Power module

Abstract

The utility model discloses a power module. The power module comprises a substrate; a plurality of power units; an insulating layer is arranged between the power units and the substrate, the substrate comprises a plurality of locking parts, a first side edge of the substrate is provided with a first locking part, a second side edge of the substrate is provided with a second locking part, each power unit comprises a power device, a plastic package body, a first power end, a second power end and a signal end, and at least two power units form a power unit group. The plurality of power unit groups are divided into two rows, the first power end of the power unit close to the middle of the first row is located on one side of the plastic package body and faces the first locking part, and the second power end of the power unit close to the middle of the second row is located on the other side of the plastic package body and faces the second locking part; the signal end is perpendicular to the upper surface of the plastic package body and is located on one side of the first power end. The power module has the advantages of small size, high reliability and strong heat dissipation capability, and can meet the requirements of various application scenes.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and more specifically, to a power module. Background Art

[0002] Power modules integrate power electronic devices such as metal oxide semiconductor field effect transistors (MOS), SiC (silicon carbide) metal oxide semiconductor field effect transistors, insulated gate bipolar transistors (IGBT), fast recovery diodes (FRD), etc. Due to their high integration and high reliability, power modules have won an increasingly large market in electric vehicles, photovoltaic power generation, wind power generation, industrial frequency conversion, etc. With the rapid development and popularization of new energy vehicles, it is necessary to develop power modules with higher reliability, higher heat dissipation capacity and higher power density in response to market demand.

[0003] Therefore, there is an urgent need for a power module with higher reliability, stronger heat dissipation capability, smaller size and higher power density to meet market demand. Utility Model Content

[0004] In view of this, the utility model provides a power module, which realizes the requirements of small size, high reliability and high heat dissipation capability.

[0005] To achieve this purpose, the utility model adopts the following technical solutions: a power module is provided, comprising: a substrate; a plurality of power units; the power unit is located on the first surface of the substrate; an insulating layer is also arranged between the power unit and the substrate; the substrate comprises a plurality of locking parts, wherein the first side edge of the substrate is provided with a first locking part, the second side edge of the substrate is provided with a second locking part, the first side edge is arranged opposite to the second side edge, the power unit comprises a power device, a plastic encapsulation body of the plastic encapsulated power device, a first power end, a second power end and a signal end, at least two power units constitute a power unit group, and a plurality of power unit groups are divided into two rows, wherein the first power end of the power unit close to the middle of the first row is located on one side of the plastic encapsulation body and faces the first locking part, the second power end of the power unit close to the middle of the second row is located on the other side of the plastic encapsulation body and faces the second locking part, and the signal end is perpendicular to the upper surface of the plastic encapsulation body and is located on one side of the first power end.

[0006] Optionally, the first locking portion and the second locking portion have different widths.

[0007] Optionally, it further includes a third locking portion, a fourth locking portion and a positioning hole, the positioning hole is located at the third locking portion and the fourth locking portion, the third locking portion is located at both sides of the first locking portion, and the fourth locking portion is located at both sides of the second locking portion.

[0008] Optionally, the power device includes a SIC MOS, the first power terminal is a source, the second power terminal is a drain, and the signal terminal includes a Kelvin pin and a gate, wherein the Kelvin pin is close to the source.

[0009] Optionally, the power device includes an IGBT, the first power end is an emitter, the second power end is a collector, and the signal end includes a Kelvin pin and a gate, wherein the Kelvin pin is close to the emitter.

[0010] Optionally, the first locking portion corresponds to the second locking portion, and a center of a locking hole of the first locking portion and a center of a locking hole of the second locking portion are located on a straight line.

[0011] Optionally, each of the first locking portion and the second locking portion comprises one.

[0012] Optionally, the first locking portion and the second locking portion each include two.

[0013] Optionally, the first locking portion includes one and the second locking portion includes two.

[0014] Optionally, the first locking portion includes two and the second locking portion includes one.

[0015] Optionally, a width of the second locking portion is smaller than a width of the first locking portion.

[0016] Optionally, the insulating layer covers the first surface and at least a portion of the side surfaces of the substrate.

[0017] Optionally, the insulating layer also covers side surfaces of the first locking portion and / or the second locking portion.

[0018] Optionally, every two power units form a power unit group, there is a gap between each power unit group, and the multiple power unit groups are arranged in two rows along the first side and the second side respectively.

[0019] Optionally, every three power units form a power unit group, there is a gap between each power unit group, and the multiple power unit groups are arranged in two rows along the first side and the second side respectively.

[0020] Optionally, every four power units form a power unit group, there is a gap between each power unit group, and the multiple power unit groups are arranged in two rows along the first side and the second side respectively.

[0021] Optionally, the length of the substrate is positively correlated with the thickness of the substrate, and the thickness of the substrate is 3 mm to 4 mm.

[0022] Optionally, the width of the substrate is 100 mm to 105 mm.

[0023] Optionally, the first surface of the insulating layer has a boss corresponding to the second power end, and the height of the boss is lower than the bottom surface of the second power end.

[0024] Optionally, the length of the boss is greater than or equal to the overall length of the power end.

[0025] Optionally, it further includes heat dissipation fins, which are located on the second surface of the substrate, and the heat dissipation fins include any one of cylindrical, elliptical, and prismatic protrusions.

[0026] Optionally, the heat dissipation fins include at least two groups, and the two groups of heat dissipation fins correspond to two rows of power unit groups respectively.

[0027] Optionally, the length of the substrate is 145mm to 160mm, the width of the first locking portion is greater than 10mm and less than or equal to 14mm, the width of the second locking portion is 8mm to 10mm, the spacing between adjacent first locking portions is 45mm to 55mm, the spacing between adjacent second locking portions is 50mm to 60mm, and the distance between the first locking portion and the adjacent third locking portion is 40mm to 50mm.

[0028] Optionally, the length of the substrate is 210mm~230mm, the width of the first locking part is 11mm~13mm, the width of the second locking part is 9mm~10mm, the spacing between adjacent first locking parts is 50mm~55mm, the spacing between adjacent second locking parts is 50mm~60mm, and the distance between the first locking part and the adjacent third locking part is 40mm~45mm.

[0029] Optionally, the length of the substrate is 260mm~280mm, the width of the first locking part is 11mm~13mm, the width of the second locking part is 9mm~10mm, the spacing between adjacent first locking parts is 70mm~75mm, the spacing between adjacent second locking parts is 70mm~80mm, and the distance between the first locking part and the adjacent third locking part is 60mm~65mm.

[0030] The beneficial technical effect of the utility model is that the locking parts on both sides of the substrate of the power module of the utility model have different widths and gaps, which makes the power module shorter in length and smaller in volume, thereby improving power density and saving costs; further, the insulating layer covers the surface and side of the substrate, which can obtain better insulation effect and improve the reliability of the power module; the other side surface of the substrate is also provided with heat dissipation fins, which further increases the heat dissipation area and improves the heat dissipation capacity.

[0031] The power module combines small size, high reliability and strong heat dissipation capability, and can meet the needs of various application scenarios such as electric or hybrid vehicles, photovoltaic power generation, wind power generation, industrial frequency conversion, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other purposes, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0033] Figure 1 It is a three-dimensional schematic diagram of a power module of the first embodiment of the utility model;

[0034] Figure 2 is a schematic diagram of a power unit of a power module of the first embodiment of the utility model;

[0035] Figure 3 This is a front view of a power module according to the first embodiment of the present utility model;

[0036] Figure 4 It is a left side view of the power module of the first embodiment of the utility model;

[0037] Figure 5 is a top view of a power module according to a first embodiment of the present utility model;

[0038] Figure 6 is a bottom view of the power module of the first embodiment of the utility model;

[0039] Figure 7 is a schematic diagram of a power module according to a second embodiment of the present utility model;

[0040] Figure 8 It is a schematic diagram of a power module according to the third embodiment of the present utility model. DETAILED DESCRIPTION

[0041] The present invention is described below based on embodiments, but the present invention is not limited to these embodiments. In the detailed description of the present invention below, some specific details are described in detail. For those skilled in the art, the present invention can be fully understood without the description of these details. In order to avoid confusing the essence of the present invention, well-known methods, processes, procedures, and components are not described in detail.

[0042] In the description of the present invention, it is necessary to understand that the orientation or position relationship indicated by the terms such as "upper", "lower", "left", "right", "inside", "outside", "horizontal" and "longitudinal" is based on the orientation or position relationship shown in the corresponding drawings. It is for the convenience of describing the shape, position and connection relationship of each component in the present invention, rather than indicating or implying that the components must be located in a specific orientation and morphological structure in the whole, and should not be understood as a limitation on the present invention.

[0043] Figure 1 It is a three-dimensional schematic diagram of a power module of the first embodiment of the utility model, and the power module of the first embodiment includes: a substrate 100, a power unit 200, a first locking portion 110, a second locking portion 120, an insulating layer 130 and a heat sink fin 140 (not shown in the figure). Among them, the substrate 100 is a heat dissipation substrate, having a first surface and a second surface opposite to each other, and a plurality of power units 200 are arranged on the first surface thereof, at least two power units 200 form a power unit group, and the plurality of power unit groups are divided into two rows, wherein the first power end 220 of the power unit 200 close to the middle of the first row is located on one side of the plastic package 210 and faces the first locking portion 110, and the second power end 230 of the power unit 200 close to the middle of the second row is located on the other side of the plastic package 210 and faces the second locking portion 120, and the signal end 240 is perpendicular to the upper surface of the plastic package 210 and is located on one side of the first power end 220.

[0044] The second surface of the substrate 100 is provided with heat dissipation fins 140, the first side of the substrate 100 is provided with a first locking portion 110, and the second side opposite to the first side is provided with a second locking portion 120, the widths of the first locking portion 110 and the second locking portion 120 are different, the width of the first locking portion 110 is greater than the width of the second locking portion 120, and correspondingly, the gap between adjacent first locking portions 110 and the gap between adjacent second locking portions 120 are also different, the first locking portion 110 is provided with a third locking portion 111 on both sides, and the second locking portion 120 is provided with a fourth locking portion 121 on both sides, and the third locking portion 111 and the fourth locking portion 121 are, for example, located at the four corners of the substrate 100. Specifically, as Figure 1As shown, the first locking portion 110 and the second locking portion 120 each include two, for example, and in this embodiment, a total of 12 array-arranged power units 200 are included. Specifically, the power units 200 are arranged in a 2*2*3 array, that is, every two power units 200 form a power unit group, which is divided into two rows, upper and lower, and three groups in each row are arranged along the first side and the second side, respectively. The insulating layer 130, for example, covers the first surface and at least part of the side of the substrate 100, and forms corresponding isolation side walls on the first locking portion 110 and / or the second locking portion 120, respectively, to better isolate the locking portion from the power terminal of the power unit 200, and at the same time, the peripheral components connected to the power terminal are electrically isolated from the power terminal, thereby improving the reliability of the product. In other embodiments, for example, there may be only one first locking portion 110, and there may be only one second locking portion 120, for example, and the present application does not limit the number of the first locking portion and the second locking portion 120.

[0045] Figure 2 A schematic diagram of a power unit of a power module of a first embodiment of the utility model is shown, wherein the power unit 200 includes a power device, a plastic package 210, a first power terminal 220, a second power terminal 230 and a signal terminal 240, wherein the plastic package 210 is, for example, rectangular, and contains a power device, and the power device includes, for example, a SIC MOS (silicon carbide metal-oxide semiconductor field effect transistor), an IGBT (insulated gate bipolar transistor), etc.; the first power terminal 220 and the second power terminal 230 are respectively arranged on the first side and the second side of the plastic package 210; the signal terminal 240 is, for example, arranged on the first side of the plastic package 210 like the first power terminal 220, and the signal terminal 240 is, for example, located at one end of the first power terminal 220 (for example Figure 2 ), the signal terminal 240 includes, for example, a Kelvin pin 241 and a gate 242. Specifically, the Kelvin pin 241 is close to the first power terminal 220, and the gate 242 is far away from the first power terminal 220. The lower surface of the second power terminal 230 is higher than the lower surface of the first power terminal 220. When the power device is a SIC MOS, the first power terminal 220 is a source, and the second power terminal 230 is a drain; when the power device is an IGBT, the first power terminal 220 is an emitter, and the second power terminal 230 is a collector.

[0046] Figure 3 and Figure 4 The front view and the left view of the power module are shown respectively. It can be seen from the figure that the second surface of the substrate 100 is provided with a heat dissipation fin 140. Specifically, as shown in FIG. Figure 4As shown, in this embodiment, the heat sink fins 140 are also divided into two groups, and the two groups of heat sink fins 140 correspond to the two rows of power unit groups respectively. The first power end 220 and the second power end 230 of the upper and lower rows of power units 200 are connected by laser welding. The second power end 230 of the power unit 200 has an upwardly convex bending design, see Figure 5 As shown in the top view, the insulating layer 130 also has a boss 150 corresponding to the second power terminal 230. The boss 150 is, for example, disposed laterally below the second power terminal 230. The top surface of the boss 150 is lower than the bottom surface of the second power terminal 230, providing support therefor to prevent the first power terminal 220 and the second power terminal 230 from not fitting together and causing a large gap during laser welding, thereby affecting the laser welding effect. The length of the boss 150 is greater than or equal to the overall length of the power terminal. The center of the lock hole of the first locking portion 110 on the first side of the substrate 100 and the center of the lock hole of the second locking portion 120 on the second side are located on a straight line (as shown by the dotted line in the figure). The length of the substrate 100 is 145 mm to 160 mm, and the width of the substrate 100 is 100 mm to 105 mm. The width d1 of the first locking portion 110 is greater than 10 mm and less than or equal to 14 mm, the width d2 of the second locking portion 120 is 8 mm to 10 mm, the spacing d3 between adjacent first locking portions 110 is 45 mm to 55 mm, the spacing d4 between adjacent second locking portions 120 is 50 mm to 60 mm, and the spacing d5 between the first locking portion 110 and the adjacent third locking portion 111 is 40 mm to 50 mm.

[0047] Figure 6 The top view of the power module is shown, from which it can be seen that the heat sink fins 140 are divided into two groups, upper and lower. Of course, the heat sink fins 140 can also be divided into more groups. The heat sink fins 140 include any one of cylindrical, elliptical, and prismatic protrusions to increase the heat dissipation area. The second power end 230 of some power units 200 extends from the second side of the substrate 100.

[0048] Figure 7 and Figure 8 Schematic diagrams of the second embodiment and the third embodiment of the power module are shown respectively. Figure 7As shown, in the second embodiment, there are 18 power units 200 on the substrate 100, and every 3 power units 200 form a power unit group. There is a gap between each group, and three groups are respectively arranged on the first side and the second side of the substrate 100. The length of the substrate 100 is 210mm-230mm, the width of the substrate 100 is 100mm-105mm, the width of the first locking portion 110 is 11mm-13mm, the width of the second locking portion 120 is 9mm-10mm, the spacing between adjacent first locking portions 110 is 50mm-55mm, the spacing between adjacent second locking portions 120 is 50mm-60mm, and the distance between the first locking portion 110 and the adjacent third locking portion 111 is 40mm-45mm.

[0049] like Figure 8 In the third embodiment shown, there are 24 power units 200 on the substrate 100, and every 4 power units 200 form a power unit group. There is a gap between each group, and three groups are respectively provided on the first side and the second side of the substrate 100. The length of the substrate 100 is 260mm-280mm, the width of the substrate 100 is 100mm-105mm, the width of the first locking portion 110 is 11mm-13mm, the width of the second locking portion 120 is 9mm-10mm, the spacing between adjacent first locking portions 110 is 70mm-75mm, the spacing between adjacent second locking portions 120 is 70mm-80mm, and the distance between the first locking portion 110 and the adjacent third locking portion 111 is 60mm-65mm.

[0050] Furthermore, the length of the substrate 100 is proportional to the thickness of the substrate 100 , and the thickness of the substrate 100 is, for example, 3 mm to 4 mm.

[0051] The beneficial technical effect of the utility model is that the locking parts on both sides of the substrate of the power module of the utility model have different widths and gaps, which makes the power module shorter in length and smaller in volume, thereby improving power density and saving costs; further, the insulating layer covers the surface and side of the substrate, which can obtain better insulation effect and improve the reliability of the power module; the other side surface of the substrate is also provided with heat dissipation fins, which further increases the heat dissipation area and improves the heat dissipation capacity.

[0052] The power module combines small size, high reliability and strong heat dissipation capability, and can meet the needs of various application scenarios such as electric or hybrid vehicles, photovoltaic power generation, wind power generation, industrial frequency conversion, etc.

[0053] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0054] At the same time, it should be understood that example embodiments are provided so that the present disclosure is comprehensive and its scope is fully conveyed to those skilled in the art. Many specific details (such as examples of specific components, devices and methods) are given to provide a comprehensive understanding of the present disclosure. It will be understood by those skilled in the art that specific details need not be adopted, that example embodiments can be implemented in many different forms, and that example embodiments should not be construed as limiting the scope of the present disclosure. In some example embodiments, well-known device structures and well-known technologies are not described in detail.

[0055] When an element or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another element or layer, it may be directly on, directly engaged to, connected to, or coupled to another element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly" "on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any or all combinations of one or more of the associated listed items.

[0056] Although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another element, region, layer or section. Terms such as "first", "second" and other numerical terms do not mean order or sequence when used here, unless the context clearly indicates. Thus, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section, without departing from the teaching of the exemplary embodiment. In addition, in the description of the utility model, unless otherwise stated, the meaning of "multiple" is two or more.

[0057] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. For those skilled in the art, the utility model may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A power module, characterized in that: include: substrate; A plurality of power units; the power units are located on the first surface of the substrate; An insulating layer is also provided between the power unit and the substrate; The substrate includes a plurality of locking parts, wherein a first locking part is provided on a first side of the substrate, a second locking part is provided on a second side of the substrate, the first side is arranged opposite to the second side, the power unit includes a power device, a plastic package of the plastic package power device, a first power end, a second power end and a signal end, at least two power units constitute a power unit group, and a plurality of power unit groups are divided into two rows, wherein the first power end of the power unit close to the middle of the first row is located on one side of the plastic package and faces the first locking part, the second power end of the power unit close to the middle of the second row is located on the other side of the plastic package and faces the second locking part, and the signal end is perpendicular to the upper surface of the plastic package and located on one side of the first power end.

2. The power module according to claim 1, characterized in that: The first locking portion and the second locking portion have different widths.

3. The power module according to claim 1, characterized in that: It also includes a third locking portion, a fourth locking portion and a positioning hole, wherein the positioning hole is located at the third locking portion and the fourth locking portion, the third locking portion is located at both sides of the first locking portion, and the fourth locking portion is located at both sides of the second locking portion.

4. The power module according to claim 1, characterized in that: The power device comprises a SIC MOS, the first power terminal is a source, the second power terminal is a drain, and the signal terminal comprises a Kelvin pin and a gate, wherein the Kelvin pin is close to the source.

5. The power module according to claim 1, characterized in that: The power device includes an IGBT, the first power end is an emitter, the second power end is a collector, and the signal end includes a Kelvin pin and a gate, wherein the Kelvin pin is close to the emitter.

6. The power module according to claim 1, characterized in that: The first locking portion corresponds to the second locking portion, and the center of the locking hole of the first locking portion and the center of the locking hole of the second locking portion are located on a straight line.

7. The power module according to claim 1, characterized in that: The first locking portion and the second locking portion each include one.

8. The power module according to claim 1, characterized in that: The first locking portion and the second locking portion each include two.

9. The power module according to claim 1, characterized in that: The first locking portion includes one, and the second locking portion includes two.

10. The power module according to claim 1, characterized in that: The first locking parts include two and the second locking part includes one.

11. The power module according to claim 2, characterized in that: The width of the second locking portion is smaller than the width of the first locking portion.

12. The power module according to claim 1, characterized in that: The insulating layer covers the first surface and at least a portion of the side surfaces of the substrate.

13. The power module according to claim 12, characterized in that: The insulating layer also covers the side surfaces of the first locking portion and / or the second locking portion.

14. The power module according to claim 3, characterized in that: Every two power units form a power unit group, there is a gap between each power unit group, and the multiple power unit groups are arranged in two rows along the first side and the second side respectively.

15. The power module according to claim 3, characterized in that: Every three power units form a power unit group, there is a gap between each group of power unit groups, and the multiple power unit groups are arranged in two rows along the first side and the second side respectively.

16. The power module according to claim 3, characterized in that: Every four power units form a power unit group, there is a gap between each group of power unit groups, and the multiple power unit groups are arranged in two rows along the first side and the second side respectively.

17. The power module according to claim 1, characterized in that: The length of the substrate is positively correlated with the thickness of the substrate, and the thickness of the substrate is 3 mm to 4 mm.

18. The power module according to claim 1, characterized in that: The width of the substrate is 100 mm to 105 mm.

19. The power module according to claim 1, characterized in that: The first surface of the insulating layer has a boss corresponding to the second power end, and the height of the boss is lower than the bottom surface of the second power end.

20. The power module according to claim 19, characterized in that: The length of the boss is greater than or equal to the overall length of the power end.

21. The power module according to claim 1, characterized in that: It also includes heat dissipation fins, which are located on the second surface of the substrate, and the heat dissipation fins include any one of cylindrical, elliptical, and prismatic protrusions.

22. The power module according to claim 21, characterized in that: The heat dissipation fins include at least two groups, and the two groups of heat dissipation fins correspond to two rows of power unit groups respectively.

23. The power module according to claim 14, characterized in that: The length of the substrate is 145mm to 160mm, the width of the first locking portion is greater than 10mm and less than or equal to 14mm, the width of the second locking portion is 8mm to 10mm, the spacing between adjacent first locking portions is 45mm to 55mm, the spacing between adjacent second locking portions is 50mm to 60mm, and the distance between the first locking portion and the adjacent third locking portion is 40mm to 50mm.

24. The power module according to claim 15, characterized in that: The length of the substrate is 210mm to 230mm, the width of the first locking part is 11mm to 13mm, the width of the second locking part is 9mm to 10mm, the spacing between adjacent first locking parts is 50mm to 55mm, the spacing between adjacent second locking parts is 50mm to 60mm, and the distance between the first locking part and the adjacent third locking part is 40mm to 45mm.

25. The power module according to claim 16, characterized in that: The length of the substrate is 260mm to 280mm, the width of the first locking part is 11mm to 13mm, the width of the second locking part is 9mm to 10mm, the spacing between adjacent first locking parts is 70mm to 75mm, the spacing between adjacent second locking parts is 70mm to 80mm, and the distance between the first locking part and the adjacent third locking part is 60mm to 65mm.

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