Switch cabinet

Abstract

A switch case disclosed by the present invention comprises a case body mechanism, a modular mechanism and a heat dissipation mechanism, the heat dissipation mechanism is inserted into the case body mechanism, the modular mechanism is inserted into the case body mechanism, and the case body mechanism comprises a machine body unit and a cover plate unit. And the cover plate unit is in threaded connection with the top of the machine body unit. By adopting the modular design, when the network scale is expanded or new functions need to be added, only corresponding modules need to be added, and the whole case does not need to be replaced, so that the extension and upgrade cost is greatly reduced, the extension and upgrade time is greatly shortened, extension and upgrade are easy, and the heat dissipation efficiency is improved by optimizing the design of a heat dissipation system. According to the heat dissipation system, the operation temperature of the switch can be effectively reduced, so that the energy consumption of the heat dissipation fan is reduced, meanwhile, the optimal design of the heat dissipation system also can avoid potential safety hazards caused by overheating, and the side surface is matched with the top heat dissipation design, so that air flow can be formed, and heat can be rapidly extracted.

Description

Technical Field

[0001] The invention relates to the field of communication technology, and in particular to a switch chassis. Background Art

[0002] A switch is a device that performs information exchange functions in a communication system. In a computer network system, the concept of switching is an improvement on the shared working mode. It can provide an exclusive electrical signal path for any two network nodes connected to the switch. The most common switch is the Ethernet switch. Other common ones include telephone voice switches and fiber optic switches. When a switch is in use, it needs to be installed in a chassis before it can be used.

[0003] The prior art publication number is: 202123071300.3. A switch chassis comprises a main body, a cover plate is connected to the front end of the main body by bolts, and a slide groove is opened on the inner side of the outer wall of the main body, a positioning groove is opened at one end of the slide groove, and a slider is slidably connected to the inner wall of the slide groove. The improved switch device, through the cooperation of the slide groove and the positioning groove, the user can slide the heat dissipation fan into the slide groove through the sliders on both sides. After the slider enters the slide groove, the elastic column inside the slider can drive the docking joint to extend and retract, so that the docking joint is stuck in the positioning groove, and the slider and the slide groove are quickly limited. In addition, the cross bar arranged inside the slider can limit the movement of the docking joint when the docking joint moves, so as to prevent the docking joint from offset during movement, thereby improving the movement stability of parts in the device. When the user installs and removes the heat dissipation fan, the device can operate normally, and there is no need to disassemble and assemble the heat dissipation fan by stopping the device.

[0004] However, the prior art still has the following shortcomings. As the core equipment of network communication, the performance and stability of the above-mentioned switch are crucial to network operation. However, the single heat dissipation chassis design often has problems such as poor heat dissipation effect and low modularity, which affects the performance and maintenance efficiency of the switch. Therefore, it is necessary to design a switch chassis with strong practicality and good heat dissipation effect. Summary of the invention

[0005] The object of the present invention is to provide a switch chassis to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a switch chassis, including a chassis body mechanism, a modular mechanism and a heat dissipation mechanism, the heat dissipation mechanism is plugged into the interior of the chassis body mechanism, the modular mechanism is plugged into the interior of the chassis body mechanism, the chassis body mechanism includes a body unit and a cover unit, and the cover unit is threadedly connected to the top of the body unit.

[0007] According to the above technical solution, the body unit is composed of an outer shell, a first heat dissipation hole, a connecting groove and a mounting bracket. The first heat dissipation hole is opened on the left and right sides of the outer shell, the connecting groove is opened on the top of the outer shell, and the mounting bracket is fixedly connected to the left and right sides of the outer shell for supporting use and facilitating air circulation.

[0008] According to the above technical solution, the cover plate unit is composed of a cover plate, a threaded connection hole, a suction fan, a connecting block, an air suction port and a second heat dissipation hole. The cover plate is threadedly connected to the top of the outer shell, the threaded connection hole is opened on the surface of the cover plate, the suction fan is threadedly connected to the bottom of the cover plate, the connecting block is fixedly connected to the side of the suction fan, the air suction port is opened at the bottom of the suction fan, and the second heat dissipation hole is opened at the top of the cover plate, which plays a main connecting role.

[0009] According to the above technical solution, the modular mechanism consists of a power module, a power interface, an electrical wiring harness, an interface module, an interface slot, a circuit board, a module plug-in interface, a controller, a mainboard module and a central processing unit. The power module is plugged into the inner side of the shell, the power interface is opened on the outer side of the power module, the electrical wiring harness is fixedly connected to the inner side of the power interface, the interface module is plugged into the other inner side of the shell away from the power module, the interface slot is opened on the outer side of the interface module, the circuit board is fixedly connected to the inner bottom of the shell, the module plug-in interface is opened at the top of the circuit board, the controller is plugged into the top of the circuit board, the mainboard module is plugged into the top of the circuit board, and the central processing unit is plugged into the top of the circuit board. A plug-in design is adopted to facilitate maintenance and replacement, and the power module, interface module, controller, mainboard module and central processing unit can be replaced independently through a separate plug-in design without replacing the entire chassis, and multiple module plug-in interfaces are provided, and modules can be flexibly added or removed as needed to meet network requirements of different scales.

[0010] According to the above technical scheme, the heat dissipation mechanism is composed of a heat sink, a heat pipe, a slot, a mounting frame and a blowing fan. The heat sink is attached to the top of the circuit board, the heat pipe is fixedly connected to the top of the heat sink, the slot is opened on the inner side of the outer shell near the first heat dissipation hole, the mounting frame is snapped into the inside of the slot, and the blowing fan is rotatably connected to the inside of the mounting frame. By cooperating with the top heat dissipation design on the side, wind flow can be formed to extract the internal heat. The heat sink is attached between the mainboard module and the power module to increase the heat dissipation area and accelerate heat conduction. The heat pipe is connected to the surface of the heat sink, and the heat on the heat sink is quickly conducted to the outside of the chassis body through the air communication heat conduction principle.

[0011] According to the above technical solution, a threaded groove is provided on the top of the shell and corresponds to the threaded connection hole on the surface of the cover plate, so as to facilitate installation and connection.

[0012] According to the above technical solution, the blowing fans are located on the left and right sides of the shell, wherein the blowing fans blow air inwards and the suction fans blow air upwards of the cover plate, so as to form wind flow inside and improve the heat dissipation effect.

[0013] According to the above technical solution, the interface module, the controller, the mainboard module and the central processing unit are electrically connected to the circuit board, and the circuit board is electrically connected to the power module.

[0014] According to the above technical solution, the shell and cover are made of aluminum alloy material. Aluminum alloy has excellent thermal conductivity and mechanical strength, which can not only meet the structural strength requirements of the chassis, but also effectively conduct the heat generated inside the switch to the outside of the chassis, thereby improving the heat dissipation effect.

[0015] Compared with the prior art, the beneficial effects achieved by the present invention are: The present invention adopts a modular design. When the network scale is expanded or new functions need to be added, only the corresponding modules need to be added without replacing the entire chassis. This greatly reduces the cost and time of expansion and upgrading, and is easy to expand and upgrade. Since the modules are designed to be pluggable, when a module fails, it can be quickly unplugged and replaced with a new module without disassembling the entire chassis. This greatly improves maintenance efficiency and reduces the time of network interruption.

[0016] The present invention can effectively reduce the operating temperature of the switch by optimizing the design of the heat dissipation system, thereby reducing the energy consumption of the heat dissipation fan. At the same time, the optimized design of the heat dissipation system can also avoid safety hazards caused by overheating.

[0017] The present invention can more reasonably utilize space and reduce waste of invalid space by adopting modular design inside the chassis. At the same time, the plug-in design also makes the internal layout of the chassis more flexible, and the position and number of modules can be adjusted as needed, which can improve space utilization.

[0018] In the present invention, the chassis is made of aluminum alloy material, which has high strength and impact resistance, can effectively protect the internal switch equipment from external damage, and the aluminum alloy has excellent thermal conductivity and mechanical strength, which can not only meet the structural strength requirements of the chassis, but also effectively conduct the heat generated inside the switch to the outside of the chassis, thereby improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 It is a schematic diagram of the appearance structure of the present invention; Figure 2 It is a side structural schematic diagram of the present invention; Figure 3 It is a schematic diagram of the internal structure of the present invention; Figure 4 The present invention Figure 3 The middle part is an enlarged structural diagram; Figure 5 It is a schematic diagram of the bottom structure of the cover plate of the present invention.

[0020] In the figure: 1. chassis body structure; 101. shell; 102. first heat dissipation hole; 103. connection slot; 104. mounting bracket; 111. cover plate; 112. threaded connection hole; 113. suction fan; 114. connection block; 115. suction port; 116. second heat dissipation hole; 2. modular structure; 201. power module; 202. power interface; 203. wiring harness; 204. interface module; 205. interface slot; 206. circuit board; 207. module plug interface; 208. controller; 209. mainboard module; 210. central processing unit; 3. heat dissipation mechanism; 301. heat sink; 302. heat pipe; 303. card slot; 304. mounting frame; 305. blowing fan. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] See also Figure 1-5The present invention provides a technical solution: a switch chassis, including a chassis body mechanism 1, a modular mechanism 2 and a heat dissipation mechanism 3, the heat dissipation mechanism 3 is plugged into the inside of the chassis body mechanism 1, the modular mechanism 2 is plugged into the inside of the chassis body mechanism 1, the chassis body mechanism 1 includes a body unit and a cover unit, the cover unit is threadedly connected to the top of the body unit, the body unit is composed of a shell 101, a first heat dissipation hole 102, a connection groove 103 and a mounting bracket 104, the top of the shell 101 is provided with a threaded groove and corresponds to the threaded connection hole 112 on the surface of the cover 111, which is convenient for installation and connection, the shell 101 and the cover 111 are made of aluminum alloy material, Aluminum alloy has excellent thermal conductivity and mechanical strength, which can not only meet the structural strength requirements of the chassis, but also effectively conduct the heat generated inside the switch to the outside of the chassis to improve the heat dissipation effect. The first heat dissipation hole 102 is opened on the left and right sides of the shell 101, and the connection groove 103 is opened on the top of the shell 101. The mounting bracket 104 is fixedly connected to the left and right sides of the shell 101 for supporting use and facilitating air circulation. The cover unit consists of a cover 111, a threaded connection hole 112, a suction fan 113, a connection block 114, an air suction port 115 and a second heat dissipation hole 116. The cover 111 is threadedly connected to the top of the shell 101, the threaded connection hole 112 is opened on the surface of the cover 111, the suction fan 113 is threadedly connected to the bottom of the cover 111, the connection block 114 is fixedly connected to the side of the suction fan 113, the suction port 115 is opened at the bottom of the suction fan 113, and the second heat dissipation hole 116 is opened on the top of the cover 111, which plays a main connecting role.

[0023] The modular mechanism 2 is composed of a power module 201, a power interface 202, an electrical wiring harness 203, an interface module 204, an interface slot 205, a circuit board 206, a module plug interface 207, a controller 208, a mainboard module 209 and a central processing unit 210. The power module 201 is plugged into the inner side of the housing 101, the power interface 202 is opened on the outer side of the power module 201, the electrical wiring harness 203 is fixedly connected to the inner side of the power interface 202, the interface module 204 is plugged into the other inner side of the housing 101 away from the power module 201, the interface module 204, the controller 208, the mainboard module 209 and the central processing unit 210 are electrically connected to the circuit board 206, and the circuit board 206 is electrically connected to the power module 201, the interface slot 205 is opened on the outer side of the interface module 204, and the blowing fan 305 is located inside the housing 101 The left and right sides of the housing 101, wherein the blowing fan 305 blows inward, and the suction fan 113 blows above the cover plate 111, so as to form wind flow inside and improve the heat dissipation effect. The circuit board 206 is fixedly connected to the inner bottom of the housing 101, and the module plug interface 207 is opened at the top of the circuit board 206. The controller 208 is plugged into the top of the circuit board 206, the mainboard module 209 is plugged into the top of the circuit board 206, and the central processing unit 210 is plugged into the top of the circuit board 206. A plug-in design is adopted to facilitate maintenance and replacement, and the power module 201, the interface module 204, the controller 208, the mainboard module 209 and the central processing unit 210 can be replaced independently through a separate plug-in design without replacing the entire chassis, and a plurality of module plug interfaces 207 are provided, and modules can be flexibly added or removed as needed to meet the needs of networks of different scales.

[0024] The heat dissipation mechanism 3 consists of a heat sink 301, a heat pipe 302, a slot 303, a mounting frame 304 and a blowing fan 305. The heat sink 301 is attached to the top of the circuit board 206, the heat pipe 302 is fixedly connected to the top of the heat sink 301, the slot 303 is opened on the inner side of the shell 101 close to the first heat dissipation hole 102, the mounting frame 304 is snapped into the inside of the slot 303, and the blowing fan 305 is rotatably connected to the inside of the mounting frame 304. Through the side and top heat dissipation design, wind flow can be formed to extract the internal heat. The heat sink 301 is attached between the mainboard module 209 and the power module 201 to increase the heat dissipation area and accelerate heat conduction. The heat pipe 302 is connected to the surface of the heat sink 301, and the heat on the heat sink is quickly conducted to the outside of the chassis body mechanism 1 through the air communication heat conduction principle.

[0025] When in use, first insert the circuit board 206, the power module 201 and the interface module 204 into the corresponding slots of the housing 101 and fix them. Then, fit the heat sink 301 between the mainboard module 209 and the power module 201 of the switch to ensure that the heat sink 301 is in close contact with the mainboard module 209 and the power module 201. Next, connect the heat pipe 302 to the surface of the heat sink 301. Finally, install the fan on the side and top of the chassis to form a complete heat dissipation system.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0027] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A switch chassis, comprising a chassis body mechanism (1), a modular mechanism (2) and a heat dissipation mechanism (3), characterized in that: The heat dissipation mechanism (3) is plugged into the interior of the chassis body mechanism (1), and the modular mechanism (2) is plugged into the interior of the chassis body mechanism (1). The chassis body mechanism (1) comprises a body unit and a cover unit, and the cover unit is threadedly connected to the top of the body unit.

2. A switch chassis according to claim 1, characterized in that: The body unit is composed of a shell (101), a first heat dissipation hole (102), a connection slot (103) and a mounting bracket (104); the first heat dissipation hole (102) is provided on the left and right sides of the shell (101); the connection slot (103) is provided on the top of the shell (101); and the mounting bracket (104) is fixedly connected to the left and right sides of the shell (101).

3. A switch chassis according to claim 2, characterized in that: The cover plate unit is composed of a cover plate (111), a threaded connection hole (112), a suction fan (113), a connection block (114), an air suction port (115) and a second heat dissipation hole (116); the cover plate (111) is threadedly connected to the top of the housing (101); the threaded connection hole (112) is opened on the surface of the cover plate (111); the suction fan (113) is threadedly connected to the bottom of the cover plate (111); the connection block (114) is fixedly connected to the side of the suction fan (113); the air suction port (115) is opened at the bottom of the suction fan (113); and the second heat dissipation hole (116) is opened on the top of the cover plate (111).

4. A switch chassis according to claim 3, characterized in that: The modular structure (2) is composed of a power module (201), a power interface (202), an electrical wiring harness (203), an interface module (204), an interface slot (205), a circuit board (206), a module plug interface (207), a controller (208), a mainboard module (209) and a central processing unit (210); the power module (201) is plugged into the inner side of the housing (101); the power interface (202) is provided on the outer side of the power module (201); the electrical wiring harness (203) is fixedly connected to the inner side of the power interface (202); The interface module (204) is plugged into the other inner side of the housing (101) away from the power module (201), the interface slot (205) is provided on the outer side of the interface module (204), the circuit board (206) is fixedly connected to the inner bottom of the housing (101), the module plug interface (207) is provided on the top of the circuit board (206), the controller (208) is plugged into the top of the circuit board (206), the mainboard module (209) is plugged into the top of the circuit board (206), and the central processing unit (210) is plugged into the top of the circuit board (206).

5. A switch chassis according to claim 4, characterized in that: The heat dissipation mechanism (3) is composed of a heat sink (301), a heat pipe (302), a slot (303), a mounting frame (304), and a blowing fan (305); the heat sink (301) is attached to the top of the circuit board (206); the heat pipe (302) is fixedly connected to the top of the heat sink (301); the slot (303) is provided on the inner side of the housing (101) near the first heat dissipation hole (102); the mounting frame (304) is snap-connected to the inside of the slot (303); and the blowing fan (305) is rotatably connected to the inside of the mounting frame (304).

6. A switch chassis according to claim 5, characterized in that: The top of the housing (101) is provided with a threaded groove which corresponds to the threaded connection hole (112) on the surface of the cover plate (111).

7. A switch chassis according to claim 6, characterized in that: The blowing fans (305) are located on the left and right sides of the housing (101), wherein the blowing fans (305) blow air inwards, and the suction fans (113) blow air upwards of the cover plate (111).

8. A switch chassis according to claim 7, characterized in that: The interface module (204), the controller (208), the mainboard module (209) and the central processing unit (210) are electrically connected to the circuit board (206), and the circuit board (206) is electrically connected to the power module (201).

9. A switch chassis according to claim 8, characterized in that: The housing (101) and the cover plate (111) are made of aluminum alloy material.

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