Processing box

Abstract

The utility model discloses a processing box, which comprises a frame, a developing roller; a photosensitive drum; a charging roller; the coupling protrusion is arranged at the right end of the frame in the left-right direction, and the coupling protrusion can receive driving force from the outside of the process cartridge so as to drive the developing roller or the photosensitive drum to rotate; a chip having a chip electrical contact surface; an electrode electrically connectable to the charging roller and having an electrode electrical contact surface disposed at a left end of the frame in the left-right direction and closer to a right end of the frame than the chip electrical contact surface; the processing box further comprises a chip rack used for supporting the chip, and the chip rack is detachably installed on the frame.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic photographic imaging, in particular to a processing box. Background Art

[0002] The prior art discloses a processing box, in which a shell for accommodating a developer, a chip arranged on the shell, and a chip rack for supporting the chip are provided. The chip rack and the shell are integrally formed. The chip is a common component for communication between the processing box and an imaging device, in which parameters such as the model and life of the processing box are stored. When the processing box is installed on the imaging device, a communication connection is established between the chip and the imaging device, so that the imaging device can accurately obtain information about the processing box.

[0003] Existing chips are generally more expensive and can correspond to the life of multiple processing cartridges. When the developer in the processing cartridge is exhausted, that is, when the life of a processing cartridge is over, the processing cartridge is usually discarded, and the chip on the processing cartridge will also be discarded. Even if the manufacturer and user want to recycle it, however, since the existing chips are generally firmly adhered to the processing cartridge by an adhesive portion, on the one hand, it is very difficult to disassemble. At this time, the chip is likely to be discarded, which causes great waste and increases the cost of use for the manufacturer and user; on the other hand, if there is a manufacturing error in the chip rack or an installation error in the chip, the chip fixedly installed in the chip rack may not be able to make electrical contact with the electrical contacts of the imaging device, resulting in the imaging device being unable to recognize the chip in the processing cartridge and an error message. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a processing box, which is mainly achieved through the following technical solutions:

[0005] A processing box, comprising:

[0006] A frame capable of accommodating a developer, the frame having opposite left and right ends in the left-right direction;

[0007] a developing roller rotatably supported on the frame;

[0008] a photosensitive drum rotatably supported on the frame;

[0009] A charging roller, capable of charging the photosensitive drum;

[0010] a coupling protrusion disposed at the right end of the frame in the left-right direction, the coupling protrusion being capable of receiving a driving force from outside the process cartridge to drive the developing roller or the photosensitive drum to rotate;

[0011] a chip having a chip electrical contact surface, wherein the chip electrical contact surface is disposed at a left end of the frame in the left-right direction;

[0012] an electrode electrically connectable to the charging roller and having an electrode electrical contact surface, the electrode electrical contact surface being disposed at a left end of the frame in the left-right direction and being closer to a right end of the frame than the chip electrical contact surface;

[0013] The processing box also includes a chip frame for supporting the chip, and the chip frame is detachably mounted on the frame.

[0014] Furthermore, the processing box also includes a force receiving protrusion, which is located at the lower end of the frame in the up and down directions perpendicular to the electrical contact surface of the chip, and the force receiving protrusion is constructed to receive a force from outside the processing box to separate the developing roller from the photosensitive drum.

[0015] Furthermore, the chip rack or the frame is provided with elastic buckles, and the chip rack is mounted on the frame through the elastic buckles or through interference fit.

[0016] Furthermore, the chip rack or the frame is provided with elastic buckles, and the chip rack is mounted on the frame through the elastic buckles or through interference fit.

[0017] Furthermore, a mounting protrusion is provided on one of the chip rack and the frame, and a mounting groove is provided on the other, and the mounting protrusion can be matched and inserted into the mounting groove to position and mount the chip rack on the frame.

[0018] Furthermore, the mounting protrusion or the mounting groove extends in the left-right direction, and the chip rack can be mounted on the frame along the left-right direction.

[0019] Furthermore, a limiting surface is provided at the extended end of the mounting groove, and the limiting surface is used to limit the movement stroke of the chip rack in the mounting direction during the process of mounting the chip rack to the frame.

[0020] Furthermore, the processing box also includes an elastic member, and the elastic member is arranged between the chip and the chip frame.

[0021] Furthermore, a first adhesive portion and a second adhesive portion are provided on two opposite sides of the elastic member, the first adhesive portion can make the elastic member adhere to the chip frame, and the second adhesive portion can make the chip adhere to the elastic member.

[0022] Furthermore, the up-down direction is perpendicular to the electrical contact surface of the chip; the chip frame includes a plurality of ribs, the plurality of ribs enclose a receiving cavity for receiving the chip, the upper end of the rib has an upper surface, and in the up-down direction, the second adhesive portion is positioned on the lower side of the upper surface of the rib.

[0023] Furthermore, the chip rack includes a accommodating cavity for accommodating the chip and an exposure opening connected to the accommodating cavity. The chip can be installed in the accommodating cavity through the exposure opening and projected along the exposure direction of the exposure opening. The projection range of the chip is completely within the projection range of the exposure opening.

[0024] Furthermore, the chip rack includes a plurality of ribs, the plurality of ribs enclose a receiving cavity for receiving the chip and an exposure opening located outside the receiving cavity, the chip can be installed in the receiving cavity through the exposure opening, and an exposure groove is formed on at least one of the ribs, the exposure groove is connected to the exposure opening; the chip electrical contact surface extends in the left-right direction and the front-back direction, and in the front-back direction, the exposure groove is arranged in the approximate middle position of the rib.

[0025] Further, in the front-to-back direction, the exposure groove has a width S, wherein 2 mm≦S≦10 mm. Further, 2.5 mm≦S≦4 mm.

[0026] The utility model provides a processing box. On the one hand, the chip rack of the processing box is detachably mounted on a frame, so that after the printing life of the processing box is exhausted, the user can easily remove the chip rack with the chip, which is simpler and more convenient than directly removing the chip. Moreover, the removed chip can be reused, which is not only green and environmentally friendly, but also the user can purchase the processing box without the chip assembly from the manufacturer, which reduces the user's processing box use cost and the manufacturer's production cost. On the other hand, elastic parts such as sponges are arranged between the chip and the chip rack to achieve stable electrical contact with the electrical contacts of the imaging device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of a processing box in Embodiment 1 of the present utility model at a certain angle;

[0028] Figure 2 It is a schematic diagram of another angle of the processing box in Embodiment 1 of the utility model;

[0029] Figure 3 This is another angled schematic diagram of the processing box in Embodiment 1 of the utility model;

[0030] Figure 4 It is a partial enlarged schematic diagram of the chip rack in Example 1 of the utility model;

[0031] Figure 5 It is a cross-sectional schematic diagram of the processing box in Embodiment 1 of the utility model;

[0032] Figure 6 It is a schematic diagram of the chip rack and the chip being separated from the processing box in Embodiment 1 of the present utility model;

[0033] Figure 7 It is a schematic diagram of a chip assembly being separated from a processing box at a certain angle in Embodiment 1 of the present utility model;

[0034] Figure 8 It is a schematic diagram from another angle of the chip assembly being separated from the processing box in Embodiment 1 of the present invention;

[0035] Fig. 9 This is a schematic diagram of the chip rack in Example 1 of the utility model;

[0036] Fig.10 This is a schematic diagram of a processing box in Embodiment 2 of the present utility model;

[0037] Fig.11 This is a schematic diagram of a chip rack in Embodiment 2 of the present utility model;

[0038] Fig.12 This is a schematic diagram of the chip assembly decomposition in Embodiment 2 of the present utility model;

[0039] Fig.13 This is a schematic diagram of a processing box in Embodiment 3 of the present utility model at a certain angle;

[0040] Fig.14 This is a schematic diagram of another angle of the processing box in Embodiment 3 of the utility model;

[0041] Fig.15 It is a schematic diagram of a processing box in which a chip assembly is separated from a frame in Embodiment 3 of the present utility model;

[0042] Fig.16 This is another angled schematic diagram of the processing box in Embodiment 3 of the present utility model;

[0043] Fig.17 This is a schematic diagram of the chip assembly in Example 3 of the utility model;

[0044] Fig.18 This is a schematic diagram of the chip assembly decomposition in Embodiment 3 of the present utility model;

[0045] Fig.19 It is a schematic diagram of a processing box in Embodiment 4 of the present utility model at a certain angle;

[0046] Fig. 20 It is a schematic diagram of another angle of the processing box in Embodiment 4 of the utility model;

[0047] Fig.21 This is another angled schematic diagram of the processing box in Embodiment 4 of the present utility model;

[0048] Fig. 22 It is a schematic diagram of a processing box in which a chip rack is removed from a frame in Embodiment 4 of the present utility model;

[0049] Fig.23 This is a schematic diagram of the chip rack installed on the frame in Example 4 of the utility model;

[0050] Fig.24 It is a schematic diagram of the chip rack in Embodiment 4 of the present utility model being disassembled from the frame;

[0051] Fig.25 This is an exploded view of the chip assembly in Example 5 of the present utility model;

[0052] Fig.26 This is a schematic diagram of a chip assembly in Embodiment 6 of the present utility model;

[0053] Fig. 27 This is a schematic diagram of the chip assembly after the chip is removed in Example 6 of the present utility model;

[0054] Fig.28 It is a cross-sectional schematic diagram of the chip assembly in Example 6 of the present utility model. DETAILED DESCRIPTION

[0055] Example 1

[0056] For the convenience of description, the direction of the processing box 100 is now defined. The developing roller 104 can rotate around the developing roller rotation axis extending along the left-right direction. In the left-right direction, the coupling part 107 is arranged at the right end of the processing box 100; the up-down direction intersects with the left-right direction, and the up-down direction is perpendicular to the chip electrical contact surface 110a. The chip electrical contact surface 110a and the photosensitive drum 105 are arranged in the up-down direction, and the chip electrical contact surface 110a is arranged at the upper end of the photosensitive drum 105; the front-to-back direction intersects with the left-to-right direction and the up-down direction, and the chip electrical contact surface 110a extends in the left-to-right direction and the front-to-back direction.

[0057] like Figure 1-9As shown, a processing box 100 in Example 1 of the utility model is shown, which can be detachably installed in an imaging device; the processing box 100 includes a frame 101 that can accommodate a developer, the frame 101 includes a developing frame and a drum frame, the processing box 100 also includes a developing roller 104 supported on the developing frame and a photosensitive drum 105 and a charging roller 106 supported on the drum frame, and a coupling portion 107 (coupling protrusion) arranged at the right end of the frame 101, the coupling portion 107 can receive the driving force of the driving head in the imaging device to rotate the developing roller 104 and the photosensitive drum 105, the developing roller 104 can rotate around the developing roller rotation axis extending in the left-right direction, and the photosensitive drum 105 can rotate around the photosensitive drum rotation axis extending in the left-right direction; the processing box 100 also includes an electrode 130 that can be electrically connected to the charging roller 106 and a chip 110 that stores relevant information of the developing box 100 and a chip frame 120 that supports the chip 110. In the present invention, the chip 110 and the chip frame 120 together constitute a chip assembly, the electrode 130 includes an electrode electrical contact surface 131 that can be electrically contacted with the power supply component of the imaging device, the chip 110 includes a chip electrical contact surface 110a that can be electrically contacted with the electrical contact of the imaging device, the chip electrical contact surface 110a is composed of a plurality of electrical contacts 110a1, and the plurality of electrical contacts 110a1 are arranged in the left-right direction. In the left-right direction, the electrode electrical contact surface 131 and the chip electrical contact surface 110a are both located at the left end of the frame 101, and, compared with the electrode electrical contact surface 131, the chip electrical contact surface 131 is farther away from the right end of the frame 101. In the up-down direction, the electrode electrical contact surface 131 and the chip electrical contact surface 110a are both located at the upper end of the frame 101 and both are arranged to face the upper end of the processing box 100. In the front-to-back direction, the chip electrical contact surface 110a is located at the front end of the electrode electrical contact surface 131.

[0058] In order to prevent the developing roller 104 from being in contact with the photosensitive drum 105 for a long time when the processing box 100 is not performing a printing task, thereby causing the developing roller 104 to deform, thereby affecting the printing effect of the processing box 100, the processing box 100 also includes a force receiving protrusion 151. The force receiving protrusion 151 is at least arranged on one side of the frame 101 in the left and right directions. In the up and down directions, the force receiving protrusion 151 is arranged at the lower end of the frame 101. The force receiving protrusion 151 is constructed to receive a force from the outside of the processing box 100, so that the force receiving protrusion 151 drives the developing frame to move, thereby separating the developing roller 104 from the photosensitive drum 105. Therefore, when the processing box 100 is not performing a printing task, the force receiving protrusion 151 can receive the external force to separate the developing roller 104 from the photosensitive drum 105, thereby avoiding deformation caused by long-term contact between the developing roller 104 and the photosensitive drum 105.

[0059] To solve the problems existing in the prior art, the chip rack 120 is separately provided from the frame 101, and the chip rack 120 is detachably installed on the frame 101. Specifically, a positioning portion for positioning the chip rack 120 is provided on the frame 101. Preferably, the positioning portion is an elastic buckle 101a, and the structure of the elastic buckle 101a can easily and quickly disassemble and assemble the chip rack 120; optionally, the elastic buckle structure can be provided on the chip rack 120, or it can be installed by interference fit with the grooves and protrusions of the frame 101. Such connection and positioning methods are not limited, as long as they can easily and quickly install the chip rack 120.

[0060] The positioning portion of the chip rack 120 also includes a pair of mounting grooves 122 arranged in the front-to-back direction at the bottom of the chip rack 120. The mounting grooves 122 can be matched and installed on a pair of mounting protrusions 101b of the frame 101 to guide the installation of the chip rack 120 during the installation process of the chip rack 120 and to position the chip rack 120 after the installation of the chip rack 120 is completed. A limiting surface 123 is also provided at the extended end of the mounting groove 122. The limiting surface 123 is used to limit the movement of the chip rack 120 in the installation direction during the installation process of the chip rack 120, so as to position the chip rack 120 at a predetermined position, thereby ensuring the position of the chip 110.

[0061] The chip rack 120 includes a housing cavity 121 for accommodating the chip 110, and a pair of blocking protrusions 125 arranged at the upper end of the housing cavity 121 and arranged in the front-to-back direction. An exposure opening 126 toward the upper end of the processing box 100 and a mounting opening 127 toward the left end of the processing box 100 are formed between the blocking protrusions 125. When the chip 110 is installed in the housing cavity 121, the exposure opening 126 can expose the chip electrical contact surface 110a of the chip 110 to allow it to be electrically contacted with the imaging device through the exposure opening 126. When the chip 110 is installed in the chip rack 120, when viewed from top to bottom, the blocking protrusion 125 can cover a portion of the chip 110, and the two have an overlapping portion in the front-to-back direction or the left-to-right direction. Through this structure, the chip 110 can be blocked by the blocking protrusion 125, which can not only position the chip 110 in the up-and-down direction, but also prevent the chip 110 from escaping upward from the processing box 100; when the chip 110 is installed to When the chip 110 is mounted on the chip rack 120, the chip 110 can be installed on the accommodating cavity 121 along the installation opening 127, that is, the chip 110 can be installed in the accommodating cavity 121 of the chip rack 120 from left to right; further, in order to prevent the chip 110 from accidentally falling off from the installation opening 127, the chip 110 and the chip rack 120 are interference fit, that is, tight fit, so that the chip 110 will be stably mounted on the chip rack 120. Optionally, as another optional embodiment, an elastic buckle structure can also be provided on the chip rack 120, and the chip 110 is stably buckled in the chip rack 120 through the elastic buckle; the chip rack 120 also includes electrical contact guide ribs 124 respectively arranged on the front and rear sides of the accommodating cavity 121, and the electrical contact guide ribs 124 are cross-arranged with the chip 110 and extend along the front and rear direction so as to guide the electrical contacts provided in the imaging device to electrically contact the chip 110 in the processing box 100.

[0062] Example 2

[0063] like Figure 10-12 As shown, a processing box 200 in embodiment 2 of the utility model is shown. The same points as those in the above-mentioned embodiment 1 will not be repeated in this embodiment. The difference is that the structure of the chip component of the processing box 200 in this embodiment is different from that in the above-mentioned embodiment, which will be described in detail below.

[0064] The chip assembly includes a chip rack 220 and a chip 210 accommodated in a accommodating cavity 221 of the chip rack 220. The chip rack 210 is not provided with a blocking protrusion located above the accommodating cavity 221. When observed from top to bottom, the upper end of the chip 210 is completely exposed to the outside of the processing box 200 through the exposure opening 226 of the chip rack 210. In other words, in the up and down directions, the projection range of the chip 210 is completely within the projection range of the exposure opening 226. In this way, the chip 210 can be installed on the accommodating cavity 221 of the chip rack 220 from top to bottom through the exposure opening 226 without being blocked. Therefore, when the chip rack 220 is set to such a structure, the installation opening of the chip rack 220 is the exposure opening 226.

[0065] Moreover, it also includes an elastic member 240 arranged between the chip 210 and the chip frame 220. The elastic member 240 can elastically support the chip 210. When the processing box 200 is installed in the imaging device, the chip 210 can elastically contact with the electrical contacts of the imaging device under the elastic force generated by the elastic member 240. Even if the chip 210 deviates from the correct installation position in the up and down directions due to installation errors, the chip 210 can still maintain electrical contact with the electrical contacts, which improves the electrical contact stability between the chip 210 and the electrical contacts of the imaging device; preferably, the elastic member 240 is a sponge, foam, rubber, spring or other components; more preferably, the elastic member 240 is a sponge, which has the advantages of low cost, easy installation, good elasticity and the like.

[0066] Furthermore, the elastic member 240 and the chip frame 220 and the chip 210 can be connected by an adhesive portion. Specifically, the adhesive portion includes a first adhesive portion arranged between the chip frame and the elastic member and a second adhesive portion arranged between the chip frame and the chip, so as to prevent the chip 210 and the elastic member 240 from falling off the chip frame 220; preferably, the adhesive portion is a double-sided adhesive tape. On the one hand, when the manufacturer does not need to install the chip, the double-sided adhesive tape can be installed on the chip frame 220 in advance. The adhesive tape will not dry when the protective film facing the outside is not torn off, and it only needs to be torn off when the chip needs to be installed. This effectively improves production efficiency. On the other hand, it also avoids the problem that when using an adhesive portion such as glue, the glue will adhere to the electrical contact surface of the chip, resulting in the electrical contact surface of the chip being unable to make electrical contact with the electrical contacts of the imaging device.

[0067] Example 3

[0068] like Figure 13-18 As shown, a processing box 300 in embodiment 3 of the utility model is shown. The same points as those in the above-mentioned embodiments 1 and 2 in the processing box 300 will not be repeated in this embodiment. The difference is that the structure of the processing box 300 and the structure of the chip assembly in this embodiment are different from those in the above-mentioned embodiments, which will be described in detail below.

[0069] In this embodiment, the processing box 300 still includes a coupling part 307, a chip 310 (the chip 310 includes a chip electrical contact surface 310a) and an electrode 330 (the electrode 330 includes an electrode electrical contact surface 331), and its specific functions are the same as those in the above-mentioned embodiments 1-2, which will not be repeated here; the difference is that, in the left-right direction, the coupling part 307 and the chip electrical contact surface 310a of the processing box 300 are located at the right end of the frame 301, and the electrode electrical contact surface 331 is located at the left end of the frame 301, that is, in this embodiment, the chip electrical contact surface 310a and the electrode electrical contact surface 331 are located at different ends of the frame 301 in the left-right direction, and the electrode electrical contact surface 331 is arranged to face the left end of the processing box 300. The processing box 300 also includes a force receiving protrusion 350 operably connected to the developing frame, and the force receiving protrusion 350 has a force receiving surface 350a. In the left-right direction, the force receiving protrusion 350 is arranged at the right end of the frame 301, and in the up-down direction, the force receiving protrusion 350 is arranged at the lower end of the frame 301. The force receiving protrusion 350 is configured to receive external force to make the developing roller contact and separate from the photosensitive drum, so as to avoid the deformation of the developing roller after the soft developing roller contacts the photosensitive drum for a long time, thereby reducing the printing quality of the processing box 300. Specifically, when the processing box 300 does not perform a printing task, the pushing component of the imaging device can apply force to the force receiving protrusion 350, so that the force receiving protrusion 350 drives the developing frame The frame moves relative to the drum frame, thereby separating the developing roller from the photosensitive drum. It is worth mentioning that when the developing roller is in a separated state from the photosensitive drum, the pushing component of the imaging device will continue to apply force to the force receiving protrusion 350 to stably maintain the separation state of the developing roller and the photosensitive drum; when the processing box 300 needs to perform a printing task again, the pushing component of the imaging device moves, so that the pushing force applied by the pushing component is removed from the force receiving protrusion 350. At this time, the spring arranged between the developing frame and the drum frame will elastically push the developing frame, so that the developing frame moves relative to the drum frame until the developing roller supported on the developing frame is in close contact with the photosensitive drum again. At this time, the developing roller and the photosensitive drum maintain a stable contact state.

[0070] Moreover, the present embodiment also has a detachable chip rack 320 mounted on the frame 301. The chip rack 320 can be mounted on the frame 301 from right to left. The chip rack 320 can be stably positioned on the frame 301 by means of structures such as elastic buckles 301a arranged on the frame 301. This is substantially the same as the aforementioned embodiments 1-2 and will not be described in detail here. Moreover, similar to the chip rack 320 in embodiment 2, the chip rack 320 is not provided with a blocking protrusion located above the accommodating cavity 321. When viewed from top to bottom, the upper end of the chip 310 is completely exposed to the outside of the processing box 300 through the exposure opening 326 of the chip rack 310. In other words, in the up and down directions, the projection range of the chip 310 is completely within the projection range of the exposure opening 326. In this way, the chip 210 can be mounted from top to bottom on the accommodating cavity 321 of the chip rack 320 without being blocked.

[0071] The chip assembly also includes an elastic member 340 arranged between the chip 310 and the chip frame 320. The elastic member 340 can elastically support the chip 310. When the processing box 300 is installed in the imaging device, the chip 310 can elastically contact with the electrical contacts of the imaging device under the elastic force generated by the elastic member 340. Even if the chip 310 deviates from the correct installation position in the up and down directions due to installation errors, the chip 310 can still maintain electrical contact with the electrical contacts, which improves the electrical contact stability between the chip 310 and the electrical contacts of the imaging device; preferably, the elastic member 340 is a sponge, foam, rubber, spring or other components; more preferably, the elastic member 340 is a sponge, which has the advantages of low cost, easy installation, good elasticity and the like.

[0072] Furthermore, the elastic member 340 and the chip frame 320 and the chip 310 can be connected by an adhesive portion to prevent the chip 310 and the elastic member 340 from falling off the chip frame 320; preferably, the adhesive portion is a double-sided tape. On the one hand, when the manufacturer does not need to install the chip, the double-sided tape can be installed on the chip frame 320 in advance. When the protective film facing the outside is not torn off, the glue will not dry out. It only needs to be torn off when the chip needs to be installed. This effectively improves production efficiency. On the other hand, it also avoids the problem that when using an adhesive portion such as glue, the glue will adhere to the electrical contact surface of the chip, resulting in the electrical contact surface of the chip being unable to make electrical contact with the electrical contacts of the imaging device.

[0073] Example 4

[0074] like Figure 19-24 As shown, a processing box 400 in embodiment 4 of the utility model is shown. The same points as those in the above-mentioned embodiments 1-3 will not be repeated in this embodiment. The difference is that the structure of the processing box 400 and the structure of the chip assembly in this embodiment are different from those in the above-mentioned embodiments, which will be described in detail below.

[0075] In this embodiment, the processing box 400 still includes a coupling portion 407, a chip 410 (including a chip electrical contact surface 410a) and an electrode 430 (electrode electrical contact surface 431), and its specific functions are the same as those in the above-mentioned embodiments 1-3, which will not be repeated here; the difference is that in the left-right direction, the coupling portion 407 of the processing box 400 is located at the right end of the frame 401, while the chip electrical contact surface 410a and the electrode electrical contact surface 431 are located at the left end of the frame 401, that is, in this embodiment, the coupling portion 407 and the chip electrical contact surface 410a, the electrode electrical contact surface 431 are located at different ends of the frame 401 in the left-right direction, and the electrode electrical contact surface 431 is arranged to face the left end of the processing box 400; not only that, the right end of the frame 301 also includes an adjusting component 409 that is movable relative to the developing roller. During the process of installing the processing box 400 to the imaging device, the adjusting component 409 can be used to adjust the inclination angle of the drive head in the imaging device to ensure that the drive head is successfully coupled to the coupling portion 407 and receives the driving force.

[0076] Moreover, the present embodiment also has a chip rack 420 detachably mounted on the frame 401. The chip rack 420 can be mounted on the frame 401 from left to right. The chip rack 420 can be stably positioned on the frame 301 by means of an elastic buckle 401a structure arranged on the frame 401. This is substantially the same as the aforementioned embodiments 1-3 and will not be described in detail here. Furthermore, in order to ensure stable positioning, the chip rack 420 also includes at least one protrusion 429, which can be correspondingly engaged in a hole 451 formed on the frame 401. Optionally, a hole can be arranged on the chip rack 420 and a protrusion can be arranged on the frame 401. This can also achieve substantially the same technical effect of making the positioning of the chip rack 420 more stable.

[0077] Furthermore, to facilitate the installation or removal of the chip 410, the chip frame 420 of this embodiment is provided with a second elastic buckle 428, and the chip 410 is stably positioned on the chip frame 420 by the buckling of the second elastic buckle 428; of course, as another optional embodiment, the chip 410 can also be installed on the chip frame 420 by interference fit.

[0078] Example 5

[0079] like Fig.25 As shown, a processing box in Example 5 of the utility model is shown. The similarities between the processing box in this embodiment and the processing box in the above-mentioned Example 4 will not be repeated in this embodiment. The difference is that the chip component is different.

[0080] The chip assembly still includes a chip 510 and a chip rack 520. The chip rack 520 is not provided with a blocking protrusion located above the accommodating cavity 521. When observed from top to bottom, the upper end of the chip 510 is completely exposed to the outside of the processing box through the exposure opening 526 of the chip rack 510. In other words, in the up and down directions, the projection range of the chip 510 is completely within the projection range of the exposure opening 526. In this way, the chip 510 can be installed from top to bottom on the accommodating cavity 521 of the chip rack 520 without being blocked.

[0081] The chip assembly also includes an elastic member 540 arranged between the chip 510 and the chip frame 520. The elastic member 540 can elastically support the chip 510. When the processing box is installed in the imaging device, the chip 510 can elastically contact with the electrical contacts of the imaging device under the elastic force generated by the elastic member 540. Even if the chip 510 deviates from the correct installation position in the up and down directions due to installation errors, the chip 510 can still maintain electrical contact with the electrical contacts, which improves the electrical contact stability between the chip 510 and the electrical contacts of the imaging device; preferably, the elastic member 540 is a sponge, foam, rubber, spring or other components; more preferably, the elastic member 540 is a sponge, which has the advantages of low cost, easy installation, good elasticity and the like.

[0082] Furthermore, the elastic member 540 can be connected to the chip frame 520 and the chip 510 through an adhesive portion to prevent the chip 510 and the elastic member 540 from falling off the chip frame 520; preferably, the adhesive portion is a double-sided tape. On the one hand, the manufacturer can install the double-sided tape on the chip frame 520 when there is no need to install the chip. The tape will not dry out if the protective film facing the outside is not torn off, and it only needs to be torn off when the chip needs to be installed. This effectively improves production efficiency. On the other hand, it also avoids the problem that when using an adhesive portion such as glue, the glue will adhere to the electrical contact surface of the chip, resulting in the electrical contact surface of the chip being unable to make electrical contact with the electrical contacts of the imaging device.

[0083] Example 6

[0084] like Figure 26-28 As shown, a processing box in Example 6 of the utility model is shown. The similarities between the processing box in this embodiment and the processing boxes in the above-mentioned embodiments 1-5 will not be repeated in this embodiment. The unmentioned parts and differences will be described in detail below. It is worth mentioning that the chip frame structure in Example 5 will be used as an example in this embodiment, but this does not mean that the technical solution in this embodiment only involves the chip frame structure of Example 5. It should be known that the technical solution described in this embodiment is applicable to any one of the processing boxes in Examples 1-5.

[0085] The chip assembly in this embodiment includes a chip 610, a chip frame 620, an elastic member 640 and an adhesive portion 641, and their positions, structures and functions are substantially the same as those in the above-mentioned embodiments, and will not be repeated here. What is not mentioned above is that the accommodating cavity 621 of the chip frame 620 is surrounded by a supporting surface 620b for supporting the chip 610 and a plurality of ribs 620a arranged around the supporting surface 620b; the arrangement direction of the electrical contacts 110a1 of the chip 610 is defined as the left-right direction, the electrical contacts 110a1 are located at the right end of the processing box in the left-right direction, the up-down direction intersects with the left-right direction, and the direction perpendicular to the chip electrical contact surface 410a is defined as the up-down direction, and the chip electrical contact surface 610a is arranged to face the upper end of the processing box.

[0086] Further, in the up-down direction, the adhesive portion 641 (in this embodiment, specifically the adhesive portion 641 located between the chip 610 and the elastic member 640) is arranged to be located at the lower side of the upper surface 620a1 of the rib 620a at the right end of the chip frame 620, that is, the adhesive portion 641 is arranged to be lower than the upper surface 620a1 of the rib 620a. In other words, the adhesive portion 641 is arranged to be located inside the accommodating cavity 621 of the chip frame 620, so that the adhesive portion 641 is arranged not to protrude from the chip frame 620; on the one hand, After the chip 610 is installed in the chip frame 620 and adhered to the adhesive portion 641, at least a portion of the chip 610 is still located in the accommodating cavity 621 of the chip frame 620, which reduces the possibility of the chip 610 being disturbed by the outside world and can maintain a stable position in the chip frame 620; on the other hand, when using a tooling such as a chip mounting tooling to install the chip, the arrangement of the above structure can also prevent the adhesive portion 641 from adhering to the chip mounting tooling before adhering to the chip 610, making it difficult for the chip 610 to be installed.

[0087] Furthermore, an exposure groove 650 is formed on the rib 620a at the right end of the chip frame 620 at approximately the middle position in the front-to-back direction. When viewed from right to left, the protective film adhered to the adhesion portion 641 is exposed at the right end of the processing box by the exposure groove 650, and the exposure groove 650 is connected to the upper end of the exposure opening 626, so that when the operator needs to install the chip 610, he can use his fingers or tools such as tweezers to reach into the exposure groove 650 and the exposure opening 626 to tear off the protective film. In this way, tools such as fingers or tweezers have enough space to reach in, and it will be more convenient and quick to tear off the protective film; and when viewed from right to left, the chip 610 has an overlapping portion with the rib 620a at the right end. In other words, at least a portion of the chip 610 is blocked by the rib 620a, so that after the exposure groove 650 is formed on the rib 620, the rib 620a still has a limiting effect on the right end of the chip 610.

[0088] Furthermore, the exposure slot 650 has a width S in the front-to-back direction, 2mm≦S≦10mm, preferably, 2.5mm≦S≦4mm, so as to avoid the problem that when S is set too small, it is difficult for fingers or tools such as tweezers to reach into the exposure slot 650, resulting in functional failure of the exposure slot 650; and to avoid the problem that when S is set too large, the right end of the chip 610 is completely exposed to the outside of the processing box, making it impossible for the rib 620a to limit the right end of the chip 610. Therefore, the S chip rack 620 within the above range has the best use effect.

[0089] The utility model provides a processing box. On the one hand, the chip rack of the processing box is detachably mounted on a frame, so that after the printing life of the processing box is exhausted, the user can easily remove the chip rack with the chip, which is simpler and more convenient than directly removing the chip. Moreover, the removed chip can be reused, which is not only green and environmentally friendly, but also the user can purchase the processing box without the chip assembly from the manufacturer, which reduces the user's processing box use cost and the manufacturer's production cost. On the other hand, elastic parts such as sponges are arranged between the chip and the chip rack to achieve stable electrical contact with the electrical contacts of the imaging device.

Claims

1. A processing box, comprising: A frame capable of accommodating a developer, the frame having opposite left and right ends in the left-right direction; a developing roller rotatably supported on the frame; a photosensitive drum rotatably supported on the frame; A charging roller, capable of charging the photosensitive drum; a coupling protrusion disposed at the right end of the frame in the left-right direction, the coupling protrusion being capable of receiving a driving force from outside the process cartridge to drive the developing roller or the photosensitive drum to rotate; a chip having a chip electrical contact surface, wherein the chip electrical contact surface is disposed at a left end of the frame in the left-right direction; an electrode electrically connectable to the charging roller and having an electrode electrical contact surface, the electrode electrical contact surface being disposed at a left end of the frame in the left-right direction and being closer to a right end of the frame than the chip electrical contact surface; It is characterized in that the processing box also includes a chip rack for supporting the chip, and the chip rack is detachably mounted on the frame.

2. The process cartridge according to claim 1, wherein: The processing box also includes a force receiving protrusion, which is located at the lower end of the frame in the up and down direction perpendicular to the electrical contact surface of the chip. The force receiving protrusion is constructed to receive a force from outside the processing box to separate the developing roller from the photosensitive drum.

3. The process cartridge according to claim 1, wherein: The chip rack or the frame is provided with elastic buckles, and the chip rack is mounted on the frame through the elastic buckles or through interference fit.

4. The process cartridge according to claim 1, wherein: One of the chip rack and the frame is provided with a mounting protrusion, and the other is provided with a mounting groove. The mounting protrusion can be matched and inserted into the mounting groove to position and mount the chip rack on the frame.

5. The process cartridge according to claim 4, wherein: The mounting protrusion or the mounting groove extends in the left-right direction, and the chip rack can be mounted on the frame along the left-right direction.

6. The process cartridge according to claim 4, wherein: A limiting surface is disposed at an extended end of the mounting groove, and the limiting surface is used to limit a movement stroke of the chip rack in a mounting direction during the process of mounting the chip rack to the frame.

7. The process cartridge according to claim 1, wherein: The processing box further comprises an elastic member, and the elastic member is arranged between the chip and the chip frame.

8. The process cartridge according to claim 7, wherein: The elastic member is provided with a first adhesive portion and a second adhesive portion on two opposite sides thereof. The first adhesive portion can make the elastic member adhere to the chip frame, and the second adhesive portion can make the chip adhere to the elastic member.

9. The process cartridge according to claim 8, wherein: The up-down direction is perpendicular to the electrical contact surface of the chip; the chip frame includes a plurality of ribs, the plurality of ribs enclose a receiving cavity for receiving the chip, the upper end of the rib has an upper surface, and in the up-down direction, the second adhesive portion is positioned on the lower side of the upper surface of the rib.

10. The process cartridge according to claim 1, wherein: The chip rack includes a housing cavity for accommodating the chip and an exposure opening connected to the housing cavity. The chip can be installed in the housing cavity through the exposure opening and projected along the exposure direction of the exposure opening. The projection range of the chip is completely within the projection range of the exposure opening.

11. The process cartridge according to claim 1, wherein: The chip rack includes a plurality of ribs, which enclose a housing cavity for accommodating the chip and an exposure opening located outside the housing cavity. The chip can be installed in the housing cavity through the exposure opening. An exposure groove is formed on at least one of the ribs, and the exposure groove is connected to the exposure opening. The chip electrical contact surface extends in the left-right direction and the front-back direction. In the front-back direction, the exposure groove is arranged approximately in the middle of the rib.

12. The process cartridge according to claim 11, wherein: In the front-to-rear direction, the exposure groove has a width S, wherein 2 mm≦S≦10 mm.

13. The process cartridge according to claim 12, wherein: 2.5mm≦S≦4mm.

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