Reciprocating type wafer sweeping device

Abstract

The utility model discloses a reciprocating type wafer sweeping device which comprises the components of a workbench which is provided with a wafer bearing position which is hollow in the middle and is used for bearing a wafer box, and two side surfaces of the wafer box are oppositely provided with a plurality of mounting grooves which are vertically arranged; the detection device comprises a transmission device, a mounting bracket and an optical fiber sensor; the mounting bracket is mounted on one side of the workbench through a mounting plate and comprises a main bracket vertically arranged on one side of the workbench, a first bracket extending out of the upper end of the main bracket and a second bracket extending out of the lower end of the main bracket; a signal transmitting end and a signal receiving end of the optical fiber sensor are respectively arranged on a first bracket and a second bracket of the mounting bracket; the transmission device is arranged on the mounting plate and drives the mounting support to move synchronously. The wafer detection device does not go deep into the wafer box during detection, so that the wafer detection device does not contact with the wafer, the detection efficiency and the safety of the wafer are improved, and meanwhile, the wafer detection device is convenient to install and debug.

Description

Technical Field

[0001] The utility model relates to the field of wafer manufacturing, in particular to a reciprocating wafer scanning device. Background Art

[0002] In the current situation of the semiconductor industry, the domestic import control of controlled products is very strict. Therefore, the procurement cycle of some commercially purchased parts used in wafer manufacturing often takes three to five months or even longer, which has a huge impact on the production cycle of wafer manufacturing. In order to solve this problem, the existing technology develops those commercially purchased parts that need to be imported internally and localizes those commercially purchased parts that need to be imported, thereby shortening the procurement cycle and solving the problem of long production cycle.

[0003] The Mapping Sensor is a detection box with a comb-like structure, which needs to be installed at the bottom of the Cassette detection position. Through the cylinder, the detection end of the comb can move it to the gap between two wafers for detection.

[0004] However, this type of wafer detection sensor is usually expensive; secondly, there are risks in the detection process of Mapping Sensor. When the machine is running, the cylinder pushes the detection device at a very fast speed, and the distance to the wafer will be very close during the detection process, so the wafer in the Cassette may come into contact with the comb-shaped detection device during the detection process, contaminating the wafer; because its comb-shaped detection end needs to contact the wafer, or directly squeeze the wafer, there is a risk of wafer breakage. This will not only increase the maintenance cost of the equipment, but may also affect production efficiency and product quality. Therefore, measures need to be taken to reduce the risk of wafer breakage and reduce the maintenance cost of the equipment. Utility Model Content

[0005] In view of the above problems existing in the prior art, a reciprocating wafer scanning device is now provided.

[0006] The specific technical solution is as follows: A reciprocating wafer scanning device, comprising:

[0007] The workbench is provided with a wafer carrying position with a hollow middle portion for carrying a wafer box, and two sides of the wafer box are provided with a plurality of vertically arranged mounting grooves facing each other;

[0008] A detection device, including a transmission device, a mounting bracket and an optical fiber sensor;

[0009] The mounting bracket is mounted on one side of the workbench through a mounting plate, and the mounting bracket includes a main bracket vertically arranged on one side of the workbench, a first bracket extending from the upper end of the main bracket, and a second bracket extending from the lower end of the main bracket;

[0010] The signal transmitting end and the signal receiving end of the optical fiber sensor are respectively arranged on the first bracket and the second bracket of the mounting bracket;

[0011] The transmission device is arranged on the mounting plate and drives the mounting bracket to move synchronously.

[0012] Preferably, the first bracket is arranged above the workbench in parallel and at a height above the wafer box;

[0013] The second bracket is arranged parallel to the bottom of the workbench, and the extension length of the second bracket is shorter than that of the first bracket;

[0014] The signal transmitting end and the signal receiving end are at an oblique angle to each other, and the wafers in the wafer box cooperate with each other to transmit and receive signals through the middle hollow.

[0015] Preferably, the front end of the first bracket and the front end of the second bracket are both provided with sensor brackets, which are used to fix the signal transmitting end and the signal receiving end of the optical fiber sensor respectively.

[0016] Each of the sensor brackets comprises:

[0017] A bracket bottom, fixed to the first bracket or the second bracket;

[0018] A bracket mounting portion, which is perpendicular to the bracket bottom, and the bracket mounting portion and the bracket bottom are L-shaped and integrally formed;

[0019] A mounting hole and a U-shaped groove are provided on the bracket mounting portion;

[0020] The base of the signal transmitting end or the signal receiving end is connected to the mounting hole and the U-shaped groove respectively by screws.

[0021] Preferably, the optical fiber sensor further comprises an optical fiber amplifier, which is fixed to the main bracket via an optical fiber amplifier bracket and is located above the mounting plate;

[0022] The optical fiber amplifier is electrically connected to the signal receiving end.

[0023] Preferably, the mounting plate is disposed between the main support and the workbench, and the mounting plate is parallel to the main support;

[0024] The transmission device comprises a slide rail mounting plate and a cylinder arranged in sequence from top to bottom;

[0025] The slide rail mounting plate is fixed to the mounting plate, a slide rail is arranged on the slide rail mounting plate, and the main bracket is slidably connected to the slide rail via a slider;

[0026] The cylinder is fixedly connected to the mounting bracket and the mounting plate respectively, and the mounting bracket slides left and right on the slide rail through the cylinder.

[0027] Preferably, it also includes a position detection device, the position detection device includes:

[0028] A comb plate, the comb plate is fixed to the upper end of the mounting plate, a plurality of comb teeth are arranged on the comb plate, and each comb tooth is respectively facing a unique slot hole in the mounting slot;

[0029] A positioning sensor is arranged above the comb plate and is fixed to the main bracket via a positioning sensor bracket.

[0030] Preferably, it also includes:

[0031] A drag chain mounting bracket, the drag chain mounting bracket is arranged at the lower end of the cylinder and fixed on the main bracket;

[0032] A drag chain is fixed on the drag chain mounting bracket.

[0033] Preferably, a plurality of positioning blocks are arranged on the workbench, a positioning area is formed by the plurality of positioning blocks, and the wafer box is arranged in the positioning area;

[0034] Each positioning block is equipped with an inductive sensor.

[0035] Preferably, an observation port is provided on the workbench, and the observation port is located at the bottom of the wafer supporting position.

[0036] The above technical solution has the following advantages or beneficial effects:

[0037] In the utility model, the optical fiber sensor is arranged on a mounting bracket, and the mounting bracket is perpendicular to a workbench on which a wafer box is arranged. During inspection, the optical fiber sensor will not penetrate into the interior of the wafer box, and thus will not contact the wafer, thereby improving the detection efficiency and the safety of the wafer. At the same time, the utility model is easy to install and debug. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The embodiments of the present invention will be described more fully with reference to the attached drawings, which are however only used for illustration and description and are not intended to limit the scope of the present invention.

[0039] Figure 1 This is a schematic diagram of the overall structure of a reciprocating wafer scanning device in a preferred embodiment of the utility model;

[0040] Figure 2 It is a side view of a reciprocating wafer scanning device in a preferred embodiment of the utility model;

[0041] Figure 3 It is a rear view of a reciprocating wafer scanning device in a preferred embodiment of the utility model;

[0042] Figure 4 It is a front view of a reciprocating wafer scanning device in a preferred embodiment of the utility model;

[0043] Figure 5 The figure is a schematic diagram of the structure of a sensor bracket in a reciprocating wafer scanning device in a preferred embodiment of the present utility model. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0045] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0046] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0047] In a preferred embodiment of the present invention, a reciprocating wafer scanning device is provided, wherein: Figure 1-4 As shown in, including:

[0048] The workbench 1 is provided with a wafer carrying position with a hollow middle portion to carry the wafer box 2, and the two sides of the wafer box 2 are provided with a plurality of vertically arranged mounting grooves facing each other;

[0049] The detection device includes a transmission device, a mounting bracket 6 and an optical fiber sensor;

[0050] The mounting bracket 6 is mounted on one side of the workbench 1 through the mounting plate 4, and the mounting bracket includes a main bracket 61 vertically arranged on one side of the workbench 1, a first bracket 62 extending from the upper end of the main bracket, and a second bracket 63 extending from the lower end of the main bracket;

[0051] The signal transmitting end 51 and the signal receiving end 52 of the optical fiber sensor are respectively arranged on the first bracket 62 and the second bracket 63 of the mounting bracket 6;

[0052] The transmission device is arranged on the mounting plate 4 and drives the mounting bracket 6 to move synchronously.

[0053] Specifically, in the prior art, there are risks in the detection process of Mapping Sensor. When the machine is running, the cylinder 9 pushes the detection device at a very fast speed, and the distance with the wafer 3 will be very close during the detection process. Therefore, the wafer 3 in the Cassette may contact with the comb-shaped detection device during the detection process, thereby contaminating the wafer 3;

[0054] Since the comb-tooth-shaped detection end needs to contact with the wafer 3 or directly press the wafer 3, there is a risk of the wafer 3 being broken.

[0055] In the above embodiment, first, a wafer support position with a hollow middle is provided on the workbench 1 for placing the wafer 3 to be tested. The wafer box 2 is placed on the wafer support position, and a plurality of mounting grooves for mounting the wafer 3 are arranged vertically on both sides thereof.

[0056] The detection device includes a transmission device, a mounting bracket 6 and an optical fiber sensor.

[0057] The mounting bracket 6 includes a main bracket 61, a first bracket 62 and a second bracket 63; the main bracket 61 is vertically arranged on one side of the workbench 1, the first bracket 62 extends from the upper end of the main bracket 61 and the first bracket 62 is vertically arranged on the main bracket 61, and the second bracket 63 extends from the lower end of the main bracket 61 and the second bracket 63 is vertically arranged on the main bracket 61;

[0058] An optical fiber sensor is arranged on the mounting bracket 6, and the optical fiber sensor includes a signal transmitting end 51 and a signal receiving end 52, one end of the signal transmitting end 51 and the signal receiving end 52 is arranged on the first bracket 62 of the mounting bracket 6, and the other end is arranged on the second bracket 63 of the mounting bracket 6.

[0059] The mounting plate 4 is perpendicular to the workbench 1 and fixedly arranged on one side of the workbench 1. The transmission device is arranged on the mounting plate 4, so the transmission device is also arranged perpendicularly relative to the workbench 1. The mounting bracket 6 is driven to move back and forth relative to the mounting plate 4 by the transmission device.

[0060] When the mounting bracket 6 moves back and forth along the side of the workbench 1 , the optical fiber sensor is controlled to work. The number of wafers 3 in the wafer box 2 is detected by the signal receiving end 52 receiving the transmission signal of the signal transmitting end 51 .

[0061] The signal receiving end 52 determines how many wafers 3 are in the wafer box 2 according to the number of times the signal transmitted by the signal transmitting end 51 is received;

[0062] Furthermore, when the transmission signal is blocked by the wafer 3 , the signal receiving end 52 cannot receive the transmission signal, which means that there is a wafer 3 in the mounting groove.

[0063] Furthermore, in the present invention, 25 installation slots are provided, and the number of the installation slots can be designed according to actual conditions.

[0064] Compared with the Mapping Sensor in the prior art, the embodiment of the utility model avoids the contact between the wafer 3 and the comb-shaped detection device, thereby reducing the risk of contaminating the wafer 3. In addition, since the embodiment of the utility model does not need to directly contact or squeeze the wafer 3, the risk of the wafer 3 breaking is also reduced.

[0065] In a preferred embodiment of the present invention, Figure 2 As shown, the first bracket 62 is arranged parallel to the workbench 1 and is located above the wafer box 2;

[0066] The second bracket 63 is arranged parallel to the bottom of the workbench 1, and the extension length of the second bracket 63 is smaller than that of the first bracket 62;

[0067] The signal transmitting end 51 and the signal receiving end 52 are at an oblique angle to each other, and cooperate with each other to transmit and receive signals through the middle hollow and the wafers 3 in the wafer box 2.

[0068] Specifically, in the above embodiment, the main support 61 is parallel to the transmission device and is fixedly connected to the transmission device. Driven by the transmission device, the main support 61 can move along the workbench 1.

[0069] The first bracket 62 and the second bracket 63 are respectively located at the upper and lower sides of the workbench 1, and both brackets are arranged parallel to the workbench 1. Therefore, the first bracket 62 and the second bracket 63 can operate the wafer carrying position at the same time.

[0070] The front end of the first bracket 62 extends above the wafer carrying position, while the front end of the second bracket 63 extends below the wafer carrying position, thereby ensuring full coverage of the wafer carrying position.

[0071] Furthermore, in order to strengthen the fixation of the first bracket 62 and the second bracket to the main bracket 61, a fixing plate is also provided at the connection between the first bracket 62 or the second bracket 63 and the main bracket 61, and one side of the fixing plate is fixedly connected to the first bracket 62 or the second bracket 63, and the other side is fixedly connected to the main bracket 61, so as to strengthen the connection relationship between the main bracket 61 and the first bracket 62 and the second bracket 63.

[0072] Furthermore, the extension length of the first bracket 62 is less than the extension length of the second bracket 63, ensuring that the light source irradiation center will be at the center of the wafer 3, thereby ensuring the detection accuracy. Therefore, the signal transmitting end 51 disposed at the front end of the first bracket 62 and the signal receiving end 52 disposed at the front end of the second bracket 63 are tilted optical fiber sensors, and such a setting can increase the detection accuracy.

[0073] In a preferred embodiment of the present invention, Figure 5 As shown, the front ends of the first bracket 62 and the second bracket 63 are both provided with sensor brackets, which are used to fix the signal transmitting end 51 and the signal receiving end 52 of the optical fiber sensor respectively;

[0074] Each sensor bracket includes:

[0075] The bracket bottom A1 is fixed on the first bracket 62 or the second bracket 63;

[0076] The bracket mounting portion A2 is perpendicular to the bracket bottom A1, and the bracket mounting portion A2 and the bracket bottom A1 are L-shaped and integrally formed;

[0077] A mounting hole A3 and a U-shaped groove A4 are provided on the bracket mounting portion A2;

[0078] The base of the signal transmitting end 51 or the signal receiving end 52 is connected to the mounting hole A3 and the U-shaped groove A4 respectively by screws.

[0079] Specifically, in the above embodiment, the signal transmitting end 51 and the signal receiving end 52 are both fixed to the mounting bracket 6 through a sensor bracket; the signal transmitting end 51 is arranged at the front end of the first bracket 62 through a sensor bracket, and the signal receiving end 52 is arranged at the front end of the second bracket 63 through another sensor bracket, thereby realizing signal transmission and reception for detection operation.

[0080] The sensor bracket includes a bracket bottom A1 and a bracket mounting portion A2;

[0081] The bracket bottom A1 is parallel to the first bracket 62 or the second bracket 63 and is fixed to the first bracket 62 or the second bracket 63 by screws;

[0082] The bracket mounting portion A2 is perpendicular to the bracket bottom A1 to form an L shape, and the bracket bottom A1 and the bracket mounting portion A2 are integrally formed. In order to fix the signal transmitting end 51 or the signal receiving end 52, a mounting hole A3 is provided on the bracket mounting portion A2. The signal transmitting end 51 and the signal receiving end 52 are fixed to the bracket mounting portion A2 through the mounting hole A3, so that the signal transmitting end 51 is fixed to the front end of the lower surface of the first bracket 62 or the signal receiving end 52 is fixed to the front end of the upper surface of the second bracket 63;

[0083] Furthermore, a U-shaped groove A4 is provided on one side of the mounting hole A3, and the signal transmitting end 51 or the signal receiving end 52 can adjust the angle through the U-shaped groove A4 to adjust the transmitting angle and the receiving angle to a suitable position;

[0084] In the present invention, after adjustment, it is ensured that the irradiation surface of the light source is as large as possible, and the accuracy of detection is increased to ensure that the center point of the emitted and received light is always at the center of the wafer 3 to be detected in the wafer box 2.

[0085] In a preferred embodiment of the present utility model, the optical fiber sensor further includes an optical fiber amplifier 7, which is fixed to the main bracket 61 through an optical fiber amplifier bracket and is located above the mounting plate 4;

[0086] The optical fiber amplifier 7 is electrically connected to the signal receiving end 52 .

[0087] Specifically, in the above embodiment, first, the optical fiber amplifier 7 is fixed to the main bracket 61 through the optical fiber amplifier bracket and is located above the mounting plate 4, thereby ensuring that the distance between the optical fiber amplifier 7 and the signal receiving end 52 is appropriate in order to obtain an accurate detection signal.

[0088] Secondly, the optical fiber amplifier 7 is connected to the signal receiving end 52. The signal receiving end 52 outputs a detection signal to the optical fiber amplifier 7 according to the situation of receiving the transmission signal. These detection signals reflect whether the wafer 3 is installed in the installation slot.

[0089] Next, according to the strength of the detection signal, the optical fiber sensor can determine whether the wafer 3 is installed at the position of the installation slot represented by the single detection signal.

[0090] If the detection signal strength is higher than the preset threshold, it indicates that there is no wafer 3 at the position; conversely, if the detection signal strength is lower than the preset threshold, it indicates that there is a wafer 3 installed at the position.

[0091] Finally, according to the results of all detection signals, the optical fiber sensor can calculate the number of wafers 3 and output the result.

[0092] In summary, the optical fiber sensor in the preferred embodiment of the present utility model can accurately detect the number of wafers 3 in the installation slot through the optical fiber amplifier 7 and the signal receiving end 52, and output the detection result.

[0093] In a preferred embodiment of the present invention, Figure 3 As shown, the mounting plate 4 is disposed between the main support 61 and the workbench 1, and the mounting plate 4 is parallel to the main support 61;

[0094] The transmission device includes a slide rail mounting plate 8 and a cylinder 9 which are arranged in sequence from top to bottom;

[0095] The slide rail mounting plate 8 is fixed on the mounting plate 4. A slide rail is provided on the slide rail mounting plate 8. The main bracket 61 is slidably connected to the slide rail via a slider 10.

[0096] The cylinder 9 is fixedly connected to the mounting bracket 6 and the mounting plate 4 respectively, and the mounting bracket 6 slides left and right on the slide rail through the cylinder 9.

[0097] Specifically, in the above embodiment, in order to move the signal transmitting end 51 and the signal receiving end 52 to the detection position, a transmission device is provided for moving the device provided on the mounting bracket 6 by moving the mounting bracket;

[0098] Further, the transmission device includes a slide rail mounting plate 8 and a cylinder 9;

[0099] The slide rail mounting plate is fixed on the mounting plate 4, and a slide rail is arranged on the slide rail mounting plate 8. The main bracket 61 can move left and right on the slide rail through a slider 10 clamped on the slide rail.

[0100] Further, the length of the slide rail is not less than the width formed by all the mounting slots in the wafer box 2;

[0101] In order to provide a moving force for the mounting bracket 6, a cylinder 9 is also provided. The cylinder 9 is arranged below the slide rail mounting plate 8. The cylinder 9 is arranged horizontally, and the bottom of the cylinder 9 is fixedly connected to the slide rail mounting plate 8. The area where the cylinder 9 is used to provide left and right sliding force is fixedly connected to the mounting bracket 6.

[0102] In a preferred embodiment of the present invention, Figure 1 and 4 As shown, it also includes a position detection device, the position detection device includes:

[0103] The comb plate 11 is fixed to the upper end of the mounting plate 4. The comb plate 11 is provided with a plurality of comb teeth, and each comb tooth is respectively opposite to a unique slot hole in the mounting slot;

[0104] The positioning sensor 12 is disposed above the comb plate 11 and is fixed to the main bracket 61 through a positioning sensor bracket.

[0105] Specifically, in the above embodiment, a position detection device is provided to determine the position of the wafer 3 being detected;

[0106] The position detection device includes a comb plate 11 and a positioning sensor 12, and each comb tooth on the comb plate 11 corresponds to a unique slot hole of the mounting slot;

[0107] Furthermore, in the present embodiment, since there are 25 mounting grooves, there are also 25 comb teeth correspondingly provided. The comb teeth are 10 mm long and 1.5 mm wide; and the center distance between two comb teeth is the same as the center distance between two adjacent mounting grooves.

[0108] The positioning sensor 12 is arranged close to and directly above the comb teeth and fixed on the main bracket 61. The sensing position of the positioning sensor 12 will pass through each comb tooth to achieve the function of detecting the position.

[0109] In a preferred embodiment of the present invention, Figure 2 As shown, it also includes:

[0110] The drag chain mounting bracket 13 is arranged at the lower end of the cylinder 9 and fixed on the main bracket 61;

[0111] The drag chain 14 is fixed on the drag chain mounting bracket 13 .

[0112] Specifically, in the above embodiment, in order to make the wiring cleaner, a drag chain 14 is provided, and the drag chain 14 is used to gather the wiring of the signal transmitting end 51, the wiring of the signal receiving end 52, the wiring of the optical fiber amplifier 7, and the wiring of the positioning sensor 12;

[0113] Furthermore, the drag chain 14 is fixed to the main bracket 61 through the mounting bracket 13 and is arranged below the cylinder 9 .

[0114] In a preferred embodiment of the present invention, Figure 1-2 As shown, a plurality of positioning blocks 15 are arranged on the workbench 1, and a positioning area is formed by the plurality of positioning blocks 15, and the wafer box 2 is arranged in the positioning area;

[0115] Each positioning block 15 has a built-in inductive sensor.

[0116] Specifically, in the above embodiment, the positioning block 15 is fixed on the workbench 1 and forms a positioning area, the positioning area is smaller than or equal to the detection area, and the positioning block 15 confirms whether the position of the wafer box 2 is accurately placed through the inductive sensor arranged inside it;

[0117] Furthermore, in the present invention, four inductive sensors are provided, and the four legs of the wafer box 2 are in contact with the sensors, so the inductive sensors can be provided as pressure sensors.

[0118] In a preferred embodiment of the present invention, Figure 1 As shown, an observation port 16 is disposed on the workbench 1 , and the observation port 16 is located at the bottom of the wafer supporting position.

[0119] Specifically, in the above embodiment, in order to facilitate observation of the internal conditions of the wafer box 2, an observation port 16 is further provided on the workbench 1. The observation port 16 is provided at the bottom of the wafer supporting position, and the size of the observation port 16 is smaller than the wafer supporting position.

[0120] To sum up, the working process of the reciprocating wafer scanning machine is as follows:

[0121] Place the wafer 3 to be tested in the wafer box 2, and then place the wafer box 2 at the wafer carrying position and contact the positioning block 15 to ensure that the wafer box 2 is placed accurately. After the wafer box 2 is placed accurately, the cylinder 9 moves the mounting bracket 6 slowly from left to right.

[0122] At this time, when the positioning sensor 12 senses the slot to be detected through the comb teeth, the signal transmitting end 51 transmits a signal to the signal receiving end 52. When the signal receiving end 52 receives the signal, a detection signal is generated and sent to the optical fiber amplifier 7. When there is a wafer 3 at this position, the intensity of the detection signal is small and lower than the threshold; when there is no wafer 3 at this position, the intensity of the detection signal is large and higher than it, and the conclusion that there is no wafer 3 is output;

[0123] Finally, the number of wafers 3 in the wafer box 2 detected this time can be known according to the output result of the optical fiber amplifier 7 , and the installation slots without wafers 3 can be determined according to the output result of the positioning sensor 12 .

[0124] The above are only preferred embodiments of the present invention, and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the contents of this specification and illustrations should be included in the protection scope of the present invention.

Claims

1. A reciprocating wafer scanning device, characterized in that: include: The workbench (1) is provided with a wafer carrying position with a hollow center for carrying a wafer box (2), and two sides of the wafer box (2) are provided with a plurality of vertically arranged mounting grooves facing each other; A detection device, including a transmission device, a mounting bracket and an optical fiber sensor; The mounting bracket (6) is mounted on one side of the workbench (1) via a mounting plate (4), and the mounting bracket comprises a main bracket (61) vertically arranged on one side of the workbench (1), a first bracket (62) extending from the upper end of the main bracket, and a second bracket (63) extending from the lower end of the main bracket; The signal transmitting end (51) and the signal receiving end (52) of the optical fiber sensor are respectively arranged on a first bracket (62) and a second bracket (63) of the mounting bracket (6); The transmission device is arranged on the mounting plate (4) and drives the mounting bracket (6) to move synchronously.

2. The reciprocating wafer scanning device according to claim 1, characterized in that: The first support (62) is arranged parallel to the top of the workbench (1) and is located above the wafer box (2); The second bracket (63) is arranged parallel to the bottom of the workbench (1), and the extended length of the second bracket (63) is shorter than that of the first bracket (62); The signal transmitting end (51) and the signal receiving end (52) are arranged at an oblique angle to each other, and cooperate with each other to transmit and receive signals through the middle hollow and the wafers (3) in the wafer box (2).

3. The reciprocating wafer scanning device according to claim 2, characterized in that: A sensor bracket is disposed at the front end of the first bracket (62) and the front end of the second bracket (63), respectively used to fix the signal transmitting end (51) and the signal receiving end (52) of the optical fiber sensor; Each of the sensor brackets comprises: A bracket bottom (A1) fixed to the first bracket (62) or the second bracket (63); A bracket mounting portion (A2) is perpendicular to the bracket bottom (A1), and the bracket mounting portion (A2) and the bracket bottom (A1) are L-shaped and integrally formed; A mounting hole (A3) and a U-shaped groove (A4) are provided on the bracket mounting portion (A2); The base of the signal transmitting end (51) or the signal receiving end (52) is respectively connected to the mounting hole (A3) and the U-shaped groove (A4) by means of screws.

4. The reciprocating wafer scanning device according to claim 2, characterized in that: The optical fiber sensor further comprises an optical fiber amplifier (7), wherein the optical fiber amplifier (7) is fixed to the main bracket (61) via an optical fiber amplifier bracket and is located above the mounting plate (4); The optical fiber amplifier (7) is electrically connected to the signal receiving end (52).

5. The reciprocating wafer scanning device according to claim 2, characterized in that: The mounting plate (4) is arranged between the main support (61) and the workbench (1), and the mounting plate (4) is parallel to the main support (61); The transmission device comprises a slide rail mounting plate (8) and a cylinder (9) which are arranged in sequence from top to bottom; The slide rail mounting plate (8) is fixed on the mounting plate (4), a slide rail is provided on the slide rail mounting plate (8), and the main bracket (61) is slidably connected to the slide rail via a slider (10); The cylinder (9) is fixedly connected to the mounting bracket (6) and the mounting plate (4) respectively, and the mounting bracket (6) slides left and right on the slide rail through the cylinder (9).

6. The reciprocating wafer scanning device according to claim 2, characterized in that: Also included is a position detection device, the position detection device comprising: A comb plate (11), the comb plate (11) being fixed to the upper end of the mounting plate (4), the comb plate (11) being provided with a plurality of comb teeth, each comb tooth being respectively opposite to a unique slot hole in the mounting slot; A positioning sensor (12), wherein the positioning sensor (12) is arranged above the comb plate (11) and is fixed to the main bracket (61) via a positioning sensor bracket.

7. The reciprocating wafer scanning device according to claim 5, characterized in that: Also includes: A drag chain mounting bracket (13), the drag chain mounting bracket (13) being arranged at the lower end of the cylinder (9) and fixed on the main bracket (61); A drag chain (14), wherein the drag chain (14) is fixed on the drag chain mounting bracket (13).

8. The reciprocating wafer scanning device according to claim 1, characterized in that: A plurality of positioning blocks (15) are arranged on the workbench (1), and a positioning area is formed by surrounding the plurality of positioning blocks (15), and the wafer box is arranged in the positioning area; Each positioning block (15) is equipped with an inductive sensor.

9. The reciprocating wafer scanning device according to claim 1, characterized in that: An observation port (16) is provided on the workbench (1), and the observation port (16) is located at the bottom of the wafer supporting position.

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