Micro-channel heat dissipation structure

Abstract

The utility model relates to the technical field of heat dissipation, and provides a micro-channel heat dissipation structure which comprises a substrate which is in contact with a heat source and is provided with a lower baffle plate; the layer plates are mounted on the lower baffle plates, and the layer plates, the substrate and the lower baffle plates are combined to form a plurality of lower micro-channels; the upper baffle plate is arranged on the layer plate, and the top plate is arranged on the upper baffle plate; the top plate, the upper baffle plate and the layer plate are combined to form a plurality of upper micro-channels; and the cross sectional area of the upper micro-channel is larger than that of the lower micro-channel. Spoilers are arranged in the upper micro-channel and / or the lower micro-channel, the spoilers comprise an upper spoiler and a lower spoiler, the direction of the upper spoiler is downward, and the direction of the lower spoiler is upward. According to the micro-channel heat dissipation structure, uneven temperature distribution in the micro-channel can be relieved, energy consumption is reduced, and the stability of a heat dissipation system is enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a microchannel heat dissipation structure. Background Art

[0002] With the development of microelectronics technology, the integration of chips is constantly increasing, and traditional heat dissipation methods are difficult to meet the needs. Microchannels have been widely used as an important component of heat sinks. However, the current microchannel structures are mostly single-layer designs. Although the heat conduction effect is obvious, its energy consumption is high. At the same time, the existing technology has the disadvantage of uneven temperature distribution inside the microchannel. Due to the temperature difference between different parts inside the microchannel, thermal stress is generated, which limits the application of microchannel heat sinks. Utility Model Content

[0003] The utility model provides a microchannel heat dissipation structure to reduce energy consumption and eliminate thermal stress in the microchannel while ensuring good heat conduction effect of the radiator microchannel. The specific technical solution is as follows:

[0004] A microchannel heat dissipation structure, comprising:

[0005] A substrate, the substrate is in contact with a heat source, and a lower baffle is mounted on the substrate;

[0006] A layer plate, wherein the layer plate is mounted on the lower baffle plate, and the layer plate, the substrate and the lower baffle plate are combined to form a plurality of lower microchannels;

[0007] An upper baffle plate is mounted on the upper layer plate, and a top plate is mounted on the upper baffle plate;

[0008] The top plate, the upper baffle plate and the layer plate are combined to form a plurality of upper microchannels;

[0009] The cross-sectional area of ​​the upper microfluidic channel is greater than the cross-sectional area of ​​the lower microfluidic channel.

[0010] Furthermore, the cross section of the upper microchannel is rectangular, triangular or trapezoidal.

[0011] Furthermore, the thickness of the upper baffle is greater than the thickness of the lower baffle.

[0012] Furthermore, a baffle is provided in the upper microchannel and / or the lower microchannel, and the baffle comprises an upper baffle and a lower baffle, the upper baffle is directed downward, and the lower baffle is directed upward.

[0013] Furthermore, the position of the upper spoiler plate is staggered with the position of the lower spoiler plate, and the two are not on the same vertical line.

[0014] Furthermore, the cross section of the spoiler is a right triangle.

[0015] Furthermore, the upper microchannel and / or the lower microchannel has a microchannel inlet, and the upper baffle plate and the lower baffle plate are provided at the microchannel inlet, and the fluid is blocked by the upper baffle plate and enters the microchannel inlet.

[0016] Beneficial effects:

[0017] (1) The utility model uses the upper microchannel to provide a heat dissipation buffer for the lower microchannel, so that the upper microchannel can have an auxiliary heat dissipation effect; because the cross-section of the upper channel is larger than the cross-sectional area of ​​the lower microchannel, the flow ratio of the upper and lower microchannels is changed by changing the size of the cross-sectional area, thereby adjusting the flow rate of the coolant in the lower microchannel and reducing the required pumping energy consumption; the auxiliary heat dissipation channel takes away part of the heat, thereby reducing the temperature gradient and maximum temperature value of the coolant in the lower microchannel, thereby alleviating the uneven temperature distribution in the lower microchannel, reducing energy consumption, and enhancing the stability of the heat dissipation system.

[0018] (2) The utility model designs the cross section of the upper microchannel to be triangular, and realizes a three-layer microchannel design with the height (thickness) of two layers of microchannels, thereby reducing the size of the device and having the beneficial effect of saving space.

[0019] (3) The utility model uses a baffle to block the straight-line flow of the fluid, causing the fluid to be turbulent. Due to the presence of the baffle, the fluid flow is blocked and eddies are formed, thereby integrating the fluid temperatures at different positions, that is, reducing the temperature unevenness caused by the different positions of the fluid, thereby reducing the generation of thermal stress. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of a three-dimensional structure decomposition of a microchannel heat dissipation structure in accordance with the first embodiment;

[0021] Figure 2 It is a front view of a microchannel heat dissipation structure of the second embodiment;

[0022] Figure 3 It is a front view of a microchannel heat dissipation structure of embodiment 3;

[0023] Figure 4 It is a front view of a microchannel heat dissipation structure of the fourth embodiment;

[0024] Figure 5 It is a front view of a microchannel heat dissipation structure of the fifth embodiment;

[0025] Figure 6 It is a schematic diagram of the three-dimensional structure decomposition of a microchannel heat dissipation structure of Example 6;

[0026] Figure 7 A side view of a microchannel heat dissipation structure of Example 6;

[0027] The following are the descriptions of the figures:

[0028] 1. Top plate;

[0029] 2. Laminates;

[0030] 3. Substrate;

[0031] 41. Upper baffle; 42. Lower baffle;

[0032] 51. first contact surface; 52. second contact surface;

[0033] 6. Spoiler;

[0034] 7. Microchannel inlet. DETAILED DESCRIPTION

[0035] The utility model is further described in detail below in conjunction with the embodiments.

[0036] In the following description, directional terms such as "up", "down", "left", and "right" are used. It should be understood that these directional terms are with respect to the directions shown in the drawings, and the terms are used for convenience of description rather than to limit the present disclosure.

[0037] Embodiment 1:

[0038] like Figure 1 The utility model provides a microchannel heat dissipation structure, which includes a top plate 1, a layer plate 2, and a substrate 3. The substrate 3 is in contact with the chip heat source. Several lower baffles 42 are installed on the substrate 3. The layer plate 2 is installed above the lower baffle 42. The layer plate 2, the substrate 3, and the lower baffle 42 are combined to form several microchannels, namely, lower microchannels. The lower microchannels are close to the chip heat source as the main heat dissipation channels. The multiple microchannels have the same structure and are evenly arranged at a certain interval. The width of a single channel of the lower microchannel is 0.2mm, the height is 1mm, and the thickness of the lower baffle 42 is 0.4mm.

[0039] A plurality of upper baffles 41 are installed above the layer plate 2, and the top plate 1 covers the upper baffles 41. The top plate 1, the upper baffles 41 and the layer plate 2 are combined together to form a plurality of microfluidic channels, namely, upper microfluidic channels;

[0040] The upper microchannel is separated from the lower microchannel by a layer plate 2 as an auxiliary heat dissipation channel. The layer plate 2 is 1.5 mm thick. The channel distribution is similar to that of the lower microchannel. A single channel is 0.7 mm wide and 2 mm high. The upper baffle 41 is 1.4 mm thick. The top of the upper microchannel is separated from the outside world by a top plate 1.

[0041] The size of the microchannel can be adjusted by adjusting the thickness of the upper baffle 41, the lower baffle 42, the substrate 3, the layer plate 2 and other components. At the same time, the heat transfer effects brought about by the different thicknesses of the components are also different. In this example, the lower baffle 42 is 0.4 mm thick and the upper baffle 41 is 1.4 mm thick. The lower microchannel is closest to the heat source and serves as a direct heat dissipation. The thinner thickness of the lower baffle 42 is beneficial to improving the heat transfer efficiency between different lower microchannels. The upper microchannel is auxiliary and needs to solve the problem of uneven temperature of the lower microchannel. Therefore, the upper baffle 41 can be relatively thicker.

[0042] Embodiment 2:

[0043] The utility model provides a microfluidic heat dissipation structure, which includes a top plate 1, a layer plate 2, and a substrate 3. The substrate 3 is in contact with a chip heat source. Several lower baffles 42 are installed on the substrate 3. The layer plate 2 is installed above the lower baffle 42. The layer plate 2, the substrate 3, and the lower baffle 42 are combined to form several microfluidic channels, namely, lower microfluidic channels; the lower microfluidic channels are closely attached to the chip heat source as the main heat dissipation channels, and the multiple microfluidic channels have the same structure and are evenly arranged at certain intervals. Several upper baffles 41 are installed above the layer plate 2, the top plate 1 covers the upper baffle 41, and the top plate 1, the upper baffle 41, and the layer plate 2 are combined to form several microfluidic channels, namely, upper microfluidic channels; the upper microfluidic channels are separated from the lower microfluidic channels by the layer plate 2 as auxiliary heat dissipation channels, and the channel distribution is similar to that of the lower microfluidic channels. The top of the upper microfluidic channels is separated from the outside world by the top plate 1.

[0044] like Figure 2 As shown, in this embodiment, the cross-sectional area of ​​the lower microchannel should be smaller than the cross-sectional area of ​​the upper microchannel. Specifically:

[0045] The cross-sectional height of the upper microchannel (i.e., the height of the upper baffle 41) is greater than the cross-sectional height of the lower microchannel (i.e., the height of the lower baffle 42); two adjacent upper baffles 41 are connected to the layer plate 2 to form a first contact surface 5, and similarly, two adjacent lower baffles 42 are connected to the layer plate 2 to form a second contact surface 52; the cross-sectional width of the upper microchannel (i.e., the width of the first contact surface 51) is greater than the cross-sectional width of the lower microchannel (i.e., the width of the second contact surface 52), specifically, the cross-sectional width value of one upper microchannel is equal to the cross-sectional width value of two lower microchannels.

[0046] Embodiment three:

[0047] The utility model provides a microfluidic heat dissipation structure, which includes a top plate 1, a layer plate 2, and a substrate 3. The substrate 3 is in contact with a chip heat source. Several lower baffles 42 are installed on the substrate 3. The layer plate 2 is installed above the lower baffle 42. The layer plate 2, the substrate 3, and the lower baffle 42 are combined to form several microfluidic channels, namely, lower microfluidic channels; the lower microfluidic channels are closely attached to the chip heat source as the main heat dissipation channels, and the multiple microfluidic channels have the same structure and are evenly arranged at certain intervals. Several upper baffles 41 are installed above the layer plate 2, the top plate 1 covers the upper baffle 41, and the top plate 1, the upper baffle 41, and the layer plate 2 are combined to form several microfluidic channels, namely, upper microfluidic channels; the upper microfluidic channels are separated from the lower microfluidic channels by the layer plate 2 as auxiliary heat dissipation channels, and the channel distribution is similar to that of the lower microfluidic channels. The top of the upper microfluidic channels is separated from the outside world by the top plate 1.

[0048] like Figure 3 As shown, in this embodiment, the cross-sectional area of ​​the lower microchannel should be smaller than the cross-sectional area of ​​the upper microchannel. Specifically:

[0049] The cross-sectional height of the upper microchannel (i.e., the height of the upper baffle 41) is equal to the cross-sectional height of the lower microchannel (i.e., the height of the lower baffle 42); two adjacent upper baffles 41 are connected to the layer plate 2 to form a first contact surface 5, and similarly, two adjacent lower baffles 42 are connected to the layer plate 2 to form a second contact surface 52; the cross-sectional width of the upper microchannel (i.e., the width of the first contact surface 51) is greater than the cross-sectional width of the lower microchannel (i.e., the width of the second contact surface 52), specifically, the cross-sectional width value of one upper microchannel is equal to the cross-sectional width value of four lower microchannels.

[0050] Embodiment 4:

[0051] The utility model provides a microfluidic heat dissipation structure, which includes a top plate 1, a layer plate 2, and a substrate 3. The substrate 3 is in contact with a chip heat source. Several lower baffles 42 are installed on the substrate 3. The layer plate 2 is installed above the lower baffle 42. The layer plate 2, the substrate 3, and the lower baffle 42 are combined to form several microfluidic channels, namely, lower microfluidic channels; the lower microfluidic channels are closely attached to the chip heat source as the main heat dissipation channels, and the multiple microfluidic channels have the same structure and are evenly arranged at certain intervals. Several upper baffles 41 are installed above the layer plate 2, the top plate 1 covers the upper baffle 41, and the top plate 1, the upper baffle 41, and the layer plate 2 are combined to form several microfluidic channels, namely, upper microfluidic channels; the upper microfluidic channels are separated from the lower microfluidic channels by the layer plate 2 as auxiliary heat dissipation channels, and the channel distribution is similar to that of the lower microfluidic channels. The top of the upper microfluidic channels is separated from the outside world by the top plate 1.

[0052] like Figure 4 As shown, in this embodiment, the cross-sectional area of ​​the lower microchannel should be smaller than the cross-sectional area of ​​the upper microchannel. Specifically:

[0053] The cross section of the upper microchannel is triangular, and the upper baffles 41 are interconnected, and the whole looks like a wavy curve. The intersections between different upper baffles 41 are also the intersections between the upper baffles 41 and the top plate 1 or the intersections between the upper baffles 41 and the layer plate 2; therefore, the cross section of the upper microchannel is triangular, and this triangular cross section can be divided into: an upright triangular cross section and an inverted triangular cross section. The former has a first contact surface 5 and its triangular vertex intersects with the top plate 1, and the latter does not have a first contact surface 5 and its triangular vertex intersects with the layer plate 2; this essentially divides the upper microchannel into two layers. This embodiment designs the cross section of the upper microchannel to be a triangle, thereby achieving a three-layer microchannel design with the height (thickness) of two layers of microchannels, thereby reducing the size of the equipment.

[0054] The cross-sectional height of the upper microfluidic channel is equal to the cross-sectional height of the lower microfluidic channel;

[0055] Two adjacent upper baffles 41 are connected to the layer plate 2 to form a first contact surface 5. Similarly, two adjacent lower baffles 42 are connected to the layer plate 2 to form a second contact surface 52. The cross-sectional width of the upper microfluidic channel (i.e., the width of the first contact surface 51) is greater than the cross-sectional width of the lower microfluidic channel (i.e., the width of the second contact surface 52). Specifically, the cross-sectional width value of one upper microfluidic channel is equal to the cross-sectional width value of two or four lower microfluidic channels.

[0056] Embodiment five:

[0057] The utility model provides a microfluidic heat dissipation structure, which includes a top plate 1, a layer plate 2, and a substrate 3. The substrate 3 is in contact with a chip heat source. Several lower baffles 42 are installed on the substrate 3. The layer plate 2 is installed above the lower baffle 42. The layer plate 2, the substrate 3, and the lower baffle 42 are combined to form several microfluidic channels, namely, lower microfluidic channels; the lower microfluidic channels are closely attached to the chip heat source as the main heat dissipation channels, and the multiple microfluidic channels have the same structure and are evenly arranged at certain intervals. Several upper baffles 41 are installed above the layer plate 2, the top plate 1 covers the upper baffle 41, and the top plate 1, the upper baffle 41, and the layer plate 2 are combined to form several microfluidic channels, namely, upper microfluidic channels; the upper microfluidic channels are separated from the lower microfluidic channels by the layer plate 2 as auxiliary heat dissipation channels, and the channel distribution is similar to that of the lower microfluidic channels. The top of the upper microfluidic channels is separated from the outside world by the top plate 1.

[0058] like Figure 5 As shown, in this embodiment, the cross-sectional area of ​​the lower microchannel should be smaller than the cross-sectional area of ​​the upper microchannel. Specifically:

[0059] The cross section of some upper microfluidic channels is triangular, and the cross section of some upper microfluidic channels is trapezoidal;

[0060] The cross section of the upper microchannel is triangular, and the triangular cross section can be divided into: an upright triangular cross section and an inverted triangular cross section. The former has a first contact surface 5 and its triangular vertex intersects with the top plate 1, and the latter does not have the first contact surface 5 and its triangular vertex intersects with the layer plate 2;

[0061] The cross-sectional height of the upper microfluidic channel is smaller than the cross-sectional height of the lower microfluidic channel;

[0062] Two adjacent upper baffles 41 are connected to the layer plate 2 to form a first contact surface 5. Similarly, two adjacent lower baffles 42 are connected to the layer plate 2 to form a second contact surface 52. The cross-sectional width of the upper microfluidic channel (i.e., the width of the first contact surface 51) is greater than the cross-sectional width of the lower microfluidic channel (i.e., the width of the second contact surface 52). Specifically, the cross-sectional width value of one upper microfluidic channel is equal to the cross-sectional width value of six or eight lower microfluidic channels.

[0063] Embodiment six:

[0064] The utility model provides a microfluidic heat dissipation structure, which includes a top plate 1, a layer plate 2, and a substrate 3. The substrate 3 is in contact with a chip heat source. Several lower baffles 42 are installed on the substrate 3. The layer plate 2 is installed above the lower baffle 42. The layer plate 2, the substrate 3, and the lower baffle 42 are combined to form several microfluidic channels, namely, lower microfluidic channels; the lower microfluidic channels are closely attached to the chip heat source as the main heat dissipation channels, and the multiple microfluidic channels have the same structure and are evenly arranged at certain intervals. Several upper baffles 41 are installed above the layer plate 2, the top plate 1 covers the upper baffle 41, and the top plate 1, the upper baffle 41, and the layer plate 2 are combined to form several microfluidic channels, namely, upper microfluidic channels; the upper microfluidic channels are separated from the lower microfluidic channels by the layer plate 2 as auxiliary heat dissipation channels, and the channel distribution is similar to that of the lower microfluidic channels. The top of the upper microfluidic channels is separated from the outside world by the top plate 1.

[0065] like Figure 6 , Figure 7 As shown, in this embodiment, baffles 6 are provided in the upper microchannel and the lower microchannel.

[0066] The spoiler 6 is divided into an upper spoiler and a lower spoiler. The spoiler 6 blocks the straight flow of the fluid and makes the fluid turbulent. Due to the existence of the spoiler 6, the fluid flow is blocked and eddies are formed, thereby integrating the fluid temperature at different positions, that is, reducing the temperature unevenness caused by the different positions of the fluid, thereby reducing the generation of thermal stress. Specifically:

[0067] In the upper microfluidic channel, the upper baffle is installed on the top plate 1, with its direction facing downward, so as to block the straight flow of the upper fluid in the upper microfluidic channel; the lower baffle is installed on the layer plate 2, with its direction facing upward, so as to block the straight flow of the lower fluid in the upper microfluidic channel; the positions of the upper baffle and the lower baffle are staggered and not on the same vertical line.

[0068] In the lower microfluidic channel, the upper baffle is installed on the layer plate 2, with its direction facing downward, so as to block the straight flow of the upper fluid in the lower microfluidic channel; the lower baffle is installed on the substrate 3, with its direction facing upward, so as to block the straight flow of the lower fluid in the lower microfluidic channel; the positions of the upper baffle and the lower baffle are staggered and not on the same vertical line.

[0069] Furthermore, the cross section of the baffle 6 is a right triangle, and the first side of the baffle 6 that the fluid contacts when it flows into the microchannel is the side where the hypotenuse of the right triangle is located. The effect of such a design is to further block the flow of the fluid and increase the turbulence effect. Of course, the sizes of the baffles 6 in the upper microchannel and the lower microchannel can be different, for example, the size of the baffle 6 in the upper microchannel is larger than the size of the baffle 6 in the lower microchannel.

[0070] Furthermore, the positional spacing between different upper baffles in the upper microchannel is greater than the positional spacing between different upper baffles in the lower microchannel; the positional spacing between different lower baffles in the upper microchannel is greater than the positional spacing between different lower baffles in the lower microchannel.

[0071] Furthermore, at the entrance of the fluid into the upper microchannel and / or the lower microchannel, i.e., the microchannel inlet 7, the corresponding baffle 6 should first be set as an upper baffle. This is because the fluid has just entered the microchannel and its own temperature is relatively low and suitable for absorbing heat. At the same time, in terms of the vertical direction, the heat transfer direction is from bottom to top. Therefore, the fluid should first flow in the lower layer of the microchannel. Accordingly, an upper baffle is first set at the microchannel inlet 7 to block the fluid from flowing in the upper layer of the microchannel, i.e., to guide the fluid to flow to the lower layer of the microchannel. After the fluid flows through the lower layer of the microchannel and absorbs heat, a lower baffle is set to guide the fluid to flow to the upper layer of the microchannel, carry the heat from the lower layer to the upper layer, and transfer it out through heat. After the heat is transferred out, an upper baffle is set to guide the fluid to flow to the lower layer of the microchannel to reabsorb the heat, and this cycle is repeated.

[0072] Although the present invention is described herein with reference to the illustrative embodiments of the present invention, the above embodiments are merely preferred embodiments of the present invention, and the embodiments of the present invention are not limited to the above embodiments. It should be understood that those skilled in the art can design many other modifications and implementations, which will fall within the scope and spirit of the principles disclosed in this application.

Claims

1. A microchannel heat dissipation structure, characterized in that: include: A substrate, the substrate is in contact with a heat source, and a lower baffle is mounted on the substrate; A layer plate, wherein the layer plate is mounted on the lower baffle plate, and the layer plate, the substrate and the lower baffle plate are combined to form a plurality of lower microchannels; An upper baffle plate is mounted on the upper layer plate, and a top plate is mounted on the upper baffle plate; The top plate, the upper baffle plate and the layer plate are combined to form a plurality of upper microchannels; The cross-sectional area of ​​the upper microfluidic channel is greater than the cross-sectional area of ​​the lower microfluidic channel.

2. A microchannel heat dissipation structure according to claim 1, characterized in that: The cross section of the upper microfluidic channel is rectangular, triangular or trapezoidal.

3. The microchannel heat dissipation structure according to claim 1, characterized in that: The thickness of the upper baffle is greater than the thickness of the lower baffle.

4. The microchannel heat dissipation structure according to claim 1, characterized in that: A baffle is provided in the upper microfluidic channel and / or the lower microfluidic channel. The baffle comprises an upper baffle and a lower baffle. The upper baffle faces downward, and the lower baffle faces upward.

5. The microchannel heat dissipation structure according to claim 4, characterized in that: The position of the upper spoiler is staggered with the position of the lower spoiler, and the two are not on the same vertical line.

6. The microchannel heat dissipation structure according to claim 4, characterized in that: The cross section of the spoiler is a right triangle.

7. The microchannel heat dissipation structure according to claim 4, characterized in that: The upper microchannel and / or the lower microchannel has a microchannel inlet, and the upper baffle plate and the lower baffle plate are arranged at the microchannel inlet. The fluid is blocked by the upper baffle plate and enters the microchannel inlet.

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