Heat dissipation structure, power assembly, motor controller and vehicle

Abstract

The utility model relates to a heat dissipation structure, a power assembly, a motor controller and a vehicle, the heat dissipation structure comprises a base body, the base body is provided with a heat dissipation area, and the heat dissipation area is provided with a heat dissipation part and a first flow guide part arranged around at least part of the edge of the heat dissipation area; the first flow guide part is used for guiding at least part of the cooling medium on the edge of the heat dissipation area to the heat dissipation part, and the heat dissipation device can improve the heat exchange effect and further improve the cooling effect on the power module.

Description

Technical Field

[0001] The present disclosure relates to the technical field of vehicles and heat dissipation structures, and in particular, to a heat dissipation structure, a power component, a motor controller and a vehicle. Background Art

[0002] With the rapid development of new energy electric vehicles, the power density of motor controller, as one of the three core components of electric vehicles, is also increasing. This puts higher and higher requirements on the heat dissipation of motor controllers. The power module in the motor controller is prone to generate extremely high heat during operation, which has a great impact on the overall performance and life of the power module.

[0003] At present, the power module is generally cooled by a cooling water channel. A heat dissipation part is provided on the cooling water channel. When the cooling medium flows through the cooling water channel, the cooling medium exchanges heat with the heat dissipation part, thereby taking away the heat generated by the power module. However, under this cooling method, the flow rate of the cooling medium is slow when flowing through the edge of the cooling water channel, resulting in poor heat exchange effect and poor cooling effect. Utility Model Content

[0004] The purpose of the present disclosure is to provide a heat dissipation structure, a power component, a motor controller and a vehicle, which can improve the heat exchange effect and further improve the cooling effect of the power module, so as to at least partially solve the above-mentioned technical problems.

[0005] In order to achieve the above-mentioned purpose, the first aspect of the present disclosure provides a heat dissipation structure, which includes a substrate, the substrate having a heat dissipation area, the heat dissipation area is provided with a heat dissipation portion and a first guide portion arranged around at least a portion of the edge of the heat dissipation area, the first guide portion is used to guide at least a portion of the cooling medium at the edge of the heat dissipation area to the heat dissipation portion.

[0006] Optionally, the base has an inlet end and an outlet end for cooling medium to flow, and the first guide portion includes a plurality of first guide fins arranged around at least part of the edge of the heat dissipation area, and the first guide fins extend from the inlet end toward the outlet end and toward the inner side of the heat dissipation area.

[0007] Optionally, the plurality of first guide fins are divided into two groups, and the two groups of first guide fins are symmetrically arranged about a center line of the heat dissipation area extending from the inlet end toward the outlet end.

[0008] Optionally, the base has an inlet end and an outlet end for circulation of a cooling medium, and the heat dissipation region includes a plurality of sub-heat dissipation regions arranged sequentially from the inlet end toward the outlet end, and in any two adjacent sub-heat dissipation regions, the number of heat dissipation parts of the sub-heat dissipation region close to the outlet end is greater than the number of heat dissipation parts of the sub-heat dissipation region close to the inlet end.

[0009] Optionally, the heat dissipation region is further provided with a second guide portion arranged between at least one group of two adjacent sub-heat dissipation regions, and the second guide portion is used to gather at least part of the cooling medium from the upstream sub-heat dissipation region toward the downstream sub-heat dissipation region.

[0010] Optionally, the second guide portion includes two groups of second guide fins, and the two groups of second guide fins are symmetrically arranged about a center line of the heat dissipation area extending from the inlet end toward the outlet end.

[0011] Optionally, the heat dissipation portion includes a heat dissipation column connected to the base, the heat dissipation column has a guide groove extending from an end away from the base toward the base, and the guide groove forms a flow channel for the cooling medium to flow through.

[0012] Optionally, the heat dissipation column and the guide groove both extend perpendicularly to the heat dissipation area, and the guide groove is configured as a U-shaped groove with an opening facing away from the base.

[0013] Optionally, in a first direction perpendicular to the heat dissipation area, a groove depth of the U-shaped groove is not less than four fifths of the length of the heat dissipation column.

[0014] Optionally, in a first direction perpendicular to the heat dissipation area, a groove depth of the U-shaped groove is not less than 5 mm.

[0015] Optionally, the outer wall surface of the heat dissipation column facing away from the U-shaped groove is an arc-shaped surface, and the U-shaped groove has a first surface and a second surface relative to each other. In a second direction perpendicular to the first surface and the second surface, the distance between the first surface and the second surface is not less than half of the maximum width of the heat dissipation column in the second direction.

[0016] Optionally, the U-shaped groove has a first surface and a second surface opposite to each other, and a groove depth of the U-shaped groove is not less than the distance between the first surface and the second surface, and is not greater than ten times the distance between the first surface and the second surface.

[0017] A second aspect of the present disclosure provides a power component, comprising a power module and a heat dissipation structure as described in any of the above optional schemes, wherein the power module is connected to a side of the substrate away from the heat dissipation area.

[0018] Optionally, the power module is welded to the substrate.

[0019] Optionally, the power module comprises a chip and a direct copper clad ceramic substrate layer, one side of the direct copper clad ceramic substrate layer is welded to the chip, and the other side of the direct copper clad ceramic substrate layer is welded to the substrate.

[0020] According to a third aspect of the present disclosure, a motor controller is provided, comprising the above-mentioned power component.

[0021] A fourth aspect of the present disclosure provides a vehicle comprising the above-mentioned motor controller.

[0022] Through the above technical solution, that is, the heat dissipation structure provided by the present disclosure, when the cooling medium flows through the heat dissipation area, it can be cooled through the heat dissipation part, for example, the power module can be cooled. In addition, since the edge of the heat dissipation area is arranged with the first guide part, the turbulence intensity of the cooling medium in the area with lower flow velocity at the edge of the heat dissipation area can be enhanced to enhance the heat exchange capacity, and the cooling medium can also be guided by the first guide part at the edge of the heat dissipation area to guide the cooling medium with lower flow velocity at the edge of the heat dissipation area to the heat dissipation part, thereby improving the cooling effect.

[0023] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0025] Figure 1 is a schematic structural diagram of a power component provided in an exemplary embodiment of the present disclosure;

[0026] Figure 2 is a schematic diagram of an exploded structure of a power component provided in an exemplary embodiment of the present disclosure;

[0027] Figure 3 is a schematic diagram of the bottom structure of a heat dissipation structure provided in an exemplary embodiment of the present disclosure;

[0028] Figure 4 is a schematic structural diagram of a heat dissipation unit provided in an exemplary embodiment of the present disclosure;

[0029] Figure 5 is a front view of a heat dissipation portion provided in an exemplary embodiment of the present disclosure.

[0030] Description of Reference Numerals

[0031] 1-substrate; 101-entry end; 102-discharge end; 110-heat dissipation area; 111-sub-heat dissipation area; 112-guide groove; 112A-first surface; 112B-second surface; 113-flow channel; 2-heat dissipation part; 201-arc surface; 3-first guide part; 310-first guide fin; 4-second guide part; 410-second guide fin; 5-chip; 501-welding layer; 6-direct copper-clad ceramic substrate layer. DETAILED DESCRIPTION

[0032] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0033] In the present disclosure, unless otherwise specified, directional words such as "inside" and "outside" refer to the inside and outside relative to the outline of the structure or component itself, and "first" and "second" are used to distinguish one element from another and have no order or importance. In addition, the same figure marks in different reference drawings represent the same elements.

[0034] In a first aspect of the present disclosure, a heat dissipation structure is provided. Figures 1 to 5 As shown, the heat dissipation structure includes a substrate 1, the substrate 1 has a heat dissipation area 110, the heat dissipation area 110 is provided with a heat dissipation portion 2 and a first guide portion 3 arranged around at least an edge of the heat dissipation area 110, the first guide portion 3 is used to guide at least part of the cooling medium at the edge of the heat dissipation area 110 to the heat dissipation portion 2.

[0035] In the above manner, when the cooling medium flows through the heat dissipation area 110, it can be cooled by the heat dissipation part 2, for example, the power module can be cooled. In addition, since the first guide part 3 is arranged at the edge of the heat dissipation area 110, the turbulence intensity of the cooling medium in the area with lower flow velocity at the edge of the heat dissipation area 110 can be enhanced to enhance the heat exchange capacity, and the cooling medium can also be guided by the first guide part 3 at the edge of the heat dissipation area 110 to the heat dissipation part 2 under the guiding effect of the cooling medium, thereby improving the cooling effect.

[0036] The heat dissipation device can be applied to any suitable scenario. For example, the heat dissipation device can be applied to the heat dissipation of the power module of the motor controller, such as the IGBT (Insulated-Gate Bipolar Transistor) module. The heat dissipation device can be connected to the IGBT module. Heat will be generated during the operation of the IGBT module. The IGBT module can be cooled by the cooling medium flowing through the heat dissipation area. Furthermore, the enhanced turbulence effect and the diversion effect brought by the first guide part 3 can achieve a better heat dissipation effect on the IGBT module, which can improve the performance and service life of the IGBT module.

[0037] The cooling medium may be a cooling liquid such as water or oil, but the present disclosure is not limited thereto.

[0038] In some embodiments, reference Figure 3 As shown, the base 1 has an inlet end 101 and an outlet end 102 for the circulation of the cooling medium, and the first guide portion 3 includes a plurality of first guide fins 310 arranged around at least part of the edge of the heat dissipation area 110, and the first guide fins 310 extend from the inlet end 101 toward the outlet end 102 and toward the inner side of the heat dissipation area 110. In this way, referring to Figure 3 As shown, Figure 3 The right side may be the entry end 101 of the substrate 1, Figure 3 The left side may be the discharge end 102 of the base 1. When the cooling medium flows from the inlet end 101 to the discharge end 102, the external equipment will be cooled on the way. In this process, the plurality of first guide fins 310 may guide the cooling medium at the edge of the heat dissipation area 110, and then guide the cooling medium to the heat dissipation part 2. More cooling medium will flow through the heat dissipation part 2, thereby improving the heat exchange effect between the heat dissipation part 2 and the external equipment, improving the cooling efficiency, and enhancing the turbulence intensity of the cooling medium in the area with lower flow rate through the first guide fins 310, thereby enhancing the heat exchange effect.

[0039] It should be noted that the structure of the first guide fin 310 can be any suitable structure capable of guiding the cooling medium to the heat dissipation portion 2, for example, Figure 3 As shown, the first guide fin 310 may be a streamlined structure extending from the inlet end 101 toward the outlet end 102 and toward the inner side of the heat dissipation area 110, that is, Figure 3 In the structure shown, when the cooling medium flows through the first guide fin 310, the streamlined structure of the first guide fin 310 can guide the cooling medium to the central heat dissipation part 2 more quickly, thereby increasing the flow rate of the cooling medium at the heat dissipation part 2, increasing the turbulence intensity, and enhancing the heat exchange capacity of the heat dissipation structure.

[0040] In some embodiments, reference Figure 3 As shown, the plurality of first guide fins 310 are divided into two groups, and the two groups of first guide fins 310 are symmetrically arranged about a center line extending from the inlet end 101 toward the outlet end 102 of the heat dissipation region 110. In this way, by symmetrically arranging the two groups of first guide fins 310, the ability of uniform heat dissipation can be improved, so that each power module or each part of the power module can be cooled as uniformly as possible.

[0041] In the related art, the water channel for cooling the IGBT module is generally a series water channel. As the temperature of the coolant increases as it flows through the water channel, it is easy to cause the chip near the water inlet to have a good heat dissipation effect, while the chip far from the water inlet has a poor heat dissipation effect, which leads to a large temperature difference between the parts of each IGBT module or between each IGBT module. Therefore, in some embodiments, reference Figures 1 to 3 As shown, the heat dissipation area 110 includes a plurality of sub-heat dissipation areas 111 arranged sequentially from the inlet end 101 toward the outlet end 102. In any two adjacent sub-heat dissipation areas 111, the number of heat dissipation parts 2 of the sub-heat dissipation area 111 close to the outlet end 102 is greater than the number of heat dissipation parts 2 of the sub-heat dissipation area 111 close to the inlet end 101. In this way, when the cooling medium flows from the inlet end 101 toward the outlet end 102, the temperature of the cooling medium will gradually increase with the heat exchange with the heat dissipation part 2. For example, referring to Figure 3As shown, the number of sub-heat dissipation areas 111 is three. When the cooling medium enters the rightmost sub-heat dissipation area 111 from the right inlet end 101, the cooling medium temperature is the lowest at this time, and the cooling medium has a better cooling effect on the external equipment. After exchanging heat with the heat dissipation part 2 of the sub-heat dissipation area 111, when the cooling medium enters the middle sub-heat dissipation area 111, the temperature of the cooling medium will increase, and its own cooling effect will be weakened. In order to maintain the cooling effect of the cooling medium, the number of heat dissipation parts 2 close to the middle sub-heat dissipation area 111 can be greater than the number of heat dissipation parts 2 close to the right sub-heat dissipation area 111. When the cooling medium flows through the middle sub-heat dissipation area 111, it will exchange heat with more heat dissipation parts 2, and at this time, the middle can be guaranteed. The heat exchange effect of the sub-heat dissipation area 111, and the temperature of the cooling medium will further increase after the heat exchange with the heat dissipation part 2 of the middle sub-heat dissipation area 111. At this time, the number of heat dissipation parts 2 in the sub-heat dissipation area 111 closest to the discharge end 102, that is, the leftmost, is greater than the number of the middle sub-heat dissipation area 111. When the cooling medium flows through the leftmost sub-heat dissipation area 111, the cooling medium will also exchange heat with more heat dissipation parts 2 there, thereby ensuring the heat exchange effect of the leftmost sub-heat dissipation area 111. Under this arrangement, when the cooling medium flows through multiple sub-heat dissipation areas 111, the problem of reduced overall heat exchange effect and uneven cooling caused by the increase in the cooling medium's own temperature can be reduced or even avoided. As a result, the arrangement of the heat dissipation parts between multiple sub-heat dissipation areas 111 has a sparse and dense gradient change, which can cool the external equipment more evenly.

[0042] It should be noted that the above-mentioned method of arranging different numbers of heat dissipation parts 2 in different sub-heat dissipation areas 111 can also be applied to the cooling of the IGBT module mentioned in the above-mentioned specific implementation mode, that is, the IGBT module also includes multiple sub-modules with different functions, and the multiple sub-modules also have chips that can perform different functions. Under the premise of adopting the above-mentioned cooling method, the chips on the multiple sub-modules can maintain the same cooling effect, which has a good beneficial effect on the safe operation of the IGBT module.

[0043] In some embodiments, reference Figure 3As shown, the heat dissipation region 110 is further provided with a second guide portion 4 arranged between at least one group of two adjacent sub-heat dissipation regions 111, and the second guide portion 4 is used to gather at least part of the cooling medium from the upstream sub-heat dissipation region 111 toward the downstream sub-heat dissipation region 111. In this way, when the cooling medium flows from the upstream sub-heat dissipation region 111 to the downstream sub-heat dissipation region 111, the second guide portion 4 can guide more cooling medium to the sub-heat dissipation region 111 close to the downstream, thereby allowing more cooling medium to exchange heat with the multiple heat dissipation portions 2 at the downstream sub-heat dissipation region 111, which can improve the heat exchange effect of the heat dissipation structure and the cooling effect on external devices as a whole.

[0044] Based on the above implementation, you can refer to Figure 3 As shown, the second guide portion 4 includes two groups of second guide fins 410, and the two groups of second guide fins 410 are symmetrically arranged about the center line extending from the inlet end 101 to the outlet end 102 of the heat dissipation area 110. In this way, when the cooling medium flows from the upstream sub-heat dissipation area 111 to the downstream sub-heat dissipation area 111, the two groups of second guide fins 410 can gather the cooling medium from both sides away from the center line toward the center line, thereby allowing more cooling medium to flow toward the center of the next sub-heat dissipation area 111, thereby improving the cooling effect.

[0045] It should be noted that the second guide fin 410 may also adopt the streamlined fin structure mentioned in the above specific embodiment, that is, Figure 3 As shown in the effect, when the cooling medium flows from the upstream sub-heat dissipation area 111 to the downstream sub-heat dissipation area 111, the streamlined second guide fin 410 can also gather the cooling medium to the center of the sub-heat dissipation area 111 more quickly, thereby achieving a better cooling effect. For example, when the heat dissipation structure is applied to the heat dissipation of the IGBT module, since the chips of multiple sub-modules in the IGBT module are roughly located at the center of their respective sub-modules, that is, the center of the sub-module is the core heating point, and the heat exchange demand here is relatively large, under the guiding effect of the streamlined second guide fin 410, the cooling medium can flow to the center of the sub-heat dissipation area 111 more quickly to cool the chip at the center of the sub-module, thereby improving the cooling effect on the chip, indirectly improving the performance of the IGBT module and extending its service life.

[0046] In some embodiments, reference Figures 1 to 5As shown, the heat dissipation part 2 includes a heat dissipation column connected to the base 1, and the heat dissipation column has a guide groove 112 extending from one end away from the base 1 toward the base 1, and the guide groove 112 forms a flow channel 113 for the cooling medium to flow through. In this way, when the cooling medium flows through the heat dissipation column, the cooling medium will pass through the flow channel 113 formed by the guide groove 112, and when passing through, the cooling medium will continuously flush the heat dissipation column. In the case of arranging the guide groove 112, the cooling medium can have a larger contact area with the heat dissipation column, thereby improving the heat exchange effect of the heat dissipation column, and at the same time, the flow resistance can be reduced.

[0047] Based on the above embodiments, the extension direction of the heat dissipation column and the specific shape of the guide groove 112 can be any suitable structure, for example, Figure 4 and Figure 5 As shown, the heat dissipation column and the guide groove 112 can both extend perpendicularly to the heat dissipation region 110, and the guide groove 112 is constructed as a U-shaped groove with an opening facing away from the base 1. In this construction mode, the heat dissipation column and the guide groove 112 are perpendicular to the heat dissipation region 110, and the cooling medium can pass through the guide groove 112 and the outside of the heat dissipation column more quickly. Moreover, the guide groove 112 constructed as a U-shaped groove can further increase the contact area between the cooling medium and the inner wall surface of the guide groove 112, thereby improving the heat exchange effect between the cooling medium and the guide groove 112, and finally improving the heat dissipation and cooling effect of the heat dissipation structure on the external device.

[0048] In other embodiments not shown in the figure, the guide groove 112 may also be, for example, a strip-shaped groove similar to a strip-shaped hole, etc. In addition, the number of the guide grooves 112 may also be one or more, but the present disclosure is not limited thereto.

[0049] In some embodiments, reference Figure 4 and Figure 5 As shown, in the first direction perpendicular to the heat dissipation area 110, the depth of the U-shaped groove is not less than four-fifths of the length of the heat dissipation column. In this way, not only the amount of cooling medium passing through the U-shaped groove is increased, but also the structural strength of the heat dissipation column itself can be improved. When the cooling medium passes through the U-shaped groove, the impact of the cooling medium on the heat dissipation column due to excessive flow rate can be reduced, thereby reducing the possibility of deformation of the heat dissipation column due to impact.

[0050] Optionally, the groove depth of the U-shaped groove may be not less than 5 mm to have good cooling and heat dissipation effect and structural strength.

[0051] In some embodiments, reference Figure 4 and Figure 5As shown, the outer wall surface of the heat dissipation column facing away from the U-shaped groove is an arc surface 201, and the U-shaped groove has a first surface 112A and a second surface 112B opposite to each other. In the second direction perpendicular to the first surface 112A and the second surface 112B, the distance between the first surface 112A and the second surface 112B is not less than half of the maximum width of the heat dissipation column in the second direction, and the groove depth of the U-shaped groove is not less than the distance between the first surface 112A and the second surface 112B, and is not greater than ten times the distance between the first surface 112A and the second surface 112B. In this way, the distance between the first surface 112A and the second surface 112B can allow more cooling medium to pass through, thereby allowing the heat dissipation column to achieve a better heat exchange cooling effect.

[0052] In a second aspect of the present disclosure, a power component is provided, referring to Figures 1 to 5 As shown, the power assembly includes a power module and the heat dissipation structure mentioned in the above specific embodiments, and the heat dissipation structure has all the beneficial effects in the above specific embodiments, and the power module is connected to the side of the substrate 1 away from the heat dissipation area 110. In this way, the power assembly can dissipate heat from the power module through the heat dissipation structure, thereby improving the performance of the power module and the service life of the power module. When dissipating heat from the power module, the power module can be located on the side of the substrate 1 away from the heat dissipation area 110, and when the coolant flows through the heat dissipation structure, the heat emitted by the power module can be carried away by the cooling medium under the heat conduction of the heat dissipation area 110.

[0053] In some embodiments, reference Figure 1 and Figure 2 As shown, the power module can be welded to the substrate 1. In this way, the power module is integrated with the heat dissipation structure, and the heat emitted by the power module can be directly transferred to the heat dissipation area 110 of the substrate 1, and transferred to the heat dissipation column on the other side of the heat dissipation area 110. Under the continuous flow of the cooling medium, the heat can be directly taken away by the cooling medium, thereby improving the heat dissipation effect. At the same time, it can also save thermal conductive structures such as the thermal conductive silicone grease layer installed between the substrate and the power module in the related technology, thereby improving the space utilization of the power component and reducing costs.

[0054] In some embodiments, reference Figure 1 and Figure 2As shown, the power module may include a chip 5 and a Direct Bonding Copper (DBC) layer 6 , one side of the DBC layer 6 is welded to the chip 5 , and the other side of the DBC layer 6 is welded to the base 1 . In this way, the direct copper-clad ceramic substrate layer 6 can play an insulating and heat-conducting role for the chip 5 on one side and the substrate 1 on the other side. In this way, when the coolant flows through the heat dissipation area 110 on one side of the substrate 1, it will not affect the normal operation of the chip 5 on the other side. At the same time, the heat generated by the operation of the chip 5 can also be transferred to the heat dissipation area 110 through the direct copper-clad ceramic substrate layer 6, so that the heat dissipation structure can take away the heat faster to improve the stability of the operation of the chip 5. It should be noted that the direct copper-clad ceramic substrate layer 6 mentioned in the above specific embodiment, that is, the DBC layer, belongs to the prior art, which generally includes an insulating ceramic layer and copper layers respectively located on both sides of the insulating ceramic layer. When welding, the chip 5 can be welded to one of the copper layers through the welding layer 501, and the copper layer on the other side can be directly welded to the substrate 1. This is not elaborated in the present disclosure.

[0055] According to a third aspect of the present disclosure, a motor controller is provided, which includes a shell and a power module, a control module, a drive module and a power component located in the shell. The power component can adopt the power component mentioned in the above specific embodiment and has all the beneficial effects in the above specific embodiment, wherein the power module can provide necessary power for the control module and the drive module, and the power module can include components such as a transformer, a rectifier, a filter and a voltage stabilizer. The control module can be used to execute control algorithms and logic, process input signals, generate control commands, and monitor the overall operating status of the motor controller. The power component can convert the electric energy output by the power module into mechanical energy for the drive module, and then control the drive module to start operating. The motor controller mentioned in the above method can also be applied to any suitable scenario. For example, the motor controller can be applied to vehicles, railway traction, ship propulsion; or household appliances such as washing machines, air conditioners, refrigerators; it can also be applied to generator sets in the energy field, and the present disclosure does not make specific limitations on this.

[0056] A fourth aspect of the present disclosure provides a vehicle, which includes a motor controller, and the motor controller adopts the motor controller mentioned in the above-mentioned specific implementation manner, and has all the beneficial effects in the above-mentioned specific implementation manner, wherein the vehicle can be a pure electric vehicle, a plug-in hybrid vehicle, an extended-range electric vehicle, etc. in the field of new energy vehicles.

[0057] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0058] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0059] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A heat dissipation structure, characterized in that: The invention comprises a substrate having a heat dissipation area, a heat dissipation portion and a first guide portion arranged around at least a part of the edge of the heat dissipation area, wherein the first guide portion is used to guide at least a part of the cooling medium at the edge of the heat dissipation area to the heat dissipation portion.

2. The heat dissipation structure according to claim 1, characterized in that: The base has an inlet end and an outlet end for cooling medium to flow through, and the first guide portion includes a plurality of first guide fins arranged around at least a portion of the edge of the heat dissipation area, and the first guide fins extend from the inlet end toward the outlet end and toward the inner side of the heat dissipation area.

3. The heat dissipation structure according to claim 2, characterized in that: The plurality of first guide fins are divided into two groups, and the two groups of first guide fins are symmetrically arranged with respect to a center line of the heat dissipation region extending from the inlet end toward the outlet end.

4. The heat dissipation structure according to claim 1, characterized in that: The base has an inlet end and an outlet end for the circulation of a cooling medium, the heat dissipation region includes a plurality of sub-heat dissipation regions arranged sequentially from the inlet end toward the outlet end, and in any two adjacent sub-heat dissipation regions, the number of the heat dissipation parts of the sub-heat dissipation region close to the outlet end is greater than the number of the heat dissipation parts of the sub-heat dissipation region close to the inlet end.

5. The heat dissipation structure according to claim 4, characterized in that: The heat dissipation region is also provided with a second guide portion arranged between at least one group of two adjacent sub-heat dissipation regions, and the second guide portion is used to gather at least part of the cooling medium from the upstream sub-heat dissipation region toward the downstream sub-heat dissipation region.

6. The heat dissipation structure according to claim 5, characterized in that: The second guide portion includes two groups of second guide fins, and the two groups of second guide fins are symmetrically arranged about a center line of the heat dissipation area extending from the inlet end toward the outlet end.

7. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation part includes a heat dissipation column connected to the base, and the heat dissipation column has a guide groove extending from an end away from the base toward the base, and the guide groove forms a flow channel for the cooling medium to flow through.

8. The heat dissipation structure according to claim 7, characterized in that: The heat dissipation column and the guide groove both extend perpendicularly to the heat dissipation area, and the guide groove is configured as a U-shaped groove with an opening facing away from the base.

9. The heat dissipation structure according to claim 8, characterized in that: In a first direction perpendicular to the heat dissipation area, a groove depth of the U-shaped groove is not less than four fifths of the length of the heat dissipation column.

10. The heat dissipation structure according to claim 8 or 9, characterized in that: In a first direction perpendicular to the heat dissipation area, a groove depth of the U-shaped groove is not less than 5 mm.

11. The heat dissipation structure according to claim 8, characterized in that: The outer wall surface of the heat dissipation column facing away from the U-shaped groove is an arc-shaped surface, and the U-shaped groove has a first surface and a second surface relative to each other. In a second direction perpendicular to the first surface and the second surface, the distance between the first surface and the second surface is not less than half of the maximum width of the heat dissipation column in the second direction.

12. The heat dissipation structure according to claim 8, characterized in that: The U-shaped groove has a first surface and a second surface opposite to each other, and a groove depth of the U-shaped groove is not less than a distance between the first surface and the second surface, and is not greater than ten times the distance between the first surface and the second surface.

13. A power component, characterized in that: It comprises a power module and the heat dissipation structure according to any one of claims 1 to 12, wherein the power module is connected to a side of the substrate away from the heat dissipation area.

14. The power assembly according to claim 13, characterized in that: The power module is welded to the substrate.

15. The power assembly according to claim 14, characterized in that: The power module comprises a chip and a direct copper-clad ceramic substrate layer, one side of the direct copper-clad ceramic substrate layer is welded to the chip, and the other side of the direct copper-clad ceramic substrate layer is welded to the base.

16. A motor controller, characterized in that: Comprising a power component as described in any one of claims 13-15.

17. A vehicle, characterized in that: Comprising a motor controller as claimed in claim 16.

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