Flow channel type phase change heat conductor

Abstract

The utility model relates to a flow channel type phase change heat conduction device, which comprises a medium capable of carrying out circulating phase change, and further comprises a heat conduction bottom plate provided with a liquid storage cavity, a plurality of vaporization flow channels arranged on one side of the liquid storage cavity and communicated with the liquid storage cavity, and a plurality of liquefaction flow channels positioned on the two sides of the liquid storage cavity and the vaporization flow channels, the two ends of the liquefying flow channel are communicated with the liquid storage cavity and the vaporizing flow channel respectively; the heat conduction cover plate is arranged on the heat conduction bottom plate and seals the liquid storage cavity, the vaporization flow channel and the liquefaction flow channel; the medium is stored in the liquid storage cavity, becomes gas in the liquid storage cavity and the vaporization flow channel after absorbing heat, and then becomes liquid after releasing heat in the liquefaction flow channel and enters the liquid storage cavity. The flow channel type phase change heat conduction device is a directional circulation radiator, namely, the directionality of a flow channel is utilized, and under the action of temperature and pressure, rapid circulation of heat absorption, heat release and heat absorption is achieved.

Description

Technical Field

[0001] The utility model relates to a heat conductor, in particular to a flow channel type phase change heat conductor. Background Art

[0002] As the power consumption of electronic products increases, the requirements for heat dissipation are also getting higher and higher. At present, heat pipes and VC liquid cooling are mainly used. The combination of VC vapor chamber and heat pipe is basically the same in principle and theoretical framework. In the production of heat pipes and VC vapor chamber products, sintered copper powder and other methods are adopted to realize the capillary wick structure, which is vacuumed and then injected with pure water. The working method is that the liquid is vaporized into gas when heated, and the hot air rises when heated. After encountering the cooling area on the upper part of the heat sink through the capillary tubes between the powders, the heat is dissipated and re-condensed into liquid. The condensed cooling liquid flows back to the evaporation source at the bottom of the vapor chamber through the capillary tubes between the powders. The reflux path and the heat dissipation path are both capillary tubes between powders. Since the reflux direction is opposite to the direction of heat dissipation evaporation, but the paths are the same, the internal flow will inevitably be offset, which will affect the heat dissipation effect, and if Figure 7 As shown, the heat dissipation direction is disordered and non-directional. Utility Model Content

[0003] In order to solve the above-mentioned problems of VC liquid cooling and heat dissipation, the utility model provides a flow channel type phase change heat conductor, and the specific technical solution is as follows:

[0004] A flow channel type phase change heat conductor, comprising a medium capable of cyclic phase change, and further comprising: a heat conductive base plate, provided with a liquid storage cavity, a plurality of vaporization flow channels arranged on one side of the liquid storage cavity and communicating with the liquid storage cavity, and a plurality of liquefaction flow channels located on both sides of the liquid storage cavity and the vaporization flow channels, wherein the two ends of the liquefaction flow channels are respectively communicated with the liquid storage cavity and the vaporization flow channels; and a heat conductive cover plate, arranged on the heat conductive base plate, and closing the liquid storage cavity, the vaporization flow channels and the liquefaction flow channels; the medium is stored in the liquid storage cavity, the medium absorbs heat and changes into gas, the gas passes through the vaporization flow channel, releases heat in the liquefaction flow channel, changes into liquid, and then enters the liquid storage cavity.

[0005] Preferably, the heights between the liquid storage cavity, the liquefaction flow channel, the vaporization flow channel and the bottom surface of the heat-conducting bottom plate decrease sequentially.

[0006] Preferably, a plurality of liquid storage tanks and a plurality of liquid storage channels are provided in the liquid storage cavity, and the liquid storage channels are communicated with the liquid storage tanks.

[0007] Furthermore, a plurality of first connecting columns are provided in the liquid storage cavity, and the first connecting columns are connected to the heat-conducting cover plate.

[0008] Preferably, in order to ensure the directionality of the heat dissipation cycle, a plurality of guide blocks for diverting and preventing backflow are provided in the vaporization flow channel, and a plurality of baffle blocks for preventing backflow are provided in the liquefaction flow channel.

[0009] Furthermore, the end of the guide block used for diversion is in an arc shape, and the end used for preventing backflow is in a triangular shape; the end of the blocking block used for preventing backflow is in a triangular shape.

[0010] Furthermore, it also includes: a plurality of choke grooves, which are arranged in the vaporization flow channel and are arranged opposite to the end of the guide block used for diversion, and the choke grooves are arc-shaped grooves.

[0011] Preferably, it further comprises: a plurality of connecting grooves respectively communicating with the vaporizing flow channel and the liquefying flow channel.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] The utility model provides a flow channel type phase change heat conductor which can realize directional circulation heat dissipation. The heat dissipation path and the return path are in the same direction and forward. The temperature, pressure and fluid characteristics in the cavity are fully utilized to realize efficient and rapid directional circulation heat dissipation. The heat dissipation efficiency is higher and the heat conduction is faster. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of this application;

[0015] Figure 2 It is a stereogram of the first viewing angle of the thermal conductive base plate;

[0016] Figure 3 It is a stereoscopic image of the second viewing angle of the thermal conductive base plate;

[0017] Figure 4 It is a front view of the heat-conducting base plate;

[0018] Figure 5 yes Figure 4 A partial enlarged view of point I in the middle;

[0019] Figure 6 It is a schematic diagram of the circulation heat dissipation of this application;

[0020] Figure 7 It is a schematic diagram showing that the heat dissipation direction of existing VC heat dissipation is disordered and non-directional. DETAILED DESCRIPTION

[0021] The utility model is now further described with reference to the accompanying drawings.

[0022] like Figures 1 to 5As shown, a flow channel type phase change heat conductor includes a medium capable of cyclic phase change, a heat conductive base plate 1 and a heat conductive cover plate 8; a liquid storage chamber 2, a plurality of vaporization flow channels 3 and a plurality of liquefaction flow channels 4 are provided on the heat conductive base plate 1, the vaporization flow channel 3 is located on one side of the liquid storage chamber 2, the vaporization flow channel 3 is communicated with the liquid storage chamber 2, the liquefaction flow channel 4 is symmetrically located on both sides of the liquid storage chamber 2 and the vaporization flow channel 3, and the two ends of the liquefaction flow channel 4 are respectively communicated with the liquid storage chamber 2 and the vaporization flow channel 3; the heat conductive cover plate 8 is sealingly welded on the heat conductive base plate 1, and closes the liquid storage chamber 2, the vaporization flow channel 3 and the liquefaction flow channel 4; the medium is stored in the liquid storage chamber 2, and after absorbing heat, the medium becomes gas in the vaporization flow channel 3, and then becomes liquid in the liquefaction flow channel 4 and enters the liquid storage chamber 2.

[0023] The heat-conducting bottom plate 1 and the heat-conducting cover plate 8 are both made of aluminum plates, and the sizes of the liquid storage cavity 2, the vaporization flow channel 3 and the liquefaction flow channel 4 are designed according to the heat conduction requirements.

[0024] The heat-conducting bottom plate 1 and the heat-conducting cover plate 8 are welded by polymer diffusion welding, and the welding is sealed, so there will be no leakage of the medium. A medium filling port 10 is left on one side or one corner of the heat-conducting bottom plate 1. After filling the liquid medium, the filling port 10 is closed by laser welding. The phase-change medium is selected according to the power consumption and calorific value of the components.

[0025] The channel-type phase-change heat conductor is installed on the top surface of the component, close to the heat source of the component. The component is centered in the middle of the heat-conducting bottom plate 1. A radiator is installed on the heat-conducting cover plate 8. The radiator is used to dissipate heat. The radiator can be an air-cooled radiator or other types of radiators. The heat generated by the component during operation drives the filled medium to undergo phase change, completing the cycle of heat absorption-heat release-heat absorption.

[0026] The channel-type phase change heat conductor has a bilaterally symmetrical circulation structure. The medium changes from a liquid endothermic phase to a gaseous phase and flows toward the vaporization channel 3. Then, it liquefies and releases heat through the liquefied channels 4 on both sides and flows back to the liquid storage chamber 2, realizing a cycle of endothermic-heat release-endothermic.

[0027] After absorbing heat, the medium changes from liquid to gas, and its volume expands. The medium that begins to vaporize enters the vaporization channel 3 and is further vaporized. The medium in the vaporization channel 3 then enters the liquefaction channel 4 under the action of pressure and liquefies under the action of temperature and pressure. When the medium liquefies, heat is released.

[0028] The latent heat of phase change is used to take away a large amount of heat energy. Then the heat generated by the working of the components is used to drive the medium to start circulating. The vaporized fluid flows along the designed vaporization flow channel 3 and liquefaction flow channel 4, transferring the heat of the components to both sides of the heat conductor. The radiator releases heat to keep the liquefaction flow channel 4 at a low temperature. The exothermic liquefied medium enters the liquid storage chamber 2, and then absorbs heat again and changes phase to vaporize. The reciprocating cycle realizes continuous heat conduction, so that the heat generated by the components when working is transferred out more orderly and efficiently, keeping the high-speed operation of the components unaffected.

[0029] The medium boils in the high-temperature area and condenses in the low-temperature area, absorbs the latent heat of phase change in the high-temperature area and releases the latent heat of phase change in the low-temperature area, alternating cycles to achieve rapid diffusion and migration of heat.

[0030] The heights of the liquid storage chamber 2, the liquefaction channel 4 and the vaporization channel 3 from the bottom surface of the heat-conducting bottom plate 1 decrease in sequence. The liquid storage chamber 2 has the smallest depth and is used to store a medium of a set weight. It is located above the components to facilitate the medium to be heated and vaporized.

[0031] The depth of the liquefied flow channel 4 is deeper than that of the liquid storage chamber 2, that is, the height between the liquefied flow channel 4 and the bottom surface of the heat-conducting bottom plate 1 is greater than the height between the liquid storage chamber 2 and the bottom surface of the heat-conducting bottom plate 1. The wall thickness of the liquefied flow channel 4 is relatively thick, and the cross-section of the liquefied flow channel 4 is relatively small. It is far away from the heat source and is in a relatively low temperature area to achieve liquefaction and heat release. The cross-sectional area of ​​the liquefied flow channel 4 becomes narrower, and the gas is more likely to liquefy and release heat when the gas pressure and temperature are reduced. The pressure of the vaporization flow channel 3 is greater than the pressure of the liquefied flow channel 4, and the pressure difference is used to achieve circulation.

[0032] The vaporization channel 3 has the largest depth, forming a metal thin-wall structure: the thin wall has low thermal resistance and fast heat conduction speed; at the same time, it is equivalent to increasing the internal volume of the phase change cavity, so that more liquid can be quickly vaporized.

[0033] The liquid storage channel 22 is connected to the inflow end of the liquefaction channel 4 and the outflow end of the vaporization channel 3 respectively. The liquid storage channel 22 connects the various liquid storage tanks 21 to form a liquid storage chamber 2. A plurality of first connecting columns 23 are provided in the liquid storage chamber 2, and the first connecting columns 23 are connected to the heat-conducting cover plate 8. A first solder groove 24 is provided on the top of the first connecting column 23 for storing solder. The first connecting column 23 increases the connection area with the heat-conducting cover plate 8, avoids deformation of the heat-conducting cover plate 8 after being compressed, and improves the overall strength and structural stability.

[0034] A plurality of guide blocks 31 for diverting and preventing backflow are provided in the vaporization flow channel 3. One end of the guide block 31 for diverting is in an arc shape, and the other end for preventing backflow is in a triangular shape, that is, the end of the guide block 31 facing the flow direction is in an arc shape, which can reduce the resistance of gas flow, and the end opposite to the gas flow direction is in a triangular shape, which can cut the reverse airflow, thereby reducing the power of the reverse airflow, so that the reverse airflow can be carried away by the forward moving airflow. In order to further prevent the formation of reverse airflow, a blocking groove 32 is also provided in part of the vaporization flow channel 3. The blocking groove 32 is arranged opposite to the arc-shaped end of the guide block 31, and the blocking groove 32 is in an arc shape, which is used to increase the resistance of the reverse airflow.

[0035] A plurality of flow blocks 41 for preventing backflow are arranged in the liquefied flow channel 4. One end of the flow block 41 for preventing backflow is in the shape of a triangle, that is, the end of the triangle is located in the flow direction of the liquid medium.

[0036] The guide block 31 and the baffle block 41 are both used to control the direction of flow, and are provided with solder grooves on the top for connecting with the heat-conducting cover plate 8, thereby increasing the connection strength between the vaporization channel 3 and the liquefaction channel 4 and the heat-conducting cover plate 8. They will not deform within a certain range of temperature and pressure changes, thereby improving the connection strength, and can support the heat-conducting cover plate 8, which is a thin plate, to reduce deformation of the heat-conducting cover plate 8.

[0037] A buffer groove 6 is also provided at the connection between the vaporization flow channel 3 and the liquefaction flow channel 4. The buffer groove 6 has a small cross section, which can reduce the amount of gas passing through, prevent the gas-liquid conversion rate from failing to meet the requirements and causing insufficient liquefaction, thereby ensuring that the heat dissipation effect will not be reduced.

[0038] The liquid storage chamber 2, vaporization channel 3 and liquefaction channel 4 of the channel-type phase change heat conductor are symmetrical structures. In order to prevent the problem of high end pressure caused by the vaporization channel 3 on both sides of the center line not being connected, a plurality of connecting grooves 5 are also included. The connecting grooves 5 are respectively connected to the vaporization channel 3 and the liquefaction channel 4 and are located at one end of the channel-type phase change heat conductor, which can facilitate the stability and balance of the directional circulation.

[0039] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the claims of the present invention.

Claims

1. A channel-type phase-change heat conductor, comprising a medium capable of cyclic phase change, characterized in that: Also includes: A heat-conducting base plate (1) is provided with a liquid storage cavity (2), a plurality of vaporization flow channels (3) provided on one side of the liquid storage cavity (2) and communicating with the liquid storage cavity (2), and a plurality of liquefaction flow channels (4) provided on both sides of the liquid storage cavity (2) and the vaporization flow channels (3), wherein two ends of the liquefaction flow channels (4) are respectively communicated with the liquid storage cavity (2) and the vaporization flow channels (3); and A heat-conducting cover plate (8) is disposed on the heat-conducting base plate (1) and seals the liquid storage cavity (2), the vaporization flow channel (3) and the liquefaction flow channel (4); The medium is stored in the liquid storage chamber (2); the medium absorbs heat and changes into gas; the gas passes through the vaporization flow channel (3), releases heat in the liquefaction flow channel (4), changes into liquid, and then enters the liquid storage chamber (2).

2. A channel type phase change heat conductor according to claim 1, characterized in that: The heights between the liquid storage chamber (2), the liquefaction flow channel (4) and the vaporization flow channel (3) and the bottom surface of the heat-conducting bottom plate (1) decrease successively, so as to accelerate circulating heat dissipation under fluid pressure conditions.

3. The channel type phase change heat conductor according to claim 1, characterized in that: A plurality of liquid storage tanks (21) and a plurality of liquid storage flow channels (22) are provided in the liquid storage cavity (2), and the liquid storage flow channels (22) are communicated with the liquid storage tanks (21).

4. A channel type phase change heat conductor according to claim 3, characterized in that: A plurality of first connecting columns (23) are provided in the liquid storage cavity (2), and the first connecting columns (23) are connected to the heat-conducting cover plate (8).

5. A channel type phase change heat conductor according to any one of claims 1 to 4, characterized in that: The vaporization flow channel (3) is provided with a plurality of flow guide blocks (31) for flow diversion and backflow prevention, and the liquefaction flow channel (4) is provided with a plurality of flow blocking blocks (41) for backflow prevention.

6. The channel type phase change heat conductor according to claim 5, characterized in that: The guide block (31) has an arc-shaped end for diverting flow and a triangular-shaped end for preventing backflow; One end of the flow blocking block (41) used to prevent backflow is in a triangular shape.

7. The channel type phase change heat conductor according to claim 5, characterized in that: Also includes: A plurality of flow-blocking grooves (32) are arranged in the vaporization flow channel (3) and are arranged opposite to one end of the flow guide block (31) used for flow diversion, and the flow-blocking grooves (32) are arc-shaped grooves.

8. The channel type phase change heat conductor according to claim 1, characterized in that: Also includes: A plurality of communication grooves (5) are respectively connected to the vaporization flow channel (3) and the liquefaction flow channel (4).

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