Carrying table and laser mass welding equipment

Abstract

The utility model provides a carrying table and laser mass welding equipment. The carrying table comprises a heating plate; the bearing plate is arranged on the heating plate, adsorption holes are formed in the bearing plate, and the adsorption holes are used for adsorbing workpieces; and the partition plate is arranged between the heating plate and the bearing plate. It can be seen that when the carrying table is used for heating the workpiece, the workpiece can be prevented from being heated too fast.

Description

Technical Field

[0001] The present application belongs to the field of carrier technology, and more specifically, to a carrier and laser mass welding equipment. Background Art

[0002] In the related art, the workpiece needs to be preheated before processing. However, when the current stage preheats the workpiece, the workpiece will be heated too quickly and unevenly. Utility Model Content

[0003] The present application is to provide a carrier and laser mass welding equipment so that the heating temperature of the workpiece by the carrier is uniform.

[0004] The technical solution adopted in this application is a carrier, comprising:

[0005] Heating plate;

[0006] A carrying plate, disposed on the heating plate, wherein adsorption holes are disposed on the carrying plate, and the adsorption holes are used to adsorb workpieces; and

[0007] The partition is arranged between the heating plate and the supporting plate.

[0008] It can be seen that in the carrier of the present application, after the partition is set, the heat generated by the heating plate is first transferred to the partition, and then transferred to the supporting plate through the partition, so as to heat the workpiece on the supporting plate. This method can reduce the speed of heat transfer. At the same time, when the heat is transferred from the heating plate to the partition, part of the heat will be dissipated at the partition, avoiding excessive heat from being directly transferred to the supporting plate, causing the workpiece on the supporting plate to heat up too quickly.

[0009] Optionally, the heating plate is provided with a limiting groove, and the partition is arranged in the limiting groove;

[0010] The bearing plate is bonded to the partition plate;

[0011] The partition is made of glass fiber material.

[0012] Optionally, the carrying plate is provided with adsorption holes, and the adsorption holes are used to adsorb the workpiece;

[0013] The partition plate is provided with an air guide groove, and the air guide groove is communicated with the adsorption hole.

[0014] Optionally, a plurality of adsorption holes are provided on the carrying plate;

[0015] The air guide grooves are respectively connected to the plurality of adsorption holes; and

[0016] The air guide grooves are provided in plurality, and each of the air guide grooves is connected to a plurality of the adsorption holes;

[0017] The plurality of air guide grooves are interconnected.

[0018] Optionally, the heating plate comprises a substrate and a heating element, the partition is arranged on the substrate, and the heating element is arranged at an end of the substrate away from the partition.

[0019] Optionally, the substrate is provided with an air guide hole, and the air guide hole is communicated with the air guide groove; and

[0020] The substrate is provided with an air inlet hole and an air outlet hole, and the air inlet hole and the air outlet hole are respectively connected with the air guide hole.

[0021] Optionally, it further comprises a base, wherein the base is spaced apart from the heating plate; and

[0022] The base is connected to the heating plate via a plurality of height adjusting members.

[0023] Optionally, a leveling drive device is further included, and the leveling drive device is drivingly connected to the base.

[0024] Optionally, a protection plate is further included, wherein the protection plate is arranged on the heating plate, the protection plate is provided with a receiving cavity, the supporting plate is located in the receiving cavity, and the adsorption plane of the supporting plate is higher than the protection plate.

[0025] A laser mass welding device comprises a laser device and a carrier, wherein the laser device is arranged opposite to the carrier, and the laser device is used for laser processing a workpiece on the carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0027] Figure 1 One of the structural schematic diagrams of a carrier provided in an embodiment of the present application;

[0028] Figure 2 for Figure 1 One of the structural schematic diagrams of a carrier provided in the embodiment;

[0029] Figure 3 for Figure 2 Sectional view at AA in the middle;

[0030] Figure 4 for Figure 1A schematic diagram of a carrier explosion provided in an embodiment.

[0031] Reference numerals:

[0032] 100, heating plate; 110, limiting groove; 120, base plate; 130, heating element; 140, air inlet; 150, air guide hole;

[0033] 200, a carrying plate; 210, an adsorption hole;

[0034] 300, partition; 310, air guide groove; 320, via hole;

[0035] 400, base; 500, height adjustment member; 600, leveling drive device; 700, protection plate; 710, accommodating cavity. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0037] It should be noted that when a metastructure is referred to as being "fixed to" or "set on" another metastructure, it can be directly on the other metastructure or indirectly on the other metastructure. When a metastructure is referred to as being "connected to" another metastructure, it can be directly connected to the other metastructure or indirectly connected to the other metastructure.

[0038] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element structure referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of some applications, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] The present application provides a carrier that can be used to support a workpiece and heat the workpiece.

[0041] For example, in some embodiments, the stage can be used to support the LED chip so that the laser device can subsequently perform laser processing on the LED chip. When the stage supports the LED chip, the stage can heat the LED chip before laser processing to achieve preheating of the LED chip.

[0042] See also Figure 1 and Figure 3 , the carrier includes a heating plate 100, a carrying plate 200 and a partition 300.

[0043] The carrying plate 200 is disposed on the heating plate 100 , and the carrying plate 200 is used for carrying a workpiece.

[0044] The partition plate 300 is disposed between the heating plate 100 and the supporting plate 200 .

[0045] Specifically, after the heating plate 100 generates heat, the heat is transferred to the carrying plate 200 through the partition plate 300 , and then the workpiece is heated through the carrying plate 200 .

[0046] It can be seen that in the carrier of the present application, after the partition 300 is set, the heat generated by the heating plate 100 is first transferred to the partition 300, and then transferred to the supporting plate 200 through the partition 300, so as to heat the workpiece on the supporting plate 200. This method can reduce the speed of heat transfer. At the same time, after the heat is transferred from the heating plate 100 to the partition 300, a part of the heat will be dissipated at the partition 300, so as to avoid excessive heat being directly transferred to the supporting plate 200, causing the workpiece on the supporting plate 200 to heat up too quickly.

[0047] See also Figure 4 In some embodiments, the heating plate 100 may be provided with a limiting groove 110, and the partition 300 is disposed in the limiting groove 110. The limiting groove 110 can facilitate the installation and positioning of the partition 300, and can also prevent the height of the carrier from being too high, making the structure of the carrier more compact.

[0048] Specifically, the partition 300 is disposed in the limiting groove 110 to achieve limiting on the heating plate 100, and the partition 300 can be fixed on the heating plate 100 by means of bolts or the like.

[0049] In some embodiments, in order to facilitate the connection between the carrier plate 200 and the partition plate 300, the carrier plate 200 can be bonded together with the partition plate 300. For example, the carrier plate 200 and the partition plate 300 can be bonded together by high temperature glue.

[0050] In some embodiments, in order to further reduce the speed of workpiece temperature rise, the partition 300 may be made of glass fiber material. It is understandable that the partition 300 made of glass fiber material can have a certain degree of heat insulation effect, thereby further reducing the efficiency of heat transfer from the heating plate 100 to the carrier plate 200.

[0051] See also Figure 1 and Figure 4 The carrier plate 200 may be provided with adsorption holes 210, and the adsorption holes 210 are used to adsorb the workpiece on the carrier plate 200, so that the workpiece can be fixed on the carrier plate 200, which is convenient for processing the workpiece.

[0052] Specifically, in some embodiments, the external vacuum generating device can be directly connected to the adsorption hole 210 of the carrier plate 200, so that the adsorption hole 210 can generate negative pressure gas. For example, an airway connected to the adsorption hole 210 can be provided inside the carrier plate, and the external vacuum generating device can be connected to the airway.

[0053] Also, see Figure 3 and Figure 4 In some embodiments, the partition plate 300 may be provided with an air guide groove 310, which is connected to the adsorption hole 210. This method can make it unnecessary to set an air channel inside the carrier plate 200, make the structure of the carrier plate 200 simpler, and facilitate processing, and also make the carrier plate 200 thinner.

[0054] Specifically, negative pressure gas can be introduced into the gas guide groove 310 in the partition 300, and then the negative pressure gas can be transmitted to the adsorption hole 210 by the gas guide groove 310, so that the adsorption hole 210 can generate negative pressure and thus achieve adsorption of the workpiece.

[0055] For example, the air guide groove 310 can be arranged on the surface of the partition 300 close to the side of the carrier plate 200. After the carrier plate 200 is arranged on the partition 300, the adsorption hole 210 on the carrier plate 200 is connected with the air guide groove 310. It can be understood that in some embodiments, since the carrier plate 200 and the partition 300 are previously connected together by bonding, after the carrier plate 200 and the partition 300 are bonded together, the sealing of the air guide groove 310 can be ensured, and then sufficient negative pressure can be generated in the adsorption hole 210 to adsorb the workpiece. In addition, this method can not only ensure that the adsorption hole 210 can generate sufficient negative pressure, but also facilitate processing.

[0056] See also Figure 1 and Figure 4In this embodiment, a plurality of adsorption holes 210 may be provided on the carrier plate 200, and the plurality of adsorption holes 210 cooperate with each other to adsorb the workpiece. In this way, on the one hand, it can ensure that the workpiece is stably adsorbed on the carrier, and on the other hand, it can reduce or avoid the workpiece from warping due to heat during processing.

[0057] Furthermore, in order to facilitate the generation of negative pressure gas in the multiple adsorption holes 210, the gas guide groove 310 can be respectively connected to the multiple adsorption holes 210. That is, negative pressure gas can be introduced into multiple adsorption holes 210 in one gas guide groove 310 at the same time.

[0058] Furthermore, a plurality of air guide grooves 310 may be provided on the partition plate 300 , and each of the air guide grooves 310 is connected to a plurality of adsorption holes 210 .

[0059] It is understandable that in some embodiments, when the supporting plate 200 is covered with adsorption holes 210 , for example, when many adsorption holes 210 are evenly distributed on the supporting plate 200 , a plurality of air guide grooves 310 may be provided on the partition 300 , and each of the air guide grooves 310 may be connected to a plurality of adsorption holes 210 .

[0060] Furthermore, in some embodiments, in order to facilitate the introduction of negative pressure gas into each air guide groove 310, multiple air guide grooves 310 can be interconnected. At this time, negative pressure gas can be generated in multiple air guide grooves 310 by introducing negative pressure gas into one or a few of the air guide grooves 310, and negative pressure gas can be generated in multiple adsorption holes 210 on the supporting plate 200.

[0061] For example, when the partition 300 is a square structure, a plurality of air guide grooves 310 may be provided on the partition 300 along the length direction and / or width direction of the partition 300. In some embodiments, an air guide groove 310 may be connected to a group of a plurality of adsorption holes 210 arranged along the length direction of the carrier plate 200 in the carrier plate 200.

[0062] See also Figure 3 and Figure 4 The heating plate 100 may further include a substrate 120 and a heating element 130 , wherein the partition 300 is disposed on the substrate 120 , and the heating element 130 is disposed at one end of the substrate 120 away from the partition 300 .

[0063] Specifically, the heating element 130 can heat the substrate 120 to make the substrate 120 generate heat, and the substrate 120 then transfers the heat to the partition 300 .

[0064] It can be understood that since the heating element 130 is arranged on the side of the substrate 120 away from the partition 300, the heating element 130 first needs to transfer heat to the substrate 120, and then the substrate 120 transfers heat to the partition 300, and the partition 300 transfers the heat to the supporting plate 200, and finally the workpiece is heated by the supporting plate 200. This method can further avoid the workpiece from heating up too quickly when heated.

[0065] In addition, the heating element 130 is directly disposed on the side of the substrate 120 away from the partition 300 , which can facilitate the installation of the heating element 130 .

[0066] Furthermore, in some embodiments, the substrate 120 is provided with an air guide hole 150 (not shown in the figure), and the air guide hole 150 is connected to the air guide groove 310 .

[0067] Specifically, the negative pressure gas can be transmitted to the gas guide groove 310 through the gas guide hole 150. For example, the substrate 120 and the partition 300 can be respectively provided with mutually connected via holes 320, and the via holes 320 on the substrate 120 can be connected with the gas guide hole 150 of the substrate 120, and the via holes 320 on the partition 300 can be connected with the gas guide groove 310 on the partition 300. This method can facilitate the generation of negative pressure gas in the gas guide groove 310, so that the thickness of the partition 300 can be reduced.

[0068] Furthermore, an air inlet hole 140 and an air outlet hole may be further provided on the substrate 120 , and the air inlet hole 140 and the air outlet hole are respectively connected to the air guide hole 150 .

[0069] Specifically, negative pressure gas may enter the air guide hole 150 from the air inlet hole 140 , and the negative pressure gas in the air guide hole 150 may be discharged from the air outlet hole.

[0070] In some embodiments, the air inlet hole 140 and the air outlet hole can be respectively arranged on the peripheral side of the substrate 120, the air inlet hole 140 can be used to install the air inlet connector, and the air outlet hole can be used to install the air outlet connector, wherein the air inlet connector and the air outlet connector can be used to connect to the vacuum generating device.

[0071] It can be seen that in the above embodiment, the negative pressure gas is transmitted to the adsorption holes 210 on the supporting plate 200 in turn through the air guide holes 150 on the substrate 120 and the air guide grooves 310 on the partition 300. This method can make the air inlet connector installed without the air inlet hole 140 and the air outlet connector installed at a position away from the supporting plate 200, avoiding the interference of the air inlet connector and the air outlet connector with the workpiece or the workpiece loading and unloading mechanism, and at the same time can make the assembly between the supporting plate 200, the partition 300 and the substrate 120 more compact.

[0072] See also Figure 1 and Figure 4The carrier may further include a base 400 , the base 400 is spaced apart from the heating plate 100 , and the base 400 and the heating plate 100 are connected via a plurality of height adjusting members 500 .

[0073] It can be understood that the spacing between the base 400 and the heating plate 100 can reduce the heat generated by the heating plate 100 being transferred to the base 400, causing the base 400 to deform due to heat, and further causing the supporting plate 200 arranged on the base 400 to tilt or fail to maintain a horizontal supporting plane, affecting the processing effect of the workpiece.

[0074] In addition, in the present application, since the partition 300 is provided, part of the heat generated during the processing of the workpiece can also be isolated by the partition 300, thereby preventing excessive heat from being transferred to the base 400 during the processing and causing deformation of the base 400.

[0075] Furthermore, since the base 400 and the heating plate 100 are connected via a plurality of height adjusting members 500 , the flatness of the heating plate 100 and the partition 300 and the supporting plate 200 disposed on the heating plate 100 can be adjusted by adjusting the height adjusting members 500 .

[0076] For example, a plurality of height adjustment members 500 may be arranged around the edges of the heating plate 100 and the base 400 at intervals, so that the mechanical energy height of a plurality of regions in the heating plate 100 can be independently adjusted to ensure the adjustment of the flatness of the heating plate 100 and the bearing plate 200 arranged on the heating plate 100. The height adjustment member 500 may be a height adjustment bolt.

[0077] In some embodiments, when the heating plate 100 includes a substrate 120 and a heating element 130 , the substrate 120 and the base 400 are spaced apart from each other, and the base 400 and the substrate 120 are connected via a plurality of height adjusting members 500 .

[0078] In addition, since the substrate 120 and the base 400 are spaced apart, the heating element 130 can be located between the substrate 120 and the base 400 and fixed on the substrate 120. It can be understood that when the heating element 130 is located between the substrate 120 and the base 400, the heating element 130 does not contact the base 400. This method is convenient for the arrangement of the heating element 130 and can reduce the heat transfer to the base 400, causing the base 400 to deform.

[0079] See also Figure 1 and Figure 4 The stage may further include a leveling drive device 600, which is drivingly connected to the base 400, and the leveling drive device 600 is used to adjust the flatness of the base 400. The leveling drive device 600 may be a six-degree-of-freedom adjustment device.

[0080] See also Figure 1 and Figure 4 The carrier may further include a protective plate 700 , which is disposed on the heating plate 100 . The protective plate 700 is provided with a receiving cavity 710 . The carrying plate 200 is located in the receiving cavity 710 , and an adsorption plane of the carrying plate 200 is higher than the protective plate 700 .

[0081] It is understandable that since the carrier plate 200 is arranged on the heating plate 100 through the partition 300, the carrier plate 200 will protrude from the heating plate 100. Therefore, in order to prevent the carrier plate 200 from being bumped by external structures or devices, a protective plate 700 is provided to surround the carrier plate 200.

[0082] In addition, the present application also provides a laser mass welding device, including a laser device and the carrier in the above embodiment, the laser device and the carrier are arranged opposite to each other, and the laser device is used to perform laser processing on the workpiece on the carrier.

[0083] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of some applications should be included in the protection scope of some applications.

Claims

1. A carrier, characterized in that: include: Heating plate; A carrying plate, arranged on the heating plate, wherein adsorption holes are arranged on the carrying plate, and the adsorption holes are used for adsorbing workpieces; as well as The partition is arranged between the heating plate and the supporting plate.

2. The stage according to claim 1, characterized in that: The heating plate is provided with a limiting groove, and the partition is arranged in the limiting groove; The bearing plate is bonded to the partition plate; The partition is made of glass fiber material.

3. The stage according to claim 1, characterized in that: The bearing plate is provided with adsorption holes, and the adsorption holes are used to adsorb workpieces; The partition plate is provided with an air guide groove, and the air guide groove is communicated with the adsorption hole.

4. The stage according to claim 3, characterized in that: The carrying plate is provided with a plurality of adsorption holes; The air guide grooves are respectively connected to the plurality of adsorption holes; and The air guide grooves are provided in plurality, and each of the air guide grooves is connected to a plurality of the adsorption holes; The plurality of air guide grooves are interconnected.

5. The stage according to claim 3, characterized in that: The heating plate comprises a substrate and a heating element. The partition is arranged on the substrate, and the heating element is arranged at one end of the substrate away from the partition.

6. The stage according to claim 5, characterized in that: The substrate is provided with an air guide hole, and the air guide hole is communicated with the air guide groove; and The substrate is provided with an air inlet hole and an air outlet hole, and the air inlet hole and the air outlet hole are respectively connected with the air guide hole.

7. The stage according to claim 1, characterized in that: It also includes a base, the base is spaced apart from the heating plate; and The base is connected to the heating plate via a plurality of height adjusting members.

8. The stage according to claim 7, characterized in that: It also includes a leveling drive device, which is drivingly connected to the base.

9. The stage according to claim 1, wherein: It also includes a protection plate, which is arranged on the heating plate. The protection plate is provided with a receiving cavity. The supporting plate is located in the receiving cavity, and the adsorption plane of the supporting plate is higher than the protection plate.

10. A laser mass welding device, characterized in that: It comprises a laser device and a carrier as described in any one of claims 1 to 9, wherein the laser device is arranged opposite to the carrier, and the laser device is used to perform laser processing on the workpiece on the carrier.

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