Cleaning equipment

Abstract

The utility model relates to cleaning equipment. The cleaning equipment comprises a mixing tank, a gas supply assembly, a medium supply assembly and a heating assembly. The mixing tank is provided with a mixing cavity and a heating space which are not communicated with each other, and the heating space is arranged around the mixing cavity; the gas supply assembly is used for inputting pressurized gas into the mixing cavity; the medium supply assembly is used for inputting a cleaning medium into the mixing cavity; the heating assembly can provide a heating medium for the heating space, and the heating medium circularly flows in the heating assembly and the heating space. The medium supply assembly inputs the cleaning medium into the mixing cavity, the heating medium in the heating space heats the cleaning medium in the mixing cavity to vaporize the cleaning medium, and the pressurized gas input into the mixing cavity by the gas supply assembly is mixed with the vaporized cleaning medium. Next, the crystal can be cleaned only by spraying the mixed gas to the surface of the crystal. Therefore, the crystal does not need to be immersed in the cleaning liquid, the cleaning liquid is not left on the surface of the crystal, the subsequent drying time can be effectively shortened, and the production efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor processing equipment, and in particular, relates to a cleaning equipment. Background Art

[0002] With the continuous development of science and technology, chips are crucial in today's information age, and the chip manufacturing process is very complicated. Specifically, the crystal is thinned, polished, and ground to reduce surface damage, and then enters the etching and cleaning steps. In the cleaning step, the wafer is generally immersed in a cleaning agent, then the wafer is taken out and dried. The drying process takes a long time, affecting production efficiency. Utility Model Content

[0003] The technical problem to be solved by the present application is to provide a cleaning device for cleaning wafers, which can shorten the drying time and improve the production efficiency.

[0004] The technical solution proposed in this application is:

[0005] A cleaning device, comprising:

[0006] A mixing tank having a mixing chamber and a heating space which are not connected to each other, wherein the heating space is arranged around the mixing chamber;

[0007] A gas supply assembly connected to the mixing tank and used to input pressurized gas into the mixing chamber;

[0008] a medium supply assembly, connected to the mixing tank, for inputting cleaning medium into the mixing chamber; and

[0009] A heating component is connected to the mixing tank and communicated with the heating space. The heating component can provide a heating medium to the heating space and allow the heating medium to circulate in the heating component and the heating space.

[0010] Furthermore, the cleaning equipment also includes a first pressure detector and a first pressure relief valve, and the first pressure detector and the first pressure relief valve are both disposed in the mixing tank and arranged corresponding to the mixing chamber.

[0011] Further, the medium supply assembly includes a medium pipeline and a supply valve, the medium pipeline is connected to the mixing tank, and the supply valve is arranged on the medium pipeline;

[0012] The cleaning device further comprises a first liquid level detector, which is disposed in the mixing tank and arranged corresponding to the mixing chamber.

[0013] Furthermore, the gas supply assembly includes a gas supply pipe, a first heating element and a flow regulating valve, the gas supply pipe is connected to the mixing tank, the first heating element and the flow regulating valve are both arranged on the gas supply pipe, and the first heating element is used to heat the pressurized gas input into the mixing chamber.

[0014] Furthermore, the gas supply pipeline also includes a preheating section, which is located upstream of the first heating element, and the heating component can also heat the pressurized gas in the preheating section.

[0015] Furthermore, the heating component includes a liquid storage component, a second heating component, a circulating power component, an input pipe and a return pipe, the liquid storage component is used to store the heating medium, the second heating component is arranged in the liquid storage component, and is used to heat the heating medium, the input pipe and the return pipe are both connected between the liquid storage component and the heating space, and the circulating power component is arranged in the input pipe and / or the return pipe.

[0016] Furthermore, the return pipe passes around the gas supply component to heat the pressurized gas.

[0017] Furthermore, the heating component also includes a liquid infusion pipeline, a liquid infusion valve and a second liquid level detector, the liquid infusion pipeline is connected to the liquid storage component, the liquid infusion valve is arranged on the liquid infusion pipeline, and the second liquid level detector is arranged on the liquid storage component.

[0018] Furthermore, the heating component also includes a drain pipe and a drain valve, the drain pipe is connected to the liquid storage component, and the drain valve is arranged on the drain pipe.

[0019] Furthermore, the heating component also includes a second pressure detector and a second pressure relief valve, and the second pressure detector and the second pressure relief valve are both arranged in the liquid storage part.

[0020] Compared with the prior art, the beneficial effects of this application are:

[0021] Using the above-mentioned cleaning equipment, the medium supply component inputs the cleaning medium into the mixing chamber, and the heating medium in the heating space heats the cleaning medium in the mixing chamber, so that the cleaning medium is vaporized, and the pressurized gas is supplied into the mixing chamber through the gas supply component to mix with the vaporized cleaning medium to form a mixed gas. Next, it is only necessary to spray the mixed gas onto the surface of the crystal to achieve the cleaning of the crystal. In this way, there is no need to immerse the crystal in the cleaning liquid, and no cleaning liquid will remain on the surface of the crystal, which can effectively shorten the subsequent drying time and improve production efficiency. At the same time, no traces will be left on the surface of the crystal, ensuring the normal use of the crystal. In addition, under the action of the pressurized gas, the impact force of the mixed gas is relatively large, which can increase the cleaning force and ensure that the surface of the crystal is cleaned. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are used to provide further understanding of the present application and constitute a part of the specification. They are used to explain the present application together with the embodiments of the present application and do not constitute a limitation of the present application.

[0023] Figure 1 A schematic diagram of the structure of a cleaning device provided in one embodiment of the present application.

[0024] Description of labels:

[0025] 110, mixing tank; 120, medium supply assembly; 130, air supply assembly; 140, heating assembly; 111, tank body; 112, heating layer; 113, injection pipeline; 114, injection valve; 115, first pressure detector; 116, first pressure relief valve; 117, first temperature detector; 118, first liquid level detector; 121, medium pipeline; 122, supply valve; 131. Air supply pipeline; 132. First heating element; 133. Flow regulating valve; 1311. Preheating section; 134. Second temperature detector; 135. Air supply valve; 141. Liquid storage element; 142. Second heating element; 143. Circulating power element; 144. Input pipeline; 145. Return pipeline; 146. Liquid replenishing pipeline; 147. Liquid replenishing valve; 148. Second liquid level detector; 149. Return valve; 150. Liquid discharge pipeline; 151. Liquid discharge valve; 152. Second pressure detector; 153. Second pressure relief valve; 154. Third temperature detector. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In order to facilitate understanding of the technical solution of the present application, the existing wafer cleaning steps are described here: Currently, the wafer is usually immersed in a cleaning solution for cleaning, and then the wafer is taken out and dried. Since the wafer is immersed in the cleaning solution, it takes a long time to dry, resulting in low production efficiency. At the same time, the cleaning solution may also leave traces on the surface of the wafer during the drying process, affecting the use of the wafer. In addition, the cleaning force is low when the wafer is immersed in the cleaning solution for cleaning, and there is also a situation where the wafer is not cleaned cleanly.

[0029] Based on the above problems, an embodiment of the present application provides a cleaning device, such as Figure 1 As shown, the cleaning device includes a cleaning device and a nozzle, the cleaning device is connected to the nozzle, and the cleaning device is used to vaporize the cleaning medium and mix it with the pressurized gas, and then spray the mixed gas toward the crystal through the nozzle, so as to clean the crystal surface. Since the crystal will not be immersed in the cleaning liquid, no cleaning liquid will remain on the surface of the crystal, so the subsequent drying time can be effectively shortened, and the production efficiency can be improved. At the same time, no traces will be left on the surface of the crystal, ensuring the normal use of the crystal. In addition, the impact force of the mixed gas is large, which can increase the cleaning force and ensure that the crystal surface is cleaned.

[0030] It should be noted that in this embodiment, the cleaning medium can be one of isopropyl alcohol, ammonia water, and sodium hydroxide, and the pressurized gas is nitrogen. Of course, the cleaning medium can be determined according to the actual product to be cleaned, and the corresponding pressurized gas can also be determined according to actual needs, which is not limited here.

[0031] In one embodiment, the cleaning device includes a mixing tank 110 and a medium supply assembly 120, an air supply assembly 130, and a heating assembly 140 connected to the mixing tank 110. The mixing tank 110 is connected to a nozzle, the medium supply assembly 120 is used to input a cleaning medium into the mixing tank 110, the air supply assembly 130 is used to input a pressurized gas into the mixing tank 110, and the heating assembly 140 is used to heat the cleaning medium in the mixing tank 110, so that the cleaning medium is vaporized and mixed with the pressurized gas in the mixing tank 110, and then the mixed gas in the mixing tank 110 is ejected through the nozzle.

[0032] Furthermore, the mixing tank 110 has a mixing chamber and a heating space that are not connected to each other, and the heating space is arranged around the mixing chamber. The medium supply component 120 and the gas supply component 130 are both connected to the mixing chamber to input the cleaning medium and the pressurized gas into the mixing chamber respectively. The heating component 140 is connected to the heating space and can provide a heating medium to the heating space, and the heating medium circulates in the heating component 140 and the heating space, and the heating medium in the heating space heats the cleaning medium in the mixing chamber, so that the cleaning medium is vaporized.

[0033] It should be noted that, in this embodiment, water vapor is input into the heating space to heat the cleaning medium. Of course, in other embodiments, the heating medium may also be oil or other flowing substances capable of heat exchange, which is not limited here. The heating space is arranged around the mixing chamber, and then the cleaning medium in the mixing chamber is heated by a heating medium such as water vapor, thereby achieving uniform heating of the mixing chamber, avoiding uneven heating of the cleaning medium, making the temperature of the cleaning medium more stable, and reducing the precipitation of crystals in the cleaning medium.

[0034] It should be explained that the mixing tank 110 includes a tank body 111 and a heating layer 112. The tank body 111 has a mixing chamber. The medium supply assembly 120 and the air supply assembly 130 are connected to the tank body 111. The heating layer 112 is arranged on the outside of the tank body 111 and encloses the surface of the tank body 111 to form a heating space, that is, the heating space is the interlayer space on the surface of the mixing tank 110. The heating assembly 140 is connected to the heating layer 112. After the heating medium flows into the heating space, it is wrapped around the surface of the tank body 111, thereby heating the cleaning medium in the mixing chamber.

[0035] In other embodiments, the heating layer 112 may also be a pipe spirally wound on the surface of the tank body 111, and the space in the pipe is the heating space. The heating medium can heat the tank body 111 during the flow in the pipe, thereby heating the cleaning medium in the mixing chamber. Of course, the present application preferably adopts the heating layer 112 and the tank body 111 to enclose a heating space to improve the heating effect.

[0036] Using the above-mentioned cleaning equipment, the medium supply component 120 inputs the cleaning medium into the mixing chamber, and the heating medium in the heating space heats the cleaning medium in the mixing chamber, so that the cleaning medium is vaporized, and the pressurized gas is supplied into the mixing chamber through the gas supply component 130 to mix with the vaporized cleaning medium to form a mixed gas. Next, it is only necessary to spray the mixed gas onto the surface of the crystal to achieve the cleaning of the crystal. In this way, there is no need to immerse the crystal in the cleaning liquid, and the cleaning liquid will not remain on the surface of the crystal, which can effectively shorten the subsequent drying time and improve production efficiency. At the same time, no traces will be left on the surface of the crystal, ensuring the normal use of the crystal. In addition, under the action of the pressurized gas, the impact force of the mixed gas is relatively large, which can increase the cleaning force and ensure that the surface of the crystal is cleaned.

[0037] It should be noted that, in this embodiment, the mixed gas in the mixing chamber is sprayed out through a nozzle, that is, an injection pipe 113 is provided, and the injection pipe 113 is connected between the mixing tank 110 and the nozzle. Further, an injection valve 114 is provided on the injection pipe 113 to control the on and off of the injection pipe 113.

[0038] In other embodiments, a jet port may be directly opened on the tank body 111, and then a valve may be set at the jet port to control the opening and closing of the jet port. After the pressure of the mixed gas in the tank body 111 reaches a preset pressure, the jet port may be opened to spray out the mixed gas to clean the crystal.

[0039] In one embodiment, the cleaning device further includes a first pressure detector 115 and a first pressure relief valve 116. The first pressure detector 115 and the first pressure relief valve 116 are both disposed in the mixing tank 110 and arranged corresponding to the mixing chamber, so as to detect the pressure in the mixing chamber through the first pressure detector 115, and to release the pressure through the first pressure relief valve 116 when the pressure in the mixing chamber is greater than a preset pressure value.

[0040] In one embodiment, the cleaning equipment also includes a first temperature detector 117, which is disposed in the mixing tank 110 and arranged corresponding to the mixing chamber to detect the temperature in the mixing chamber, thereby ensuring that the cleaning medium in the mixing tank 110 reaches a vaporization temperature, achieving mixing of the vaporized cleaning medium with the pressurized gas, and ensuring that the sprayed gas is a mixed gas, thereby ensuring the cleaning effect.

[0041] In one embodiment, the cleaning equipment also includes a first liquid level detector 118, which is disposed in the mixing tank 110 and arranged corresponding to the mixing chamber to detect the liquid level height of the cleaning medium in the mixing chamber, so that the medium supply component 120 operates according to the detection result of the first liquid level detector 118.

[0042] Furthermore, the medium supply assembly 120 includes a medium pipeline 121 and a supply valve 122. The medium pipeline 121 is connected to the mixing tank 110 and communicated with the mixing chamber to input the cleaning medium into the mixing chamber. The supply valve 122 is arranged on the medium pipeline 121 to control the on and off of the medium pipeline 121, thereby controlling the supply of the cleaning medium.

[0043] Specifically, when the liquid level of the cleaning medium in the mixing chamber is lower than the preset low liquid level value, the supply valve 122 is opened, and the medium pipeline 121 starts to input the cleaning medium into the mixing chamber; when the liquid level of the cleaning medium in the mixing chamber reaches the preset high liquid level value, the supply valve 122 is closed, and the medium pipeline 121 stops inputting the cleaning medium into the mixing chamber.

[0044] In one embodiment, the gas supply assembly 130 includes a gas supply pipeline 131, a first heating element 132 and a flow regulating valve 133. The gas supply pipeline 131 is connected to the mixing tank 110 and can input pressurized gas into the mixing chamber. The first heating element 132 and the flow regulating valve 133 are both arranged in the gas supply pipeline 131. The first heating element 132 is used to heat the pressurized gas input into the mixing chamber from the gas supply pipeline 131. In this way, after the heated pressurized gas enters the mixing chamber, the temperature in the mixing chamber will not be reduced, which facilitates the vaporization of the cleaning medium and the mixing with the pressurized gas. At the same time, the flow regulating valve 133 is used to adjust the flow of the pressurized gas input into the mixing chamber from the gas supply pipeline 131, so that the flow of the pressurized gas can be adjusted according to the pressure and temperature data in the mixing chamber to ensure that the concentration of the cleaning medium in the mixed gas meets the requirements.

[0045] It should be noted that in order to further ensure the accuracy of the concentration, a concentration detection mechanism can be set at the opening where the mixed gas is output from the mixing tank 110, or at the nozzle, and then the flow rate of the pressurized gas can be adjusted in real time according to the detection result of the concentration detection mechanism, or while adjusting the flow rate of the pressurized gas, the action of the heating component 140 and the medium supply component 120 can be adjusted, as long as the concentration of the cleaning medium in the mixed gas can be accurately adjusted.

[0046] Regarding the setting of the flow control valve 133, it should be noted that:

[0047] On the one hand, the flow regulating valve 133 can be arranged upstream of the first heating element 132, that is, the pressurized gas passes through the flow regulating valve 133 and the first heating element 132 in sequence, and the flow regulating valve 133 is arranged in front. In this way, after the first heating element 132 heats the pressurized gas, the pressure of the pressurized gas increases, and the flow regulating valve 133 can prevent the pressurized gas with increased pressure from affecting the input of the upstream pressurized gas. On the other hand, the flow regulating valve 133 can also be arranged downstream of the first heating element 132. At this time, a one-way valve can be arranged upstream of the first heating element 132 to prevent the pressurized gas with increased pressure from affecting the input of the upstream pressurized gas. At the same time, the flow regulating valve 133 arranged downstream of the first heating element 132 should also have a certain heat resistance.

[0048] In one embodiment, the gas supply pipeline 131 further includes a preheating section 1311, which is located upstream of the first heating element 132. The heating assembly 140 can also heat the pressurized gas in the preheating section 1311 to achieve preheating of the pressurized gas, facilitate the subsequent heating of the pressurized gas by the first heating element 132, and reduce energy loss. Of course, when the flow control valve 133 is disposed upstream of the first heating element 132, the heating section is also located upstream of the flow control valve 133.

[0049] Furthermore, the gas supply component 130 also includes a second temperature detector 134, which is arranged in the gas supply pipe 131 and located downstream of the first heating element 132, and is used to detect the temperature of the pressurized gas input into the mixing chamber, thereby ensuring that the temperature of the pressurized gas input into the mixing chamber meets the requirements.

[0050] In one embodiment, the gas supply assembly 130 further includes a gas supply valve 135, which is disposed in the gas supply pipeline 131 and is used to control the on-off of the gas supply pipeline 131. Specifically, the gas supply valve 135 includes two, one of which is disposed upstream of the preheating section 1311 and is used to control the input of pressurized gas, and the other is disposed downstream of the second temperature detector 134 to achieve closure when the temperature detection fails, thereby preventing a large amount of pressurized gas with unqualified temperature from entering the mixing chamber.

[0051] In one embodiment, the heating assembly 140 includes a liquid storage member 141, a second heating member 142, a circulating power member 143, an input pipe 144, and a return pipe 145. The liquid storage member 141 is used to store a heating medium, the second heating member 142 is disposed in the liquid storage member 141, and is used to heat the heating medium, the input pipe 144 and the return pipe 145 are both connected between the liquid storage member 141 and the heating space to form a circulation channel between the liquid storage member 141 and the heating space, and the circulating power member 143 is disposed in the input pipe 144 and / or the return pipe 145, so that the heating medium circulates along the liquid storage member 141, the input pipe 144, the heating space, and the return pipe 145.

[0052] It can be understood that the input pipe 144 is connected to the input end of the heating space so that the heating medium is input into the heating space, and the return pipe 145 is connected to the output end of the heating space so that the heating medium that has undergone heat exchange with the cleaning medium in the heating space can flow back to the liquid storage element 141 and be reheated by the second heating element 142.

[0053] It should be noted that, in this embodiment, the liquid storage element 141 includes liquid water and water vapor, the second heating element 142 is used to heat the liquid water to form water vapor, the medium flowing in the input pipe 144 is water vapor, and the water vapor is at least partially condensed into liquid water after heat exchange with the cleaning medium in the heating space, and there is at least flowing liquid water in the return pipe 145, so at this time, the circulating power element 143 can be set on both the input pipe 144 and the return pipe 145 to ensure the circulation of the heating medium. In other embodiments, when the state of the heating medium is only one, such as liquid, the circulating power element 143 can be separately set on the input pipe 144 or the return pipe 145 to provide power for the circulation of the heating medium.

[0054] Furthermore, the heating component 140 also includes a liquid infusion pipe 146, a liquid infusion valve 147 and a second liquid level detector 148. The liquid infusion pipe 146 is connected to the liquid storage component 141 and can input heating medium into the liquid storage component 141. The liquid infusion valve 147 is arranged on the liquid infusion pipe 146 to control the on-off of the liquid infusion pipe 146. The second liquid level detector 148 is arranged on the liquid storage component 141 to detect the liquid level of the heating medium in the liquid storage component 141.

[0055] It should be noted that when the heating medium is water vapor, the second liquid level detector 148 is used to detect the liquid level of the liquid water in the liquid storage part 141. When the liquid water level is lower than the preset low liquid level value, the liquid replenishment valve 147 is opened, and the liquid replenishment pipe 146 inputs liquid water into the liquid storage part 141; when the liquid water level reaches the preset high liquid level value, the liquid replenishment valve 147 is closed. When the heating medium is other and the form is only liquid, since the heating medium will not have evaporation loss, the liquid replenishment pipe 146, the liquid replenishment valve 147 and the second liquid level detector 148 may not be provided while ensuring the sealing. Of course, it is preferred to adopt an embodiment in which the liquid replenishment pipe 146, the liquid replenishment valve 147 and the second liquid level detector 148 are provided.

[0056] It should be further explained that the infusion pipe 146 can be connected to the return pipe 145, and thus connected to the side wall of the liquid storage part 141 through the return pipe 145. In addition, a return valve 149 can be provided at one end of the return pipe 145 close to the liquid storage part 141, which can be closed when it is necessary to stop inputting the heating medium into the liquid storage part 141.

[0057] In one embodiment, the heating component 140 also includes a drain pipe 150 and a drain valve 151. The drain pipe 150 is connected to the liquid storage component 141 and is used to discharge the cleaning medium in the liquid storage component 141. The drain valve 151 is arranged on the drain pipe 150 and is used to control the on and off of the drain pipe 150.

[0058] The heating medium may be contaminated after long-term use. In order to avoid the contamination affecting the use of the heating medium, the contaminated heating medium can be discharged from the liquid storage part 141 through the drainage pipe 150. Preferably, the drainage pipe 150 is connected to the bottom of the liquid storage part 141 to ensure that the waste liquid in the liquid storage part 141 is completely discharged.

[0059] In one embodiment, the heating component 140 also includes a second pressure detector 152 and a second pressure relief valve 153, and the second pressure detector 152 and the second pressure relief valve 153 are both arranged in the liquid storage part 141 to detect the pressure in the liquid storage part 141 and realize pressure control to ensure the safety of the equipment.

[0060] In one embodiment, the heating component 140 also includes a third temperature detector 154, which is disposed in the liquid storage component 141 and is used to detect the temperature of the heating medium in the liquid storage component 141, so as to ensure that the temperature of the heating medium input into the heating space meets the requirements and the temperature of the heating medium can vaporize the cleaning medium.

[0061] In one embodiment, the return pipe 145 in the heating assembly 140 also passes around the preheating section 1311 of the gas supply pipe 131, thereby heating the pressurized gas in the preheating section 1311, improving the utilization rate of waste heat and reducing energy loss.

[0062] In one embodiment, the cleaning device further comprises a control mechanism, which is electrically connected to the valve, pressure detector, temperature detector, liquid level detector and heating element in the above embodiments, so as to realize automatic operation of the cleaning device.

[0063] In order to facilitate understanding of the technical solution of this application, Figure 1 The working process of the cleaning device in the above embodiment is described as follows:

[0064] For the heating component 140: open the liquid replenishing valve 147, and inject liquid water into the liquid storage part 141 through the liquid replenishing pipe 146 until the liquid level of the liquid water reaches the preset high liquid level value, and then close the liquid replenishing valve 147. Then the second heating element 142 heats the liquid water to heat the liquid water into water vapor, and the water vapor is guided to the heating space through the circulating power element 143 on the input pipe 144. After exchanging heat with the cleaning medium in the mixing chamber, the water vapor condenses into condensed water with a certain temperature, and the condensed water is guided to flow back to the liquid storage part 141 through the circulating power element 143 in the return pipe 145. During the reflux process of the condensed water in the return pipe 145, the residual heat can be used to heat the pressurized gas in the preheating section 1311.

[0065] For the cleaning medium and pressurized gas: open the supply valve 122, supply the cleaning medium into the mixing chamber through the supply pipeline until the liquid level of the cleaning medium reaches the preset high liquid level value, and then close the supply valve 122. The heating medium evenly heats the cleaning medium in the mixing chamber until the cleaning medium reaches the preset temperature and begins to vaporize. While the cleaning medium vaporizes, the gas supply valve 135 opens, and the pressurized gas heated by the heating medium and the first heating element 132 enters the mixing chamber and mixes with the vaporous cleaning medium; then open the injection valve 114, and the mixed gas is sprayed toward the wafer through the nozzle to achieve the cleaning of the crystal.

[0066] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A cleaning device, characterized in that: include: A mixing tank having a mixing chamber and a heating space which are not connected to each other, wherein the heating space is arranged around the mixing chamber; A gas supply assembly connected to the mixing tank and used to input pressurized gas into the mixing chamber; A medium supply assembly, connected to the mixing tank, for inputting a cleaning medium into the mixing chamber; and A heating component is connected to the mixing tank and communicated with the heating space. The heating component can provide a heating medium to the heating space and allow the heating medium to circulate in the heating component and the heating space.

2. The cleaning device according to claim 1, characterized in that: The cleaning device further includes a first pressure detector and a first pressure relief valve. The first pressure detector and the first pressure relief valve are both disposed in the mixing tank and arranged corresponding to the mixing chamber.

3. The cleaning device according to claim 1, characterized in that: The medium supply assembly comprises a medium pipeline and a supply valve, the medium pipeline is connected to the mixing tank, and the supply valve is arranged on the medium pipeline; The cleaning device further comprises a first liquid level detector, which is disposed in the mixing tank and arranged corresponding to the mixing chamber.

4. The cleaning device according to claim 1, characterized in that: The gas supply assembly includes a gas supply pipeline, a first heating element and a flow regulating valve. The gas supply pipeline is connected to the mixing tank. The first heating element and the flow regulating valve are both arranged on the gas supply pipeline. The first heating element is used to heat the pressurized gas input into the mixing chamber.

5. The cleaning device according to claim 4, characterized in that: The gas supply pipeline further includes a preheating section, which is located upstream of the first heating element. The heating assembly is also capable of heating the pressurized gas in the preheating section.

6. The cleaning device according to any one of claims 1 to 5, characterized in that: The heating component includes a liquid storage component, a second heating component, a circulating power component, an input pipe and a return pipe. The liquid storage component is used to store the heating medium. The second heating component is arranged in the liquid storage component and is used to heat the heating medium. The input pipe and the return pipe are both connected between the liquid storage component and the heating space. The circulating power component is arranged in the input pipe and / or the return pipe.

7. The cleaning device according to claim 6, characterized in that: The return pipe passes around the gas supply assembly to heat the pressurized gas.

8. The cleaning device according to claim 6, characterized in that: The heating component also includes a liquid replenishing pipeline, a liquid replenishing valve and a second liquid level detector. The liquid replenishing pipeline is connected to the liquid storage component. The liquid replenishing valve is arranged on the liquid replenishing pipeline. The second liquid level detector is arranged on the liquid storage component.

9. The cleaning device according to claim 6, characterized in that: The heating component also includes a liquid discharge pipe and a liquid discharge valve. The liquid discharge pipe is connected to the liquid storage component, and the liquid discharge valve is arranged on the liquid discharge pipe.

10. The cleaning device according to claim 6, characterized in that: The heating component further includes a second pressure detector and a second pressure relief valve, and the second pressure detector and the second pressure relief valve are both arranged in the liquid storage member.

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