High-temperature testing device for integrated circuit board

Abstract

The utility model discloses an integrated circuit board high-temperature testing device, which relates to the technical field of circuit board high-temperature detection, and comprises a detection cabinet main body, the detection cabinet main body is divided into a front cabinet and a rear cabinet by a partition plate, a circulating fan I and a circulating fan II are respectively fixed on the partition plate, and two groups of air distribution plates are fixed in the rear cabinet. The first circulating fan is located in a cavity defined by one group of air distribution plates and the rear cabinet, the second circulating fan is located in a cavity defined by the other group of air distribution plates and the rear cabinet, a heating pipe is further arranged in the rear cabinet and located in a middle cavity defined by the two groups of air distribution plates and the rear cabinet, and heat conduction fins are arranged on the faces, corresponding to the heating pipe, of the air distribution plates. By arranging the partition plate, the circulating fan I, the circulating fan II and the air distribution plate, circulating air is heated in a reciprocating manner, the temperature of the air is ensured, hot air is driven to circulate, the hot air is uniformly distributed through the air distribution plate and is uniformly conducted through the heat conduction fins, and the heating uniformity and the heating speed of a circuit board are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of high-temperature detection of circuit boards, in particular to a high-temperature testing device for integrated circuit boards. Background Art

[0002] The circuit board high temperature resistance test is a test that detects the performance of the circuit board by creating a high temperature environment. It is common in the field of circuit board manufacturing. Its purpose is to simulate the daily use environment of the product, thereby exposing circuit board defects, such as poor welding, component parameter mismatch, and failures caused during the debugging process, and plays a role in stabilizing parameters. The existing circuit board high temperature aging test is to place the circuit board in an insulation box, test the circuit board by adjusting the temperature change, and detect the service life of the circuit board. However, the existing circuit boards are usually tested in a static high temperature environment, and the air in the insulation box lacks fluidity. During use, the circuit boards are usually placed horizontally at intervals. The number of circuit boards to be tested is large and densely distributed. Therefore, the heating speed of the circuit board needs to be improved, and it also affects the problem of whether the circuit board is heated evenly. For this reason, we propose a high temperature test device for integrated circuit boards. Utility Model Content

[0003] The utility model aims to provide a high-temperature testing device for an integrated circuit board, which is used to solve the problems of uniform heating and increased heating speed during high-temperature testing of a circuit board.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-temperature testing device for an integrated circuit board, comprising a detection cabinet body, a vertical partition fixed in the cabinet body of the detection cabinet body, and the detection cabinet body is divided into a front cabinet and a rear cabinet by the partition, and a circulation fan 1 and a circulation fan 2 are respectively fixed on the partition, the circulation fan 1 is located at one end of the front cabinet to suck air, and is located at one end of the rear cabinet to blow air, the circulation fan 2 is located at one end of the front cabinet to blow air, and is located at one end of the rear cabinet to suck air, the inner wall of the front cabinet is fixed with a side mounting frame, the front cabinet is provided with a transverse support frame spaced from top to bottom through the side mounting frame, two groups of air distribution plates are fixed in the rear cabinet, and air holes are arranged on the air distribution plates, the circulation fan 1 is located in a chamber separated by one group of air distribution plates and the rear cabinet, and the circulation fan 2 is located in a chamber separated by another group of air distribution plates and the rear cabinet, a heating pipe is also arranged in the rear cabinet, and the heating pipe is located in the middle chamber separated by the two groups of air distribution plates and the rear cabinet, and a heat-conducting fin is arranged on one side of the air distribution plate corresponding to the heating pipe.

[0005] Preferably, the circulation fan 1 is distributed on the upper part of the partition, the air distribution plate is distributed laterally, and the circulation fan 1 is located in the upper chamber.

[0006] Preferably, the second circulation fan is distributed at the lower part of the partition, the air distribution plate is distributed laterally, and the second circulation fan is located in the lower chamber.

[0007] Preferably, a heat preservation plate is provided on the inner circumference of the detection cabinet body.

[0008] Preferably, the side mounting frame includes a connecting plate and slots bent from the connecting plate, and the slots are arranged at intervals along the length direction of the connecting plate.

[0009] Preferably, the support frame includes a connecting portion and a rod frame, the connecting portion is fixed at both ends of the rod frame, and the support frame is inserted into the slot through the connecting portion, and a gap is set between the rod frames.

[0010] The utility model has the following beneficial effects:

[0011] 1. By setting the partition, circulating fan 1, circulating fan 2 and air distribution plate, after the circuit board is placed in the main body of the test cabinet, circulating fan 1 introduces the air in the front cabinet into the rear cabinet for heating, and circulating fan 2 introduces the heated air from the rear cabinet. The reciprocating heating circulated air maintains the temperature of the air and drives the circulation of hot air. The circulating hot air passes through the circuit board placed on the support frame to heat the circuit board, and the air is evenly distributed through the air distribution plate during the circulation process and then evenly conducts heat through the heat conducting fins. The air is heated evenly, and the heating uniformity and heating speed of the circuit board are improved at the same time;

[0012] 2. Insulate the air in the main body of the test cabinet by setting up insulation boards to reduce heat loss and save heat;

[0013] 3. The support frame is composed of rod frames, and gaps are reserved between the rod frames, so that hot air can flow between the circuit boards placed on the upper and lower layers, ensuring the circulation effect of air;

[0014] 4. The support frame is installed through the side mounting frame. The distance between the upper and lower support frames is adjustable, ensuring sufficient space for air circulation and placing circuit boards, which is suitable for testing circuit boards of different models and batches. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the appearance of the utility model;

[0016] Figure 2 This is a schematic diagram of the internal structure of the front cabinet of the utility model;

[0017] Figure 3 This is a schematic diagram of the internal structure of the rear cabinet of the utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the side mounting frame of the utility model;

[0019] Figure 5 This is a schematic diagram of the support frame structure of the utility model.

[0020] In the figure: 1. detection cabinet body; 11. front cabinet; 12. rear cabinet; 13. insulation board; 2. partition; 3. circulation fan 1; 4. circulation fan 2; 5. side mounting frame; 51. connecting plate; 52. slot; 6. support frame; 61. connecting part; 62. rod frame; 7. air distribution plate; 71. thermal fin; 8. heating tube. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figure 1-5As shown, the utility model provides a technical solution: a high-temperature testing device for integrated circuit boards, including a detection cabinet body 1, a heat preservation plate 13 is arranged on the inner peripheral side of the cabinet body of the detection cabinet body 1 to reduce heat loss and save heat, a vertical partition 2 is fixed in the cabinet body of the detection cabinet body 1, and the detection cabinet body 1 is divided into a front cabinet 11 and a rear cabinet 12 by the partition 2, and a circulation fan 1 3 and a circulation fan 2 4 are respectively fixed on the partition 2, and the front cabinet 11 and the rear cabinet 12 ensure air circulation through the circulation fan 1 3 and the circulation fan 2 4, and the circulation fan 1 3 is at least two groups, and the circulation fan 1 3 is distributed at the two upper corners of the partition 2, and the circulation fan 2 4 is at least two groups, and the circulation fan 2 4 is distributed at the two lower corners of the partition 2, and the circulation fan 1 3 is located at one end of the front cabinet 11 to suck air, and is located at one end of the rear cabinet 12 to blow air, the purpose is to drive air circulation, and lead the air from the front cabinet 11 to the rear cabinet 12 for circulation heating. The circulation fan 2 4 is located at one end of the front cabinet 11 to blow air, and is located at one end of the rear cabinet 12 to suck air, the purpose is to drive air circulation, and introduce circulating heated air to the circuit board placement to heat the circuit board. Side mounting frames 5 are fixed on both sides of the inner wall of the front cabinet 11. The side mounting frame 5 includes a connecting plate 51 and a slot 52 bent by the connecting plate 51. The slot 52 is a "one"-shaped slot, and the slot 52 is arranged at intervals along the length direction of the connecting plate 51. The front cabinet 11 is provided with a horizontal support frame 6 at intervals from top to bottom through the side mounting frame 5. The support frame 6 includes a connecting portion 61 and a rod frame 62, the connecting portion 61 is fixed at both ends of the rod frame 62, and the support frame 6 is inserted into the slot 52 for installation through the connecting portion 61, and the installation height of the support frame 6 and the spacing between the support frames 6 are adjustable through the slot 52, ensuring sufficient space for air circulation and placing circuit boards, and a gap is set between the rod frames 62 to facilitate hot air circulation, and two groups of air distribution plates 7 are fixed in the rear cabinet 12, and dense air holes are arranged on the air distribution plates 7. A heat-conducting fin 71 is arranged on one side of the air distribution plate 7 corresponding to the heating tube 8, and the heat-conducting fin 71 is densely distributed. The air holes are used to evenly distribute the circulating air, and the heat-conducting fin 71 is used to evenly heat the circulating air, so as to evenly heat the circulating hot air. , to ensure that the air is heated evenly, the air distribution plates 7 are distributed horizontally, the circulation fan 1 3 is located in the chamber separated by one group of air distribution plates 7 and the rear cabinet 12, and the circulation fan 1 3 is located in the upper chamber, the circulation fan 2 4 is located in the chamber separated by another group of air distribution plates 7 and the rear cabinet 12, and the circulation fan 2 4 is located in the lower chamber, and a heating pipe 8 is also arranged in the rear cabinet 12. The air distribution plates 7 are distributed horizontally, and the heating pipe 8 is located in the middle chamber separated by two groups of air distribution plates 7 and the rear cabinet 12. When in use, the air of the front cabinet 11 enters from the circulation fan 2 4 and circulates from the bottom to the top, and the air of the rear cabinet 12 enters from the circulation fan 1 3 and circulates from the top to the bottom, and is evenly heated after being evenly distributed through the air distribution plates 7, the heat conducting fins 71 and the heating pipe 8.

[0023] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high temperature testing device for an integrated circuit board, comprising a testing cabinet body (1), characterized in that: A vertical partition (2) is fixed inside the cabinet body of the detection cabinet main body (1), and the detection cabinet main body (1) is divided into a front cabinet (11) and a rear cabinet (12) by the partition (2). A circulation fan 1 (3) and a circulation fan 2 (4) are respectively fixed on the partition (2). The circulation fan 1 (3) is located at one end of the front cabinet (11) for suction and at one end of the rear cabinet (12) for blowing. The circulation fan 2 (4) is located at one end of the front cabinet (11) for blowing and at one end of the rear cabinet (12) for suction. A side mounting frame (5) is fixed to the inner wall of the front cabinet (11). The front cabinet (11) is connected to the side mounting frame (5) from the top. A transverse support frame (6) is arranged at a spacing downward, two groups of air distribution plates (7) are fixed in the rear cabinet (12), air holes are arranged on the air distribution plates (7), the circulation fan 1 (3) is located in a chamber separated by one group of air distribution plates (7) and the rear cabinet (12), the circulation fan 2 (4) is located in a chamber separated by another group of air distribution plates (7) and the rear cabinet (12), a heating pipe (8) is also arranged in the rear cabinet (12), the heating pipe (8) is located in an intermediate chamber separated by the two groups of air distribution plates (7) and the rear cabinet (12), and a heat conducting fin (71) is arranged on one side of the air distribution plate (7) corresponding to the heating pipe (8).

2. The high temperature testing device for integrated circuit board according to claim 1, characterized in that: The circulation fan one (3) is distributed on the upper part of the partition (2), the air distribution plate (7) is distributed horizontally, and the circulation fan one (3) is located in the upper chamber.

3. The high temperature testing device for integrated circuit board according to claim 1, characterized in that: The second circulation fan (4) is distributed at the lower part of the partition (2), the air distribution plate (7) is distributed horizontally, and the second circulation fan (4) is located in the lower chamber.

4. The high temperature testing device for integrated circuit board according to claim 1, characterized in that: A heat preservation plate (13) is arranged on the inner circumference of the cabinet body (1) of the detection cabinet.

5. The high temperature testing device for integrated circuit board according to claim 1, characterized in that: The side mounting frame (5) comprises a connecting plate (51) and a slot (52) formed by bending the connecting plate (51), and the slots (52) are arranged at intervals along the length direction of the connecting plate (51).

6. The high temperature testing device for integrated circuit board according to claim 5, characterized in that: The support frame (6) comprises a connecting portion (61) and a rod frame (62), wherein the connecting portion (61) is fixed at both ends of the rod frame (62), and the support frame (6) is inserted into the slot (52) via the connecting portion (61), and a gap is provided between the rod frames (62).

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