Heat-conducting phase-change material structure

Abstract

The utility model relates to the technical field of heat-conducting phase-change materials, in particular to a heat-conducting phase-change material structure which comprises a heat-conducting phase-change material body, side openings are formed in the two sides of the top end face of the heat-conducting phase-change material body in an integrally-formed mode respectively, and heat-conducting cushion blocks are arranged above the inner sides of the side openings. The heat conduction cushion block is arranged in the middle of the heat conduction phase change material body, a dotted line tearing opening is formed in the connecting position of the heat conduction cushion block and the heat conduction phase change material body, and a plastic inserting plate is arranged below the middle of the inner side of the side opening. When the heat-conducting phase-change material structure is pasted and mounted on electronic equipment, the whole material is pulled to be pasted and mounted through the operation that two fingers clamp the plastic inserting plate and do not make contact with the bonding bottom face, the problems that the bonding bottom face of the material is prone to being sticky to hands and dirt is attached to the bonding bottom face are solved, and the bonding effect after the material is mounted is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of heat-conducting phase-change materials, in particular to a heat-conducting phase-change material structure. Background Art

[0002] With the continuous development of electronic equipment, its integration and power density are increasing, resulting in increasingly prominent heat problems inside the equipment. The use of thermal conductive phase change materials can absorb and release heat when the equipment is working, play an effective role in heat dissipation and ensure the stability of the equipment. At the same time, common thermal conductive phase change materials include thermal conductive silicone sheets, thermal conductive grease and thermal conductive graphite sheets;

[0003] In the prior art, when a thermally conductive phase change material structure is used to assist electronic devices in performing heat dissipation operations, it is generally necessary to achieve a reliable connection with the electronic device through an adhesive glue reserved at the bottom. However, considering that the adhesive surface of the material is prone to stickiness during the bonding process of the adhesive material, the dirt on the operator's hands will not only adhere to the adhesive surface of the material and cause pollution, but will also lead to poor bonding effect after the material is installed, and is not conducive to the stable installation of the material. Therefore, a thermally conductive phase change material structure is proposed to address the above problems. Summary of the invention

[0004] The purpose of the utility model is to provide a thermally conductive phase change material structure to solve the problem that the existing thermally conductive phase change material structure mentioned in the above background technology will be sticky during pasting and installation, resulting in poor adhesion after installation and being unfavorable for stable installation of the material.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A heat-conducting phase change material structure comprises a heat-conducting phase change material body, side openings are respectively formed on both sides of the top surface of the heat-conducting phase change material body through integral molding, a heat-conducting pad is provided on the inner upper side of the side opening, a dotted tear is provided at the connection between the heat-conducting pad and the heat-conducting phase change material body, a plastic plug is provided at the lower middle position of the inner side of the side opening, a center pad is provided at the middle position of the heat-conducting phase change material body through integral molding, side clips are respectively provided at the middle of the front end and the middle of the rear end of the plastic plug through integral molding, and rubber edging is provided on the outside of the side clips.

[0007] Preferably, the thermally conductive phase change material body comprises a central base layer, and an adhesive base layer is provided at the bottom of the central base layer, and a reinforcing layer and a wear-resistant outer layer are provided above the central base layer in sequence from bottom to top.

[0008] Preferably, a slot for engaging with the plastic insert plate is provided at the middle position of the bottom end of the thermally conductive pad block, and the plastic insert plate and the central pad block are plug-connected.

[0009] Preferably, the height of the rubber edging is equal to that of the plastic insert plate, and the outer shape of the rubber edging is a "U"-shaped structure, and the inner end of the rubber edging and the outer end of the side clip are matched in size.

[0010] Preferably, the length of the plastic plug plate is equal to the length of the heat-conducting phase change material body, and the outer shape of the plastic plug plate is a rectangular structure.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] In the utility model, by providing the thermally conductive pads, plastic insert plates, rubber edging, side clips and center pads, it is convenient for the thermally conductive phase change material structure to be installed on the electronic device by pasting. After removing a group of thermally conductive pads in advance, under the limiting effect of the rubber edging, side clips and center pads, the entire material is pulled for pasting installation by clamping the plastic insert plates with two fingers and not touching the adhesive bottom surface, thereby avoiding the problem of the adhesive bottom surface of the material being sticky and dirty. At the same time, by using the auxiliary traction structure for auxiliary pasting installation, the bonding effect of the material after installation can be guaranteed, and the problem of unstable pasting caused by contamination of the adhesive bottom surface after the material is pasted can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 For this utility model Figure 1 A schematic diagram of the structure at A;

[0015] Figure 3 This is a schematic diagram of the installation structure of the plastic plug board of the utility model;

[0016] Figure 4 This is a schematic diagram of the rubber edging structure of the utility model;

[0017] Figure 5 It is a schematic diagram of the internal structure of the thermal conductive phase change material body of the utility model.

[0018] In the figure: 1. Thermal conductive phase change material body; 2. Side opening; 3. Thermal conductive pad; 4. Dotted tear; 5. Plastic plug-in board; 6. Rubber edging; 7. Side clip strip; 8. Center base layer; 9. Adhesive bottom layer; 10. Reinforcement layer; 11. Wear-resistant outer layer; 12. Center pad. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-5 , the utility model provides a technical solution:

[0021] A heat-conducting phase change material structure comprises a heat-conducting phase change material body 1, side openings 2 are respectively formed on both sides of the top surface of the heat-conducting phase change material body 1 through integral molding, and a heat-conducting pad 3 is provided on the inner upper side of the side opening 2, a dotted tear 4 is provided at the connection between the heat-conducting pad 3 and the heat-conducting phase change material body 1, a plastic plug board 5 is provided at the lower middle position of the inner side of the side opening 2, a center pad 12 is provided at the middle position of the heat-conducting phase change material body 1 through integral molding, side clips 7 are respectively provided at the middle of the front end and the middle of the rear end of the plastic plug board 5 through integral molding, and a rubber edging 6 is provided on the outside of the side clips 7.

[0022] like Figure 1 , Figure 3 and Figure 5 As shown, the thermal conductive phase change material body 1 includes a central base layer 8, and an adhesive base layer 9 is provided at the bottom of the central base layer 8, and a reinforcing layer 10 and a wear-resistant outer layer 11 are provided above the central base layer 8 from bottom to top. By providing the adhesive base layer 9, the entire thermal conductive phase change material structure can utilize the adhesive effect of the adhesive base layer 9 to be quickly bonded to the electronic device; a card slot that is engaged with the plastic plug plate 5 is provided at the middle position of the bottom end of the thermal conductive pad 3, and a plug-in connection is provided between the plastic plug plate 5 and the central pad 12. Since a card slot is provided at the middle position of the bottom end of the thermal conductive pad 3, the reserved setting of this card slot will not affect the plug-in installation of the plastic plug plate 5.

[0023] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the height of the rubber edging 6 is set equal to the height of the plastic plug board 5, and the shape of the rubber edging 6 is a "U"-shaped structure. The inner end of the rubber edging 6 and the outer end of the side clamping strip 7 are matched in size. Under the setting of matching inner and outer sizes, the rubber edging 6 can be quickly connected with the plastic plug board 5 by fitting and bonding itself with the side clamping strip 7, so that the plastic plug board 5 can be tightly plugged and installed later; the length of the plastic plug board 5 is set equal to the length of the thermal conductive phase change material body 1, and the shape of the plastic plug board 5 is a rectangular structure. Under the setting of equal length, the plastic plug board 5 after being plugged and installed in place will not be too protruding, affecting the normal covering operation of the entire thermal conductive phase change material structure.

[0024] Workflow: When using the thermally conductive phase change material structure, first clean the electronic device on which the thermally conductive phase change material is installed, and tear off the thermally conductive pad 3 from the inside of the side opening 2 in sequence along the cut position of the dotted tear 4. At this time, the open setting of the side opening 2 is convenient for the operator to pull the entire material later, and it is also convenient for the entire material to use a group of holes and grooves reserved in the side opening 2 to assist the electronic equipment in ventilation and heat dissipation. Then, under the central limiting effect of the central pad 12, the operator clamps the two side ends of the plastic plug board 5 with two fingers, and picks up the entire thermally conductive phase change material in a way that does not touch the adhesive bottom surface. The isolation protective paper on the bottom surface of the adhesive bottom layer 9 can be removed first, and then the entire thermally conductive phase change material can be removed. It is aligned and pasted on the corresponding electronic device so that it can assist the electronic device in performing heat conduction and heat dissipation operations later. At the same time, before the plastic plug board 5 that plays an auxiliary traction role is plugged into the entire thermally conductive phase change material, a group of rubber edging 6 can be bonded onto a group of side clips 7. At this time, the connection between a group of side clips 7 and a group of rubber edging 6 will increase the friction force of the plastic plug board 5 during the plug-in installation operation of the plastic plug board 5. In addition, by setting a reinforcing layer 10 that is made of glass fiber material and a wear-resistant outer layer 11 that is a wear-resistant coating, this setting will make the entire thermally conductive phase change material structure have a stable structure and anti-skid contact effect during actual use.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A thermal conductive phase change material structure, comprising a thermal conductive phase change material body (1), characterized in that: Side openings (2) are formed at both sides of the top surface of the heat-conducting phase change material body (1) through integral molding, and a heat-conducting pad (3) is provided on the upper inner side of the side opening (2), a dotted tear notch (4) is provided at the connection between the heat-conducting pad (3) and the heat-conducting phase change material body (1), a plastic insert plate (5) is provided at the lower middle position of the inner side of the side opening (2), a center pad (12) is formed at the middle position of the heat-conducting phase change material body (1) through integral molding, and side clips (7) are formed at the middle of the front end and the middle of the rear end of the plastic insert plate (5) through integral molding, and the outer side of the side clips (7) is provided with a rubber edging (6).

2. A thermally conductive phase change material structure according to claim 1, characterized in that: The thermally conductive phase change material body (1) comprises a central base layer (8), and an adhesive base layer (9) is provided at the bottom of the central base layer (8), and a reinforcement layer (10) and a wear-resistant outer layer (11) are provided above the central base layer (8) in order from bottom to top.

3. A thermally conductive phase change material structure according to claim 1, characterized in that: A slot for engaging with the plastic insert plate (5) is provided at the middle position of the bottom end of the heat-conducting pad (3), and the plastic insert plate (5) and the central pad (12) are plug-connected.

4. A thermally conductive phase change material structure according to claim 1, characterized in that: The height of the rubber edging (6) is equal to the height of the plastic insert plate (5), and the outer shape of the rubber edging (6) is a "U"-shaped structure, and the inner end of the rubber edging (6) and the outer end of the side clip (7) are arranged to match in size.

5. The thermally conductive phase change material structure according to claim 1, characterized in that: The length of the plastic plug plate (5) is set to be equal to the length of the heat-conducting phase change material body (1), and the outer shape of the plastic plug plate (5) is set to be a rectangular structure.

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