High-density interconnected multilayer rigid-flex printed circuit board
By setting up a fracture-proof layer and a high-strength layer on the high-density interconnected multi-layer rigid-flex bonding plate, the problems of fragility and insufficient protection functions of the plate are solved, and the high strength and long life of the plate are achieved.
Patent Information
- Application Number
- CN202420841513.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-22
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-04-22
AI Technical Summary
The high-density interconnected multi-layer rigid-flex bonding plate lacks protection function, resulting in a short service life, and the flexible plate is fragile and easy to break, affecting normal use.
A high-density interconnected multi-layer rigid-flex bonding board is designed. The strength and protection function of the board are enhanced by setting a crack-proof layer, a glass cloth layer, a leather layer, a rubber layer, a high tear-resistant silicone layer on the soft circuit board and a hard circuit board.
It effectively prevents breakage of soft circuit boards and hard circuit boards, extends the service life of the board, and improves the practicality and durability of high-density interconnected multi-layer rigid-flex bonding boards.
Smart Images

Figure CN222602656U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of rigid-flexible boards, in particular to a high-density interconnected multi-layer rigid-flexible board. Background Art
[0002] Rigid-flex boards are not ordinary circuit boards. As the name implies, they are a combination of soft boards and hard boards. They are formed by combining a thin layer of flexible bottom layer and a rigid bottom layer, and then laminating them into a single component. Rigid-flex boards change the traditional flat design concept and expand it to a three-dimensional space concept. While it brings great convenience to product design, it also brings great challenges. Designers of rigid-flex boards can use a single component to replace a composite printed circuit board connected by multiple connectors, multiple cables and ribbon cables, which has stronger performance and higher stability. At the same time, the scope of the design is limited to one component, and the available space can be optimized by bending and folding the lines like a folded paper swan.
[0003] A Chinese patent discloses a rigid-flexible board (authorization announcement number CN 210519039 U). The patented technology can make the welding operation go smoothly, which is beneficial to improving the welding efficiency and the welding quality of electronic components. However, the high-density interconnected multi-layer rigid-flexible board does not have a good protective function, which affects the service life of the high-density interconnected multi-layer rigid-flexible board. In addition, the flexible board is relatively fragile, and the structure of the flexible board is unstable after multiple bendings, which affects the normal use effect of the high-density interconnected multi-layer rigid-flexible board.
[0004] Therefore, those skilled in the art provide a high-density interconnected multi-layer rigid-flex board to solve the problems raised in the above background technology. Utility Model Content
[0005] In order to solve the above technical problems, the utility model provides a high-density interconnected multi-layer rigid-flexible board, comprising a flexible circuit board body;
[0006] The top and bottom of the flexible circuit board body are fixedly connected with the rigid circuit board body, the right side of the rigid circuit board body is bonded with an anti-leakage protection layer, the right side of the anti-leakage protection layer is provided with a heat dissipation insulation layer, the right side of the heat dissipation insulation layer is bonded with a moisture-proof protection layer by glue, the right side of the moisture-proof protection layer is bonded with an anti-corrosion material layer by glue, the right side of the anti-corrosion material layer is bonded with an iron plate by glue, and the right side of the iron plate is fixedly connected with a rubber plate;
[0007] A high-strength layer is arranged on the right side of the rubber plate, the high-strength layer includes a thin steel layer, a thin aluminum layer is bonded to the right side of the thin steel layer, a thin cast iron layer is bonded to the right side of the thin aluminum layer, a graphene layer is bonded to the right side of the thin cast iron layer, and an alumina ceramic layer is bonded to the right side of the graphene layer.
[0008] Preferably: an anti-fracture layer is provided on the surface of the flexible circuit board body, the anti-fracture layer includes a glass cloth layer, a leather layer is bonded to the surface of the glass cloth layer, a rubber layer is bonded to the surface of the leather layer, a high-tear-resistant silicone layer is bonded to the surface of the rubber layer, and the inner wall of the glass cloth layer is bonded to the surface of the flexible circuit board body.
[0009] Preferably: the top and bottom of the anti-fracture layer are bonded to the inner side of the hard circuit board body, the material of the heat dissipation insulation layer is insulating rubber material, the inner cavity of the anti-fracture layer is located on the surface of the soft circuit board body, and the left side of the heat dissipation insulation layer is located on the right side of the anti-leakage protection layer.
[0010] Preferably: the four corners of the front side of the rigid circuit board body are provided with mounting holes, and the rear ends of the mounting holes penetrate to the back side of the high-strength layer. By providing the anti-fracture layer, the flexible circuit board body is provided with an anti-fracture function, thereby solving the problem that the flexible circuit board body is relatively fragile and is prone to fracture during use. The flexible circuit board body can be effectively prevented from fracture, and the service life of the flexible circuit board body is extended, thereby extending the service life of the high-density interconnected multi-layer rigid-flexible board.
[0011] Preferably: a fixed groove is arranged at the bottom of the rigid circuit board body, connecting rods are arranged at the four corners of the lower end of the fixed groove, a triangular pier is arranged at the lower end of the connecting rod, and a plurality of neatly arranged insulating rubber shock-absorbing plates are arranged at the bottom of the triangular pier. The insulating rubber shock-absorbing plates have the characteristics of wear resistance, corrosion resistance and insulation.
[0012] Technical effects and advantages of the utility model:
[0013] 1. The utility model provides an anti-fracture layer, a glass cloth layer, a leather layer, a rubber layer, a high tear-resistant silicone layer, an anti-leakage protection layer, a heat dissipation insulation layer, a moisture-proof protection layer, an anti-corrosion material layer, an iron plate, and a rubber plate, which cooperate with each other to prevent the flexible circuit board body from breaking, thereby solving the problem that the flexible circuit board body is relatively fragile and is prone to breaking during use. The utility model can effectively prevent the flexible circuit board body from breaking, prolong the service life of the flexible circuit board body, and thus prolong the service life of the high-density interconnected multi-layer rigid-flexible board.
[0014] 2. The utility model increases the strength of the rigid circuit board body by arranging a high-strength layer, a thin steel layer, a thin aluminum layer, a thin cast iron layer, a graphene layer and an alumina ceramic layer to cooperate with each other, thereby solving the problem that the rigid circuit board body is prone to breakage due to its low strength during installation, and can effectively prevent the rigid circuit board body from breaking during installation, thereby extending the service life of the rigid circuit board body, thereby extending the service life of the high-density interconnected multi-layer rigid-flexible board, so that during the installation process of the rigid circuit board, the strength of the rigid circuit board can be effectively increased to prevent the hard circuit board from breaking, and the anti-fracture effect of the soft circuit board can be increased to prevent the soft circuit board from breaking, thereby extending the service life of the high-density interconnected multi-layer rigid-flexible board, thereby achieving the advantages of high strength and anti-fracture of the rigid-flexible board.
[0015] 3. The utility model provides a fixed slot, a connecting rod, a triangular pier and an insulating rubber damping plate, which makes the rigid circuit board body wear-resistant, corrosion-resistant and insulated, thereby further extending the service life of the high-density interconnected multi-layer rigid-flexible board. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of a high-density interconnected multi-layer rigid-flexible board provided in an embodiment of the present application. Figure 1 ;
[0017] Figure 2 This is a schematic diagram of a high-density interconnected multi-layer rigid-flexible board provided in an embodiment of the present application. Figure 2 ;
[0018] Figure 3 It is a schematic diagram of the structure of a high-strength layer in a high-density interconnected multi-layer rigid-flex board provided in an embodiment of the present application;
[0019] Figure 4 It is a structural schematic diagram of a fixed slot in a high-density interconnected multi-layer rigid-flex board provided in an embodiment of the present application;
[0020] Figure 5 This is a schematic diagram of the structure of an anti-fracture layer, a glass cloth layer, a leather layer, a rubber layer and a high-tear-resistant silicone layer in a high-density interconnected multi-layer rigid-flex board provided in an embodiment of the present application;
[0021] Figure 6 It is a structural schematic diagram of connecting rods, triangular piers and insulating rubber shock-absorbing plates in a high-density interconnected multi-layer rigid-flex board provided in an embodiment of the present application.
[0022] In the figure: 1. flexible circuit board body; 2. anti-fracture layer; 3. glass cloth layer; 4. leather layer; 5. rubber layer; 6. high tear-resistant silicone layer; 7. rigid circuit board body; 8. anti-leakage protection layer; 9. heat dissipation insulation layer; 10. moisture-proof protection layer; 11. anti-corrosion material layer; 12. iron plate; 13. rubber plate; 14. high-strength layer; 141. thin steel layer; 142. thin aluminum layer; 143. thin cast iron layer; 144. graphene layer; 145. alumina ceramic layer; 15. fixed trough; 16. connecting rod; 17. triangular pier; 18. insulating rubber shock-absorbing plate. DETAILED DESCRIPTION
[0023] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific purposes.
[0024] Example 1
[0025] See also Figures 1 to 6 In this embodiment, a high-density interconnected multi-layer rigid-flexible board is provided, including a flexible circuit board body 1, a surface of the flexible circuit board body 1 is provided with an anti-fracture layer 2, the anti-fracture layer 2 includes a glass cloth layer 3, a surface of the glass cloth layer 3 is bonded to a leather layer 4, a surface of the leather layer 4 is bonded to a rubber layer 5, and a surface of the rubber layer 5 is bonded to a high-tear-resistant silicone layer 6;
[0026] The top and bottom of the flexible circuit board body 1 are fixedly connected with a rigid circuit board body 7, an anti-leakage protection layer 8 is bonded to the right side of the rigid circuit board body 7, a heat dissipation insulation layer 9 is arranged on the right side of the anti-leakage protection layer 8, a moisture-proof protection layer 10 is bonded to the right side of the heat dissipation insulation layer 9 by glue, an anti-corrosion material layer 11 is bonded to the right side of the moisture-proof protection layer 10 by glue, an iron plate 12 is bonded to the right side of the anti-corrosion material layer 11 by glue, and by providing the anti-leakage protection layer 8, when the rigid circuit board body 7 leaks electricity, no personal injury will be caused to the maintenance personnel. Damage, by providing a heat dissipation insulation layer 9, the heat dissipation capacity of the rigid circuit board body 7 is further enhanced, by providing a moisture-proof protective layer 10, the moisture-proof effect of the rigid circuit board body 7 is enhanced, by providing an anti-corrosion material layer 11, the problem that the high-density interconnected multi-layer rigid-flexible board is prone to internal short circuit due to poor moisture resistance during use is solved, by providing an iron plate 12, the gravity of the high-density interconnected multi-layer rigid-flexible board is enhanced, and the stability of placement is improved; the right side of the iron plate 12 is fixedly connected with a rubber plate 13;
[0027] A high-strength layer 14 is provided on the right side of the rubber plate 13, and the high-strength layer 14 includes a thin steel layer 141, a thin aluminum layer 142 is bonded to the right side of the thin steel layer 141, a thin cast iron layer 143 is bonded to the right side of the thin aluminum layer 142, a graphene layer 144 is bonded to the right side of the thin cast iron layer 143, and an alumina ceramic layer 145 is bonded to the right side of the graphene layer 144. The inner wall of the glass cloth layer 3 is bonded to the surface of the flexible circuit board body 1, and the top and bottom of the anti-fracture layer 2 are bonded to the inner side of the rigid circuit board body 7. The material of the heat dissipation insulation layer 9 is an insulating rubber material. The inner cavity of 2 is located on the surface of the flexible circuit board body 1, the left side of the heat dissipation insulation layer 9 is located on the right side of the anti-leakage protection layer 8, and the four corners of the front side of the rigid circuit board body 7 are provided with mounting holes, and the rear end of the mounting hole penetrates to the back side of the high-strength layer 14. By setting the anti-fracture layer 2, the flexible circuit board body 1 has an anti-fracture function, which solves the problem that the flexible circuit board body 1 is relatively fragile and the flexible circuit board body 1 is prone to fracture during use, and can effectively prevent the flexible circuit board body 1 from being fractured, thereby extending the service life of the flexible circuit board body 1, thereby extending the service life of the high-density interconnected multi-layer rigid-flexible board;
[0028] A fixing groove 15 is arranged at the bottom of the rigid circuit board body 7, connecting rods 16 are arranged at the four corners of the lower end of the fixing groove 15, a triangular pier 17 is arranged at the lower end of the connecting rod 16, and a plurality of neatly arranged insulating rubber damping plates 18 are arranged at the bottom of the triangular pier 17. The insulating rubber damping plates 18 have the characteristics of wear resistance, corrosion resistance and insulation;
[0029] By providing the high-strength layer 14, the strength of the rigid circuit board body 7 is increased, and the problem that the rigid circuit board body 7 is prone to breakage due to low strength during installation is solved. The rigid circuit board body 7 can be effectively prevented from breaking during installation, and the service life of the rigid circuit board body 7 is extended, thereby extending the service life of the high-density interconnected multi-layer rigid-flexible board.
[0030] By setting the anti-fracture layer 2, the glass cloth layer 3, the leather layer 4, the rubber layer 5, the high tear-resistant silicone layer 6, the anti-leakage protection layer 8, the heat dissipation insulation layer 9, the moisture-proof protection layer 10, the anti-corrosion material layer 11, the iron plate 12, the rubber plate 13, the high-strength layer 14, the thin steel layer 141, the thin aluminum layer 142, the thin cast iron layer 143, the graphene layer 144 and the alumina ceramic layer 145, the advantages of high strength and anti-fracture of the rigid-flexible board are achieved, and the existing high-density interconnected multi-layer rigid-flexible board does not have the high-strength and anti-fracture functions, which leads to the problem that the hard circuit board is easy to break during the installation process due to the low strength, and the soft circuit board is relatively fragile and easy to break during use. During the installation process of the hard circuit board, the strength of the hard circuit board can be effectively increased to prevent the hard circuit board from breaking, and the anti-fracture effect of the soft circuit board can be increased to prevent the soft circuit board from breaking, thereby extending the service life of the high-density interconnected multi-layer rigid-flexible board, thereby improving the practicality of the high-density interconnected multi-layer rigid-flexible board;
[0031] When in use, the anti-fracture layer 2, the glass cloth layer 3, the leather layer 4, the rubber layer 5, the high tear-resistant silicone layer 6, the anti-leakage protection layer 8, the heat dissipation insulation layer 9, the moisture-proof protection layer 10, the anti-corrosion material layer 11, the iron plate 12, and the rubber plate 13 cooperate with each other to prevent the soft circuit board body 1 from breaking, thereby solving the problem that the soft circuit board body 1 is relatively fragile and is prone to breaking when in use, and can effectively prevent the soft circuit board body 1 from breaking, thereby extending the service life of the soft circuit board body 1, thereby extending the service life of the high-density interconnected multi-layer rigid-flexible board, and by setting the high-strength layer 14, the thin steel layer 141, the thin aluminum layer 142, the thin cast iron layer 143, the graphene layer 144 and the aluminum oxide The ceramic layers 145 cooperate with each other to increase the strength of the rigid circuit board body 7, solving the problem that the rigid circuit board body 7 is prone to breakage due to its low strength during installation, and can effectively prevent the rigid circuit board body 7 from breaking during installation, thereby extending the service life of the rigid circuit board body 7, thereby extending the service life of the high-density interconnected multi-layer rigid-flexible board, so that during the installation process of the rigid circuit board, the strength of the rigid circuit board can be effectively increased to prevent the hard circuit board from breaking, and at the same time, the anti-fracture effect of the soft circuit board can be increased to prevent the soft circuit board from breaking, thereby extending the service life of the high-density interconnected multi-layer rigid-flexible board, thereby achieving the advantages of high strength and anti-fracture of the rigid-flexible board.
[0032] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. Structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to conventional means in the field unless otherwise specified and limited.
Claims
1. A high-density interconnected multi-layer rigid-flexible board, comprising a flexible circuit board body (1), characterized in that: The top and bottom of the flexible circuit board body (1) are fixedly connected to a hard circuit board body (7); an anti-leakage protection layer (8) is bonded to the right side of the hard circuit board body (7); a heat dissipation insulation layer (9) is provided on the right side of the anti-leakage protection layer (8); a moisture-proof protection layer (10) is bonded to the right side of the heat dissipation insulation layer (9) by glue; an anti-corrosion material layer (11) is bonded to the right side of the moisture-proof protection layer (10) by glue; an iron plate (12) is bonded to the right side of the anti-corrosion material layer (11) by glue; and a rubber plate (13) is fixedly connected to the right side of the iron plate (12); A high-strength layer (14) is arranged on the right side of the rubber plate (13), and the high-strength layer (14) comprises a thin steel layer (141), a thin aluminum layer (142) is bonded to the right side of the thin steel layer (141), a thin cast iron layer (143) is bonded to the right side of the thin aluminum layer (142), a graphene layer (144) is bonded to the right side of the thin cast iron layer (143), and an aluminum oxide ceramic layer (145) is bonded to the right side of the graphene layer (144).
2. A high-density interconnect multi-layer rigid-flex board according to claim 1, characterized in that: The surface of the flexible circuit board body (1) is provided with an anti-fracture layer (2), and the anti-fracture layer (2) comprises a glass cloth layer (3).
3. A high-density interconnect multi-layer rigid-flex board according to claim 2, characterized in that: The surface of the glass cloth layer (3) is bonded to a leather layer (4), and the surface of the leather layer (4) is bonded to a rubber layer (5).
4. A high-density interconnect multi-layer rigid-flex board according to claim 3, characterized in that: The surface of the rubber layer (5) is bonded and connected to a high tear resistance silicone layer (6), and the inner wall of the glass cloth layer (3) is bonded and connected to the surface of the flexible circuit board body (1).
5. The high-density interconnect multi-layer rigid-flex board according to claim 3, characterized in that: The top and bottom of the anti-fracture layer (2) are both bonded and connected to the inner side of the hard circuit board body (7), and the material of the heat dissipation insulation layer (9) is an insulating rubber material.
6. A high-density interconnect multi-layer rigid-flex board according to claim 5, characterized in that: The inner cavity of the anti-fracture layer (2) is located on the surface of the flexible circuit board body (1), and the left side of the heat dissipation insulation layer (9) is located on the right side of the anti-leakage protection layer (8).
7. The high-density interconnect multi-layer rigid-flex board according to claim 1, characterized in that: The four corners of the front side of the rigid circuit board body (7) are provided with mounting holes, and the rear ends of the mounting holes penetrate to the back side of the high-strength layer (14).
8. The high-density interconnect multi-layer rigid-flex board according to claim 7, characterized in that: A fixed groove (15) is arranged at the bottom of the rigid circuit board body (7), connecting rods (16) are arranged at the four corners of the lower end of the fixed groove (15), and a triangular pier (17) is arranged at the lower end of the connecting rod (16).
9. A high-density interconnect multi-layer rigid-flex board according to claim 8, characterized in that: A plurality of neatly arranged insulating rubber shock-absorbing plates (18) are provided at the bottom of the triangular pier (17).
Citation Information
Patent Citations
Rigid-flex printed circuit board
CN210519039U