Passive heat dissipation device

Abstract

The utility model belongs to the technical field of heat dissipation of electronic products, and particularly relates to a passive heat dissipation device. A passive heat dissipation idea is adopted, the heat dissipation part, the transmission part and the heat conductor are arranged layer by layer, heat generated by the heating part is evenly and efficiently dissipated out, and therefore efficient operation of the edge computer is guaranteed. In addition, the device is simple in structure, convenient to disassemble and maintain, compatible with different master control PCBAs, capable of being customized according to requirements, and wide in application range.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic products, in particular to a passive heat dissipation device. Background Art

[0002] This section is intended to provide a background or context to the embodiments of the utility model recited in the claims. The description herein is not admitted to be prior art by inclusion in this section.

[0003] Electronic products, especially computers, often generate a lot of heat during operation, so heat dissipation is needed to keep the equipment running normally. At present, the most commonly used heat dissipation method is passive heat dissipation. Passive heat dissipation is a heat dissipation method that increases the surface area of ​​the object and promotes heat transfer. It is mainly used in electronic equipment, optical equipment, automobiles, aircraft and other fields. In these fields, the equipment will generate a lot of heat when working for a long time, which will cause equipment damage or performance degradation, so heat dissipation treatment is required. Common passive heat dissipation structure design solutions include heat sinks, heat pipes, heat towers, metal mesh / metal mesh shells, etc. At the same time, with the development of heat dissipation technology, new materials and structures continue to emerge, such as radiators made of thermally conductive plastic materials, and the use of porous materials and nanomaterials to enhance heat dissipation efficiency.

[0004] Although passive cooling technology is already very mature, it still has the following problems and disadvantages: (1) Limited cooling efficiency: Passive cooling has a relatively low cooling efficiency compared to active cooling, especially in high temperature environments, where the cooling effect is less obvious. (2) Large radiator size: To ensure the cooling effect, the radiator generally needs to adopt a complex structural design, resulting in a large radiator size and heavy weight. (3) Structural complexity and high cost: In order to achieve the best cooling effect, some radiator designs adopt complex structures, resulting in a complex manufacturing process and high cost.

[0005] Based on the above problems, the existing technology needs to be further developed and improved. Utility Model Content

[0006] The purpose of the utility model is to provide a passive heat dissipation device for dissipating the heat of the heating element in the PCBA to protect it and enable it to work normally in view of the above problems.

[0007] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is as follows.

[0008] A passive heat dissipation device comprises a heat dissipation component, a heat conductor, a bottom shell and a baffle. The heat dissipation component, the bottom shell and the baffle form a shell. The heat conductor is located in the shell and is used to transfer the heat of the heat-generating component in the shell to the heat sink.

[0009] In some embodiments, the heat dissipation device further includes a transfer component, which is located between the heat conductor and the heat dissipation component and is in contact with the heat conductor and the heat dissipation component, and the heat conductor transfers heat to the heat dissipation component through the transfer component.

[0010] In some embodiments, the transfer component is a tubular heat conductor.

[0011] In some embodiments, an outer contour of the transmission component projected on the heat dissipation component is larger than an outer contour of the heat conductor projected on the heat dissipation component.

[0012] In some embodiments, the transfer components are symmetrically distributed about the center of the heat conductor.

[0013] In some embodiments, a surface of the heat dissipation component that contacts the transmission component is provided with a groove that matches the transmission component.

[0014] In some embodiments, the heat generating component is a PCBA, and the PCBA, the heat conductor, the transfer component, and the heat dissipation component are sequentially connected by screws.

[0015] In some embodiments, the baffle includes a first baffle and a second baffle located on opposite sides of the PCBA, the first baffle and the second baffle are connected to the PCBA through corresponding interfaces, and the bottom shell includes a bottom surface and two side panels arranged opposite to the bottom surface perpendicularly, and the side panels and the baffle constitute the side walls of the heat dissipation device.

[0016] In some embodiments, the surface of the heat conductor, the heat dissipation component and / or the transfer component is coated with thermal grease.

[0017] In some embodiments, the device further includes an identification plate, which is U-shaped, and the distance between the openings of the two ends of the U-shaped groove is greater than or equal to the thickness of the heat dissipation component, and cooperates with the heat dissipation component.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] The utility model adopts the passive heat dissipation concept, and evenly and efficiently dissipates the heat generated by the heat-generating components through the layered arrangement of heat dissipating components, transfer components and heat conductors, thereby ensuring the efficient operation of the edge computer. In addition, the utility model has a simple structure, is easy to disassemble and repair, is compatible with different main control PCBAs, and can be customized according to needs, and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0021] Figure 1 It is a schematic diagram of the structure of the passive heat dissipation device of an embodiment of the utility model;

[0022] Figure 2 It is another structural schematic diagram of the passive heat dissipation device of the embodiment of the utility model;

[0023] Figure 3 This is an exploded view of the passive heat dissipation device of an embodiment of the utility model;

[0024] Figure 4 It is a partial assembly diagram of the passive heat dissipation device of an embodiment of the utility model.

[0025] In the accompanying drawings, 1-heat dissipation component, 2-baffle, 201-first baffle, 201-second baffle, 3-bottom shell, 4-PCBA, 5-heat conductor, 6-transmission component, 7-heat generating component, 8-screw, 9-identification plate. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in combination with the embodiments and drawings. The schematic implementation mode and description of the utility model are only used to explain the utility model and are not intended to limit the utility model. It should be noted that the utility model is already in the actual development and use stage.

[0027] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc., of the present invention are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

[0028] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time. When an element is referred to as being "provided with" another element, it may be provided on the surface or inside of the element.

[0029] Unless explicitly stated otherwise, throughout the specification and claims, the term “comprise” or variations such as “include” or “comprising”, etc., will be understood to include the stated elements or components but not to exclude other elements or components.

[0030] The utility model aims to solve the problems of limited heat dissipation efficiency, large radiator size, complex structure and high cost of existing passive heat dissipation structures, and provide a passive heat dissipation device to effectively solve the heat dissipation problem of heat-generating components and improve the passive heat dissipation efficiency, thereby ensuring that the main control PCBA can work normally.

[0031] The embodiments of the utility model solve the above technical problems through the following ideas: (1) There is a bottleneck problem of low heat dissipation efficiency. This problem stems from the limitations of heat conduction itself and the influence of the background environment, such as insufficient fluid velocity, excessive resistance, etc. The solution can be achieved by increasing the heat dissipation area, improving heat dissipation materials, improving structural design, etc. (2) The problems of large size and high cost of the radiator are mainly due to the high material cost and processing cost, as well as the high requirements for heat dissipation performance in the design. The solution can be to choose more economical and efficient materials, such as die-cast aluminum alloy or plastic materials, and adopt advanced processing technology and other measures to reduce costs and processing difficulty. (3) The complexity of the radiator structure design is mainly due to the need to consider multiple heat dissipation methods and adapt to the heat dissipation requirements of different scenarios. In order to solve this problem, technologies in other fields, such as fluid mechanics and thermodynamics, can be used to improve design efficiency and accuracy. At the same time, computer simulation technology can also be used to assist in the design and optimization of the radiator.

[0032] The heat dissipation of the utility model can be used for the heat dissipation of any heat-generating component that can be placed in the device, and is particularly suitable for the heat dissipation of PCBA.

[0033] Specifically, a passive heat dissipation device includes a heat dissipation component 1, a heat conductor 5, a bottom shell 3, and a baffle 2. The heat dissipation component 1, the bottom shell 3 and the baffle 2 form a shell. The heat conductor 5 is located in the shell and is used to transfer the heat of the heat-generating component 7 in the shell to the heat sink. Figure 1 and Figure 2 The schematic diagram of the utility model after assembly, Figure 1 The utility model is shown from the perspective of the heat dissipation component 1. Figure 2The present invention is shown from the perspective of the bottom shell 3. The heat generating component 7 is placed or installed in the heat dissipation device. Taking PCBA4 as an example, PCBA4, heat conductor 5, transfer component 6, and heat dissipation component 1 can be connected detachably (such as by screws 8, snap-on, etc.) or fixedly (such as bonding). In this embodiment, the detachable connection is preferred, and the several parts are connected by screws 8 to facilitate the subsequent addition or reduction of components or maintenance operations on the PCBA4 board. The heat dissipation component 1 of the present invention adopts a passive heat dissipation method, and a plurality of heat sinks are provided on the outside of the heat dissipation component 1 to dissipate the heat in the device.

[0034] In order to dissipate heat more efficiently, the heat dissipation device further includes a transfer component 6, which is located between the heat conductor 5 and the heat dissipation component 1 and is in contact with the heat conductor 5 and the heat dissipation component 1. The heat conductor 5 transfers heat to the heat dissipation component 1 through the transfer component 6. Figure 3 As shown. The function of the transfer component 6 is to transfer the heat derived from the heat conductor 5 to the heat dissipation component 1 more evenly, thereby improving the heat dissipation efficiency. Optionally, in order to better improve the heat dissipation efficiency, the outer contour of the transfer component 6 projected on the heat dissipation component 1 is larger than the outer contour of the heat conductor 5 projected on the heat dissipation component 1. The transfer component 6 can be of any shape, and can be a regular or irregular shape. Since the heat conductor 5 generally overlaps with the center of the heat-generating component 7, optionally, the transfer component 6 is symmetrically distributed about the center of the heat conductor 5. For example, a circular, square, regular or irregular pattern, or a plurality of tubular shapes symmetrically distributed about the heat conductor 5. As Figure 4 In order to prevent the transfer component 6 from sliding relative to the heat dissipation component 1, especially the tubular transfer component 6, which is easy to slide and affect the heat transfer, in some embodiments, the side of the heat dissipation component 1 that contacts the transfer component 6 is provided with a groove that matches the transfer component 6.

[0035] Specifically, the embodiment of the utility model uses sheet metal forming and bending equipment to make aluminum alloy plates into specific shapes and aluminum extrusion dies to make heat dissipation components 1, and uses copper blocks as heat conductors 5, heat pipes as transfer components 6, and is assembled with PCBA 4 through copper columns, screws 8, thermally conductive silicone sheets and other accessories, and ensures that the heat-generating component 7 is tightly attached to the radiator module; utilizing the high thermal conductivity of copper, the fast heat transfer efficiency of the heat pipe, and the good heat dissipation effect of aluminum, when the heating element contacts the copper block, the heat can be better and faster transferred out, so that it can work normally and stably for a long time in a certain environment. Here, the radiator module can be regarded as a whole by treating the heat conductor 5, the transfer component 6, and the heat dissipation component 1 as a whole, which is called a radiator module.

[0036] In some embodiments, the device is provided with a baffle 2 for access to an external interface. The baffle 2 may be one or more, for example, the baffle 2 includes a first baffle 201 and a second baffle 201 located on opposite sides of the PCBA 4, the first baffle 201 and the second baffle 201 are connected to the PCBA 4 through corresponding interfaces, and the bottom shell 3 includes a bottom surface and two side panels perpendicular to the bottom surface and oppositely arranged, and the side panels and the baffle 2 form the side wall of the heat dissipation device. For example, the first baffle 201 and the second baffle 201 are respectively arranged on two opposite sides of the device, and the number and shape of the interfaces can be set according to requirements.

[0037] In some embodiments, in order to enhance the heat dissipation efficiency, thermal grease is coated on the surface of the heat conductor 5, the heat dissipation component 1 and / or the transfer component 6 to further improve the heat absorption capacity of the heat conductor 5, the heat dissipation component 1 and / or the transfer component 6, thereby improving the heat dissipation efficiency.

[0038] Optionally, in order to distinguish the product from other manufacturers, the device further includes a sign 9, which is U-shaped, and the distance between the openings of the two ends of the U-shaped groove is greater than or equal to the thickness of the heat dissipation component 1, and matches the heat dissipation component 1. The sign 9 is inserted between the heat dissipation device and the PCBA 4 through one end of the U-shaped shape, and the other end can be attached to the surface of the heat dissipation component 1.

[0039] Optionally, the copper block can be replaced according to different heating elements within a certain size range to be compatible with different main control PCBA4s. The left and right baffles are made of aluminum profiles, and the side openings can also be customized.

[0040] It should be noted that, for the aforementioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0041] The above specific implementation methods further illustrate the purpose, technical solutions and beneficial effects of the utility model in detail. It should be understood that the above description is only the specific implementation method of the utility model and is not used to limit the protection scope of the utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A passive heat dissipation device, characterized in that: It includes a heat dissipation component, a heat conductor, a bottom shell, and a baffle. The heat dissipation component is provided with a plurality of heat sinks on the outside to dissipate the heat in the device. The heat dissipation component, the bottom shell and the baffle form a shell. The heat conductor is located in the shell to transfer the heat of the heat-generating component in the shell to the heat sinks. The heat dissipation device further comprises a transfer component, which is located between the heat conductor and the heat dissipation component and is in contact with the heat conductor and the heat dissipation component, and the heat conductor transfers heat to the heat dissipation component through the transfer component; The transfer component is a tubular heat conductor.

2. A passive heat dissipation device according to claim 1, characterized in that: An outer contour of the transmission component projected on the heat dissipation component is larger than an outer contour of the heat conductor projected on the heat dissipation component.

3. A passive heat dissipation device according to claim 2, characterized in that: The transfer components are symmetrically distributed about the center of the heat conductor.

4. A passive heat dissipation device according to claim 3, characterized in that: A groove matching the transmission component is arranged on a surface of the heat dissipation component that contacts the transmission component.

5. A passive heat dissipation device according to claim 1, characterized in that: The heat generating component is a PCBA, and the PCBA, the heat conductor, the transfer component, and the heat dissipation component are connected in sequence by screws.

6. A passive heat dissipation device according to claim 5, characterized in that: The baffle includes a first baffle and a second baffle located on opposite sides of the PCBA, the first baffle and the second baffle are connected to the PCBA through corresponding interfaces, the bottom shell includes a bottom surface and two side panels perpendicular to the bottom surface and oppositely arranged, the side panels and the baffle constitute the side walls of the heat dissipation device.

7. A passive heat dissipation device according to any one of claims 1 to 6, characterized in that: The surfaces of the heat conductor, the heat dissipation component and / or the transmission component are coated with thermal conductive silicone grease.

8. A passive heat dissipation device according to claim 7, characterized in that: The device also includes an identification plate, which is U-shaped, and the distance between the openings of the two ends of the U-shaped groove is greater than or equal to the thickness of the heat dissipation component, and is matched with the heat dissipation component.

Images