Liquid cooling radiator

Abstract

The utility model provides a liquid cooling radiator, which is used for radiating heat of a power device and comprises a radiating shell, the radiating shell comprises a radiating base and an arched upper cover covering the radiating base, a radiating cavity is formed between the radiating base and the arched upper cover, a plurality of diversion trenches are arranged on the inner side wall of the radiating base, and the diversion trenches are communicated with the radiating base. The heat dissipation base is in direct contact with the power device; the flow guide cover is arranged in the heat dissipation cavity, and the flow guide cover and the bottom of the heat dissipation base are jointly limited to form an evaporation cavity; the liquid cooling medium is arranged in the evaporation chamber; the plurality of heat dissipation pipes are uniformly distributed on the flow guide cover, and the heat dissipation pipes are communicated with the evaporation chamber; according to the liquid cooling radiator, two modes of condensation backflow and arched upper cover gravity backflow are simultaneously realized, the structure is small and exquisite, and the problems that in the prior art, a liquid cooling radiator is large in size and inconvenient to use due to the fact that the liquid cooling radiator is conveyed to a forced cooling area through a conveying pipeline to be condensed and then flows back to a heating end are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electrical components, in particular to a liquid cooling radiator. Background Art

[0002] A radiator is a heat transfer and heat dissipation device that uses the principle of heat conduction to transfer the heat from the heating end, thereby reducing the temperature of the heating device. The current mainstream radiators include liquid cooling and air cooling. Liquid cooling radiators dissipate heat through the rapid heat transfer properties of the phase change of the liquid cooling medium.

[0003] Liquid cooling has significant advantages over traditional air cooling. First, because liquid has a stronger thermal conductivity than air, the liquid cooling system can remove heat in a shorter time, achieve efficient heat dissipation, thereby reducing device temperature and improving performance. Second, the liquid cooling system can save about half of the electricity, achieving energy conservation and consumption reduction. In addition, because liquid has a larger heat capacity and thermal conductivity, it can better cope with the heat generated by high loads.

[0004] At present, the shell materials of liquid cooling radiators are all made of metal, such as copper, aluminum, etc. When in use, it is generally necessary to package the power device and then install it on the liquid cooling radiator, or add a thermal conductive insulation layer between the power device and the liquid cooling radiator. The contact layer has a large thermal resistance, which affects the overall heat dissipation. In addition, the metal shell is prone to oxidation and corrosion in an exposed environment, especially in harsh conditions such as high temperature and high humidity, which will accelerate the corrosion of the metal shell and there is a risk of leakage of the liquid cooling medium. At the same time, the current common liquid cooling requires a transmission pipeline for the liquid cooling medium to transmit it to the forced cooling area for condensation and then return it to the heating end, resulting in a larger size of the radiator and limited application environment. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the technical problem to be solved by the present invention is to provide a liquid-cooled radiator to solve the problem that the liquid-cooled radiator in the prior art is large in size and inconvenient to use because it uses a transmission pipeline to transmit the liquid to the forced cooling area for condensation and then flows back to the heating end.

[0006] In order to solve the above technical problems, the utility model provides a liquid cooling radiator for cooling power devices, comprising:

[0007] A heat dissipation housing, the heat dissipation housing comprising a heat dissipation base and a dome-shaped upper cover buckled on the heat dissipation base, a heat dissipation cavity is formed between the heat dissipation base and the dome-shaped upper cover, a plurality of guide grooves are arranged on the inner side wall of the heat dissipation base, and the heat dissipation base is used to directly contact with the power device;

[0008] A guide cover, the guide cover is arranged in the heat dissipation cavity and is limited together with the bottom of the heat dissipation base to form an evaporation chamber;

[0009] A liquid cooling medium, wherein the liquid cooling medium is disposed in the evaporation chamber;

[0010] A plurality of heat dissipation pipes, wherein the plurality of heat dissipation pipes are evenly arranged on the guide cover, and the heat dissipation pipes are in conduction with the evaporation chamber;

[0011] When the heat of the power device is not high, the liquid-cooling medium in the evaporation chamber absorbs heat and evaporates, then diffuses outward from the heat dissipation pipe. During the diffusion process, the liquid-cooling medium is cooled and condensed on the inner wall of the heat dissipation pipe, and returns to the evaporation chamber, completing the self-circulation of the liquid-cooling medium. When the heat of the power device is too high, the heat dissipation pipe cannot meet the heat dissipation requirements, and the excess liquid-cooling medium vapor condenses at the dome upper cover and slides to the joint between the dome upper cover and the heat dissipation base, and flows back to the evaporation chamber through the guide groove, completing the self-circulation of the liquid-cooling medium.

[0012] As a more preferred method, the heat dissipation shell is made of ceramic material. Ceramic material is used as the heat dissipation shell of the liquid-cooled radiator. Because ceramic has good strength and impact resistance, and ceramic itself has insulation properties, power devices can be directly packaged on the heat pipe to reduce the intermediate thermal resistance layer and improve the efficiency of heat transfer. The ceramic material's anti-oxidation, aging resistance, and corrosion resistance are all better than metal materials, which can extend the service life of the radiator.

[0013] As a more preferred method, the heat dissipation pipe is also made of ceramic material, and the heat dissipation shell and the heat dissipation pipe are sealed together. Ceramic material is used as the heat dissipation pipe of the liquid cooling radiator because ceramic has good strength and impact resistance. At the same time, the oxidation resistance, aging resistance and corrosion resistance of ceramic material are better than those of metal material, which can extend the service life of the radiator.

[0014] As a more preferred method, the ceramic material adopts one or more of aluminum oxide, aluminum nitride, and silicon carbide. Aluminum oxide, aluminum nitride, and silicon carbide each have unique performance advantages. Suitable ceramic materials can be selected according to specific application scenarios and needs. Specifically: Aluminum oxide ceramics are a ceramic material with aluminum oxide as the main body, which has good conductivity, mechanical strength and high temperature resistance. Its high temperature resistance is particularly outstanding and is widely used in the fields of thick film integrated circuits; aluminum nitride ceramics are aluminum nitride as the main crystal phase, with high thermal conductivity, high thermal expansion coefficient and good electrical properties. Its thermal conductivity is much higher than that of aluminum oxide, which makes aluminum nitride ceramics have excellent thermal shock resistance and can withstand extreme heat of up to two thousand degrees Celsius. In addition, aluminum nitride ceramics are also not corroded by aluminum liquid and other molten metals, and are particularly suitable for occasions in contact with molten metals; silicon carbide ceramics are known for their excellent room temperature mechanical properties and high temperature mechanical properties. It has high bending strength, good oxidation resistance and corrosion resistance, and low friction coefficient. At high temperatures, the strength of silicon carbide ceramics can still be maintained at a high level. The hard and brittle texture and small expansion coefficient of silicon carbide ceramics make it have excellent resistance to rapid cooling and heating. At the same time, silicon carbide ceramics have a low density, so ceramic parts made of it are the lightest.

[0015] As a more preferred method, the heat dissipation cavity is a vacuum environment to prevent liquid leakage, which has the following advantages. First, in a vacuum environment, the liquid cooling medium is less likely to leak, and the vacuum state can ensure that the cooling system is more stable and reliable, reducing the risk of performance degradation or equipment damage caused by liquid leakage; secondly, it can reduce liquid vaporization: in a normal pressure or high pressure environment, the liquid cooling medium may vaporize due to temperature rise to form bubbles, which will reduce the thermal conductivity of the liquid and affect the heat dissipation effect. In a vacuum environment, due to the extremely low air pressure, the vaporization point of the liquid cooling medium will be greatly reduced, reducing the possibility of liquid vaporization, thereby ensuring the stable flow of the liquid cooling medium and efficient heat dissipation; at the same time, it can also avoid corrosion and oxidation: in a vacuum environment, the content of oxygen and other gases that may cause corrosion or oxidation is extremely low, which helps to extend the service life of the liquid cooling system and reduce performance degradation or failures caused by corrosion or oxidation; and the vacuum environment can improve the heat dissipation efficiency: the vacuum environment can reduce the thermal resistance in the heat conduction process, so that the heat is transferred to the liquid cooling medium more quickly, thereby improving the heat dissipation efficiency; finally, the vacuum environment can also reduce the resistance of the liquid cooling medium in the flow process, making the heat dissipation system more efficient.

[0016] As a more preferred embodiment, the liquid-cooled radiator further comprises a connecting pipe arranged on the heat dissipation shell, and the connecting pipe is used to inject liquid cooling medium into the heat dissipation cavity, and after the injection is completed, the heat dissipation cavity is vacuumed through the connecting pipe.

[0017] As a more preferred method, the connecting tube is made of copper, which has good stability and corrosion resistance, which means that the copper connecting tube is not easily affected by corrosion or oxidation, thereby ensuring the long-term stability and reliability of the liquid-cooled heat dissipation.

[0018] As a more preferred manner, the inner wall of the heat dissipation pipe is paved with a porous structure layer, and the porous structure layer can transport the liquid cooling medium condensed on the inner side of the heat dissipation pipe to the evaporation chamber through capillary action.

[0019] As a more preferred manner, the porous structure layer is made by sintering alumina. The porous structure layer obtained by using alumina has a higher specific surface area and porosity and has good adsorption performance.

[0020] As a more preferred method, the guide cover also adopts a dome-shaped design, and a part of the liquid cooling medium condensed on the dome-shaped upper cover drips onto the guide cover, flows along the guide cover through the guide groove and then flows back to the evaporation chamber, further improving the self-circulation of the liquid cooling medium.

[0021] As described above, the liquid-cooled radiator of the utility model has the following beneficial effects: when the liquid-cooled radiator of the utility model is used to dissipate heat for power devices, when the heat of the power devices is not high, the liquid-cooling medium in the evaporation chamber absorbs heat and evaporates and then diffuses outward from the heat dissipation pipe. During the diffusion process, the liquid-cooling medium is cooled and condensed on the inner wall of the heat dissipation pipe and returns to the evaporation chamber, completing the self-circulation of the liquid-cooling medium; when the heat of the power devices is too high, the heat dissipation pipe cannot meet the heat dissipation demand, and the excess liquid-cooling medium vapor condenses at the dome-shaped upper cover and slides to the joint between the dome-shaped upper cover and the heat dissipation base, and flows back to the evaporation chamber through the guide groove. The heat dissipation chamber completes the self-circulation of the liquid cooling medium; in the above cooling cycle, the cooling medium completes the mutual conversion between the liquid phase and the gas phase in the heat dissipation cavity, and takes away a large amount of heat from the power device during the conversion process. Compared with the traditional liquid cooling heat dissipation, which requires a transmission pipeline for the liquid cooling medium to transmit it to the forced cooling area for condensation and then return it to the heating end, it requires smaller space and is widely applicable to various scenarios; at the same time, the liquid cooling radiator of the utility model provides two methods: condensation reflux of the heat dissipation pipe and gravity reflux of the dome-shaped upper cover, which can be applicable to the heat dissipation needs of different powers, further enriching the usage scenarios.

[0022] To sum up, the liquid-cooled radiator of the utility model realizes both condensation reflux and gravity reflux of the dome-shaped upper cover through the heat dissipation pipes and the dome-shaped upper cover arranged in the heat dissipation inner cavity. It has a compact structure and meets the use scenarios of heat dissipation in a narrow space and with different powers. It solves the problem in the prior art that the liquid-cooled radiator is large in size and inconvenient to use because it uses a transmission pipeline to transmit the liquid to the forced cooling area for condensation and then returns to the heating end. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Shown is a cross-sectional view of the liquid cooling radiator of the present utility model;

[0024] Figure 2 Display as Figure 1 Sectional view in the AA direction;

[0025] Figure 3 Shown is a general internal view of the liquid cooling radiator of the present invention.

[0026] Component number description

[0027] 1 Heat dissipation housing

[0028] 11 Heat sink

[0029] 111 diversion trough

[0030] 12 Dome cover

[0031] 121 connecting pipe

[0032] 2. Diversion cover

[0033] 3Liquid cooling medium

[0034] 4 heat pipes

[0035] 41 porous structure layer

[0036] 5 Power Devices DETAILED DESCRIPTION

[0037] The following is a description of the implementation of the present invention by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0038] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that can be implemented in this utility model, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that can be produced by the utility model and the purposes that can be achieved, should still fall within the scope of the technical content disclosed by the utility model. The following detailed description should not be considered restrictive, and the scope of the embodiments of this application is limited only by the claims of the published patents. The terms used here are only for describing specific embodiments and are not intended to limit this application. Spatial related terms, such as "upper", "lower", "left", "right", "below", "below", "lower", "above", "upper", etc., can be used in the text to facilitate the description of the relationship between an element or feature shown in the figure and another element or feature.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "hold" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless there is an indication to the contrary in the context. It should be further understood that the terms "comprise", "include" indicate the presence of the described features, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence or addition of one or more other features, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition will only occur when the combination of elements, functions or operations is inherently mutually exclusive in some way.

[0041] like Figure 1 , Figure 2 as well as Figure 3 As shown, the utility model provides a liquid cooling radiator for cooling the power device 5, comprising:

[0042] A heat dissipation housing 1, the heat dissipation housing 1 comprising a heat dissipation base 11 and a dome-shaped upper cover 12 buckled on the heat dissipation base 11, a heat dissipation cavity is formed between the heat dissipation base 11 and the dome-shaped upper cover 12, a plurality of guide grooves 111 are provided on the inner side wall of the heat dissipation base 11, and the heat dissipation base 11 is used to directly contact with the power device 5;

[0043] The guide cover 2 is disposed in the heat dissipation cavity and is limited together with the bottom of the heat dissipation base 11 to form an evaporation chamber;

[0044] Liquid cooling medium 3, the liquid cooling medium 3 is arranged in the evaporation chamber;

[0045] A plurality of heat dissipation tubes 4, wherein the plurality of heat dissipation tubes 4 are evenly arranged on the guide cover 2, and the heat dissipation tubes 4 are in conduction with the evaporation chamber;

[0046] When the heat of the power device 5 is not high, the liquid-cooling medium 3 in the evaporation chamber absorbs heat and evaporates, then diffuses outward from the heat dissipation pipe 4. During the diffusion process, the liquid-cooling medium 3 is cooled and condensed on the inner wall of the heat dissipation pipe 4, and returns to the evaporation chamber, completing the self-circulation of the liquid-cooling medium 3. When the heat of the power device 5 is too high, the heat dissipation pipe 4 cannot meet the heat dissipation requirements, and the excess liquid-cooling medium 3 vapor condenses at the dome upper cover 12 and slides to the joint between the dome upper cover 12 and the heat dissipation base 11, and flows back to the evaporation chamber through the guide groove 111, completing the self-circulation of the liquid-cooling medium 3.

[0047] In order to better introduce the utility model, the following specific applications are now used for explanation: when the liquid-cooled radiator of the utility model is used to dissipate heat for the power device 5, when the heat of the power device 5 is not high, the liquid-cooling medium 3 in the evaporation chamber absorbs heat and evaporates and then diffuses outward from the heat dissipation pipe 4. During the diffusion process, the liquid-cooling medium 3 is cooled and condensed on the inner wall of the heat dissipation pipe 4, and returns to the evaporation chamber, completing the self-circulation of the liquid-cooling medium 3; when the heat of the power device 5 is too large, the heat dissipation pipe 4 cannot meet the heat dissipation demand, and the excess liquid-cooling medium 3 vapor condenses at the dome upper cover 12 and slides to the joint between the dome upper cover 12 and the heat dissipation base 11, and is guided The flow groove 111 flows back to the evaporation chamber to complete the self-circulation of the liquid cooling medium 3; in the above cooling cycle, the cooling medium completes the mutual conversion between the liquid phase and the gas phase in the heat dissipation cavity, and takes away a large amount of heat from the power device 5 during the conversion process. Compared with the traditional liquid cooling heat dissipation, which requires a transmission pipeline for the liquid cooling medium to transmit it to the forced cooling area for condensation and then return it to the heating end, it requires smaller space and is widely applicable to various scenarios; at the same time, the liquid cooling radiator of the utility model provides two methods: condensation reflux of the heat dissipation pipe 4 and gravity reflux of the dome-shaped upper cover 12, which can be suitable for heat dissipation requirements of different powers, further enriching the usage scenarios.

[0048] In this embodiment, if Figure 1 , Figure 2 as well as Figure 3 As shown, the heat pipe 4 is perpendicular to the heat dissipation base 11, and a certain gap is maintained between the top of the heat pipe 4 and the dome-shaped upper cover 12. As a more preferred method, the heat dissipation housing 1 is made of ceramic material. The ceramic material is used as the heat dissipation housing 1 of the liquid cooling radiator. Because ceramic has good strength and impact resistance, and ceramic itself has insulation, the power device 5 can be directly packaged on the heat pipe to reduce the intermediate thermal resistance layer and improve the efficiency of heat transfer. The anti-oxidation, anti-aging and anti-corrosion properties of ceramic materials are better than those of metal materials, which can extend the service life of the radiator.

[0049] In this embodiment, the heat dissipation tube 4 is also made of ceramic material, and the heat dissipation shell 1 and the heat dissipation tube 4 are sealed together. Ceramic material is used as the heat dissipation tube 4 of the liquid-cooled radiator because ceramic has good strength and impact resistance. At the same time, the oxidation resistance, aging resistance and corrosion resistance of ceramic materials are better than those of metal materials, which can extend the service life of the radiator.

[0050] In this embodiment, if Figure 2 as well as Figure 3 As shown, the outer contour of the heat dissipation base 11 is a cylinder, and the bottom surface of the cylinder is in contact with the power device 5, and the larger side area of ​​the cylinder is used to assist in heat dissipation. At the same time, the outer contour of the cylinder is also easy to process and produce; the outer edge of the dome-shaped upper cover 12 is a circle that matches the top of the heat dissipation base 11, and the outer edge of the dome-shaped upper cover 12 and the top of the heat dissipation base 11 are attached to each other and sealed, thereby completing the production of the entire heat dissipation housing 1.

[0051] In this embodiment, the ceramic material is one or more of aluminum oxide, aluminum nitride, and silicon carbide. Aluminum oxide, aluminum nitride, and silicon carbide each have unique performance advantages. Suitable ceramic materials can be selected according to specific application scenarios and needs. Specifically: Aluminum oxide ceramics are a ceramic material with aluminum oxide as the main body, which has good conductivity, mechanical strength and high temperature resistance. Its high temperature resistance is particularly outstanding and is widely used in the fields of thick film integrated circuits; aluminum nitride ceramics are aluminum nitride as the main crystal phase, with high thermal conductivity, high thermal expansion coefficient and good electrical properties. Its thermal conductivity is much higher than that of aluminum oxide, which makes aluminum nitride ceramics have excellent thermal shock resistance and can withstand extreme heat of up to two thousand degrees Celsius. In addition, aluminum nitride ceramics are also not corroded by aluminum liquid and other molten metals, and are particularly suitable for occasions in contact with molten metals; silicon carbide ceramics are known for their excellent room temperature mechanical properties and high temperature mechanical properties. It has high bending strength, good oxidation resistance and corrosion resistance, and low friction coefficient. At high temperatures, the strength of silicon carbide ceramics can still be maintained at a high level. The hard and brittle texture and small expansion coefficient of silicon carbide ceramics make it have excellent resistance to rapid cooling and heating. At the same time, silicon carbide ceramics have a low density, so ceramic parts made of it are the lightest.

[0052] In this embodiment, the heat dissipation cavity is a vacuum environment to prevent liquid leakage, which has the following advantages. First, in a vacuum environment, the liquid cooling medium is less likely to leak, and the vacuum state can ensure that the cooling system is more stable and reliable, reducing the risk of performance degradation or equipment damage caused by liquid leakage; secondly, it can reduce liquid vaporization: in a normal pressure or high pressure environment, the liquid cooling medium may vaporize due to temperature rise to form bubbles, which will reduce the thermal conductivity of the liquid and affect the heat dissipation effect. In a vacuum environment, due to the extremely low air pressure, the vaporization point of the liquid cooling medium will be greatly reduced, reducing the possibility of liquid vaporization, thereby ensuring the stable flow of the liquid cooling medium and efficient heat dissipation; at the same time, it can also avoid corrosion and oxidation: in a vacuum environment, the content of oxygen and other gases that may cause corrosion or oxidation is extremely low, which helps to extend the service life of the liquid cooling system and reduce performance degradation or failures caused by corrosion or oxidation; and the vacuum environment can improve the heat dissipation efficiency: the vacuum environment can reduce the thermal resistance in the heat conduction process, so that the heat is transferred to the liquid cooling medium more quickly, thereby improving the heat dissipation efficiency; finally, the vacuum environment can also reduce the resistance of the liquid cooling medium in the flow process, making the heat dissipation system more efficient.

[0053] In the present embodiment, the liquid-cooled radiator also includes a connecting pipe 121 arranged on the heat dissipation shell 1, and the connecting pipe 121 is used to inject liquid cooling medium 3 into the heat dissipation cavity, and after the injection is completed, the heat dissipation cavity is vacuumed through the connecting pipe 121; further, in the present embodiment, the connecting pipe 121 is arranged at the center position of the dome-shaped upper cover 12, and further, in the present embodiment, the connecting pipe 121 is made of copper, and copper has good stability and corrosion resistance, which means that the connecting pipe 121 made of copper is not easily affected by corrosion or oxidation, thereby ensuring the long-term stability and reliability of the liquid-cooled heat dissipation.

[0054] In this embodiment, if Figure 1 , Figure 2 As shown, the inner wall of the heat dissipation tube 4 is paved with a porous structure layer 41, and the porous structure layer 41 can transport the liquid cooling medium 3 condensed on the inner side of the heat dissipation tube 4 to the evaporation chamber through capillary action; further, in this embodiment, the porous structure layer 41 is made of alumina sintering, and the porous structure layer 41 obtained by alumina has a high specific surface area and porosity, and has good adsorption performance.

[0055] In this embodiment, if Figure 1 As shown, the guide cover 2 also adopts a dome-shaped design. A portion of the liquid cooling medium 3 condensed on the dome-shaped upper cover 12 drips onto the guide cover 2, flows along the guide cover 2 through the guide groove 111 and then flows back to the evaporation chamber, further improving the self-circulation of the liquid cooling medium 3.

[0056] As described above, the liquid-cooled radiator of the utility model has the following beneficial effects: when the liquid-cooled radiator of the utility model is used to dissipate heat for the power device 5, when the heat of the power device 5 is not high, the liquid-cooling medium 3 in the evaporation chamber absorbs heat and evaporates and then diffuses outward from the heat dissipation tube 4. During the diffusion process, the liquid-cooling medium 3 is cooled and condensed on the inner wall of the heat dissipation tube 4, and returns to the evaporation chamber, completing the self-circulation of the liquid-cooling medium 3; when the heat of the power device 5 is too high, the heat dissipation tube 4 cannot meet the heat dissipation demand, and the excess liquid-cooling medium 3 vapor condenses at the dome upper cover 12 and slides to the joint between the dome upper cover 12 and the heat dissipation base 11, and passes through the guide groove 111 flows back to the evaporation chamber to complete the self-circulation of the liquid-cooling medium 3; in the above-mentioned cooling cycle, the cooling medium completes the mutual conversion between the liquid phase and the gas phase in the heat dissipation cavity, and takes away a large amount of heat from the power device 5 during the conversion process. Compared with the traditional liquid cooling heat dissipation, which requires a transmission pipeline of the liquid cooling medium to transmit it to the forced cooling area for condensation and then return it to the heating end, it requires smaller space and is widely applicable to various scenarios; at the same time, the liquid-cooling radiator of the utility model can provide two modes of condensation reflux of the heat dissipation pipe 4 and gravity reflux of the dome-shaped upper cover 12, which can be applicable to the heat dissipation requirements of different powers, further enriching the usage scenarios.

[0057] In summary, the liquid cooling radiator of the utility model realizes both condensation reflux and gravity reflux of the dome upper cover 12 through the heat dissipation tube 4 and the dome upper cover 12 disposed in the heat dissipation inner cavity. The structure is compact and meets the use scenarios of heat dissipation in a small space and with different powers. It solves the problem that the liquid cooling radiator in the prior art is large in size and inconvenient to use because it is transmitted to the forced cooling area by a transmission pipeline for condensation and then refluxed to the heating end. Therefore, the utility model effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0058] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. A liquid cooling radiator for dissipating heat from a power device (5), characterized in that: include: A heat dissipation housing (1), the heat dissipation housing (1) comprising a heat dissipation base (11) and a dome-shaped upper cover (12) buckled on the heat dissipation base (11), a heat dissipation cavity being formed between the heat dissipation base (11) and the dome-shaped upper cover (12), a plurality of guide grooves (111) being provided on the inner side wall of the heat dissipation base (11), and the heat dissipation base (11) being used for directly contacting with a power device (5); A flow guide cover (2), the flow guide cover (2) being arranged in the heat dissipation cavity and being limited together with the bottom of the heat dissipation base (11) to form an evaporation chamber; A liquid cooling medium (3), the liquid cooling medium (3) being arranged in the evaporation chamber; A plurality of heat dissipation pipes (4), wherein the plurality of heat dissipation pipes (4) are evenly arranged on the guide cover (2), and the heat dissipation pipes (4) are in conduction with the evaporation chamber; When the heat of the power device (5) is not high, the liquid cooling medium (3) in the evaporation chamber absorbs heat and evaporates, then diffuses outward from the heat dissipation pipe (4). During the diffusion process, the liquid cooling medium (3) is cooled and condensed on the inner wall of the heat dissipation pipe (4), and returns to the evaporation chamber, completing the self-circulation of the liquid cooling medium (3). When the heat of the power device (5) is too high, the heat dissipation pipe (4) cannot meet the heat dissipation demand, and the excess liquid cooling medium (3) vapor condenses at the dome-shaped upper cover (12) and slides to the joint between the dome-shaped upper cover (12) and the heat dissipation base (11), and flows back to the evaporation chamber through the guide groove (111), completing the self-circulation of the liquid cooling medium (3).

2. The liquid cooling radiator according to claim 1, characterized in that: The heat dissipation housing (1) is made of ceramic material.

3. The liquid cooling radiator according to claim 2, characterized in that: The heat dissipation pipe (4) is also made of ceramic material, and the heat dissipation housing (1) and the heat dissipation pipe (4) are sealed together.

4. The liquid cooling radiator according to claim 3, characterized in that: The ceramic material is one or more of aluminum oxide, aluminum nitride and silicon carbide.

5. The liquid cooling radiator according to claim 1, characterized in that: The heat dissipation cavity is in a vacuum environment.

6. The liquid cooling radiator according to claim 5, characterized in that: The liquid-cooled radiator further comprises a connecting pipe (121) arranged on the heat dissipation housing (1), wherein the connecting pipe (121) is used to inject the liquid cooling medium (3) into the heat dissipation cavity, and after the injection is completed, the heat dissipation cavity is evacuated through the connecting pipe (121).

7. The liquid cooling radiator according to claim 6, characterized in that: The connecting pipe (121) is made of copper.

8. The liquid cooling radiator according to claim 1, characterized in that: The inner wall of the heat dissipation pipe (4) is paved with a porous structure layer (41), and the porous structure layer (41) can transport the liquid cooling medium (3) condensed on the inner side of the heat dissipation pipe (4) to the evaporation chamber through capillary action.

9. The liquid cooling radiator according to claim 8, characterized in that: The porous structure layer (41) is made by sintering alumina.

10. The liquid cooling radiator according to claim 1, characterized in that: The guide cover (2) also adopts a dome-shaped design, and a portion of the liquid cooling medium (3) condensed on the dome-shaped upper cover (12) drips onto the guide cover (2), flows along the guide cover (2) through the guide groove (111) and then flows back to the evaporation chamber, thereby further improving the self-circulation of the liquid cooling medium (3).

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