Mixed reality flight simulation helmet with high heat dissipation efficiency

Abstract

The utility model discloses a mixed reality flight simulation helmet with high heat dissipation efficiency, which belongs to the field of mixed reality and comprises a display module, a helmet module, a helmet shell and a circuit board. The display module is arranged on the helmet module, the circuit board is arranged in the helmet module, and the heating electronic devices are dispersedly arranged on the circuit board in the helmet module; a lining is arranged in the helmet module, the circuit board is arranged between the lining and the helmet shell, and the heat dissipation problem of the flight simulation mixed reality helmet is systematically solved through comprehensive design in the aspects of material body selection, heat production device position arrangement, air convection channels and heat exhaust ports.

Description

Technical Field

[0001] The utility model relates to the field of mixed reality, and more specifically, to a mixed reality simulated flight helmet with high heat dissipation efficiency. Background Art

[0002] Existing head-mounted display products are limited by the small space, and the devices are concentrated at the eye position. The devices are arranged closely, and the heat is concentrated at the eye position, which causes eye discomfort after long-term wearing. In order to solve the heat dissipation problem, some products add fans, which increases the weight of the product. The noise generated by the fan will be conducted to the ears through the bones. Utility Model Content

[0003] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a mixed reality flight simulation helmet with high heat dissipation efficiency. The comprehensive design from the aspects of material selection, location arrangement of heat generating devices, air convection channels, and heat exhaust ports systematically solves the heat dissipation problem of the flight simulation mixed reality helmet.

[0004] The purpose of the utility model is achieved through the following solutions:

[0005] A mixed reality flight simulation helmet with high heat dissipation efficiency, comprising:

[0006] Display module, helmet module, helmet shell and circuit board; the display module is arranged on the helmet module, the circuit board is arranged in the helmet module, and the heat-generating electronic devices are dispersedly arranged on the circuit board in the helmet module; an inner liner is provided in the helmet module, and the circuit board is arranged between the inner liner and the helmet shell; the inner liner is designed and processed with an air convection channel based on the air thermal convection characteristics to introduce external cold air from the lower edge of the helmet, the corresponding lower opening of the circuit board is larger than the side inlet, and the cold air is guided to flow to the circuit board based on fluid mechanics, and the circuit board is placed in the helmet tangent to the fluid flow direction to reduce resistance and increase more heat exchange with the air; the gap at the side top position is reduced to form a turbulent flow to allow the side cold air to flow to the circuit board.

[0007] Furthermore, an air outlet is provided at the upper end of the helmet shell for discharging hot air, so that efficient air convection is formed in the space where the circuit board is located.

[0008] Furthermore, the lining is made of foamed EPP or EPS to prevent the heat in the circuit board space from being transferred to the human head in the helmet.

[0009] Furthermore, an exhaust hole is provided on the upper portion of the helmet module for discharging heat and moisture from the head.

[0010] Furthermore, a buffer pad is also provided in the helmet module.

[0011] Furthermore, the number of the exhaust holes includes four.

[0012] Furthermore, the buffer pad has large openings, which allows a larger area of ​​space for the head and facilitates heat dissipation.

[0013] Furthermore, the cushion pad is a cushion pad formed by punching or molding of sponge.

[0014] Furthermore, the cushion pad is a cushion pad whose surface is in contact with the head and is made of cloth or leather.

[0015] Furthermore, the cushion pad is connected to the inner lining by Velcro or snaps, and can be disassembled, washed and replaced; at the same time, the cushion pad also has a heat-insulating effect, and can form a second heat-insulating layer.

[0016] Beneficial effects of the utility model:

[0017] The utility model dissipates heat for the circuit board mainly by opening an air convection space on the inner lining, and improves the heat dissipation efficiency according to air flow dynamics. After the design is completed, the components can be easily obtained by mold forming or machining. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a first structural schematic diagram of the utility model;

[0020] Figure 2 It is a second structural schematic diagram of the utility model;

[0021] Figure 3 This is a third structural schematic diagram of the utility model;

[0022] Figure 4 This is a fourth structural schematic diagram of the utility model;

[0023] In the figure, 1-display module, 2-helmet module, 3-helmet shell, 4-circuit board, 5-lining, 6-cushion pad. DETAILED DESCRIPTION

[0024] All features disclosed in all embodiments in this specification, or all features implicitly disclosed, except for mutually exclusive features, can be combined or replaced in any way.

[0025] The technical solution of the utility model is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the utility model is not limited to the following. Any feature disclosed in this specification (including any additional claims, abstracts and drawings) can be replaced by other equivalent or alternative features with similar purposes unless otherwise stated. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

[0026] Before describing the embodiments, some necessary terms need to be explained. For example:

[0027] If the terms "first", "second" and the like are used to describe various elements in this application, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, the "first" element discussed below may also be referred to as the "second" element without departing from the teaching of the present utility model. It should be understood that when an element is "connected" or "coupled" to another element, it may be directly connected or directly coupled to another element or there may be an intermediate element. On the contrary, when an element is "directly connected" or "directly coupled" to another element, there is no intermediate element.

[0028] When the terms "include" and / or "comprising" are used in this specification, these terms indicate the existence of the stated features, integers, steps, operations, elements and / or parts, but do not exclude the existence and / or addition of one or more other features, integers, steps, operations, elements, parts and / or groups thereof.

[0029] Example 1

[0030] like Figure 1 As shown, this embodiment provides a mixed reality simulation flight helmet with high heat dissipation efficiency, including: a display module 1, a helmet module 2, a helmet shell 3 and a circuit board 4; the existing head-mounted display device has no or a relatively simple helmet module, and the heat-generating devices are concentrated in the display module. The solution of the utility model arranges most of the electronic heat-generating devices in the display module 1 into the helmet module 2. The heat-generating electronic devices are arranged on the circuit board 4, the circuit board design size is large, and the device arrangement is dispersed. Specifically, the display module 1 is arranged on the helmet module 2, the circuit board 4 is arranged in the helmet module 2, and the heat-generating electronic devices are dispersedly arranged on the circuit board 4 in the helmet module 2.

[0031] like Figure 2As shown, a lining 5 is provided in the helmet module 2, and the circuit board 4 is arranged between the lining 5 and the helmet shell 3; the lining 5 is designed and processed with an air convection channel according to the air thermal convection characteristics, and the external cold air is introduced from the lower edge of the helmet. The corresponding lower opening of the circuit board 4 is larger than the side inlet. According to fluid mechanics, the cold air is guided to flow to the circuit board 4. The circuit board 4 is placed in the helmet in a direction tangent to the fluid flow direction to reduce resistance and increase more heat exchange with the air; the gap at the side top position is reduced to form a turbulent flow, allowing the side cold air to flow to the circuit board 4.

[0032] Example 2

[0033] On the basis of Example 1, Figure 3 As shown, an air outlet is opened at the upper end of the helmet shell 3 for exhausting hot air, so that efficient air convection is formed in the space where the circuit board 4 is located.

[0034] Example 3

[0035] On the basis of Example 1, the lining 5 is made of foamed EPP or EPS lining, which has a good heat insulation effect and prevents the heat in the space of the circuit board 4 from being transferred to the human head in the helmet.

[0036] Example 4

[0037] Based on Example 1, the helmet module 2 has exhaust holes on the top for discharging heat and moisture from the head.

[0038] In an optional embodiment, the number of the exhaust holes includes four, such as Figure 4 As shown, exhaust holes are provided at ABCD on the upper part of the helmet module for discharging heat and moisture from the head.

[0039] Example 5

[0040] On the basis of embodiment 1, a buffer pad 6 is further provided in the helmet module 2 .

[0041] In an optional embodiment, the buffer pad 6 has large openings to allow a larger area of ​​space for the head, making it easier to dissipate heat.

[0042] In an optional implementation manner, the buffer pad 6 is a buffer pad formed by punching or molding of sponge.

[0043] In an optional embodiment, the cushion pad 6 is a cushion pad whose surface is in contact with the head and is made of cloth or leather.

[0044] In an optional implementation manner, the cushion pad 6 is connected to the lining 5 by Velcro or snaps, and is detachable, washable and replaceable; at the same time, the cushion pad also has a heat-insulating effect, and can form a second heat-insulating layer.

[0045] The remaining technical features in this embodiment can be flexibly selected by those skilled in the art according to actual conditions to meet different specific practical needs. However, it is obvious to those skilled in the art that it is not necessary to adopt these specific details to implement the utility model. In other examples, in order to avoid confusing the utility model, the well-known components, structures or parts are not described in detail, which are all within the technical protection scope defined by the technical solution claimed in the claims of the utility model.

[0046] In the description of the present utility model, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" are all broadly defined and should be understood by those skilled in the art in a broad sense. For example, it can be a fixed connection, a movable connection, an integral connection, or a partial connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection through an intermediate medium, or a connection between two components, etc. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances, that is, the expression of textual language and the implementation of actual technology can correspond flexibly, and the expression of the textual language (including drawings) of the specification of the present utility model does not constitute any single restrictive interpretation of the claims.

[0047] The modifications and variations made by those skilled in the art shall not depart from the spirit and scope of the present invention and shall be within the scope of protection of the claims attached to the present invention. In the above description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is obvious to those skilled in the art that these specific details are not necessary to implement the present invention.

Claims

1. A mixed reality flight simulation helmet with high heat dissipation efficiency, characterized in that: include: The invention comprises a display module (1), a helmet module (2), a helmet shell (3) and a circuit board (4); the display module (1) is arranged on the helmet module (2), the circuit board (4) is arranged in the helmet module (2), and the heat-generating electronic components are dispersedly arranged on the circuit board (4) in the helmet module (2); an inner liner (5) is arranged in the helmet module (2), and the circuit board (4) is arranged between the inner liner (5) and the helmet shell (3); the inner liner (5) is designed and processed with an air convection channel according to the air thermal convection characteristics, and the external cold air is introduced from the lower edge of the helmet; the corresponding lower opening of the circuit board (4) is larger than the side inlet, and the cold air is guided to flow toward the circuit board (4) according to fluid mechanics; the circuit board (4) is placed in the helmet in a direction tangent to the fluid flow direction, so as to reduce resistance and increase heat exchange with the air; the gap at the side top position is reduced, so as to form a turbulent flow, so as to allow the side cold air to flow toward the circuit board (4).

2. The mixed reality flight simulation helmet with high heat dissipation efficiency according to claim 1, characterized in that: An air outlet is provided at the upper end of the helmet shell (3) for discharging hot air, thereby forming efficient air convection in the space where the circuit board (4) is located.

3. The mixed reality flight simulation helmet with high heat dissipation efficiency according to claim 1, characterized in that: The inner lining (5) is made of foamed EPP or EPS to prevent the heat in the space of the circuit board (4) from being transferred to the human head in the helmet.

4. The mixed reality flight simulation helmet with high heat dissipation efficiency according to claim 1, characterized in that: The upper part of the helmet module (2) is provided with an exhaust hole for exhausting heat and moisture from the head.

5. The mixed reality flight simulation helmet with high heat dissipation efficiency according to claim 1, characterized in that: A buffer pad (6) is also provided in the helmet module (2).

6. The mixed reality flight simulation helmet with high heat dissipation efficiency according to claim 4, characterized in that: The number of the exhaust holes includes four.

7. The mixed reality flight simulation helmet with high heat dissipation efficiency according to claim 5, characterized in that: The buffer pad (6) has a large opening, which allows a larger area of ​​space for the head, making it easier to dissipate heat.

8. The mixed reality flight simulation helmet with high heat dissipation efficiency according to claim 5, characterized in that: The buffer pad (6) is a buffer pad formed by punching or molding of sponge.

9. The mixed reality flight simulation helmet with high heat dissipation efficiency according to claim 5, characterized in that: The cushion pad (6) is a cushion pad whose surface is in contact with the head and is made of cloth or leather.

10. The mixed reality flight simulation helmet with high heat dissipation efficiency according to claim 5, characterized in that: The cushion pad (6) is connected to the inner lining (5) by means of Velcro or snaps and can be disassembled, washed and replaced; at the same time, the cushion pad also has a heat insulating effect and can form a second heat insulating layer.

Images