear (104); the flip tube (110) is fixedly connected to a flip fixing frame 1 (117) through a flip return spring (116), and a flip fixing frame 2 (118) and a flip fixing frame (121) are slidably arranged on a flip fixing ring (119) of an output shaft of a flip cylinder (120).

2. A semiconductor chip flipping device according to claim 1, characterized in that: A second flip semi-toothed ring (107) is fixedly provided at the other end of the flip tube (110), the second flip semi-toothed ring (107) meshes with a flip semi-gear (113) fixedly provided on the flip rotating rod (103), a second flip protrusion (115) is fixedly provided on the flip semi-gear (113), the second flip protrusion (115) is slidably matched with a first flip protrusion (114) fixedly provided on the flip annular nozzle (112), the flip annular nozzle (112) is connected to the flip rotating rod (103) via a spline, and a flip spring (102) is fixedly provided between the flip annular nozzle (112) and the flip vacuum adsorption pen (101).

3. A semiconductor chip flipping device according to claim 2, characterized in that: The flip annular nozzle (112) is provided with a plurality of gas exhaust channels, and a flip cleaning air pump (111) is fixedly provided on the flip annular nozzle (112).

4. A semiconductor chip flipping device according to claim 3, characterized in that: The tilting cylinder (120) is fixedly arranged on the base (2).

5. A semiconductor chip flipping device according to claim 4, characterized in that: The surface of the cam ring (3) that slides with the flip sliding ball (109) is an inclined surface.

6. A semiconductor chip flipping device according to claim 5, characterized in that: The flip tube (110) and the flip sliding ball (109) are made of stainless steel, and the flip sliding ball (109) is spherical.

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