Dispensing device for semiconductor chip

Abstract

The dispensing device comprises a base, the top of the base is fixedly connected with a working table, the top of the working table is provided with a discharging port, the top of the base is fixedly connected with a motor, the output end of the motor is connected with a first threaded rod through a coupler, the outer wall of the first threaded rod is sleeved with a threaded sleeve in a threaded mode, and the threaded sleeve is connected with a second threaded rod through a coupler. The threaded sleeve slides on the top of the base, one side of the threaded sleeve is rotationally connected with a connecting rod, the other end of the connecting rod is rotationally connected with a vertical plate, the top end of the vertical plate is slidably connected with the workbench in an inserted mode, one side of the vertical plate is fixedly connected with a push rod, and a sliding groove is formed in the top of the base. According to the utility model, the vertical plate is driven to slide in the chute under the driving of the motor and the connecting action of the connecting rod, so that the push rod is driven to push forwards, and the semiconductor chip is pushed to move, and then the semiconductor chip is pushed down from the blanking port, so that the semiconductor chip does not need to be held by hands, and workers are prevented from being scalded.

Description

Technical Field

[0001] The utility model relates to the technical field of glue dispensing devices, in particular to a glue dispensing device for semiconductor chips. Background Art

[0002] Semiconductor chip: A semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet. The dispensing device is a device used in the production process of semiconductor chips to perform dispensing and fixing of semiconductor chips.

[0003] At present, most of the existing dispensing devices require manual labor to take out the semiconductor chips with dispensing, which is inefficient and has the risk of scalding the workers. Therefore, a dispensing device for semiconductor chips is proposed. Utility Model Content

[0004] The utility model aims to solve the shortcomings of low chip taking efficiency and potential safety hazards in the prior art, and proposes a semiconductor chip dispensing device.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A dispensing device for semiconductor chips comprises a base, the top of the base is fixedly connected to a workbench, the top of the workbench is provided with a feeding port, the top of the base is fixedly connected to a motor, the output end of the motor is connected to a first threaded rod through a coupling, the outer wall thread sleeve of the first threaded rod is provided with a threaded sleeve, the threaded sleeve slides on the top of the base, one side of the threaded sleeve is rotatably connected to a connecting rod, the other end of the connecting rod is rotatably connected to a vertical plate, the top of the vertical plate is slidably plugged into the workbench, one side of the vertical plate is fixedly connected to a push rod, the top of the base is provided with a slide groove, and the vertical plate slides in the slide groove.

[0007] Furthermore, the top of the threaded sleeve is fixedly connected to a side plate, the side plate is slidably plugged into the workbench, a connecting shaft is slidably plugged into one side of the side plate, the other end of the connecting shaft is fixedly connected to a limiting plate, and a spring is sleeved on the outer wall of the connecting shaft.

[0008] Furthermore, one side of the workbench is fixedly connected to a support frame, the other side of the workbench is fixedly connected to a C-shaped bracket, and a slide is slidably connected between the C-shaped bracket and the support frame.

[0009] Furthermore, a second threaded rod is rotatably inserted between the two ends of the slide, and a sliding block is threadedly sleeved on the outer wall of the second threaded rod, and the sliding block slides on the slide.

[0010] Furthermore, a glue box is fixedly connected to the top of the slider, a glue dispensing head is fixedly connected to the bottom of the slider, and the glue dispensing head and the glue box are connected via a connecting pipe.

[0011] Furthermore, a conveyor belt is arranged on the top of the base, and the conveyor belt is located below the discharge port.

[0012] The beneficial effects of the utility model are:

[0013] 1. The vertical plate is driven to slide in the slide groove under the drive of the motor and the connection of the connecting rod, thereby driving the push rod forward, thereby pushing the semiconductor chip to move, and then pushing the semiconductor chip down from the discharge port. Therefore, there is no need to hold the semiconductor chip by hand to avoid scalding the staff.

[0014] 2. The first threaded rod is rotated under the drive of the motor, thereby driving the threaded sleeve to move, and then driving the side plate, the connecting shaft and the limit plate to move forward, thereby driving the limit plate close to the fixed plate, thereby clamping the semiconductor chip to facilitate the dispensing operation of the semiconductor chip.

[0015] 3. Through the design of the sliding plug-in mode of the connecting shaft and the side plate and the buffering of the clamping force of the semiconductor chip under the elastic action of the spring, the semiconductor chip is prevented from being damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a three-dimensional structural schematic diagram of a semiconductor chip dispensing device proposed by the utility model;

[0017] Figure 2 A schematic diagram of a clamping structure of a semiconductor chip dispensing device proposed by the utility model;

[0018] Figure 3 This is a schematic diagram of the push structure of a semiconductor chip dispensing device proposed by the utility model;

[0019] In the figure: 1. base; 2. motor; 3. first threaded rod; 4. threaded sleeve; 5. side plate; 6. connecting shaft; 7. limit plate; 8. spring; 9. vertical plate; 10. slide groove; 11. connecting rod; 12. push rod; 13. workbench; 14. support frame; 15. slide frame; 16. glue box; 17. second threaded rod; 18. glue dispensing head; 19. C-type bracket; 20. conveyor belt; 21. unloading port. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0021] Reference Figure 1-Figure 3A semiconductor chip dispensing device comprises a base 1, a workbench 13 is fixed to the top of the base 1 by bolts, a feeding port 21 is arranged on the top of the workbench 13, a motor 2 is fixed to the top of the base 1 by bolts, a first threaded rod 3 is connected to the output end of the motor 2 by a coupling, a threaded sleeve 4 is arranged on the outer wall thread sleeve of the first threaded rod 3, the threaded sleeve 4 slides on the top of the base 1, a connecting rod 11 is rotatably connected to one side of the threaded sleeve 4, a vertical plate 9 is rotatably connected to the other end of the connecting rod 11, the top of the vertical plate 9 is slidably plugged with the workbench 13, a push rod 12 is welded to one side of the vertical plate 9, a slide groove 10 is arranged on the top of the base 1, the vertical plate 9 slides in the slide groove 10, and the vertical plate 9 is driven by the motor 2 and the connection of the connecting rod 11 to slide in the slide groove 10, thereby driving the push rod 12 to push forward, thereby pushing the semiconductor chip to move, and thus pushing the semiconductor chip down from the feeding port 21.

[0022] A fixed plate is welded on the top of the workbench 13, and a side plate 5 is welded on the top of the threaded sleeve 4. The side plate 5 is slidably plugged into the workbench 13. A connecting shaft 6 is slidably plugged into one side of the side plate 5. A limiting plate 7 is welded on the other end of the connecting shaft 6. Driven by the motor 2, the first threaded rod 3 rotates, thereby driving the threaded sleeve 4 to move, and then driving the side plate 5, the connecting shaft 6 and the limiting plate 7 to move forward, thereby driving the limiting plate 7 to approach the fixed plate, thereby clamping the semiconductor chip. A spring 8 is sleeved on the outer wall of the connecting shaft 6. Through the design of the sliding plug-in mode of the connecting shaft 6 and the side plate 5 and the elastic action of the spring 8, the force of clamping the semiconductor chip is buffered to avoid damage to the semiconductor chip. A support frame 14 is welded on one side of the workbench 13, and a C-shaped bracket 19 is welded on the other side of the workbench 13. The C-shaped bracket 19 and the support frame 1 4 is slidably connected with a slide 15, a second threaded rod 17 is rotatably inserted between the two ends of the slide 15, a slider is threadedly sleeved on the outer wall of the second threaded rod 17, the slider slides on the slide 15, a glue box 16 is fixed to the top of the slider by bolts, and a glue head 18 is fixed to the bottom of the slider by bolts. The second threaded rod 17 is turned to drive the slider to move, thereby driving the glue box 16 and the glue head 18 to move, and then the glue head 18 is moved to the top of the semiconductor chip, and then the slide 15 is pushed downward, so that the glue head 18 contacts with the semiconductor chip, and then the semiconductor chip is glued. The glue head 18 is connected to the glue box 16 by a connecting pipe, and a conveyor belt 20 is arranged on the top of the base 1, and the semiconductor chip with glue is transported by the conveyor belt 20, and the conveyor belt 20 is located below the feed port 21.

[0023] The working principle of this embodiment is as follows: when in use, first, the semiconductor chip is placed on the workbench 13, and the semiconductor chip is placed between the fixed plate and the limit plate 7. Then, the first threaded rod 3 is rotated under the drive of the positive rotation of the motor 2, thereby driving the threaded sleeve 4 to move, and then driving the side plate 5, the connecting shaft 6 and the limit plate 7 to move forward, thereby driving the limit plate 7 to approach the fixed plate, thereby clamping the semiconductor chip. Next, the second threaded rod 17 is twisted to drive the slider to move, thereby driving the glue box 16 and the dispensing head 18 to move, and then the dispensing head 18 is moved to the semiconductor chip. The upper part of the body chip is moved, and then the slide 15 is pushed downward, so that the dispensing head 18 contacts the semiconductor chip, and then the semiconductor chip is dispensed. After the dispensing is completed, the glue box 16 and the dispensing head 18 are lifted up, and then, the limit plate 7 is retracted under the drive of the reverse rotation of the motor 2. At the same time, the vertical plate 9 is driven to slide in the slide groove 10 under the connection action of the connecting rod 11, thereby driving the push rod 12 to push forward, and then pushing the semiconductor chip to move, so that the semiconductor chip is pushed from the discharge port 21 to the conveyor belt 20, and then the semiconductor chip is transported away by the conveyor belt 20.

[0024] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor chip dispensing device, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to a workbench (13), the top of the workbench (13) is provided with a feed port (21), the top of the base (1) is fixedly connected to a motor (2), the output end of the motor (2) is connected to a first threaded rod (3) through a coupling, the outer wall thread sleeve of the first threaded rod (3) is provided with a threaded sleeve (4), the threaded sleeve (4) slides on the top of the base (1), one side of the threaded sleeve (4) is rotatably connected to a connecting rod (11), the other end of the connecting rod (11) is rotatably connected to a vertical plate (9), the top of the vertical plate (9) is slidably plugged with the workbench (13), one side of the vertical plate (9) is fixedly connected to a push rod (12), the top of the base (1) is provided with a slide groove (10), and the vertical plate (9) slides in the slide groove (10).

2. A semiconductor chip dispensing device according to claim 1, characterized in that: The top of the threaded sleeve (4) is fixedly connected to a side plate (5), the side plate (5) is slidably plugged into the workbench (13), a connecting shaft (6) is slidably plugged into one side of the side plate (5), the other end of the connecting shaft (6) is fixedly connected to a limiting plate (7), and a spring (8) is sleeved on the outer wall of the connecting shaft (6).

3. A semiconductor chip dispensing device according to claim 1, characterized in that: One side of the workbench (13) is fixedly connected to a support frame (14), the other side of the workbench (13) is fixedly connected to a C-shaped support frame (19), and a slide frame (15) is slidably connected between the C-shaped support frame (19) and the support frame (14).

4. A semiconductor chip dispensing device according to claim 3, characterized in that: A second threaded rod (17) is rotatably inserted between the two ends of the slide (15), and a sliding block is threadedly sleeved on the outer wall of the second threaded rod (17), and the sliding block slides on the slide (15).

5. A semiconductor chip dispensing device according to claim 4, characterized in that: The top of the slider is fixedly connected to a glue box (16), the bottom of the slider is fixedly connected to a glue dispensing head (18), and the glue dispensing head (18) and the glue box (16) are connected via a connecting pipe.

6. The semiconductor chip dispensing device according to claim 1, characterized in that: A conveyor belt (20) is arranged on the top of the base (1), and the conveyor belt (20) is located below the discharge port (21).

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