Heat dissipation structure of chip

Abstract

The utility model provides a heat dissipation structure of a chip. The heat dissipation structure comprises a fan shell, a rotating seat is fixedly installed on the top of a rotating rod body, a plurality of blades are arranged on the side of the rotating seat, a transverse clamping groove is formed in one side of the top of a vertical guide groove, and two symmetrical clamping rods are arranged on the two sides of the top of the rotating rod body; the vertical guide groove and the transverse clamping groove are formed in the rotating seat connected with the fan blades, the clamping rod is pushed along the vertical guide groove, the rotating seat is rotated, the clamping rod is clamped in the transverse clamping groove, the top of the rotating seat and the top of the rotating rod body further have the pressing effect of a pressing spring, and the rotating seat is easy and efficient to install and good in stability; when the blades need to be cleaned, the blades can be directly detached to be cleaned, meanwhile, the openable side cover plate is further arranged on the side face of the fan shell, when simple cleaning is needed, the side cover plate can be directly opened, the blades can be directly cleaned from the outside, and more convenience is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip heat dissipation, and relates to a chip heat dissipation structure. Background Art

[0002] Integrated circuits are a way of miniaturizing circuits in electronics, and are often manufactured on the surface of semiconductor wafers. After multiple processing steps, the final product is called a chip. After installation, the chip needs to be cooled by a cooling fan to take away the heat generated by the chip. The blades inside the cooling fan will absorb dust after long-term use, seriously affecting the heat dissipation effect of the blades. Therefore, they need to be cleaned. However, since traditional ones are fixed in place, the blade sides are blocked by the fan casing, leaving little space for cleaning the blades, and the blades cannot be disassembled, which makes cleaning difficult. Utility Model Content

[0003] The purpose of the utility model is to provide a heat dissipation structure of a chip to solve the problems raised in the above background technology.

[0004] The purpose of the utility model can be achieved through the following technical solutions:

[0005] A heat dissipation structure for a chip comprises a fan housing, a rotating seat, an inner support frame, a rotating rod body and a clamping rod, wherein a driving motor is arranged at the bottom of the fan housing, and the driving motor is arranged at the center position of the fan housing, the output end of the driving motor is fixedly connected to the rotating rod body, the top of the rotating rod body is fixedly installed with a rotating seat, a plurality of blades are arranged at the side position of the rotating seat, and the plurality of blades are evenly separated and arranged, a vertical guide groove is opened on the side of the rotating seat, a horizontal clamping groove is opened on one side of the top of the vertical guide groove, two symmetrical clamping rods are arranged on both sides of the top of the rotating rod body, and the clamping rods are clamped in the inside of the horizontal clamping groove.

[0006] In the above-mentioned heat dissipation structure of a chip, a plurality of inner support frames are arranged at the bottom of the fan housing, and one end of the inner support frame is fixedly connected to the outer wall surface of the driving motor.

[0007] In the above-mentioned heat dissipation structure of a chip, a wire cavity is opened inside the inner support frame, and the power cable of the drive motor is placed inside the wire cavity.

[0008] In the above-mentioned heat dissipation structure of a chip, a spring rod is fixedly connected to the top end of the rotating rod body, a compression spring is sleeved on the outside of the spring rod, and the top of the compression spring is placed inside the rotating seat.

[0009] In the above-mentioned heat dissipation structure of a chip, a side groove is opened on the side of the fan housing, a side cover plate is movably arranged on the side of the side groove, a locking bolt is arranged at one end of the side cover plate, and a locking hole position cooperating with the locking bolt is opened on the outer wall surface of the fan housing.

[0010] Compared with the prior art, the heat dissipation structure of a chip of the utility model has the following advantages:

[0011] The fan structure provided in the present application has a vertical guide groove and a horizontal locking groove on the rotating seat to which the fan blades are connected, and two locking rods are provided on the rotating rod body connected to the driving motor. During installation, the locking rods can be pushed along the vertical guide grooves, and then the rotating seat can be rotated so that the locking rods are locked in the horizontal locking grooves. Moreover, since the rotating seat and the top of the rotating rod body also have the clamping effect of a clamping spring, the installation of the rotating seat is simple and efficient, and at the same time has good stability. When the blades need to be cleaned, the blades can be directly removed for cleaning. At the same time, the present application also provides an openable side cover plate on the side of the fan casing. When simple cleaning is required, the side cover plate can be directly opened, and the blades can be cleaned directly from the outside, which is more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 The utility model is a schematic structural diagram of a heat dissipation structure of a chip.

[0013] Figure 2 The utility model is a schematic diagram of the top structure of a driving motor of a chip heat dissipation structure.

[0014] Figure 3 The utility model is a schematic diagram of an enlarged structure of a card rod of a heat dissipation structure of a chip.

[0015] In the figure, 1. fan casing; 2. rotating seat; 3. blades; 4. inner support frame; 5. wire cavity; 6. side cover; 7. locking bolt; 8. rotating rod body; 9. driving motor; 10. clamping rod; 11. spring rod; 12. compression spring; 13. vertical guide groove; 14. horizontal clamping groove. DETAILED DESCRIPTION

[0016] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0017] A heat dissipation structure for a chip includes a fan housing 1, a rotating seat 2, an inner support frame 4, a rotating rod body 8 and a clamping rod 10. A driving motor 9 is arranged at the bottom of the fan housing 1, and the driving motor 9 is arranged at the center position of the fan housing 1. The output end of the driving motor 9 is fixedly connected to the rotating rod body 8. The top of the rotating rod body 8 is fixedly installed with a rotating seat 2. A plurality of blades 3 are arranged at the side position of the rotating seat 2, and the plurality of blades 3 are evenly separated and arranged. A vertical guide groove 13 is opened on the side of the rotating seat 2, and a horizontal clamping groove 14 is opened on one side of the top of the vertical guide groove 13. Two symmetrical clamping rods 10 are arranged on both sides of the top of the rotating rod body 8, and the clamping rods 10 are clamped in the inside of the horizontal clamping groove 14.

[0018] like Figure 1 , Figure 2 and Figure 3 As shown, the utility model is a heat dissipation structure of a chip. Specifically, a plurality of inner support frames 4 are arranged at the bottom of a fan housing 1, and one end of the inner support frame 4 is fixedly connected to the outer wall surface of a driving motor 9.

[0019] like Figure 1 , Figure 2 and Figure 3 As shown, the utility model is a heat dissipation structure of a chip. Specifically, a wire cavity 5 is opened inside the inner support frame 4, and the power cable of the drive motor 9 is placed inside the wire cavity 5.

[0020] like Figure 1 , Figure 2 and Figure 3 As shown, the utility model is a heat dissipation structure of a chip. Specifically, a spring rod 11 is fixedly connected to the top of a rotating rod body 8, a compression spring 12 is sleeved on the outside of the spring rod 11, and the top of the compression spring 12 is placed inside the rotating seat 2.

[0021] like Figure 1 , Figure 2 and Figure 3 As shown, the utility model is a heat dissipation structure of a chip. Specifically, a side groove is opened at the side position of the fan housing 1, a side cover plate 6 is movably arranged on the side of the side groove, a locking bolt 7 is arranged at one end of the side cover plate 6, and a locking hole position cooperating with the locking bolt 7 is opened on the outer wall surface of the fan housing 1.

[0022] The utility model discloses a heat dissipation structure of a chip, in which a vertical guide groove 13 and a horizontal clamping groove 14 are provided on a rotating seat 2 to which a fan blade 3 is connected, and two clamping rods 10 are provided on a rotating rod body 8 connected to a driving motor 9. During installation, the clamping rod 10 can be pushed along the vertical guide groove 13, and then the rotating seat 2 is rotated so that the clamping rod 10 is clamped in the horizontal clamping groove 14. Moreover, since the rotating seat 2 and the top of the rotating rod body 8 also have a clamping effect of a clamping spring 12, the rotating seat 2 is easy and efficient to install, and has good stability. When the blade 3 needs to be cleaned, the blade 3 can be directly disassembled for cleaning. At the same time, the present application also provides an openable side cover plate 6 at the side position of the fan housing 1. When simple cleaning is needed, the side cover plate 6 can be directly opened, and the blade 3 can be directly cleaned from the outside, which is more convenient.

[0023] The contents not described in detail in this specification belong to the prior art known to the professional and technical personnel in this field. The specific embodiments described in this article are only used to illustrate the spirit of the utility model. The technicians in the technical field of the utility model can make various modifications or supplements to the specific embodiments described or replace them in a similar way, but they will not deviate from the spirit of the utility model or exceed the scope defined by the attached claims.

Claims

1. A heat dissipation structure for a chip, comprising a fan housing (1), a rotating seat (2), an inner support frame (4), a rotating rod body (8) and a clamping rod (10), characterized in that: A driving motor (9) is arranged at the bottom of the fan housing (1), and the driving motor (9) is arranged at the center of the fan housing (1); the output end of the driving motor (9) is fixedly connected to a rotating rod body (8); a rotating seat (2) is fixedly installed on the top of the rotating rod body (8); a plurality of blades (3) are arranged at the side of the rotating seat (2), and the plurality of blades (3) are evenly spaced apart; a vertical guide groove (13) is provided on the side of the rotating seat (2); a transverse clamping groove (14) is provided on one side of the top of the vertical guide groove (13); two symmetrical clamping rods (10) are provided on both sides of the top of the rotating rod body (8), and the clamping rods (10) are clamped inside the transverse clamping groove (14).

2. The heat dissipation structure of a chip according to claim 1, characterized in that: A plurality of inner support frames (4) are arranged at the bottom of the fan housing (1), and one end of the inner support frame (4) is fixedly connected to the outer wall surface of the drive motor (9).

3. The heat dissipation structure of a chip according to claim 2, characterized in that: A wire cavity (5) is provided inside the inner support frame (4), and a power cable of the drive motor (9) is placed inside the wire cavity (5).

4. The heat dissipation structure of a chip according to claim 1, characterized in that: The top end of the rotating rod body (8) is fixedly connected to a spring rod (11), the outer portion of the spring rod (11) is sleeved with a compression spring (12), and the top of the compression spring (12) is placed inside the rotating seat (2).

5. The heat dissipation structure of a chip according to claim 1, characterized in that: A side groove is provided on the side of the fan housing (1); a side cover plate (6) is movably provided on the side of the side groove; a locking bolt (7) is provided at one end of the side cover plate (6); and a locking hole that cooperates with the locking bolt (7) is provided on the outer wall surface of the fan housing (1).

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