Wafer chamfering processing detection device

Abstract

The utility model provides a wafer chamfering machining detection device which comprises a three-dimensional translation mechanism, a support, a rotating table, a driving mechanism, a grinding wheel, a single laser sensor and a PLC system. The three-dimensional translation mechanism is used for providing translation in the X direction, the Y direction and the Z direction; the bracket is connected to the three-dimensional translation mechanism; the rotating table is used for fixing and driving a wafer to rotate in an XY plane; the driving mechanism is arranged on the bracket; the grinding wheel is connected to the driving mechanism so as to rotate and chamfer the wafer on the rotating table; the laser sensor is installed on the support and at least used for detecting geometric structure parameters of the portion, chamfered by the grinding wheel, of the wafer in real time when the wafer on the rotating table is chamfered. The PLC system is in communication connection with the three-dimensional translation mechanism, the rotating table, the driving mechanism and the laser sensor so as to control operation of the three-dimensional translation mechanism, the rotating table, the driving mechanism and the laser sensor and receive geometric structure parameters, detected by the laser sensor in real time, of the portion, chamfered by the grinding wheel, of the wafer.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductors, and more specifically to a wafer chamfering processing detection device. Background Art

[0002] With the continuous development of science and technology, chips are essential to today's information age. However, the chip manufacturing process is very complicated. After cutting the wafer, the edge chamfering process begins. The key chamfering process is to chamfer the edge of the wafer into a bevel or arc surface to prevent the wafer from collapsing and completely eliminate the possibility of damage during future circuit manufacturing. Chamfering is to chamfer and grind the corresponding edges according to the requirements of the end user. Customers with different wafer sizes have different requirements for the shape of the grinding edge, including round edges, straight edges, notch corners, etc.

[0003] Conventionally, the quality of the wafer chamfering is tested separately after the chamfering process is completely completed. This separation of the chamfering process and the testing is not conducive to improving the overall efficiency of the chamfering process testing.

[0004] In addition, when the chamfer quality inspection of the wafer is performed separately, if contact inspection is used, there is a risk that the contacted part of the wafer will be scratched, affecting the wafer quality.

[0005] In addition, when the chamfer quality inspection of the wafer is performed separately, the chamfered wafer must be transferred from the chamfering station to the inspection station. During the transportation process, there is a risk that the wafer may be bumped and damaged. Utility Model Content

[0006] In view of the problems existing in the background technology, an object of the present disclosure is to provide a wafer chamfering processing detection device, which can improve the overall efficiency of chamfering processing detection.

[0007] Another object of the present disclosure is to provide a wafer chamfering processing detection device, which can avoid the risk of scratching the contacted part of the wafer and affecting the wafer quality in contact detection.

[0008] Another object of the present disclosure is to provide a wafer chamfering processing detection device, which can avoid the risk of wafers being bumped and damaged during transportation.

[0009] Therefore, a wafer chamfering processing detection device is provided, and the wafer chamfering processing detection device includes a three-dimensional translation mechanism, a bracket, a rotating table, a driving mechanism, a grinding wheel, a single laser sensor, and a PLC system. The three-dimensional translation mechanism is used to provide translation in the X direction, translation in the Y direction, and translation in the Z direction; the bracket is connected to the three-dimensional translation mechanism; the rotating table is used to fix the wafer to be chamfered and drive the wafer to rotate in the XY plane; the driving mechanism is arranged on the bracket; the grinding wheel is connected to the driving mechanism to rotate under the drive of the driving mechanism and chamfer the wafer on the rotating table; the laser sensor is installed on the bracket, and the laser sensor is at least used to detect the geometric structure parameters of the part of the wafer chamfered by the grinding wheel in real time when the wafer on the rotating table is chamfered; the PLC system is communicatively connected to the three-dimensional translation mechanism, the rotating table, the driving mechanism, and the laser sensor to control the operation of the three-dimensional translation mechanism, the rotating table, the driving mechanism, and the laser sensor and receive the geometric structure parameters of the part of the wafer chamfered by the grinding wheel detected in real time by the laser sensor.

[0010] The beneficial effects of the present disclosure are as follows.

[0011] In the wafer chamfering processing detection device according to the present invention, wafer chamfering processing and wafer chamfering detection are integrated in one workstation. When the wafer is chamfered by the grinding wheel, the geometric structure parameters of the part of the wafer after being chamfered by the grinding wheel are detected in real time by a laser sensor, which is beneficial to improving the overall efficiency of wafer chamfering processing detection.

[0012] In the wafer chamfering processing detection device according to the present invention, because a single laser sensor is used to detect the geometric structure parameters of the part of the wafer after being chamfered by the grinding wheel, this detection is a non-contact non-destructive detection, thereby avoiding the risk of scratching the contacted part of the wafer and affecting the wafer quality in contact detection.

[0013] In the wafer chamfering processing and detection device according to the present invention, because the wafer chamfering processing and wafer chamfering detection are integrated in one workstation and the geometric structure parameters of the part of the wafer after chamfering by the grinding wheel are detected in real time by a laser sensor when the wafer passes through the grinding wheel chamfering, there is no transportation required for the chamfering process and detection separation processing method of the background technology, thereby avoiding the risk of the wafer being bumped and damaged during the transportation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of a wafer chamfering processing detection device according to the present disclosure is shown.

[0015] Figure 2 Schematic diagram showing laser sensor sensing of a wafer.

[0016] The reference numerals are described as follows:

[0017] 100 Wafer chamfering inspection device 5 grinding wheels

[0018] 1 Three-dimensional translation mechanism 51 upper inverted cone

[0019] 11X axis translation mechanism 52 lower positive cone

[0020] 12Y-axis translation mechanism 53 connected to avoid cylindrical surface

[0021] 13Z-axis translation mechanism 6 laser sensor

[0022] 2 brackets 7 PLC system

[0023] 3 rotating tables 8 connecting rods

[0024] 4 driving mechanism 9 vacuum adsorption mechanism

[0025] 41 grinding wheel spindle 91 suction cup

[0026] 42 Rotating motor 92 Connecting pipe

[0027] 43 first corner motor 93 vacuum machine

[0028] 44 Second corner motor 10HMI

[0029] 200 wafers DETAILED DESCRIPTION

[0030] The accompanying drawings show embodiments of the present disclosure, and it will be understood that the disclosed embodiments are merely examples of the present disclosure, and the present disclosure can be implemented in various forms. Therefore, the specific details disclosed herein should not be interpreted as limiting, but merely as the basis for the claims and as a representative basis for teaching ordinary technicians in the field to implement the present disclosure in various ways.

[0031] In the description of the present disclosure, unless otherwise specified, the terms “first”, “second”, etc. are only used for the purpose of description and component identification, and should not be understood as relative importance and mutual relationship.

[0032] Reference Figure 1 and Figure 2 According to the present disclosure, the wafer chamfering processing detection device 100 includes a three-dimensional translation mechanism 1, a bracket 2, a rotating table 3, a driving mechanism 4, a grinding wheel 5, a single laser sensor 6, and a PLC system 7.

[0033] The three-dimensional translation mechanism 1 is used to provide translation in the X direction, translation in the Y direction, and translation in the Z direction. The bracket 2 is connected to the three-dimensional translation mechanism 1. The rotating table 3 is used to fix the wafer 200 to be chamfered and drive the wafer 200 to rotate in the XY plane. The driving mechanism 4 is arranged on the bracket 2. The grinding wheel 5 is connected to the driving mechanism 4 to rotate under the drive of the driving mechanism 4 and chamfer the wafer 200 on the rotating table 3. The laser sensor 6 is installed on the bracket 2, and the laser sensor 6 is at least used to detect the geometric structure parameters of the part of the wafer 200 chamfered by the grinding wheel 5 in real time when the wafer 200 on the rotating table 3 is chamfered. The PLC system 7 is communicatively connected to the three-dimensional translation mechanism 1, the rotating table 3, the driving mechanism 4, and the laser sensor 6 to control the operation of the three-dimensional translation mechanism 1, the rotating table 3, the driving mechanism 4, and the laser sensor 6 and receive the geometric structure parameters of the part of the wafer 200 chamfered by the grinding wheel 5 detected in real time by the laser sensor 6.

[0034] In the wafer chamfering processing detection device 100 according to the present disclosure, wafer chamfering processing and wafer chamfering detection are integrated in one workstation. When the wafer 200 is chamfered by the grinding wheel 5, the laser sensor 6 is used to detect in real time the geometric structure parameters of the portion of the wafer 200 chamfered by the grinding wheel 5, which is beneficial to improving the overall efficiency of the chamfering processing detection of the wafer 200.

[0035] In the wafer chamfering processing detection device 100 according to the present disclosure, since a single laser sensor 6 is used to detect the geometric structure parameters of the portion of the wafer 200 after being chamfered by the grinding wheel 5, this detection is a non-contact non-destructive detection, thereby avoiding the risk of scratching the contacted portion of the wafer and affecting the wafer quality that exists in contact detection.

[0036] In the wafer chamfering processing and detection device 100 according to the present disclosure, because the wafer chamfering processing and wafer chamfering detection are integrated in one workstation, and the laser sensor 6 is used to detect in real time the geometric structural parameters of the portion of the wafer 200 chamfered by the grinding wheel 5 when the wafer 200 is chamfered by the grinding wheel 5, there is no transportation required for the chamfering process and detection separation processing method of the background technology, thereby avoiding the risk of the wafer being bumped and damaged during the transportation process.

[0037] During operation, refer to Figure 2For chamfering the straight edge (i.e., vertical plane) of the wafer 200, for the upper edge of the chamfered straight edge, the PLC system 7 controls the rotation angle of the rotating table 3 so that the straight edge of the wafer 200 on the rotating table 3 is parallel to the X direction. The PLC system 7 controls the X-direction translation, Y-direction translation, and Z-direction translation of the three-dimensional translation mechanism 1 so that the grinding wheel 5 is at the starting point of the upper edge of the straight edge. Then, the PCL system 7 communicates with the three-dimensional translation mechanism 1 to enable the three-dimensional translation mechanism 11 to provide X-direction translation, and then the three-dimensional translation mechanism 1 drives the bracket 2 together with the driving mechanism 4, the grinding wheel 5, and the laser sensor 6 to translate from the starting point of the upper edge of the straight edge along the X direction. At the same time, the grinding wheel 5 chamfers the upper edge of the straight edge, and the laser sensor 6 follows the grinding wheel 5 to chamfer the upper edge of the straight edge and detects the geometric structure parameters of the upper edge of the straight edge after chamfering in real time, for example Figure 2 The Y-direction dimension A1, the Z-direction dimension A2, the angle R between the chamfered surface and the Z-direction, and the thickness T of the wafer 200 after the chamfering of the upper edge are shown, until the grinding wheel 5 completes the chamfering of the upper edge of the straight edge. For the chamfering of the lower edge of the straight edge, the PLC system 7 controls the X-direction translation, the Y-direction translation, and the Z-direction translation of the three-dimensional translation mechanism 1 to make the grinding wheel 5 at the starting point of the lower edge of the straight edge. Similarly, the laser sensor 6 follows the grinding wheel 5 to chamfer the lower edge of the straight edge and detects the geometric structure parameters of the lower edge of the straight edge in real time, for example Figure 2 The dimensions B1 in the Y direction, B2 in the Z direction, the angle R2 between the chamfered surface and the Z direction, and the thickness T of the wafer 200 are shown after the chamfering of the lower edge.

[0038] During operation, for the chamfering of the circular edge (i.e., part of the circular surface) of the wafer 200 except the straight edge (i.e., the vertical plane), the PLC system 7 also first determines the starting point of the chamfering of the grinding wheel 5, that is, the three-dimensional translation mechanism 1, the driving mechanism 4 and the rotating table 3 can be controlled by the PLC system 7 to determine the starting point of the chamfering of the circular edge by the grinding wheel 5 (for example, one of the ends where the straight edge and the circular edge intersect), the grinding wheel 5 remains in place at the starting point and is rotated by the driving mechanism 4, and the rotating table 3 rotates in the XY plane in the direction away from the straight edge, thereby chamfering the upper edge / lower edge of the circular edge. Similarly, the laser sensor 6 performs real-time detection of the geometric structure parameters after the upper edge / lower edge is chamfered.

[0039] In the wafer chamfering processing detection device 100 according to the present disclosure, the geometric structure parameters of the part of the wafer 200 chamfered by the grinding wheel 5 are detected in real time by the laser sensor 6. By communicating with the PLC system 7, the PLC system 7 can compare the geometric structure parameters received from the laser sensor 6 with the pre-stored standard geometric structure parameters to determine whether the accuracy of the part of the wafer 200 chamfered by the grinding wheel 5 meets the requirements and whether there is a collapse defect. If the collapse defect is detected in real time, the PLC system 7 communicates with the rotating table 3 to stop rotating, the three-dimensional translation mechanism 1 and the driving mechanism 4 to stop working, and the PLC system 7 communicates with the picking structure (such as a manipulator) to remove the wafer 200 with the collapse defect and put it into the waste collection box. On the contrary, if the collapse defect does not appear after the chamfering of the wafer 200 is completed, the chamfered wafer 200 is a qualified product, and the PLC system 7 communicates with the picking structure (such as a manipulator) to remove the wafer 200 with the collapse defect and put it into the qualified product collection box.

[0040] In the wafer chamfering processing detection device 100 according to the present disclosure, the laser sensor 6 can also collect data on the circumferential surface of the entire wafer 200 before the grinding wheel 5 is working and communicate it to the PLC system 7 for storage, which serves as data on the geometric structure of the circumferential surface of the wafer 200 before the wafer 200 is chamfered and as a basis for judging different parts of the circumferential surface of the wafer 200 (such as straight edges, round edges, Notch corners).

[0041] In the wafer chamfering processing detection device 100 according to the present disclosure, the three-dimensional translation mechanism 1, the driving mechanism 4 and the rotating table 3 are controlled by the PLC system 7 to achieve chamfering of different sides of the peripheral surface of the wafer 200.

[0042] like Figure 1 As shown, in one example, the three-dimensional translation mechanism 1 includes an X-direction translation mechanism 11, a Y-direction translation mechanism 12, and a Z-direction translation mechanism 13 which are communicatively connected to the PLC system 7. The X-direction translation mechanism 11 is arranged on the Y-direction translation mechanism 12 and can translate relative to the Y-direction translation mechanism 12 along the X-direction. The Z-direction translation mechanism 13 is arranged on the X-direction translation mechanism 11, and the Z-direction translation mechanism 13 is used to drive the bracket 2 together with the drive mechanism 4, the grinding wheel 5 and the laser sensor 6 to translate along the Z-direction; the X-direction translation mechanism 11 is used to drive the Z-direction translation mechanism 13 together with the bracket 2, the drive mechanism 4, the grinding wheel 5 and the laser sensor 6 to translate along the X-direction; the Y-direction translation mechanism 12 is used to drive the X-direction translation mechanism 11, the Z-direction translation mechanism 13 together with the bracket 2, the drive mechanism 4, the grinding wheel 5 and the laser sensor 6 to translate along the Y-direction.

[0043] like Figure 1 As shown, in one example, the bracket 2 extends along the Y direction.

[0044] The size of the rotating table 3 can be selected based on the size range of the wafer 200 to adapt to different size specifications of the wafer 200. Similarly, the size of the suction cup 91 described later is also selected accordingly.

[0045] like Figure 1 As shown, in one example, the driving mechanism 4 includes a grinding wheel shaft 41, a rotating motor 42, a first angle motor 43, and a second angle motor 44 that are connected to the PLC system 7 for communication. The grinding wheel shaft 41 extends along the Z direction, and the upper and lower ends of the grinding wheel shaft 41 are respectively connected to the grinding wheel 5 and the first rotating motor 42; the rotating motor 42 is used to drive the grinding wheel shaft 41 and the grinding wheel 5 to rotate in the XY plane; the first angle motor 43 is connected to the rotating motor 42, and the first angle motor 43 is used to drive the rotating motor 42, the grinding wheel shaft 41 and the grinding wheel 5 to rotate in the YZ plane to adjust the angle of the grinding wheel 5; the second angle motor 44 is connected to the rotating motor 42, and the second angle motor 44 is used to drive the rotating motor 42, the grinding wheel shaft 41 and the grinding wheel 5 to rotate in the XZ plane to adjust the angle of the grinding wheel 5.

[0046] like Figure 1 As shown, in one example, the grinding wheel 5 includes an upper inverted cone 51, a lower positive cone 52, and a connecting avoidance cylindrical surface 53. The upper inverted cone 51 is used to chamfer the upper edge of the wafer 200. The lower positive cone 52 is used to chamfer the lower edge of the wafer 200. The connecting avoidance cylindrical surface 53 extends along the Z direction and connects the bottom surface of the upper inverted cone 51 and the top surface of the lower positive cone 52, and the connecting avoidance cylindrical surface 53 avoids the wafer 200 when the upper inverted cone 51 or the lower positive cone 52 is chamfered.

[0047] In one example, the laser sensor 6 can be any commercially available product that can detect the three-dimensional geometric structure parameters of the wafer 200. For example, the laser sensor 6 is a line laser sensor. Specifically, the line laser sensor 6 is a Keyence 3DLJ-X series, which has high detection accuracy. Figure 2 As shown, X in the KEYENCE 3DLJ-X series corresponds to Figure 1 The specific selection under the Keyence 3DLJ-X series can be appropriately determined based on the X-axis scale and Z-axis size of the emitted line laser, the length of the straight edge / round edge in the X direction and the thickness of the wafer 200, for example, the Keyence 3DLJ-X8000 product can be further selected. Figure 2As shown, the KEYENCE 3DLJ-X series can detect the Y-direction dimension A1, Z-direction dimension A2, angle R between the chamfered surface and the Z-direction, thickness T of the wafer 200, Y-direction dimension B1, Z-direction dimension B2, and angle R2 between the chamfered surface and the Z-direction after the upper edge is chamfered. This is applicable to straight edges, round edges, and notch corners.

[0048] Reference Figure 1 In one example, the wafer chamfering processing detection device 100 further includes a connecting rod 8, the upper portion of the connecting rod 8 is connected to the bracket 2, and the lower portion of the connecting rod 8 is used to install the laser sensor 6. Figure 1 As shown, the connecting rod 8 extends along the Z direction.

[0049] Reference Figure 1 In one example, the wafer chamfering processing detection device 100 further includes a vacuum adsorption mechanism 9. The vacuum adsorption mechanism 9 is used to fix the wafer 200 on the rotating table 3 by vacuum adsorption, and the vacuum adsorption mechanism 9 is communicatively connected to the PLC system 7. Specifically, the vacuum adsorption mechanism 9 includes a suction cup 91, a connecting pipe 92, and a vacuum pump 93; the suction cup 91 is installed on the top of the rotating table 3 and can rotate in the XY plane under the drive of the rotating table 3; the connecting pipe 92 passes through the rotating table 3 and connects the suction cup 91 and the vacuum pump 93; the vacuum pump 93 is used to vacuum the wafer 200 on the suction cup 91 and the suction cup 91 through the connecting pipe 92 and the suction cup 91, thereby fixing the wafer 200 on the suction cup 91, and the vacuum pump 93 is communicatively connected to the PLC system 7. Compared with fixing the wafer 200 by mechanical physical contact, vacuum adsorption causes much less damage to the quality of the wafer 200.

[0050] Reference Figure 1 In one example, the wafer chamfering processing detection device 100 also includes an HMI 10, which is communicatively connected to the PLC system 7, and the HMI 10 is used to display the working status of the three-dimensional translation mechanism 1, the rotating table 3, the driving mechanism 4 and the laser sensor 6 in real time.

[0051] The above detailed description is used to describe multiple exemplary embodiments, but this document is not intended to be limited to the explicitly disclosed combinations. Therefore, unless otherwise stated, the various features disclosed herein can be combined together to form multiple additional combinations that are not shown for the sake of simplicity.

Claims

1. A wafer chamfering processing detection device, characterized in that: The wafer chamfering processing detection device (100) comprises a three-dimensional translation mechanism (1), a bracket (2), a rotating table (3), a driving mechanism (4), a grinding wheel (5), a single laser sensor (6), and a PLC system (7); The three-dimensional translation mechanism (1) is used to provide translation in the X direction, translation in the Y direction and translation in the Z direction; The bracket (2) is connected to the three-dimensional translation mechanism (1); The rotating table (3) is used to fix the wafer (200) to be chamfered and drive the wafer (200) to rotate in the XY plane; The driving mechanism (4) is arranged on the bracket (2); The grinding wheel (5) is connected to the driving mechanism (4) so ​​as to rotate under the drive of the driving mechanism (4) and chamfer the wafer (200) on the rotating table (3); The laser sensor (6) is mounted on the bracket (2), and the laser sensor (6) is used at least to detect in real time the geometrical structural parameters of the portion of the wafer (200) chamfered by the grinding wheel (5) when the wafer (200) on the rotating table (3) is chamfered; The PLC system (7) is communicatively connected to the three-dimensional translation mechanism (1), the rotating table (3), the driving mechanism (4) and the laser sensor (6) to control the operation of the three-dimensional translation mechanism (1), the rotating table (3), the driving mechanism (4) and the laser sensor (6) and receive the geometric structure parameters of the part of the wafer (200) after being chamfered by the grinding wheel (5) detected in real time by the laser sensor (6).

2. The wafer chamfering processing detection device according to claim 1, characterized in that: The three-dimensional translation mechanism (1) comprises an X-direction translation mechanism (11), a Y-direction translation mechanism (12), and a Z-direction translation mechanism (13) which are communicatively connected to the PLC system (7); The X-direction translation mechanism (11) is arranged on the Y-direction translation mechanism (12) and can be translated along the X-direction relative to the Y-direction translation mechanism (12); The Z-direction translation mechanism (13) is arranged on the X-direction translation mechanism (11), and the Z-direction translation mechanism (13) is used to drive the bracket (2) together with the driving mechanism (4), the grinding wheel (5) and the laser sensor (6) to translate along the Z direction; The X-direction translation mechanism (11) is used to drive the Z-direction translation mechanism (13) together with the bracket (2), the driving mechanism (4), the grinding wheel (5) and the laser sensor (6) to translate along the X-direction; The Y-direction translation mechanism (12) is used to drive the X-direction translation mechanism (11), the Z-direction translation mechanism (13), the bracket (2), the driving mechanism (4), the grinding wheel (5) and the laser sensor (6) to translate along the Y-direction.

3. The wafer chamfering processing detection device according to claim 1, characterized in that: The driving mechanism (4) comprises a grinding wheel shaft (41), a rotating motor (42), a first rotating angle motor (43) and a second rotating angle motor (44) which are connected to the PLC system (7); The grinding wheel shaft (41) extends along the Z direction, and the upper and lower ends of the grinding wheel shaft (41) are respectively connected to the grinding wheel (5) and the first rotating motor (42); The rotary motor (42) is used to drive the grinding wheel shaft (41) and the grinding wheel (5) to rotate in the XY plane; The first angle motor (43) is connected to the rotating motor (42), and the first angle motor (43) is used to drive the rotating motor (42), the grinding wheel shaft (41) and the grinding wheel (5) to rotate in the YZ plane to adjust the angle of the grinding wheel (5); The second angle motor (44) is connected to the rotating motor (42), and is used to drive the rotating motor (42), the grinding wheel shaft (41) and the grinding wheel (5) to rotate in the XZ plane to adjust the angle of the grinding wheel (5).

4. The wafer chamfering processing detection device according to claim 1, characterized in that: The grinding wheel (5) comprises an upper inverted cone (51), a lower positive cone (52), and a connecting avoidance cylindrical surface (53); The upper inverted cone (51) is used to chamfer the upper edge of the wafer (200); The lower frustum (52) is used to chamfer the lower edge of the wafer (200); The connecting avoidance cylindrical surface (53) extends along the Z direction and connects the bottom surface of the upper inverted cone (51) and the top surface of the lower regular cone (52), and the connecting avoidance cylindrical surface (53) avoids the wafer (200) when the upper inverted cone (51) or the lower regular cone (52) is chamfered.

5. The wafer chamfering processing detection device according to claim 1, characterized in that: The laser sensor (6) is a line laser sensor.

6. The wafer chamfering processing detection device according to claim 5, characterized in that: The line laser sensor (6) is a KEYENCE 3DLJ-X series.

7. The wafer chamfering processing detection device according to claim 1, characterized in that: The wafer chamfering processing detection device (100) further comprises a connecting rod (8), The upper part of the connecting rod (8) is connected to the bracket (2), and the lower part of the connecting rod (8) is used for installing the laser sensor (6).

8. The wafer chamfering processing detection device according to claim 1, characterized in that: The wafer chamfering processing detection device (100) further includes a vacuum adsorption mechanism (9), The vacuum adsorption mechanism (9) is used to fix the wafer (200) on the rotating table (3) by vacuum adsorption, and the vacuum adsorption mechanism (9) is communicatively connected to the PLC system (7).

9. The wafer chamfering processing detection device according to claim 8, characterized in that: The vacuum adsorption mechanism (9) comprises a suction cup (91), a connecting pipe (92), and a vacuum pump (93); The suction cup (91) is mounted on the top of the rotating table (3) and can rotate in the XY plane under the drive of the rotating table (3). The connecting pipe (92) passes through the rotating table (3) and connects the suction cup (91) and the vacuum pump (93); The vacuum pump (93) is used to perform vacuuming between the wafer (200) on the suction cup (91) and the suction cup (91) via the connecting pipe (92) and the suction cup (91), thereby fixing the wafer (200) on the suction cup (91). The vacuum pump (93) is communicatively connected to the PLC system (7).

10. The wafer chamfering processing detection device according to claim 1, characterized in that: The wafer chamfering processing detection device (100) further comprises an HMI (10), the HMI (10) being communicatively connected to the PLC system (7), and the HMI (10) being used to display in real time at least the working status of the three-dimensional translation mechanism (1), the rotating table (3), the driving mechanism (4) and the laser sensor (6).

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