Circuit grounding structure based on aluminum substrate
By setting a reference ground for the RF circuit on the aluminum substrate and using the interference contact between the aluminum shell and the aluminum substrate, the problem of signal interference of RF circuits on the aluminum substrate is solved, and the effect of simplifying circuit grounding and reducing production costs is achieved.
Patent Information
- Application Number
- CN202420598607.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-03-26
AI Technical Summary
In existing lighting equipment, the direct laying of RF circuits on aluminum substrates will lead to eddy current effects, affecting RF signal communication, and the commonly used opening methods have problems of conductive metal oxidation, tolerance problems and low production efficiency.
A circuit grounding structure based on an aluminum substrate is designed, by setting a reference ground of the radio frequency circuit at the edge of the copper metal layer, and using an aluminum shell to interfere with the copper metal layer and the aluminum metal layer, the aluminum shell is able to conduct the reference ground with the aluminum metal layer and shielding electromagnetic interference.
It realizes that electromagnetic interference can be shielded without opening, simplifies circuit grounding, reduces production costs, and improves connection stability.
Smart Images
Figure CN222602880U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of lighting equipment, in particular to a circuit grounding structure based on an aluminum substrate. Background Art
[0002] In order to improve product integration and reduce product maintenance costs, lighting equipment usually uses the DOB (Driver On Board) solution for lighting circuit settings. In the DOB solution, the LED light source driver circuit and the RF circuit are set on the same aluminum substrate to save space. However, if the RF circuit is directly laid on the aluminum substrate, the aluminum substrate will form an eddy current effect, thereby affecting the communication of the RF signal. To solve the problem of RF signal interference, the commonly used method is to open a hole in the aluminum substrate, and then set the corresponding conductive metal in the hole to connect the aluminum layer of the aluminum substrate and the ground phase of the RF circuit to achieve the effect of shielding electromagnetic interference. However, the conductive metal is easy to oxidize during long-term use, and the hole has tolerance problems, which can easily cause poor contact problems. At the same time, this connection method is not convenient enough, resulting in low product production efficiency. Utility Model Content
[0003] The technical problem to be solved by the utility model is to provide a circuit grounding structure based on an aluminum substrate, which can simplify the circuit grounding method and reduce the production cost while realizing electromagnetic interference shielding.
[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is:
[0005] A circuit grounding structure based on an aluminum substrate comprises an aluminum substrate, a radio frequency circuit and an insulating shell; the aluminum substrate comprises a copper metal layer, an insulating layer and an aluminum metal layer stacked in sequence from top to bottom;
[0006] The reference ground of the radio frequency circuit is arranged at the edge of the copper metal layer; the insulating shell comprises an aluminum shell, and the aluminum shell is respectively in contact with the edge of the copper metal layer and the edge of the aluminum metal layer.
[0007] Furthermore, the aluminum substrate further includes a solder resist layer; the solder resist layer is arranged in an area of the copper metal layer away from the insulating layer and where the reference ground is not arranged.
[0008] Furthermore, the aluminum shell and the edge of the aluminum substrate are in interference contact.
[0009] Furthermore, the side edge of the aluminum substrate is provided with a first inclined surface and a second inclined surface;
[0010] The first inclined surface extends from the copper metal layer to the aluminum metal layer, and the second inclined surface extends from a first side of the aluminum metal layer close to the aluminum shell to a second side of the aluminum metal layer adjacent to the first side.
[0011] Furthermore, the insulating shell also includes a plastic shell; the aluminum shell is embedded in the interior of the plastic shell.
[0012] The beneficial effect of the utility model is that the reference ground of the radio frequency circuit is set at the edge of the copper metal layer, and the aluminum shell is in contact with the copper metal layer and the aluminum metal layer of the aluminum substrate. Based on this, the reference ground and the aluminum metal layer located on both sides of the insulating layer are connected through the aluminum shell, thereby shielding electromagnetic interference without opening holes in the aluminum substrate. At the same time, the connection is based on the existing insulating shell of the lighting equipment, without the need to set up additional conductive metal, simplifying the circuit grounding method and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 A cross-sectional view of a circuit grounding structure based on an aluminum substrate provided in an embodiment of the utility model;
[0014] Figure 2 A detailed diagram of a circuit grounding structure based on an aluminum substrate provided in an embodiment of the utility model;
[0015] Figure 3 A top view of an aluminum substrate provided in an embodiment of the utility model;
[0016] Figure 4 A schematic diagram of the structure of an insulating housing provided in an embodiment of the utility model;
[0017] Description of labels:
[0018] 1. Aluminum substrate; 2. Insulating shell; 3. Reference ground; 11. Copper metal layer; 12. Insulating layer; 13. Aluminum metal layer; 14. Solder resist layer; 21. Aluminum shell; 22. Plastic shell; 101. First inclined plane; 102. Second inclined plane. DETAILED DESCRIPTION
[0019] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in conjunction with the implementation modes and the accompanying drawings.
[0020] Please refer to Figure 1 The present invention provides a circuit grounding structure based on an aluminum substrate, comprising an aluminum substrate, a radio frequency circuit and an insulating housing; the aluminum substrate comprises a copper metal layer, an insulating layer and an aluminum metal layer stacked in sequence from top to bottom;
[0021] The reference ground of the radio frequency circuit is arranged at the edge of the copper metal layer; the insulating shell comprises an aluminum shell, and the aluminum shell is respectively in contact with the edge of the copper metal layer and the edge of the aluminum metal layer.
[0022] From the above description, it can be seen that the beneficial effect of the utility model is that the reference ground of the radio frequency circuit is set at the edge of the copper metal layer, and the aluminum shell is in contact with the copper metal layer and the aluminum metal layer of the aluminum substrate. Based on this, the reference ground and the aluminum metal layer located on both sides of the insulating layer are connected through the aluminum shell, thereby shielding electromagnetic interference without opening holes in the aluminum substrate. At the same time, the connection is based on the existing insulating shell of the lighting equipment, without the need to set up additional conductive metal, simplifying the circuit grounding method and reducing production costs.
[0023] Furthermore, the aluminum substrate further includes a solder resist layer; the solder resist layer is arranged in an area of the copper metal layer away from the insulating layer and where the reference ground is not arranged.
[0024] From the above description, it can be seen that no solder mask layer is set in the area where the reference ground is set on the copper metal layer, so that the copper metal layer enters the subsequent process cutting in the form of bare copper. At the same time, because the insulating layer is very thin and the copper metal layer has ductility, during the cutting process, the copper metal layer is extended to the aluminum metal layer, thereby realizing the connection between the copper metal layer and the aluminum metal layer, and then ensuring the sufficient connection between the reference ground and the aluminum metal layer.
[0025] Furthermore, the aluminum shell and the edge of the aluminum substrate are in interference contact.
[0026] It can be seen from the above description that the interference contact between the edges of the aluminum housing and the aluminum substrate can ensure that the copper metal layer and the aluminum metal layer of the aluminum housing and the aluminum substrate are fully connected, thereby improving the stability of the connection.
[0027] Furthermore, the side edge of the aluminum substrate is provided with a first inclined surface and a second inclined surface;
[0028] The first inclined surface extends from the copper metal layer to the aluminum metal layer, and the second inclined surface extends from a first side of the aluminum metal layer close to the aluminum shell to a second side of the aluminum metal layer adjacent to the first side.
[0029] From the above description, it can be seen that by setting the side of the aluminum substrate to a sloped structure to cooperate with the aluminum shell for interference contact, the aluminum substrate and the aluminum shell are assembled firmly, and the contact area between the aluminum substrate and the aluminum shell is increased to improve the heat dissipation capacity of the aluminum substrate.
[0030] Furthermore, the insulating shell also includes a plastic shell; the aluminum shell is embedded in the interior of the plastic shell.
[0031] From the above description, it can be seen that the circuit signal inside the aluminum housing is isolated by the plastic housing to avoid potential safety hazards caused by circuit leakage.
[0032] The present invention provides a circuit grounding structure based on an aluminum substrate, which can be applied to lighting equipment to realize DOB circuit design while shielding electromagnetic interference caused by the aluminum substrate, simplify the circuit grounding method, and reduce production costs. The following is an explanation through specific embodiments:
[0033] Please refer to Figures 1 to 4 , Embodiment 1 of the present utility model is:
[0034] A circuit grounding structure based on an aluminum substrate, such as Figure 1 and Figure 2 As shown, it includes an aluminum substrate 1, a radio frequency circuit and an insulating shell 2; the aluminum substrate 1 includes a copper metal layer 11, an insulating layer 12 and an aluminum metal layer 13 stacked in sequence from top to bottom; the reference ground 3 of the radio frequency circuit is set at the edge of the copper metal layer 11; the insulating shell 2 includes an aluminum shell 21, and the aluminum shell 21 is in contact with the edge of the copper metal layer 11 and the edge of the aluminum metal layer 13 respectively.
[0035] In some embodiments, the reference ground 3 of the RF circuit is a point structure, and at least one reference ground 3 of the RF circuit is disposed on the edge of the copper metal layer 11 .
[0036] In some embodiments, Figure 3 As shown, the reference ground 3 of the RF circuit is a line structure, and the reference ground 3 of the RF circuit is arranged along the edge of the copper metal layer 11 , so that the reference ground 3 of the RF circuit can surround the copper metal layer 11 .
[0037] It should be noted that the reference ground 3 of the RF circuit is set at the outermost edge of the aluminum substrate 1 so that the reference ground 3 can be exposed at the edge of the aluminum substrate 1, thereby connecting to the aluminum metal layer 13 in the aluminum substrate 1 through the aluminum shell 21 in the insulating shell 2.
[0038] In some embodiments, the copper metal layer 13 of the aluminum substrate 1 is also called a circuit layer, and setting the reference ground 3 of the RF circuit at the edge of the copper metal layer 11 is specifically as follows: when drawing a circuit on the copper metal layer 11 of the aluminum substrate 1, the line connected to the aluminum shell 21 needs to be drawn at the edge of the copper metal layer 11, so that the copper metal layer 11 can be removed during subsequent process processing to expose the corresponding insulating layer 12.
[0039] In an optional embodiment, the aluminum substrate 1 further includes a solder resist layer 14; the solder resist layer 14 is disposed in an area of the copper metal layer 11 away from the insulating layer 12 and where the reference ground 3 is not disposed.
[0040] In some embodiments, the solder resist layer 14 may be disposed on a side of the copper metal layer 11 away from the insulating layer 12. That is, the solder resist layer 14 is covered in all areas of the copper metal layer 11. At this time, although the reference ground 3 is covered with the solder resist layer 14, the purpose of connecting the reference ground 3 with the aluminum metal layer 13 can also be achieved by connecting the side of the reference ground 3 with the aluminum shell 21. Furthermore, the solder resist layer 14 may not be disposed in the area where the reference ground 3 is disposed on the copper metal layer 11. At this time, the area of the reference ground 3 is subjected to subsequent process flow in a manner of exposing the copper metal layer 11, so that the reference ground 3 and the aluminum metal layer 13 may be directly connected during the process flow, thereby improving the stability of the connection between the reference ground and the aluminum metal layer.
[0041] In an optional embodiment, the aluminum housing 21 is in interference contact with the edge of the aluminum substrate 1 .
[0042] In some embodiments, the cross section of the aluminum substrate 1 is circular, and the cross section of the inner cavity of the aluminum shell 21 is also circular. The diameter of the aluminum shell 21 is larger than the diameter of the aluminum substrate 1. In the process of assembling the aluminum substrate 1 into the inner cavity of the aluminum shell 21, the aluminum shell 21 is deformed after being squeezed by the aluminum substrate 1, so that the aluminum shell 21 can wrap around the copper metal layer 11 and the aluminum metal layer 13 along the side of the aluminum substrate 1 to achieve interference contact.
[0043] In an optional embodiment, the side of the aluminum substrate 1 is provided with a first inclined surface 101 and a second inclined surface 102; the first inclined surface 101 extends from the copper metal layer 11 to the aluminum metal layer 13, and the second inclined surface 102 extends from the first side of the aluminum metal layer 13 close to the aluminum shell 21 to the second side of the aluminum metal layer 13 adjacent to the first side.
[0044] In some embodiments, since the side of the aluminum substrate 1 needs to be provided with a first inclined surface 101, and the first inclined surface 101 extends from the copper metal layer 11 to the aluminum metal layer 13, when the aluminum substrate 1 is punched, since the insulating layer 12 in the aluminum substrate 1 is very thin, the copper metal layer 11 may, based on its ductility, cross the insulating layer 12 and connect with the aluminum metal layer 13. When the reference ground 3 is a line structure provided at the edge of the copper metal layer 11, the probability of the copper metal layer 11 connecting to the aluminum metal layer 13 during the punching process is increased, so that the copper metal layer 11 of the aluminum substrate 1 is likely to be connected to the aluminum metal layer 13 when the aluminum shell 21 is not assembled, so as to ensure that the copper metal layer 11 and the aluminum metal layer 13 in the aluminum substrate 1 can be fully connected.
[0045] In an optional embodiment, if Figure 4 As shown, the insulating shell 2 further includes a plastic shell 22 ; the aluminum shell 21 is embedded in the plastic shell 22 .
[0046] In summary, the utility model provides a circuit grounding structure based on an aluminum substrate, in which the reference ground of the radio frequency circuit is set at the edge of the copper metal layer, and at the same time, the aluminum shell is in interference contact with the copper metal layer and the aluminum metal layer of the aluminum substrate, thereby connecting the copper metal layer and the aluminum metal layer located on both sides of the insulating layer, that is, connecting the reference ground on the copper metal layer with the aluminum metal layer, shielding the electromagnetic interference caused by the aluminum metal layer, and no holes are required on the aluminum substrate. The utility model does not need to set additional conductive metal on the aluminum substrate, but is connected based on the existing insulating shell of the lighting equipment, which simplifies the circuit grounding method and reduces production costs.
[0047] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.
Claims
1. A circuit grounding structure based on an aluminum substrate, characterized in that: It includes an aluminum substrate, a radio frequency circuit and an insulating shell; the aluminum substrate includes a copper metal layer, an insulating layer and an aluminum metal layer stacked in sequence from top to bottom; The reference ground of the radio frequency circuit is arranged at the edge of the copper metal layer; the insulating shell comprises an aluminum shell, and the aluminum shell is respectively in contact with the edge of the copper metal layer and the edge of the aluminum metal layer.
2. A circuit grounding structure based on an aluminum substrate according to claim 1, characterized in that: The aluminum substrate further includes a solder resist layer; the solder resist layer is arranged in an area of the copper metal layer away from the insulating layer and where the reference ground is not arranged.
3. The circuit grounding structure based on an aluminum substrate according to claim 1, characterized in that: The aluminum shell and the edges of the aluminum substrate are in interference contact.
4. A circuit grounding structure based on an aluminum substrate according to claim 3, characterized in that: The side edge of the aluminum substrate is provided with a first inclined surface and a second inclined surface; The first inclined surface extends from the copper metal layer to the aluminum metal layer, and the second inclined surface extends from a first side of the aluminum metal layer close to the aluminum shell to a second side of the aluminum metal layer adjacent to the first side.
5. The circuit grounding structure based on an aluminum substrate according to claim 1, characterized in that: The insulating shell also includes a plastic shell; the aluminum shell is embedded in the interior of the plastic shell.