Etching cavity environment testing device and etching machine
By designing the etching cavity environment test device, using FBAR sensors and markers to detect changes in the cavity environment, simulate the by-product attachment process, and analyze the by-product components through the rotation of the top door panel, the problem of difficult to effectively detect the etching cavity environment in the prior art is solved, and the stability and production capacity of the product quality are improved.
Patent Information
- Application Number
- CN202420721189.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-09
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-04-09
AI Technical Summary
In the prior art, the etching cavity environment is difficult to effectively detect, resulting in unstable product quality, reduced production capacity and waste of resources.
A test device for etching cavity environment is designed, including fixtures, top door panels, FBAR sensors and markers. The dynamic detection of the mass of sediment on the surface of the cavity is achieved through the setting of the sticks and FBAR sensors, simulate the by-product attachment process, and conveniently analyze the by-product components through the rotation of the top door panel.
Effective detection of environmental changes of the etching cavity is achieved, the impact on the process is reduced, the stability of product quality is improved, and resource waste is avoided.
Smart Images
Figure CN222636120U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor manufacturing, and relates to an etching chamber environment testing device and an etching machine. Background Art
[0002] In semiconductor etching (ET) machines, chamber conditions have always been a crucial factor in the process. Currently, most judgments rely on engineers' experience and experimental data, but the chamber environment will continue to change with product design differences and process nuances, often bringing certain challenges to product stability. For example, when products are undergoing the etching process, some will have the first wafer effect, but some will not. The products that produce the first wafer effect are mainly caused by changes in the chamber environment due to etching products during the etching process. To eliminate this first wafer effect, the chamber can be cleaned by inserting a cleaning (clean or season) step during the run process, but this takes up run time and will cause a significant drop in production capacity.
[0003] At present, in order to maintain the stability of the etching chamber environment, most manufacturers in the industry coat an inert protective layer on the side wall of the chamber. However, this coating of the inert protective layer only enhances the stability of the chamber hardware itself and cannot effectively control the accumulation of etching byproducts. In the actual production process, a large number of experiments are still needed to explore the method and timing of cleaning the etching chamber to ensure the stability of product quality. The exploration of the run-in process requires a lot of time and resources. In addition, due to the ever-changing product types and product designs, a mature run-in model is difficult to cover various situations, which can easily lead to low production capacity and difficult to control product quality. The root cause of these problems is that there is no effective monitoring method during the run-in process, and it is impossible to deeply understand the changes in the chamber environment during the run-in process and detect abnormalities in time.
[0004] Therefore, it is necessary to provide an etching chamber environment testing device and an etching machine to detect changes in the etching chamber environment. Utility Model Content
[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an etching chamber environment testing device and an etching machine, so as to solve the problem that the etching chamber environment is difficult to effectively detect in the prior art.
[0006] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides an etching chamber environment testing device, the etching chamber environment testing device comprising:
[0007] A fixing member, wherein a cavity penetrating the fixing member is provided in the fixing member;
[0008] A top door plate, the end of which is movably connected to the side wall of the fixing member and covers the cavity;
[0009] A film bulk acoustic resonator (FBAR) sensor, wherein the FBAR sensor is located on a surface of the top door panel;
[0010] A label is located on the surface of the FBAR sensor, and the label is transformed in position in the cavity by the rotation of the top door plate.
[0011] Optionally, it further includes a bottom door plate, the bottom door plate is in contact with the fixing member, the cavity has a first opening and a second opening, the bottom door plate covers the first opening, and the top door plate covers the second opening.
[0012] Optionally, the bottom door panel is detachably connected to the fixing member.
[0013] Optionally, the fixing member is an elastic fixing member.
[0014] Optionally, the end of the top door panel is connected to the side wall of the fixing member via a bearing.
[0015] Optionally, the projection of the label on the FBAR sensor completely covers the FBAR sensor.
[0016] Optionally, the surface of the label is coated with an inert protective layer.
[0017] Optionally, the size of the etching chamber environment testing device is at the centimeter level.
[0018] Optionally, it further includes a controller and a driving member, wherein the controller communicates with the FBAR sensor, the driving member communicates with the controller, and the driving member is connected to the top door panel; it also includes a display and / or an alarm that communicates with the FBAR sensor.
[0019] The present application also provides an etching machine, which includes any of the above-mentioned etching chamber environment testing devices.
[0020] As described above, the etching chamber environment testing device and etching machine of the utility model include a fixing part, a top door plate, an FBAR sensor and a label. A cavity penetrating the fixing part is provided in the fixing part, the end of the top door plate is movably connected to the side wall of the fixing part and covers the cavity, the FBAR sensor is located on the surface of the top door plate, the label is located on the surface of the FBAR sensor and its position is changed in the cavity by the rotation of the top door plate.
[0021] The etching chamber environment testing device and etching machine of the utility model can realize dynamic detection of the quality of the deposits on the chamber surface and detection of the changes in the chamber environment through the setting of the standard sheet and the FBAR sensor, and simulate the adhesion process of the by-products in the chamber to the greatest extent. Moreover, the composition analysis of the etching by-products can be conveniently performed without opening the chamber through the rotation of the top door plate, so as to realize effective detection of the etching chamber environment. The FBAR sensor has high sensitivity, small size and rapid response, and can greatly reduce the influence on the chamber process. Furthermore, the etching chamber environment testing device can also be provided with a bottom door plate to further improve the airtightness of the etching chamber during the test and avoid the influence of the test process on the etching chamber environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a schematic diagram of the structure of the etching machine in the utility model.
[0023] Figure 2 It is a schematic diagram showing the basic principle of the FBAR sensor in the present invention.
[0024] Figure 3a and Figure 3b Shown are two state structural schematic diagrams of the etching chamber environment testing device in the utility model.
[0025] Figure 4a to Figure 4e It shows a schematic diagram of the structure of each state of the etching chamber environment testing device in the utility model when performing a rotation operation.
[0026] Description of Reference Numerals
[0027] 100 Etching chamber environment test device
[0028] 101 Fixing parts
[0029] 102 Bottom door panel
[0030] 103 Top door panel
[0031] 104 FBAR sensor
[0032] 105 Label
[0033] 106 Bearings
[0034] 201 Shell
[0035] 202 Suction Cup
[0036] 300 Wafer DETAILED DESCRIPTION
[0037] The following is an explanation of the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.
[0038] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0039] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0040] like Figure 3a , Figure 3b and Figure 4a to Figure 4c The present embodiment provides an etching chamber environment testing device, wherein the etching chamber environment testing device 100 includes: a fixing member 101, a bottom door plate 102, a top door plate 103, a FBAR (film bulk acoustic resonator) sensor 104 and a label 105.
[0041] The fixing member 101 is provided with a cavity having a first opening and a second opening; the bottom door plate 102 is in contact with the fixing member 101 and covers the first opening; the end of the top door plate 103 is movably connected to the side wall of the fixing member 101 and covers the second opening; the FBAR sensor 104 is located on the surface of the top door plate 103; the label 105 is located on the surface of the FBAR sensor 104, and the label 105 is switched between the first opening and the second opening by rotating the top door plate 103.
[0042] Specifically, Figure 2The basic principle of the FBAR sensor 104 is the inverse piezoelectric effect of the piezoelectric film. When the piezoelectric film is in an external electric field, the internal charge polarization of the piezoelectric film causes internal deformation, and the sound waves generated by the internal deformation of the piezoelectric film form standing wave oscillations, generating a resonant frequency signal. When there is mass adsorbed on the surface of the FBAR sensor 104, the resonant frequency will change. According to the change in the resonant frequency, the mass change of the trace substance adsorbed on the surface of the FBAR sensor 104 can be detected.
[0043] So far, FBAR sensors have been successfully applied in the detection of trace organic vapors, immunoglobulins, cancer markers, thrombin, deoxyribonucleic acid (DNA) and drug molecules, and achieved remarkable results.
[0044] The etching chamber environment testing device 100 of the present application can realize dynamic detection of the quality of the deposits on the cavity surface, detection of changes in the cavity environment, and maximum simulation of the adhesion process of by-products in the cavity through the arrangement of the marker 105 and the FBAR sensor 104; the FBAR sensor 104 has high sensitivity, small size, and rapid response, which can greatly reduce the impact on the cavity process; the connection between the bottom door plate 102, the top door plate 103, and the fixing part 101 can conveniently realize the position conversion of the marker 105 between the first opening and the second opening, so that the composition analysis of the etching by-products can be conveniently performed without opening the cavity, thereby realizing effective detection of the etching chamber environment.
[0045] In this embodiment, by the coordinated arrangement of the top door plate 103 and the bottom door plate 102, it can be ensured that when the top door plate 103 is in operation, the etching chamber is isolated from the external environment through the bottom door plate 102, and when the bottom door plate 102 is in operation, the etching chamber is isolated from the external environment through the top door plate 103, thereby further improving the airtightness of the etching chamber during the test process and avoiding the influence of the test process on the etching chamber environment. However, the structure of the etching chamber environment testing device 100 is not limited to this. For example, in another embodiment, when the top door plate 103 can achieve a good seal with the fixing member 101 during operation, that is, when the top door plate 103 can ensure a good isolation of the etching chamber from the external environment during operation, the bottom door plate 102 may not be provided.
[0046] like Figure 1This embodiment provides an etching machine, which includes a housing 201, a suction cup 202 located in the housing 201 for carrying a wafer 300, and the etching chamber environment test device 100 is installed on the housing 201 of the etching machine. According to needs, the etching chamber environment test device 100 can be installed on the side wall or top wall of the etching machine, and the specific installation position and installation method are not overly limited here. The specific type of the etching machine is not overly limited here.
[0047] As an example, the end of the top door panel 103 may be connected to the side wall of the fixing member 101 via a bearing 106 .
[0048] Specifically, Figure 3a , Figure 3b and Figure 4a to Figure 4c In this embodiment, in order to reduce friction, it is preferred that the top door plate 103 and the fixing member 101 are connected via the bearing 106, so that the top door plate 103 can rotate along the bearing 106, thereby reducing the influence of external force, impurities, etc. generated by friction on the detection of the FBAR sensor 104 while making the top door plate 103 switch positions between the first opening and the second opening, thereby improving the test accuracy. However, the connection method between the end of the top door plate 103 and the side wall of the fixing member 101 is not limited to this, and no excessive restriction is made here.
[0049] As an example, the fixing member 101 may be an elastic fixing member.
[0050] Specifically, Figure 3a , Figure 3b and Figure 4a to Figure 4e In this embodiment, the fixing member 101 is an elastic fixing member. When the top door plate 103 is switched between the first opening and the second opening, the elastic fixing member can be stretched. Figure 3b , Figure 4a and Figure 4b , so as to change the size of the first opening, so that the end of the top door plate 103 is not in contact with the fixing member 101, thereby reducing friction during the rotation operation; and after the rotation operation is completed, the elastic fixing member can be squeezed to achieve good contact between the elastic fixing member and the end of the top door plate 103, such as Figure 4c and Figure 4d , so that the top door plate 103 completely covers the first opening, thereby preventing the cavity from communicating with the internal environment of the housing 201 when the bottom door plate 102 is opened to disassemble or test the label 105 and / or the FBAR sensor 104, as shown in FIG. Figure 4e, so that the composition analysis of etching by-products can be conveniently carried out without opening a cavity.
[0051] As an example, it is preferred that the projection of the label 105 on the FBAR sensor 104 completely covers the FBAR sensor 104 .
[0052] Specifically, in order to avoid the influence of the by-products generated in the shell 201 on the FBAR sensor 104 and improve the test accuracy, it is preferred that the projection of the label 105 on the FBAR sensor 104 completely covers the FBAR sensor 104, so that the by-products generated in the shell 201 will not directly contact the surface of the FBAR sensor 104, for example, when there is a step structure, the accumulation of by-products in the step gap can be avoided.
[0053] As an example, it is preferred that an inert protective layer is coated on the surface of the label 105 .
[0054] Specifically, when the inert protective layer is coated on the surface of the label 105, the replacement cycle of the label 105 can be extended, and when the inner wall of the housing 201 is coated with the inert protective layer, the inert protective layer on the surface of the label 105 can ensure that it has the same material surface as the inner wall of the housing 201 to improve the test accuracy. The material of the inert protective layer may include, for example, yttrium oxide coating, etc., and no excessive restrictions are made here.
[0055] As an example, the size of the etching chamber environment testing device 100 can be in the centimeter level, such as 2 cm, 5 cm, 10 cm, etc., and can be selected according to needs. Among them, under the condition of meeting the test requirements, it is preferred that the etching chamber environment testing device 100 selects a smaller size to reduce the impact on the process.
[0056] As an example, the bottom door panel 102 may be detachably connected to the fixing member 101, and the detachable connection method may include, for example, a snap connection, a threaded connection, or a pin connection.
[0057] Specifically, as needed, the bottom door panel 102 can be directly connected to the fixing member 101, and the connection method can be a snap connection, a threaded connection or a pin connection, but is not limited to this. The bottom door panel 102 can also be directly connected to the outer wall of the shell 201. The specific selection can be made according to needs, and no excessive restrictions are made here.
[0058] As an example, the etching chamber environment testing device 100 further includes a controller (not shown) and a driver (not shown), the controller communicates with the FBAR sensor 104 , the driver communicates with the controller, and the driver is connected to the top door plate 103 .
[0059] Specifically, in order to realize the automatic control of the etching chamber environment testing device 100, it is preferred that the controller, such as a computer, is arranged in the etching chamber environment testing device 100, wherein the communication method may include wired communication and wireless communication, and the specific communication method may be set as needed, and no excessive restrictions are made here.
[0060] After the controller is set, the FBAR sensor 104 preferably communicates with the controller. Further, the etching chamber environment testing device 100 preferably also includes a driving member, and the driving member is connected to the top door plate 103, such as a motor, so as to drive the top door plate 103 to rotate automatically through the driving member, wherein the driving member preferably communicates with the controller to realize automatic control.
[0061] The specific types of the controller and the driving component, the communication method, etc. can be set as needed and are not excessively restricted here.
[0062] As an example, the etching chamber environment testing apparatus 100 may further include a display (not shown) and / or an alarm (not shown) in communication with the FBAR sensor 104 .
[0063] Specifically, when the display is provided, the result detected by the FBAR sensor 104 can be directly displayed through the display to facilitate observation by staff. The specific type of the display can be selected according to needs.
[0064] Furthermore, the etching chamber environment testing device 100 may also include the alarm that communicates with the FBAR sensor 104, so that the alarm can timely warn the abnormal results detected by the FBAR sensor 104, so that the staff can take measures in time to improve production efficiency. The alarm may include, for example, an acoustic alarm, an optical alarm, or an acoustic and optical alarm, and the specific type of the alarm is not excessively limited here.
[0065] The installation method of the components of the etching chamber environment testing device 100, the specific type and material of each component, etc. can be flexibly selected according to needs. In principle, the surface of the label 105 and the inner wall of the shell 201 should be kept flat as much as possible, friction should be minimized, the shell 201 should not be directly connected to the atmosphere, and corrosion resistance is preferred.
[0066] In the semiconductor manufacturing process, due to different settings of product design and process recipe, the by-product generation rate and composition in the etching process may be different. The following is an example of the applicable scenario of the etching chamber environment testing device in this embodiment, but the applicable scenario of the etching chamber environment testing device is not limited to this. Specifically, for example:
[0067] 1) Suitable for testing chamber environment changes during the run process: If applied to the first wafer effect test, the etching chamber environment testing device in this embodiment can be used to analyze the difference between the signal changes of the FBAR sensor of the first wafer during the run process and the FBAR sensor signal changes of subsequent wafers, so as to test the first wafer effect, and the test signal results in this application are single and intuitive, which is convenient for analysis.
[0068] 2) Study on the mixed preparation of different thin film layers (layer mix run study): The etching chamber environment test device in this embodiment can be used to track the changes in the process chamber environment for a long time, such as being applied to inline analysis of data changes such as CD / THK (feature size / thickness), analyzing the impact of different run ratios on the chamber environment, locating the appropriate machine PM (maintenance) time, and the standard slice of the etching chamber environment test device can be conveniently sliced to conveniently analyze the difference in by-product composition. For example: in the process of mixing layer A and layer B, it is preliminarily verified that there is no shift in the mix run inline, but during the continuous run of layer A, the FBAR sensor signal shows that the by-products have been accumulating. When there is a shift when running layer B inline after 50 pcs, a process standard (spec) can be set by the signal fed back by the FBAR sensor to reasonably set the number and rules of runs for different products.
[0069] 3) Study applicable to the run mode: For example, when product A is continuously run for 5 pcs and 10 pcs, the etching chamber environment test device does not detect any abnormality. When it is continuously run for 20 pcs, it is found that the inline has a shift, that is, the signal transmitted by the FBAR sensor can be used to know that the accumulation of by-products has caused the change of the chamber environment. At this time, when the run count is greater than 20 pcs, the clean recipe process can be inserted around run 15 pcs to clean the by-products in the chamber to ensure product quality.
[0070] In summary, the etching chamber environment testing device and etching machine of the utility model include a fixing part, a top door plate, an FBAR sensor and a label. A cavity penetrating the fixing part is provided in the fixing part, the end of the top door plate is movably connected to the side wall of the fixing part and covers the cavity, the FBAR sensor is located on the surface of the top door plate, the label is located on the surface of the FBAR sensor and its position is changed in the cavity by the rotation of the top door plate.
[0071] The etching chamber environment testing device and etching machine of the utility model can realize dynamic detection of the quality of the deposits on the chamber surface and detection of the changes in the chamber environment through the setting of the standard sheet and the FBAR sensor, and simulate the adhesion process of the by-products in the chamber to the greatest extent. Moreover, the composition analysis of the etching by-products can be conveniently performed without opening the chamber through the rotation of the top door plate, so as to realize effective detection of the etching chamber environment. The FBAR sensor has high sensitivity, small size and rapid response, and can greatly reduce the influence on the chamber process. Furthermore, the etching chamber environment testing device can also be provided with a bottom door plate to further improve the airtightness of the etching chamber during the test, so as to avoid the influence of the test process on the etching chamber environment.
[0072] Therefore, the utility model effectively overcomes various shortcomings in the prior art and has high industrial utilization value.
[0073] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.
Claims
1. An etching chamber environment testing device, characterized in that: The etching chamber environment testing device comprises: A fixing member, wherein a cavity penetrating the fixing member is provided in the fixing member; A top door plate, the end of which is movably connected to the side wall of the fixing member and covers the cavity; an FBAR sensor, wherein the FBAR sensor is located on a surface of the top door panel; A label is located on the surface of the FBAR sensor, and the label is transformed in position in the cavity by the rotation of the top door plate.
2. The etching chamber environment testing device according to claim 1, characterized in that: It also includes a bottom door plate, which is in contact with the fixing member. The cavity has a first opening and a second opening, and the bottom door plate covers the first opening, and the top door plate covers the second opening.
3. The etching chamber environment testing device according to claim 2, characterized in that: The bottom door plate is detachably connected to the fixing member.
4. The etching chamber environment testing device according to claim 1, characterized in that: The fixing piece is an elastic fixing piece.
5. The etching chamber environment testing device according to claim 1, characterized in that: The end of the top door plate is connected to the side wall of the fixing member via a bearing.
6. The etching chamber environment testing device according to claim 1, characterized in that: The projection of the label on the FBAR sensor completely covers the FBAR sensor.
7. The etching chamber environment testing device according to claim 1, characterized in that: The surface of the label is coated with an inert protective layer.
8. The etching chamber environment testing device according to claim 1, characterized in that: The size of the etching chamber environment testing device is in the centimeter level.
9. The etching chamber environment testing device according to claim 1, characterized in that: It also includes a controller and a driving member, wherein the controller communicates with the FBAR sensor, the driving member communicates with the controller, and the driving member is connected to the top door panel; and it also includes a display and / or an alarm that communicates with the FBAR sensor.
10. An etching machine, characterized in that: The etching machine comprises the etching chamber environment testing device according to any one of claims 1 to 9.