Flexible filament and lamp adopting same

Abstract

The utility model relates to a flexible filament and a lamp using the flexible filament, the flexible filament comprises a flexible substrate, the front surface and / or the back surface of the flexible substrate are / is coated with a supporting glue layer along the length direction of the flexible substrate in a whole or local manner, and a plurality of LED chips are pasted on the front surface or the back surface of the flexible substrate along the length direction of the flexible substrate. The LED chips are connected in series, in parallel or in a series-parallel connection mode to form a light source module, pins electrically connected with electrodes at the two ends of the light source module are attached to one end and / or the two ends of the flexible substrate, the front face and / or the back face of the flexible substrate are / is coated with a light-transmitting glue layer wrapping the supporting glue layer, and the light source module is packaged and wrapped by the light-transmitting glue layer on the front face. According to the utility model, the support glue layer is arranged on the front surface and / or the back surface of the flexible substrate, so that the rigidity and the stability of the substrate are effectively improved, and the substrate is prevented from curling or deforming when the LED chip is pasted, thereby ensuring the accuracy of the production process and the product quality.

Description

Technical Field

[0001] The utility model relates to the field of lighting, in particular to a flexible filament and a lamp using the flexible filament. Background Art

[0002] In the field of lighting technology, flexible filaments are popular because of their strong plasticity and easy installation. However, in the process of realizing flexible lighting, technicians face a series of challenges, especially when selecting and using flexible substrates. Traditional flexible substrates, although light and plastic, are prone to curling or deformation during the production process, especially when attaching LED chips, the stability of the substrate becomes a key issue.

[0003] First, the flexible nature of these materials makes them prone to deformation when subjected to external forces or temperature changes, which not only affects the precise placement of LED chips, but may also cause the mounted chips to be damaged due to substrate deformation, thus affecting the service life and lighting effect of the entire filament. In addition, substrates without sufficient support are also prone to problems when encapsulating the light-transmitting adhesive layer, such as uneven adhesive layers and bubbles, which will affect the luminous effect and stability of the filament.

[0004] Secondly, from the perspective of production process, the stability of the substrate is crucial to both production efficiency and product quality. An unstable substrate may lead to an increase in the defect rate during the production process and increase production costs. At the same time, the instability of the substrate may also affect the accuracy and efficiency of subsequent processes, such as gold wire welding and fluorescent glue coating. Summary of the invention

[0005] The technical problem to be solved by the utility model is how to overcome the problems of curling, deformation and insufficient stability that are easy to occur in the process of manufacturing flexible filaments of traditional flexible substrates, and provide a flexible filament and a lamp using the flexible filament.

[0006] The utility model is implemented in this way, providing a flexible filament, including a flexible substrate, the front side and / or the back side of the flexible substrate is coated with a supporting adhesive layer in the whole surface or part along the length direction thereof, a plurality of LED chips are attached to the front side or the back side of the flexible substrate along the length direction thereof, each LED chip is connected in series, in parallel or in a series-parallel hybrid connection to form a light source module, one end and / or both ends of the flexible substrate are attached with pins electrically connected to electrodes at both ends of the light source module, the front side and / or the back side of the flexible substrate are coated with a light-transmitting adhesive layer coated to the supporting adhesive layer, and the light-transmitting adhesive layer encapsulates and covers the light source module attached to the corresponding side.

[0007] Furthermore, the flexible substrate is a polyimide film, a polyester film or a flexible silicone substrate.

[0008] Furthermore, the pins are respectively connected to the flexible substrate or the supporting adhesive layer, and the outer sides thereof extend to the outside of the flexible substrate.

[0009] Furthermore, the pins are respectively attached to the flexible substrate by pin glue, and the light-transmitting glue layer simultaneously covers the inner end of the pin and the pin glue package.

[0010] Furthermore, the supporting adhesive layer includes a back adhesive layer and a front adhesive frame. The back side of the flexible substrate is coated with the back adhesive layer along its entire length direction, and the front side is coated with the front adhesive frame along its length direction edge. The interval surrounded by the front adhesive frame is the chip layout area. Each LED chip is connected in series, in parallel, or in a series-parallel hybrid to form a light source module, and the light source module is arranged in the chip layout area. The pins are arranged on the front side of the flexible substrate at both ends of the chip layout area, and one outer end thereof extends to the outside of the flexible substrate.

[0011] Furthermore, the supporting adhesive layer is silica gel, fluorescent silica gel, silicone resin or fluorescent silicone resin.

[0012] Furthermore, the width of the flexible substrate is 0.6 mm-5 mm.

[0013] Furthermore, the thickness of the supporting adhesive layer 2 is 0.2 mm-1 mm.

[0014] A lamp using the flexible filament comprises a light-transmitting carrier, wherein the flexible filament is arranged in the light-transmitting carrier, and pins at one end or both ends of the flexible filament are electrically connected to a built-in or external power source.

[0015] Furthermore, the light-transmitting carrier includes a bulb, a power driver and a lamp holder for electrically connecting to an external power source, the flexible filament is arranged in the bulb, the lamp holder is connected to one side outside the bulb, the power driver is disposed in the lamp holder, and the pins at one end or both ends of the flexible filament are electrically connected to the lamp holder via the power driver;

[0016] Alternatively, the light-transmitting carrier includes a light-transmitting cover, a lamp holder, a power driver and a lithium battery as a built-in power source, the flexible filament is arranged in the light-transmitting cover, the power driver and the lithium battery are placed in the lamp holder, and the pins at one end or both ends of the flexible filament are connected to the lithium battery via the power driver.

[0017] Compared with the prior art, the present invention effectively improves the rigidity and stability of the substrate by arranging a supporting adhesive layer on the front and / or back of the flexible substrate, thereby preventing the substrate from curling or deforming when the LED chip is attached, thereby ensuring the accuracy of the production process and the product quality; due to the improved stability of the flexible substrate, the defective rate in the production process is effectively reduced, thereby improving the overall production efficiency; by enhancing the stability of the substrate, the LED chip can be more firmly attached to the substrate, reducing the risk of chip damage caused by deformation of the substrate, thereby extending the service life of the flexible filament; the light-transmitting adhesive layer can be more evenly coated on a stable substrate, avoiding the problems of bubbles and uneven coating, thereby ensuring that the luminous effect of the flexible filament is more uniform and stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the cross-sectional structure of the flexible filament of the utility model;

[0019] Figure 2 for Figure 1 Middle A is an enlarged schematic diagram;

[0020] Figure 3 for Figure 1 A schematic diagram of the connection structure of the flexible substrate, the supporting adhesive layer and the pins on the flexible substrate;

[0021] Figure 4 A connection diagram of the flexible substrate, supporting adhesive layer and pins of the flexible filament described in Example 1;

[0022] Figure 5 for Figure 4 Schematic diagram of the process after LED chips are attached to the supporting adhesive layer of the structure shown;

[0023] Figure 6 for Figure 5 A schematic diagram of electrical connections between LED chips after the process shown;

[0024] Figure 7 for Figure 6 Schematic diagram of the process of coating a light-transmitting adhesive layer on the front and back surfaces after the process shown;

[0025] Figure 8 A connection diagram of the flexible substrate, supporting adhesive layer and pins of the flexible filament described in Example 2;

[0026] Fig. 9 for Figure 8 Schematic diagram of the process after LED chips are attached to the supporting adhesive layer of the structure shown;

[0027] Fig.10 for Fig. 9 A schematic diagram of electrical connections between LED chips after the process shown;

[0028] Fig.11 for Fig.10 Schematic diagram of the process of coating a light-transmitting adhesive layer on the front and back surfaces after the process shown;

[0029] Fig.12 Schematic diagram of the structure of a lamp in which the light-transmitting carrier is a bulb in Example 3;

[0030] Fig.13 This is a schematic diagram of the lamp structure in which the light-transmitting carrier is a light-transmitting cover in Example 3. DETAILED DESCRIPTION

[0031] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0032] Example 1: Please refer to Figure 1-13 The utility model discloses a flexible filament, comprising a flexible substrate 1, a supporting adhesive layer 2 is formed on the entire surface or part of the front and / or back surface of the flexible substrate 1 along its length direction, a plurality of LED chips 51 are attached to the front or back surface of the flexible substrate 1 along its length direction, each LED chip 51 is connected in series, in parallel or in a series-parallel hybrid manner to form a light source module 5, a pin 4 electrically connected to electrodes at both ends of the light source module 5 is attached to one end and / or both ends of the flexible substrate 1, a light-transmitting adhesive layer 6 coated to the supporting adhesive layer is coated on the front and / or back surface of the flexible substrate 1, and the light-transmitting adhesive layer 6 encapsulates and covers the light source module 5 attached to the corresponding side.

[0033] The flexible substrate 1 is a polyimide film, a polyester film or a flexible silicone substrate. The polyimide film is also called a PI film, which is a thin film insulating material with excellent performance. It is made by polycondensing pyromellitic anhydride and diaminodiphenyl ether in a strong polar solvent and casting into a film and then imidizing. The polyimide film has excellent high and low temperature resistance and can be used for a long time in the temperature range of -269℃ to 280℃, and can reach a high temperature of 400℃ for a short time. At the same time, its glass transition temperatures are 280°C, 385°C and above 500°C respectively. At 20°C, its tensile strength is 200MPa, and at 200°C, the tensile strength is still greater than 100MPa; PET film is a polyester product with high toughness, high strength, small thickness, and good electrical insulation. PET film has a very high light transmittance, which allows light to pass through effectively. It has excellent flexibility and bendability. PET film has good weather resistance and can maintain stable performance under different climatic conditions. It is not easy to age or deform; flexible silicone substrate is a substrate based on silicone. It inherits the excellent characteristics of silicone and has dielectric properties, corrosion resistance, heat and high pressure resistance, and odorlessness. Compared with the previously used PET board, the silicone substrate has higher ductility and flexibility, and can withstand high temperatures above 200°C.

[0034] The pins 4 are respectively connected to the flexible substrate 1 or the supporting adhesive layer 2, and the outer side thereof extends to the outer side of the flexible substrate 1. The pins 4 are respectively attached to the flexible substrate 1 by the pin adhesive 7, and the light-transmitting adhesive layer 6 simultaneously encapsulates and covers the inner end of the pin 4 and the pin adhesive 7. The supporting adhesive layer 2 is silicone, fluorescent silicone, silicone resin or fluorescent silicone resin. Further, the supporting adhesive layer 2 and the light-transmitting adhesive layer 6 are fluorescent silicone, or the pin adhesive 7 can also be fluorescent silicone. The fluorescent silicone is transparent methyl fluorescent silicone.

[0035] The width of the flexible substrate 1 is 0.6 mm to 5 mm. The thickness of the supporting adhesive layer 2 is 0.2 mm to 1 mm.

[0036] Example 2. Please refer to Figure 4-7 As shown. Based on Example 1, the supporting adhesive layer 2 includes a back adhesive layer 21 and a front adhesive frame 22. The back side of the flexible substrate 1 is coated with the back adhesive layer 21 along the entire length direction, and the front side is coated with the front adhesive frame 22 along the edge of the length direction. The area surrounded by the front adhesive frame is the chip arrangement area 20. Each LED chip 51 is connected in series, in parallel, or in series-parallel hybrid connection to form a light source module 5, and the light source module 5 is arranged in the chip arrangement area 20. The pins 4 are arranged on the front side of the flexible substrate 1 at both ends of the chip arrangement area 20, and one of the outer ends thereof extends to the outside of the flexible substrate 1.

[0037] Example 3. Please refer to Figure 8-11As shown, a lamp using the flexible filament includes a light-transmitting carrier, in which the flexible filament 10 is arranged, and pins 4 at one or both ends of the flexible filament 10 are electrically connected to a built-in or external power source.

[0038] Furthermore, the light-transmitting carrier includes a bulb shell 30, a power driver 40 and a lamp holder 50 for electrically connecting to an external power source, the flexible filament 10 is arranged in the bulb shell 30, the lamp holder 50 is connected to one side outside the bulb shell 30, the power driver 40 is disposed in the lamp holder 50, and the pins 4 at one or both ends of the flexible filament 10 are electrically connected to the lamp holder 50 via the power driver 40;

[0039] Alternatively, the light-transmitting carrier includes a light-transmitting cover 60, a lamp holder 70, a power driver 40 and a lithium battery 80 as a built-in power source, the flexible filament 10 is arranged in the light-transmitting cover 60, the power driver 40 and the lithium battery 80 are placed in the lamp holder 70, and the pins 4 at one end or both ends of the flexible filament 10 are electrically connected to the lithium battery 80 via the power driver 40.

[0040] Embodiment 4. A process for preparing a flexible substrate comprises the following steps:

[0041] S1: cutting the flexible substrate 1 according to the required specifications;

[0042] S2: configure fluorescent silica gel;

[0043] S3: coating the entire back surface of the cut flexible substrate 1 with fluorescent silicone, and forming a back support adhesive layer 2 after baking and curing, the baking temperature is 150° C.-190° C., and the baking time is 50-70 minutes;

[0044] S4: applying fluorescent silica gel to the front and / or edge of the cut flexible substrate 1, and forming a front support adhesive layer 2 after baking and curing, the baking temperature is 150° C.-190° C., and the baking time is 50-70 minutes;

[0045] S5: One end or both ends of the flexible substrate 1 are located between the supporting adhesive layers 2 on both sides and coated with fluorescent silica gel to form a pin glue 7, and then the pin 4 is placed in the pin glue 7, and after baking and curing, the pin is bonded to one end or both ends of the flexible substrate 1, the baking temperature is 150° C.-190° C., and the baking time is 50-70 minutes;

[0046] S5: A flexible substrate product is obtained.

[0047] Embodiment 5. A process for preparing a filament using the flexible substrate comprises the following steps:

[0048] S1: attaching a plurality of LED chips 51 to the front side of the flexible substrate 1 along the length direction by using a bonding adhesive;

[0049] S2: First baking, placing the flexible substrate 1 with the LED chip 51 attached thereto into a baking device for baking, and cooling after baking, so that the die-bonding adhesive solidifies so that the LED chip 51 is positioned and connected to the front of the flexible substrate 1; the baking temperature is 150° C.-190° C., and the baking time is 40-70 minutes;

[0050] S3: Use gold wire, aluminum wire or alloy wire to connect the electrodes of the LED chip 5 in series and in parallel in sequence to form a light source module 5 and electrically connect the two ends of the light source module 5 to the corresponding pins 4;

[0051] S4: Covering the front side of the flexible substrate 1 with a light-transmitting adhesive layer 6, the light-transmitting adhesive layer 6 also covers the front side supporting adhesive layer 2, the light source module 5 and the inner side of the pins 4 to the flexible substrate 1;

[0052] S5: after turning over the flexible substrate 1, the reverse side of the flexible substrate 1 is covered with the reverse light-transmitting adhesive layer 2 to the flexible substrate 1;

[0053] S7: Second baking: putting the semi-finished product covered with the light-transmitting adhesive layer 2 on the reverse side into a baking device for baking. After the baking is completed, the filament is obtained.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A flexible filament, characterized in that: The invention comprises a flexible substrate (1), wherein the front surface and / or the back surface of the flexible substrate (1) is entirely or partially coated with a supporting adhesive layer (2) along its length direction, a plurality of LED chips (51) are attached to the front surface or the back surface of the flexible substrate (1) along its length direction, and each LED chip (51) is connected in series, in parallel, or in a series-parallel hybrid manner to form a light source module (5), one end and / or both ends of the flexible substrate (1) are attached with pins (4) electrically connected to electrodes at both ends of the light source module (5), and the front surface and / or the back surface of the flexible substrate (1) are coated with a light-transmitting adhesive layer (6) that is coated to the supporting adhesive layer, and the light-transmitting adhesive layer (6) encapsulates and covers the light source module (5) attached to the corresponding side.

2. The flexible filament according to claim 1, characterized in that: The flexible substrate (1) is a polyimide film, a polyester film or a flexible silicone substrate.

3. The flexible filament according to claim 1, characterized in that: The pins (4) are respectively connected to the flexible substrate (1) or the supporting adhesive layer (2), and their outer sides extend to the outside of the flexible substrate (1).

4. The flexible filament according to claim 1, characterized in that: The pins (4) are respectively attached to the flexible substrate (1) via pin glue (7), and the light-transmitting glue layer (6) simultaneously encapsulates and covers the inner end of the pin (4) and the pin glue (7).

5. The flexible filament according to claim 1, characterized in that: The supporting adhesive layer (2) comprises a back adhesive layer (21) and a front adhesive frame (22); the back surface of the flexible substrate (1) is coated with the back adhesive layer (21) along the entire length direction thereof, and the front surface is coated with the front adhesive frame (22) along the edge of the length direction thereof; the area surrounded by the front adhesive frame is a chip arrangement area (20); the LED chips (51) are connected in series, in parallel, or in a series-parallel hybrid connection to form a light source module (5); and the light source module (5) is arranged in the chip arrangement area (20); the pins (4) are arranged on the front side of the flexible substrate (1) at both ends of the chip arrangement area (20), and one outer end thereof extends to the outside of the flexible substrate (1).

6. The flexible filament according to claim 1, characterized in that: The supporting adhesive layer (2) is silica gel, fluorescent silica gel, silicone resin or fluorescent silicone resin.

7. The flexible filament according to claim 1, characterized in that: The width of the flexible substrate (1) is 0.6 mm-5 mm.

8. The flexible filament according to claim 1, characterized in that: The thickness of the supporting adhesive layer (2) is 0.2 mm-1 mm.

9. A lamp using the flexible filament as claimed in any one of claims 1 to 8, characterized in that: It comprises a light-transmitting carrier, wherein the flexible filament (10) is arranged in the light-transmitting carrier, and the pins (4) at one end or both ends of the flexible filament (10) are electrically connected to a built-in or external power supply.

10. The lamp according to claim 9, characterized in that The light-transmitting carrier comprises a bulb (30), a power driver (40) and a lamp holder (50) for being electrically connected to an external power source, the flexible filament (10) being arranged in the bulb (30), the lamp holder (50) being connected to a side outside the bulb (30), the power driver (40) being arranged in the lamp holder (50), and the pins (4) at one end or both ends of the flexible filament (10) being electrically connected to the lamp holder (50) via the power driver (40); Alternatively, the light-transmitting carrier comprises a light-transmitting cover (60), a lamp holder (70), a power driver (40), and a lithium battery (80) as a built-in power source, the flexible filament (10) is arranged in the light-transmitting cover (60), the power driver (40) and the lithium battery (80) are placed in the lamp holder (70), and the pins (4) at one end or both ends of the flexible filament (10) are electrically connected to the lithium battery (80) via the power driver (40).

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