Punching device for strip substrate of intelligent card module

Abstract

The utility model discloses a punching device of an intelligent card module strip substrate, and relates to the technical field of intelligent card modules, the device comprises a workbench and an upper die, the upper die is arranged above the workbench, the surface of the workbench is provided with a groove, a lower die is fixedly installed in the groove through a bolt, and the lower die is fixedly connected with the workbench through a bolt. A cavity used for containing an intelligent card module is formed in the upper surface of the lower die, the adjusting mechanism is arranged at the upper end of the workbench and used for adjusting the position of the upper die, and the collecting mechanism is arranged in the workbench and used for collecting waste materials generated after punching. According to the utility model, the punching heads and the through grooves of the upper die and the lower die are matched with each other, so that the middle part of the intelligent card module is set to be in a hollow state, a wafer is convenient to place, the wafer and a bonding wire do not occupy the space of the surface of the intelligent card module, the overall thickness of the module is reduced, and the market demand is met.

Description

Technical Field

[0001] The utility model relates to the technical field of smart card modules, in particular to a punching device for a strip substrate of a smart card module. Background Art

[0002] Smart card is a general term for plastic cards with embedded microchips. With the advancement of electronic technology, smart cards are increasingly used in communication, payment, identity authentication and other fields. The demand for smart card modules will continue to grow. In order to meet the market demand for thinner and more integrated smart card modules, smart card modules are also constantly developing. In the production process of smart card modules, punching devices are often used. However, the punching devices in the prior art are not convenient for rapid prototyping of the wire holes and die-bonding holes of the smart card modules, and cannot meet the demand for the thinner and lighter development of smart cards. In addition, since the wafer and the wires are installed on the surface of the smart card, it is difficult to reduce the overall thickness of the module and the structure is relatively complex, which is not conducive to integrating multiple modules into one substrate and promoting product integration.

[0003] Based on this, a punching device for a smart card module strip substrate is now provided, which can eliminate the disadvantages of the existing device. Utility Model Content

[0004] The utility model aims to provide a punching device for a smart card module strip substrate to solve the problems in the background art that the fast forming process is not convenient and the development demand for thin and light smart cards cannot be met.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A punching device for a smart card module strip substrate comprises a workbench and an upper mold, wherein the upper mold is arranged above the workbench, a groove is provided on the surface of the workbench, a lower mold is fixedly installed inside the groove by bolts, and a cavity for placing a smart card module is provided on the upper surface of the lower mold. The device also comprises an adjusting mechanism and a collecting mechanism, wherein the adjusting mechanism is arranged at the upper end of the workbench for adjusting the position of the upper mold, and the collecting mechanism is arranged inside the workbench for collecting waste after punching.

[0007] Preferably, the adjustment mechanism includes a symmetrically arranged electric push rod, a horizontal plate is fixedly mounted on the upper end of the output end of the electric push rod, a slide groove is opened at the lower end of the horizontal plate, a screw rod is rotatably connected inside the slide groove, one end of the screw rod extends to the outside of the horizontal plate and is fixedly connected to the output end of the motor, a slider is threadedly connected to the outer side of the screw rod, and a lifting assembly is provided at the lower end of the slider.

[0008] Preferably, the collecting mechanism comprises an inclined groove arranged at the lower end of the groove, the inclined groove is connected to the groove, one side of the inclined groove is connected to a movable groove, a collecting box is slidably arranged inside the movable groove, and one side of the collecting box is provided with a handle.

[0009] Preferably, the lifting assembly comprises a lifting push rod, and a rotating chuck is provided at the lower end of the output end of the lifting push rod, and the rotating chuck is clamped with the upper mold.

[0010] Preferably, a base is symmetrically arranged at the lower end of the workbench.

[0011] Preferably, a control panel is provided on one side of the workbench, and the control panel is electrically connected to the electric push rod, the motor, and the lifting push rod.

[0012] Preferably, a plurality of punching heads are provided at the lower end of the upper mold, a through groove is provided on the surface of the lower mold, the positions of the punching heads correspond to the through grooves, and the upper mold is adapted to the lower mold.

[0013] Preferably, a plurality of springs are provided on the bottom wall of the cavity, the upper ends of the springs are fixedly connected with a pressing plate, and the smart card module is in contact with the pressing plate but is not fixed.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0015] 1. The utility model is provided with an adjustment mechanism, and with the cooperation of the electric push rod, the motor and the screw rod, the slider and the lifting assembly are driven to move along the direction of the slide slot, so as to adjust the horizontal and vertical positions of the upper mold, which is convenient for the punching operation. A collection mechanism is provided to facilitate the collection of waste materials, and the user does not need to manually clean the waste materials, thereby improving production efficiency and quality, and contributing to the streamlined production of smart card modules. In addition, a collection box is provided to facilitate the centralized treatment of waste materials, and the utility model has good practicality.

[0016] 2. The utility model provides an innovative mold structure. Due to the mutual cooperation between the punching head of the upper mold and the through groove of the lower mold, the middle part of the smart card module is set to a hollow state, which is convenient for placing the wafer, so that the wafer and the welding wire do not occupy the space on the surface of the smart card module. By optimizing the layout of the wafer and the welding wire, the overall thickness of the module is reduced, thereby meeting market demand. The structure is relatively simple, which is conducive to the integration of industrial products and to improving the efficiency of the assembly process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the utility model.

[0018] Figure 2 It is a schematic diagram of the internal structure of the utility model.

[0019] Figure 3 It is a cutaway view of the utility model.

[0020] Figure 4 It is a structural schematic diagram of the lower mold of the utility model.

[0021] Figure 5 It is a structural schematic diagram of the lifting assembly of the utility model.

[0022] Figure 6 This is a schematic structural diagram of Example 2 of the present utility model.

[0023] Notes on figure numbers: 101, workbench; 102, upper mold; 103, groove; 104, lower mold; 105, base; 106, control panel; 107, pressure plate; 200, adjustment mechanism; 201, electric push rod; 202, horizontal plate; 203, slide groove; 204, screw; 205, slider; 206, lifting push rod; 207, rotary chuck; 300, collection mechanism; 301, inclined groove; 302, movable groove; 303, collection box; 304, handle. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0025] Example 1

[0026] In this embodiment, if Figure 1-Figure 5As shown, a punching device for a smart card module strip substrate comprises a workbench 101 and an upper mold 102. The upper mold 102 is arranged above the workbench 101. A groove 103 is provided on the surface of the workbench 101. An exhaust fan can be provided inside the groove 103 to facilitate cleaning of debris generated during punching and improve the production efficiency of the smart card module. A lower mold 104 is fixedly installed inside the groove 103 by bolts to facilitate replacement and installation of the lower mold 104. The upper mold 102 and the lower mold 104 are used together to form a mold. A cavity for placing the smart card module is provided on the upper surface of the lower mold 104. The cavity has the same size as the smart card module. Adaptation, avoiding the smart card module from offsetting during the punching process, preventing the occurrence of dislocation, and facilitating the integration of industrial products. It also includes an adjustment mechanism 200 and a collection mechanism 300. The adjustment mechanism 200 is arranged at the upper end of the workbench 101 and is used to adjust the position of the upper mold 102. The collection mechanism 300 is arranged inside the workbench 101 and is used to collect waste after punching. Before the punching device for the smart card module strip substrate is used, first check whether the device can be used normally, then select the upper mold 102 and the lower mold 104 of specific specifications, install them at the corresponding position, and place the smart card module inside the cavity, so that the device enters a ready-to-use state;

[0027] Among them Figure 2-Figure 4 As shown, the adjustment mechanism 200 includes a symmetrically arranged electric push rod 201, and a horizontal plate 202 is fixedly installed on the upper end of the output end of the electric push rod 201. The surface of the horizontal plate 202 is provided with a scale bar, which is convenient for ensuring the normal use of the device, so that the upper mold 102 and the lower mold 104 can accurately correspond to each other, thereby improving the overall practicality. A slide groove 203 is provided at the lower end of the horizontal plate 202, and a screw rod 204 is rotatably connected inside the slide groove 203. One end of the screw rod 204 extends to the outside of the horizontal plate 202 and is fixedly connected to the output end of the motor. The motor is started to drive the screw rod 204 to rotate, so that the slider 205 can move along the direction of the slide groove 203, so that the upper mold 102 corresponds to the lower mold 104. The outer side of the screw rod 204 is threadedly connected with the slider 205, and the slider 205 is slidably connected to the slide groove 203. A lifting component is provided at the lower end of the slider 205, through which the punching head can form the welding wire hole and the solid crystal hole at one time, so as to accurately and quickly form the required structure and improve production efficiency.

[0028] Among them Figure 2 and Figure 3As shown, the collecting mechanism 300 includes an inclined slot 301 arranged at the lower end of the groove 103, and the inclined slot 301 is connected to the through slot inside the lower mold 104, so that the waste generated after punching can move from the inside of the through slot to the inside of the inclined slot 301, and then quickly move to the inside of the collecting box 303. The inclined slot 301 is connected to the groove 103, and one side of the inclined slot 301 is connected to a moving slot 302. The collecting box 303 is slidably arranged inside the moving slot 302, which is convenient for centralized one-time processing of more wastes and reduces the labor of the user. A handle 304 is provided on one side of the collecting box 303, which is convenient for pulling the collecting box 303 and improving convenience.

[0029] Among them Figure 2 and Figure 5 As shown, the lifting assembly includes a lifting push rod 206, which enables the punching head to quickly perform the punching operation. The lower end of the output end of the lifting push rod 206 is provided with a rotating chuck 207, which is convenient for replacing and installing the upper mold 102, and is suitable for molds of different sizes and specifications, and has good applicability. The rotating chuck 207 is clamped with the upper mold 102, which is convenient for quick installation operation;

[0030] Among them Figure 1 As shown, a base 105 is symmetrically arranged at the lower end of the workbench 101, and the base 105 plays a supporting role, thereby increasing the overall practicality of the punching device for the smart card module strip substrate and facilitating movement;

[0031] Among them Figure 1 As shown, a control panel 106 is provided on one side of the workbench 101, and the control panel 106 is electrically connected to the electric push rod 201, the motor, and the lifting push rod 206. Through the control panel 106, it is convenient for the user to quickly operate the device, and the structure is relatively simple, which is convenient for the integration and automation of the smart card module;

[0032] Among them Figure 4 and Figure 5As shown, a plurality of punching heads are provided at the lower end of the upper mold 102, a through slot is provided on the surface of the lower mold 104, and handles are provided on the left and right sides of the lower mold 104 for easy movement. The punching heads correspond to the positions of the through slots, and the wire welding holes and the crystal fixing holes on the surface of the smart card module correspond to the positions of the through slots. The upper mold 102 is adapted to the lower mold 104. In the traditional process, the wafer and the welding wire are both arranged on the surface of the substrate, and no hollow process is arranged in the middle of the substrate. This method increases the overall thickness of the module, and steps such as fixing the wafer and fixing the welding wire are required, which increases the complexity of the structure, resulting in weak versatility and market potential. Therefore, in order to meet the market demand for thinner and lighter smart cards, an upper and lower mold is provided, and a plurality of punching heads are provided. The layout of the cutting head meets this demand. A punching head is provided in the middle of the upper mold 102, and a through groove is also provided in the middle of the lower mold 104. The wire bonding hole and the die-fixing hole are formed at one time, so that the wafer can be fixed in the middle hole position during the processing of the smart card module, so that the wafer and the wire bonding wire do not occupy the space on the surface of the smart card module, which significantly reduces the overall thickness of the module, thereby improving production efficiency and quality. The structural design of the mold enables the substrate structure to be formed accurately and quickly, improves production efficiency, and is conducive to controlling the height of the wire bonding wire. It is significantly different from the production method of traditional smart card modules, is suitable for SIM card modules and dual-interface modules, has strong versatility and market potential, and is convenient for the development of lightweight smart card modules.

[0033] Example 2

[0034] The difference from Example 1 is that Figure 6 As shown, a plurality of springs are provided on the bottom wall of the cavity, and a pressure plate 107 is fixedly connected to the upper end of the spring. The smart card module is in contact with the pressure plate 107 and is not fixed. When the upper mold 102 is in contact with the smart card module, the upper mold 102 exerts a downward pressure on the pressure plate 107, so that the spring is in a contracted state. When the punching operation is completed, the smart card module can be pushed outward by the force generated by the spring, so that the user can perform the unloading operation conveniently.

[0035] When in use, the upper mold 102 is installed at the lower end of the rotating chuck 207, and the lower mold 104 is fixedly installed in the groove 103 by bolts. The adjustment mechanism 200 is operated through the control panel 106. With the cooperation of the motor and the electric push rod, the upper mold 102 and the lower mold 104 are made to correspond, and the position of the punching head and the through groove corresponds. Then the smart card module is placed in the cavity, and the lifting push rod 206 is started to perform a one-time forming operation of the welding wire hole and the solid crystal hole. The operation is simple, so that the wafer and the welding wire do not occupy the space on the surface of the smart card module, which significantly reduces the overall thickness of the module, thereby improving production efficiency and quality.

[0036] The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A punching device for a smart card module strip substrate, comprising a workbench (101) and an upper mold (102), wherein the upper mold (102) is arranged above the workbench (101), a groove (103) is provided on the surface of the workbench (101), a lower mold (104) is fixedly installed in the interior of the groove (103) by bolts, and a cavity for placing a smart card module is provided on the upper surface of the lower mold (104); It is characterized in that It also includes an adjustment mechanism (200), which is arranged at the upper end of the workbench (101) and is used to adjust the position of the upper mold (102); A collecting mechanism (300), the collecting mechanism (300) being arranged inside the workbench (101) and used for collecting waste materials after punching; The adjustment mechanism (200) comprises a symmetrically arranged electric push rod (201), a horizontal plate (202) is fixedly mounted on the upper end of the output end of the electric push rod (201), a slide groove (203) is provided at the lower end of the horizontal plate (202), a screw rod (204) is rotatably connected inside the slide groove (203), one end of the screw rod (204) extends to the outside of the horizontal plate (202) and is fixedly connected to the output end of the motor, a slider (205) is threadedly connected to the outside of the screw rod (204), and a lifting assembly is provided at the lower end of the slider (205); The lifting assembly comprises a lifting push rod (206), a rotating chuck (207) is provided at the lower end of the output end of the lifting push rod (206), and the rotating chuck (207) is clamped with the upper mold (102); A plurality of springs are arranged on the bottom wall of the cavity, and the upper ends of the springs are fixedly connected to a pressing plate (107), and the smart card module is in contact with the pressing plate (107) and is not fixed.

2. The punching device for a smart card module strip substrate according to claim 1, characterized in that: The collecting mechanism (300) comprises an inclined groove (301) arranged at the lower end of the groove (103), the inclined groove (301) being connected to the groove (103), one side of the inclined groove (301) being connected to a movable groove (302), a collecting box (303) being slidably arranged inside the movable groove (302), and a handle (304) being provided on one side of the collecting box (303).

3. The punching device for a smart card module strip substrate according to claim 1, characterized in that: A base (105) is symmetrically arranged at the lower end of the workbench (101).

4. The punching device for a smart card module strip substrate according to claim 1, characterized in that: A control panel (106) is provided on one side of the workbench (101), and the control panel (106) is electrically connected to the electric push rod (201), the motor, and the lifting push rod (206).

5. The punching device for a smart card module strip substrate according to claim 1, characterized in that: A plurality of punching heads are provided at the lower end of the upper mold (102), and a through slot is provided on the surface of the lower mold (104). The positions of the punching heads correspond to the through slot, and the upper mold (102) and the lower mold (104) are adapted to each other.

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