Laser projection equipment

Abstract

The utility model relates to the field of projection, and discloses laser projection equipment which comprises a light source, a light valve, a lens and a radiator. The light source comprises a laser; the radiator comprises a substrate, a first radiating fin, a second radiating fin and a plurality of heat conduction pipes; the substrate comprises a first surface and a second surface which are opposite, the first cooling fin is in contact connection with the first surface, and the second cooling fin is in contact connection with the second surface; the second surface is provided with a mounting seat for mounting a laser; the heat conduction pipes comprise the first heat conduction pipe and the second heat conduction pipe. One end of the first heat conduction pipe is fixedly arranged on the first surface, and the other end is inserted into the first radiating fin; the first heat conduction pipe is obliquely arranged relative to the first surface; one end of the second heat conduction pipe is fixedly arranged on the first surface, and the other end is inserted into the second radiating fin; the second heat conduction pipe is obliquely arranged relative to the first surface, and the inclination direction of the first heat conduction pipe is opposite to that of the second heat conduction pipe. The laser projection equipment can improve the heat dissipation capability during multi-angle projection.

Description

Technical Field

[0001] The utility model relates to the technical field of projection, in particular to a laser projection device. Background Art

[0002] A projection device is a device that can project images or videos onto a screen. The projection device usually includes a housing and a light source assembly and a heat sink inside the housing. During the use of the projection device, the light source assembly and other heating elements will generate a large amount of heat, and the heat sink is used to dissipate the heat into the air. Due to the different usage scenarios of the projection device and the various installation and use angles of the projection device, the heat sink cannot guarantee efficient heat dissipation, thus affecting the normal use of the entire projection device. Utility Model Content

[0003] The utility model discloses a laser projection device, which is used for improving the heat dissipation effect of a radiator so as to be suitable for different use scenarios of the laser projection device.

[0004] In order to achieve the above object, the utility model provides the following technical solutions:

[0005] A laser projection device comprises a light source, a light valve, a lens and a radiator; the light source comprises a laser;

[0006] The heat sink comprises: a substrate, a first heat sink, a second heat sink and a plurality of heat pipes;

[0007] The substrate comprises a first surface and a second surface opposite to each other, the first heat sink is in contact with and connected to the first surface, and the second heat sink is in contact with and connected to the second surface; the second surface is provided with a mounting seat for mounting the laser;

[0008] The plurality of heat-conducting pipes include a first heat-conducting pipe and a second heat-conducting pipe; one end of the first heat-conducting pipe is fixedly arranged on the first surface, and the other end is inserted into the first heat sink; the first heat-conducting pipe is arranged to be inclined relative to the first surface;

[0009] One end of the second heat pipe is fixed to the first surface, and the other end is inserted into the second heat sink; the second heat pipe is configured to be inclined relative to the first surface, and the inclination direction of the first heat pipe is opposite to the inclination direction of the second heat pipe.

[0010] In some embodiments, the first heat pipe comprises a first heat pipe segment, a second heat pipe segment, and a first bent pipe segment connecting the first heat pipe segment and the second heat pipe segment, the first heat pipe segment and the second heat pipe segment both extend along a first direction; the first heat pipe segment is fixedly arranged on the first surface, and the second heat pipe segment is inserted into a first heat dissipation hole on the first heat sink; the orthographic projection of the first heat pipe segment on the first surface and the orthographic projection of the second heat pipe segment on the first surface are arranged along a second direction;

[0011] And / or, the second heat pipe comprises a third heat pipe segment, a fourth heat pipe segment and a second bent pipe segment connecting the third heat pipe segment and the fourth heat pipe segment, the third heat pipe segment and the fourth heat pipe segment both extend along the first direction; the third heat pipe segment is fixed on the first surface, and the fourth heat pipe segment is inserted into the second heat dissipation hole on the second heat sink; the orthographic projection of the third heat pipe segment on the first surface and the orthographic projection of the fourth heat pipe segment on the first surface are arranged along the second direction;

[0012] The second direction has an included angle with the first direction.

[0013] In some embodiments, the first heat dissipation hole is a through hole, there are at least two first heat pipes, and at least two first heat pipes are inserted into the first heat dissipation hole from both ends of the same first heat dissipation hole, and / or there is at least one first heat pipe that passes through one first heat dissipation hole.

[0014] In some embodiments, the second heat dissipation hole is a through hole, and the second heat pipe runs through the second heat dissipation hole;

[0015] And / or, there are at least two second heat-conducting pipes, and the number of the second heat-dissipating holes corresponds one-to-one to the number of the second heat-conducting pipes.

[0016] In some embodiments, the plurality of heat-conducting pipes further include a third heat-conducting pipe and a fourth heat-conducting pipe, one end of the third heat-conducting pipe is fixedly arranged on the first surface, and the other end is inserted into the first heat sink; the third heat-conducting pipe is arranged perpendicular to the first surface;

[0017] One end of the fourth heat conducting pipe is fixed on the first surface, and the other end is inserted into the second heat sink; the fourth heat conducting pipe is arranged perpendicular to the first surface.

[0018] In some embodiments, the third heat pipe includes a fifth heat pipe segment, a sixth heat pipe segment, and a third bent pipe segment connecting the fifth heat pipe segment and the sixth heat pipe segment, the fifth heat pipe segment and the sixth heat pipe segment both extend along the first direction; the fifth heat pipe segment is fixed on the first surface, and the sixth heat pipe segment is inserted into the third heat dissipation hole on the first heat sink;

[0019] And / or, the fourth heat pipe includes a seventh heat pipe segment, an eighth heat pipe segment and a fourth bent pipe segment connecting the seventh heat pipe segment and the eighth heat pipe segment, the seventh heat pipe segment and the eighth heat pipe segment both extend along the first direction; the seventh heat pipe segment is fixed on the first surface, and the eighth heat pipe segment is inserted into the fourth heat dissipation hole on the second heat sink.

[0020] In some embodiments, the plurality of heat-conducting pipes further include at least one heat-scaling pipe; and the at least one heat-scaling pipe is fixedly disposed on the first surface.

[0021] In some embodiments, the at least one heat equalizing pipe includes a first heat equalizing pipe and a second heat equalizing pipe, the first heat equalizing pipe includes a ninth heat pipe segment, a tenth heat pipe segment, and a fifth bend segment connecting the ninth heat pipe segment and the tenth heat pipe segment, the second heat equalizing pipe includes an eleventh heat pipe segment, a twelfth heat pipe segment, and a sixth bend segment connecting the eleventh heat pipe segment and the twelfth heat pipe segment; along the second direction, the eleventh heat pipe segment is located between the ninth heat pipe segment and the tenth heat pipe segment, and the tenth heat pipe segment is located between the eleventh heat pipe segment and the twelfth heat pipe segment.

[0022] In some embodiments, the first surface has a plurality of first grooves for fixing the plurality of heat-conducting pipes.

[0023] In some embodiments, the first heat sink has a second groove matching the first groove on a side facing the first surface, and the plurality of heat pipes are fixed in a receiving space formed by the first groove and the second groove.

[0024] The embodiment of the utility model provides a laser projection device, including a light source, a light valve, a lens and a heat sink. The light valve may include a light modulation partition corresponding to the light source one by one. The light source emits light, and the light is transmitted to the light modulation partition corresponding to the light source in the light valve. The light modulation partition in the light valve can modulate the incident light and then emit it to the lens. The lens can project the incident light to form a projection picture. The light source includes a laser, and the heat sink is connected to the laser for heat dissipation. The heat sink specifically includes a substrate, a first heat sink, a second heat sink and a plurality of heat pipes. The substrate includes a first surface and a second surface relative to each other. The mounting seat on the second surface is used to mount the laser. The heat generated by the laser can be directly transferred to the substrate. The first heat sink is in contact with the first surface of the substrate, and the second heat sink is in contact with the second surface of the substrate. Therefore, the heat on the substrate can be directly transferred to the first heat sink and the second heat sink by heat conduction, thereby improving the heat dissipation efficiency. The multiple heat pipes in the radiator include a first heat pipe and a second heat pipe. One end of the first heat pipe is fixed to the first surface of the substrate, and the other end is inserted into the first heat sink. That is, the first heat pipe uses the substrate as an evaporation end and the first heat sink as a condensation end, and uses the superconducting heat transfer performance of the heat pipe to conduct heat on the substrate to the first heat sink. One end of the second heat pipe is fixed on the first surface of the substrate, and the other end is inserted into the second heat sink, that is, the second heat pipe uses the substrate as the evaporation end and the second heat sink as the condensation end, and uses the superconducting heat transfer performance of the heat pipe to export the heat on the substrate to the second heat sink; further, the first heat pipe is configured to be inclined relative to the first surface, and the second heat pipe is configured to be inclined relative to the first surface, and the inclination direction of the first heat pipe is opposite to the inclination direction of the second heat pipe. Heat pipes with different inclination directions can ensure that when the laser projection device is projected at multiple angles, the condensed working fluid in the heat pipe is refluxed along the gravity direction, so that the heat pipe is in a favorable heat transfer direction, maintains the superconducting heat transfer performance, and exports the heat to the first heat sink or the second heat sink to meet the heat dissipation requirements. The first heat sink and the second heat sink can discharge the heat exported by the heat pipe into the air in time, and the first heat sink and the second heat sink are both directly in contact with the substrate, so that the heat of the substrate is directly transferred to the first heat sink and the second heat sink. The heat conduction from the substrate to the first heat sink and the second heat sink is not affected by the direction of gravity, which can reduce the pressure of the heat transfer of the heat pipe, thereby ensuring the normal heat dissipation of the laser projection device. Therefore, the laser projection device provided by the embodiment of the utility model can make up for the heat transfer defect in the radiator when the heat pipe is in an unfavorable heat dissipation direction in the use scenario of various installation angles, so that the radiator meets the heat dissipation requirements, which is conducive to improving the heat dissipation capacity of the entire laser projection device, thereby improving the multi-angle projection capability of the laser projection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of a radiator in the related art;

[0026] Figure 2 A scene diagram when a laser projection device is projected on a projection screen provided by an embodiment of the utility model;

[0027] Figure 3 A schematic diagram of a laser projection device provided in an embodiment of the utility model Figure 1 ;

[0028] Figure 4 A schematic diagram of a laser projection device provided in an embodiment of the utility model Figure 2 ;

[0029] Figure 5 A schematic diagram of a heat sink provided by an embodiment of the utility model Figure 1 ;

[0030] Figure 6 A schematic diagram of a heat sink provided by an embodiment of the utility model Figure 2 ;

[0031] Figure 7 A schematic diagram of a heat sink provided by an embodiment of the utility model Figure 3 ;

[0032] Figure 8 A schematic diagram of a heat sink provided by an embodiment of the utility model Figure 4 ;

[0033] Fig. 9 A layout of heat pipes in a radiator provided by an embodiment of the utility model Figure 1 ;

[0034] Fig.10 A layout of heat pipes in a radiator provided by an embodiment of the utility model Figure 2 ;

[0035] Fig.11 A layout of heat pipes in a radiator provided by an embodiment of the utility model Figure 3 ;

[0036] Fig.12 A layout of heat pipes in a radiator provided by an embodiment of the utility model Figure 4 ;

[0037] Fig.13 A layout of heat pipes in a radiator provided by an embodiment of the utility model Figure 5 ;

[0038] Fig.14 A layout of heat pipes in a radiator provided by an embodiment of the utility model Figure 6 ;

[0039] Fig.15 A layout of heat pipes in a radiator provided by an embodiment of the utility model Figure 7 ;

[0040] Fig.16 A layout of heat pipes in a radiator provided by an embodiment of the utility model Figure 8 ;

[0041] Fig.17 A layout diagram of a second heat sink and a mounting seat in a heat sink provided in an embodiment of the utility model;

[0042] Fig.18 A schematic diagram of a heat sink provided by an embodiment of the utility model Figure 5 ;

[0043] Fig.19 for Fig.18 Enlarged view of point A in the middle;

[0044] Icon: 1-substrate; 2-heat pipe; 3-fin;

[0045] 100-substrate; 200-first heat sink; 300-second heat sink; 400-first heat pipe; 500-second heat pipe; 600-third heat pipe; 700-fourth heat pipe; 800-first heat spreader; 900-second heat spreader; 1000-laser projection device; 110-first surface; 120-second surface; 111-first groove; 121-mounting seat; 210-first heat dissipation hole; 220-third heat dissipation hole; 230-second groove; 310-second heat dissipation hole; 320-fourth heat dissipation hole; 410-first heat pipe section; 420-second heat pipe section; 430-first bend section; 510-third heat pipe section; 520-fourth heat pipe section; 530-second bend section; 610-fifth heat pipe section; 620-sixth heat pipe section; 630-third bend section; 710-seventh heat pipe section; 720-eighth heat pipe section; 730-fourth bend section; 810-ninth heat pipe section; 820-tenth heat pipe section; 830-fifth bend section; 910-eleventh heat pipe section; 920-twelfth heat pipe section; 930-sixth bend section; 1010-laser; 1020-light valve; 1030-lens; 1001-projection screen. DETAILED DESCRIPTION

[0046] First, let me introduce the application scenario of this application: In order to dissipate the heat of the laser in the current laser projection equipment, a fan and a radiator are usually set on the laser projection equipment. The radiator can exchange heat with the laser and absorb the heat of the laser; and when the fan rotates, it will generate wind flow, which can blow to the radiator and take away the heat of the radiator, thereby achieving the effect of reducing the temperature of the laser. Usually, the radiator in the laser projection equipment adopts a combination of "substrate + heat pipe + fin". The substrate contacts the laser and transfers the heat from the laser to the heat pipe. The heat pipe connects the substrate and the fins, transferring the heat from the substrate to the fins. The fins are generally made of aluminum, and the fan is used to discharge the heat in the fins to the surrounding environment through air convection, thereby achieving normal heat dissipation of the laser projection equipment.

[0047] The heat pipe is generally a pure copper hollow sealed tube with a microstructure on the inner wall, including copper mesh arrangement, copper powder sintering, processing grooves or composite molding. The interior is vacuumed and an appropriate amount of working fluid is injected. When the heat pipe is working, the end in contact with the substrate is the evaporation heating end, and the end in contact with the fins is the condensation end. When the heating end is heated, the working fluid in the microstructure of the inner wall of the vacuum heat pipe will instantly vaporize, the pressure will increase, and it will rush to the condensation end. After the heat at the condensation end is discharged to the environment through the fins, the gas at the condensation end condenses back to the working fluid state, and returns to the evaporation end through the microstructure of the tube wall with the help of capillary force, completing a cycle. The phase change process in the heat pipe can quickly transfer heat, making the heat transfer efficiency of the heat pipe up to hundreds of times the thermal conductivity of pure copper.

[0048] Commonly used radiators in laser projection equipment such as Figure 1 As shown in the figure, the heat conducting substrate is separated from the heat dissipating fins, and the heat is transferred by the heat pipe in the middle. When the heat transfer performance of the heat pipe is reduced or even fails due to the reverse gravity or low temperature icing, the heat dissipation performance of the heat pipe radiator will be seriously attenuated, thus affecting the heat dissipation performance of the entire laser projection equipment. The reasons are as follows:

[0049] Heat transfer by heat pipes is affected by gravity and is limited to single-angle applications. Therefore, when the laser projection equipment has multi-angle projection requirements, the heat transfer power of the heat pipe is severely attenuated, and the radiator cannot meet the heat dissipation requirements, resulting in poor heat dissipation of the laser projection equipment. Specifically, when the substrate is higher than the heat sink fins, the capillary force of the tube wall microstructure responsible for returning the condensed working fluid to the evaporation end needs to overcome gravity to do work, resulting in a slowdown in the circulation of the working fluid and a deterioration in the heat transfer effect of the heat pipe. When the heat pipe transfers heat vertically downward, the heat transfer power will drop to about 50% of the horizontal state. In commercial laser projection equipment, due to the variety of installation and use angles, some heat pipes are inevitably at unfavorable heat dissipation angles, reducing the heat dissipation performance of the laser projection equipment.

[0050] The heat transfer of heat pipes is affected by the ambient temperature. Therefore, when the laser projection equipment is used in a low-temperature scene, the heat transfer power of the heat pipe is severely attenuated, and the radiator cannot meet the heat dissipation requirements, resulting in poor heat dissipation of the laser projection equipment. The working fluid used in the heat pipe is pure water, which is cheap, has a high latent heat of vaporization, and has stable performance. When the laser projection equipment is used in a low-temperature environment below 0°C, the pure water in the heat pipe freezes and cannot be vaporized, which hinders the phase change heat transfer process of the pure water. When the temperature of the substrate rises, only part of the ice in the heat pipe around the substrate melts, causing the thermal cycle to occur in a very small area, and the heat cannot be transferred to the fins normally, so that the performance of the heat pipe radiator cannot meet the use requirements, reducing the heat dissipation performance of the laser projection equipment.

[0051] Based on the above application scenarios, the embodiments of the present application provide a laser projection device that can compensate for the heat transfer defects of the entire machine when the heat pipe is in an unfavorable heat dissipation direction and a low-temperature environment during the use of the laser projection device, thereby increasing the multi-angle adaptability and low-temperature environment adaptability of the laser projection device.

[0052] The following will combine the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Among them, in the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in the text is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" refers to two or more than two.

[0053] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as suggesting or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features, and in the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.

[0054] like Figure 2-Figure 4As shown, the embodiment of the utility model provides a laser projection device 1000, including a light source, a light valve 1020, a lens 1030 and a heat sink; the light source includes a laser 1010; the light valve may include light modulation partitions corresponding to the light source; the light source emits light, which is transmitted to the light modulation partitions corresponding to the light source in the light valve, the light modulation partitions in the light valve can modulate the incident light and then emit it to the lens, and the lens can project the incident light to form a projection picture. The light source includes a laser, and the heat sink is connected to the laser for heat dissipation. Figures 5 to 8 As shown, the heat sink includes: a substrate 100, a first heat sink 200, a second heat sink 300 and a plurality of heat pipes; the substrate 100 includes a first surface 110 and a second surface 120 opposite to each other, the first heat sink 200 is in contact with and connected to the first surface 110, and the second heat sink 300 is in contact with and connected to the second surface 120; the second surface 120 is provided with a mounting seat 121 for mounting the laser; the plurality of heat pipes include a first heat pipe 400 and a second heat pipe 500; one end of the first heat pipe 400 is fixed on the first surface 110, and the other end is inserted into the first heat sink 200; the first heat pipe 400 is configured to be tilted relative to the first surface 110; one end of the second heat pipe 500 is fixed on the first surface 110, and the other end is inserted into the second heat sink 300; the second heat pipe 500 is configured to be tilted relative to the first surface 110, and the tilt direction of the first heat pipe 400 is opposite to the tilt direction of the second heat pipe 500.

[0055] Figure 3 FIG. 1 shows a schematic diagram of the structure of a laser projection device in which the light source is projected forward. At this time, the first heat sink 200 is located above the second heat sink 300. Figure 4 The schematic diagram of the structure of the laser projection device with the light source inverted is shown, and at this time the first heat sink 200 is located below the second heat sink 300. However, no matter at what angle the laser projection device is projected, it has a high heat dissipation capacity.

[0056] like Figure 5-Figure 8As shown, the heat sink includes a substrate 100, a first heat sink 200, a second heat sink 300 and a plurality of heat pipes. The substrate 100 includes a first surface 110 and a second surface 120 opposite to each other. The mounting seat 121 on the second surface 120 is used to mount the laser, and the heat generated by the laser can be directly transferred to the substrate 100. Exemplarily, the first heat sink 200 and the second heat sink 300 are both heat sink fins. The first heat sink 200 is in contact with and connected to the first surface 110 of the substrate 100, and the second heat sink 300 is in contact with and connected to the second surface 120 of the substrate 100. Therefore, the heat on the substrate 100 can be directly transferred to the first heat sink 200 and the second heat sink 300 by heat conduction, thereby improving the heat dissipation efficiency. The multiple heat pipes in the radiator include a first heat pipe 400 and a second heat pipe 500. One end of the first heat pipe 400 is fixed to the first surface 110 of the substrate 100, and the other end is inserted into the first heat sink 200. That is, the first heat pipe 400 uses the substrate 100 as an evaporation end and the first heat sink 200 as a condensation end, and uses the superconducting heat transfer performance of the heat pipe to conduct heat on the substrate 100 to the first heat sink 200. One end of the second heat pipe 500 is fixed on the first surface 110 of the substrate 100, and the other end is inserted into the second heat sink 300, that is, the second heat pipe 500 uses the substrate 100 as an evaporation end and the second heat sink 300 as a condensation end, and uses the superconducting heat transfer performance of the heat pipe to export the heat on the substrate 100 to the second heat sink 300; further, the first heat pipe 400 is configured to be inclined relative to the first surface 110, and the second heat pipe 500 is configured to be inclined relative to the first surface 110, and the inclination direction of the first heat pipe 400 is opposite to the inclination direction of the second heat pipe 500. Heat pipes with different inclination directions can ensure that when the laser projection device is projected at multiple angles, the reflux process of the condensed working fluid in the heat pipe is along the gravity direction, so that the heat pipe is in a favorable heat transfer direction, maintains the superconducting heat transfer performance, and exports the heat to the first heat sink 200 or the second heat sink 300 to meet the heat dissipation requirements. The first heat sink 200 and the second heat sink 300 can discharge the heat derived from the heat pipe into the air in time, and the first heat sink 200 and the second heat sink 300 are directly in contact with the substrate 100, so that the heat of the substrate 100 is directly transferred to the first heat sink 200 and the second heat sink 300. The heat conduction from the substrate 100 to the first heat sink 200 and the second heat sink 300 is not affected by the direction of gravity, which can reduce the pressure of heat transfer of the heat pipe, thereby ensuring the normal heat dissipation of the laser projection device. Therefore, the laser projection device provided by the embodiment of the utility model can make up for the heat transfer defect in the radiator when the heat pipe is in an unfavorable heat dissipation direction in the use scenario of various installation and use angles, so that the radiator meets the heat dissipation requirements, which is conducive to improving the heat dissipation capacity of the entire laser projection device, thereby improving the multi-angle projection capability of the laser projection device.

[0057] Furthermore, when the laser projection device is in a low temperature environment, such as when the ambient temperature is lower than 0°C, the working fluid in the multiple heat pipes freezes at the beginning, and the heat transfer performance is greatly attenuated. At this time, the heat generated by the laser can be directly transferred from the substrate 100 to the first heat sink 200 and the second heat sink 300 by heat conduction. Since metal heat transfer is not affected by low temperature, the temperature of the substrate 100 rises to above 0°C during the heat conduction process, which is conducive to the melting of the working fluid in the heat pipe fixed on the first surface 110 of the substrate 100, and the partial phase change heat transfer capacity of the heat pipe is restored. The substrate 100 is in direct contact with the first heat sink 200 and the second heat sink 300, and the heat is directly transferred to the first heat sink 200 and the second heat sink 300, reducing the dependence on the phase change heat transfer in the heat pipe. Since the ambient temperature is low at this time, although the heat transfer performance of the heat pipe is affected, the radiator as a whole can still meet the heat dissipation requirements of the laser projection device and ensure the heat dissipation capacity of the laser projection device.

[0058] Therefore, the embodiment of the utility model can meet the requirements of multi-angle installation and use in low-temperature environment of the laser projection device through the design of the heat sink structure of the laser projection device.

[0059] In some embodiments, the first heat pipe 400 includes a first heat pipe segment 410, a second heat pipe segment 420, and a first bent pipe segment 430 connecting the first heat pipe segment 410 and the second heat pipe segment 420. The first heat pipe segment 410 and the second heat pipe segment 420 both extend along a first direction. The first heat pipe segment 410 is fixed to the first surface 110, and the second heat pipe segment 420 is inserted into the first heat dissipation hole 210 on the first heat sink 200. The orthographic projection of the first heat pipe segment 410 on the first surface 110 and the orthographic projection of the second heat pipe segment 420 on the first surface 110 are arranged along a second direction.

[0060] And / or, the second heat pipe 500 includes a third heat pipe segment 510, a fourth heat pipe segment 520 and a second curved pipe segment 530 connecting the third heat pipe segment 510 and the fourth heat pipe segment 520, the third heat pipe segment 510 and the fourth heat pipe segment 520 both extend along the first direction; the third heat pipe segment 510 is fixed on the first surface 110, and the fourth heat pipe segment 520 is inserted into the second heat dissipation hole 310 on the second heat sink 300; the orthographic projection of the third heat pipe segment 510 on the first surface 110 and the orthographic projection of the fourth heat pipe segment 520 on the first surface 110 are arranged along the second direction; wherein the second direction has an angle with the first direction. If the first direction is Fig. 9 The middle X direction, the second direction is Fig. 9 The X direction is perpendicular to the Y direction.

[0061] like Fig. 9As shown, the first heat pipe 400 is a U-shaped structure, including a first heat pipe section 410, a second heat pipe section 420, and a first curved pipe section 430 connecting the first heat pipe section 410 and the second heat pipe section 420. The first heat pipe section 410 and the second heat pipe section 420 both extend along the X direction; and when viewed from the positive direction of the X axis, the first heat pipe 400 is inclined toward the positive direction of the Y axis. Figure 5-Figure 8 , the first heat pipe section 410 is arranged in the substrate 100 along the X direction, the second heat pipe section 420 is arranged in the first heat dissipation hole 210 of the first heat sink 200, and the first bend section 430 is located outside the first heat sink 200. It can be understood that the first heat pipe 400 can be formed by connecting the first heat pipe section 410, the first bend section 430 and the second heat pipe section 420 in sequence, or can be formed by bending a heat pipe. The first heat pipe 400 includes a working fluid, and the first heat pipe 400 has a cavity, and the working fluid can be located in the cavity. Further, the working fluid can flow back and forth between the first heat pipe section 410, the first bend section 430 and the second heat pipe section 420 of the first heat pipe 400, and the working fluid can accelerate the transmission speed of heat in the first heat pipe 400, thereby accelerating the heat exchange efficiency between the first heat pipe 400 and the first heat sink 200.

[0062] like Fig.10 As shown, the second heat pipe 500 is a U-shaped structure, including a third heat pipe segment 510, a fourth heat pipe segment 520, and a second curved pipe segment 530 connecting the third heat pipe segment 510 and the fourth heat pipe segment 520. The third heat pipe segment 510 and the fourth heat pipe segment 520 both extend along the X direction; and when viewed from the positive direction of the X axis, the second heat pipe 500 is inclined toward the positive direction of the Y axis, but the fourth heat pipe segment 520 is located on the side of the substrate 100 facing the second surface 120. Figure 5-Figure 8 , the third heat pipe section 510 is arranged in the substrate 100 along the X direction, the fourth heat pipe section 520 is arranged in the second heat dissipation hole 310 of the second heat sink 300, and the second bend section 530 is located outside the second heat sink 300. It can be understood that the second heat pipe 500 can be formed by connecting the third heat pipe section 510, the second bend section 530 and the fourth heat pipe section 520 in sequence, or it can be formed by bending a heat pipe. The second heat pipe 500 includes a working fluid, and the second heat pipe 500 has a cavity, and the working fluid can be located in the cavity. Further, the working fluid can flow back and forth between the third heat pipe section 510, the second bend section 530 and the fourth heat pipe section 520 of the second heat pipe 500, and the working fluid can accelerate the transmission speed of heat in the second heat pipe 500, thereby accelerating the heat exchange efficiency between the second heat pipe 500 and the second heat sink 300.

[0063] It should be noted that the first heat pipe 400 and the second heat pipe 500 are both inclined relative to the first surface 110 of the substrate 100, and the inclination directions are opposite, which can ensure that when the heat dissipation efficiency of the first heat pipe 400 is reduced due to the installation angle problem of the substrate 100, the second heat pipe 500 can maintain a higher heat dissipation efficiency. For example: the first heat pipe section 410 and the second heat pipe section 420 of the first heat pipe 400 are arranged along the gravity direction, that is, the working fluid is restricted by gravity when flowing through the first curved pipe section 430, thereby causing the heat transfer efficiency of the first heat pipe 400 to be reduced. Since the inclination direction of the second heat pipe 500 is different from that of the first heat pipe 400, the flow of the working fluid in the second heat pipe 500 is relatively less affected by gravity, and the heat dissipation efficiency of the second heat pipe 500 can be maintained.

[0064] In some embodiments, the first heat dissipation hole 210 is a through hole, there are at least two first heat pipes 400, and there are at least two first heat pipes 400 inserted into the first heat dissipation hole 210 from both ends of the same first heat dissipation hole 210, and / or there is at least one first heat pipe 400 passing through a first heat dissipation hole 210.

[0065] In some embodiments, the second heat dissipation hole 310 is a through hole, and the second heat pipe 500 passes through the second heat dissipation hole 310;

[0066] And / or, there are at least two second heat-conducting pipes 500 , and the number of the second heat-dissipating holes 310 corresponds to the number of the second heat-conducting pipes 500 .

[0067] like Figure 8 and Fig. 9 As shown, the heat sink has three first heat pipes 400, two of which are arranged along the X direction, and another first heat pipe 400 is arranged along the Y direction with the two first heat pipes 400. The three first heat pipes 400 have the same inclination direction, and the inclination angles of the three first heat pipes 400 can be the same or different. Definition Fig. 9 The first heat conducting pipe 400 on the left of the two first heat conducting pipes 400 arranged along the X direction is the first first heat conducting pipe 400, and is defined as Fig. 9 The first heat conducting pipe 400 on the right side of the two first heat conducting pipes 400 arranged along the X direction is the second first heat conducting pipe 400, and is defined as Fig. 9 The last first heat conducting pipe 400 is the third first heat conducting pipe 400. Fig. 9As shown, for easy installation, the first first heat pipe 400 and the second first heat pipe 400 pass through the same first heat dissipation hole 210 on the first heat sink 200, and are respectively inserted from both ends of the first heat dissipation hole 210. The three first heat pipes 400 are all U-shaped structures, and the openings of the first first heat pipe 400 and the third first heat pipe 400 are both facing the positive direction of the X axis, and the opening of the second first heat pipe 400 is facing the negative direction of the X axis. Along the X direction, the length of the third first heat pipe 400 is greater than the total length of the first first heat pipe 400 and the second first heat pipe 400. The third first heat pipe 400 passes through another first heat dissipation hole 210 on the first heat sink 200.

[0068] like Figure 8 and Fig.10 As shown, the radiator has two second heat pipes 500, wherein the two second heat pipes 500 are arranged along the Y direction. The two second heat pipes 500 have the same inclination direction, and the inclination angles of the two second heat pipes 500 can be the same or different. Both the two second heat pipes 500 are U-shaped structures, and the openings of the two second heat pipes 500 are both oriented toward the negative direction of the X axis. Along the X direction, the two second heat pipes 500 pass through the two second heat dissipation holes 310 on the second heat sink 300, that is, one second heat pipe 500 passes through one second heat dissipation hole 310.

[0069] In some embodiments, the plurality of heat pipes further include a third heat pipe 600 and a fourth heat pipe 700, wherein one end of the third heat pipe 600 is fixed on the first surface 110, and the other end is inserted into the first heat sink 200; the third heat pipe 600 is configured to be perpendicular to the first surface 110; one end of the fourth heat pipe 700 is fixed on the first surface 110, and the other end is inserted into the second heat sink 300; the fourth heat pipe 700 is configured to be perpendicular to the first surface 110, and both the third heat pipe 600 and the fourth heat pipe 700 are perpendicular to the first surface 110, which can ensure that when the first surface 110 of the substrate 100 is parallel to the horizontal plane, a higher heat dissipation efficiency can be achieved.

[0070] In some embodiments, the third heat pipe 600 includes a fifth heat pipe segment 610, a sixth heat pipe segment 620, and a third bent pipe segment 630 connecting the fifth heat pipe segment 610 and the sixth heat pipe segment 620. The fifth heat pipe segment 610 and the sixth heat pipe segment 620 both extend along the first direction. The fifth heat pipe segment 610 is fixed to the first surface 110, and the sixth heat pipe segment 620 is inserted into the third heat dissipation hole 220 on the first heat sink 200.

[0071] And / or, the fourth heat pipe 700 includes a seventh heat pipe segment 710, an eighth heat pipe segment 720 and a fourth bent pipe segment 730 connecting the seventh heat pipe segment 710 and the eighth heat pipe segment 720, the seventh heat pipe segment 710 and the eighth heat pipe segment 720 both extend along the first direction; the seventh heat pipe segment 710 is fixed to the first surface 110, and the eighth heat pipe segment 720 is inserted into the fourth heat dissipation hole 320 on the second heat sink 300.

[0072] like Fig.11 As shown, the third heat pipe 600 is a U-shaped structure, including a fifth heat pipe segment 610, a sixth heat pipe segment 620, and a third curved pipe segment 630 connecting the fifth heat pipe segment 610 and the sixth heat pipe segment 620. The fifth heat pipe segment 610 and the sixth heat pipe segment 620 both extend along the X direction; and the first surface 110 is an XY plane, and the third heat pipe 600 is located in the XZ plane. Figure 5-Figure 8 , the fifth heat pipe segment 610 is arranged in the substrate 100 along the X direction, the sixth heat pipe segment 620 is arranged in the third heat dissipation hole 220 of the first heat sink 200, and the third bend pipe segment 630 is located outside the first heat sink 200. It can be understood that the third heat pipe 600 can be formed by connecting the fifth heat pipe segment 610, the third bend pipe segment 630 and the sixth heat pipe segment 620 in sequence, or it can be formed by bending a heat pipe. The third heat pipe 600 includes a working fluid, and the third heat pipe 600 has a cavity, and the working fluid can be located in the cavity. Further, the working fluid can flow back and forth between the fifth heat pipe segment 610, the third bend pipe segment 630 and the sixth heat pipe segment 620 of the third heat pipe 600, and the working fluid can accelerate the transmission speed of heat in the third heat pipe 600, thereby accelerating the heat exchange efficiency between the third heat pipe 600 and the first heat sink 200. It can be understood that the third heat dissipation hole 220 is a through hole, and the sixth heat pipe segment 620 passes through the third heat dissipation hole 220 .

[0073] like Fig.12 As shown, the fourth heat pipe 700 is a U-shaped structure, including a seventh heat pipe segment 710, an eighth heat pipe segment 720, and a fourth curved pipe segment 730 connecting the seventh heat pipe segment 710 and the eighth heat pipe segment 720. The seventh heat pipe segment 710 and the eighth heat pipe segment 720 both extend along the X direction; and when viewed from the positive direction of the X axis, the fourth heat pipe 700 is inclined toward the positive direction of the Y axis, but the eighth heat pipe segment 720 is located on the side of the substrate 100 facing the second surface 120. Figure 2-Figure 5, the seventh heat pipe segment 710 is arranged in the substrate 100 along the X direction, the eighth heat pipe segment 720 is arranged in the fourth heat dissipation hole 320 of the second heat sink 300, and the fourth bend pipe segment 730 is located outside the second heat sink 300. It can be understood that the fourth heat pipe 700 can be formed by connecting the seventh heat pipe segment 710, the fourth bend pipe segment 730 and the eighth heat pipe segment 720 in sequence, or it can be formed by bending a heat pipe. The fourth heat pipe 700 includes a working fluid, and the fourth heat pipe 700 has a cavity, and the working fluid can be located in the cavity. Further, the working fluid can flow back and forth between the seventh heat pipe segment 710, the fourth bend pipe segment 730 and the eighth heat pipe segment 720 of the fourth heat pipe 700, and the working fluid can accelerate the transmission speed of heat in the fourth heat pipe 700, thereby accelerating the heat exchange efficiency between the fourth heat pipe 700 and the second heat sink 300. It can be understood that the fourth heat dissipation hole 320 is a through hole, and the eighth heat pipe segment 720 runs through the fourth heat dissipation hole 320 .

[0074] It should be noted that, for the convenience of processing and installation, the axis of the first heat dissipation hole 210, the axis of the second heat dissipation hole 310, the axis of the third heat dissipation hole 220 and the axis of the fourth heat dissipation hole 320 are all parallel. Of course, the axes of only three heat dissipation holes may be parallel, or the axes of only two heat dissipation holes may be parallel, or the axes of all four heat dissipation holes may be different.

[0075] In some embodiments, the plurality of heat conducting pipes further include at least one heat averaging pipe; at least one heat averaging pipe is fixedly disposed on the first surface 110. The heat averaging pipe can evenly distribute the local heat on the substrate 100 over the entire substrate 100, thereby improving the heat dissipation efficiency. Exemplarily, the heat averaging pipe transfers the heat of the portion of the substrate 100 that is in direct contact with the laser 1010 to a position away from the laser 1010, so that the heat is transferred to the entire substrate 100 as quickly as possible and distributed as evenly as possible, so that the entire substrate 100 becomes the evaporation end.

[0076] In some embodiments, at least one heat equalizing pipe includes a first heat equalizing pipe 800 and a second heat equalizing pipe 900, the first heat equalizing pipe 800 includes a ninth heat pipe segment 810, a tenth heat pipe segment 820, and a fifth bend segment 830 connecting the ninth heat pipe segment 810 and the tenth heat pipe segment 820, the second heat equalizing pipe 900 includes an eleventh heat pipe segment 910, a twelfth heat pipe segment 920, and a sixth bend segment 930 connecting the eleventh heat pipe segment 910 and the twelfth heat pipe segment 920; along the second direction, the eleventh heat pipe segment 910 is located between the ninth heat pipe segment 810 and the tenth heat pipe segment 820, and the tenth heat pipe segment 820 is located between the eleventh heat pipe segment 910 and the twelfth heat pipe segment 920.

[0077] like Fig.13 and Fig.14As shown, the first heat-scaling tube 800 and the second heat-scaling tube 900 are both U-shaped structures. The first heat-scaling tube 800 includes a ninth heat pipe segment 810, a tenth heat pipe segment 820, and a fifth curved tube segment 830 connecting the ninth heat pipe segment 810 and the tenth heat pipe segment 820. The second heat-scaling tube 900 includes an eleventh heat pipe segment 910, a twelfth heat pipe segment 920, and a sixth curved tube segment 930 connecting the eleventh heat pipe segment 910 and the twelfth heat pipe segment 920. The ninth heat pipe segment 810, the tenth heat pipe segment 820, the eleventh heat pipe segment 910, and the twelfth heat pipe segment 920 all extend along the X direction. Figure 5-Figure 8 , the ninth heat pipe segment 810, the tenth heat pipe segment 820, the eleventh heat pipe segment 910 and the twelfth heat pipe segment 920 are all arranged in the X direction through the substrate 100. It can be understood that the first heat-scaling pipe 800 can be formed by connecting the ninth heat pipe segment 810, the fifth bend segment 830 and the tenth heat pipe segment 820 in sequence, or it can be formed by bending a heat pipe. The first heat-scaling pipe 800 includes a working fluid, and the first heat-scaling pipe 800 has a cavity, and the working fluid can be located in the cavity. Further, the working fluid can flow back and forth between the ninth heat pipe segment 810, the fifth bend segment 830 and the tenth heat pipe segment 820 of the first heat-scaling pipe 800, and the working fluid can speed up the transmission speed of heat in the first heat-scaling pipe 800, thereby speeding up the heat exchange efficiency between the first heat-scaling pipe 800 and the substrate 100. Similarly, the second heat-scaling tube 900 can be formed by connecting the eleventh heat pipe segment 910, the sixth bend segment 930 and the twelfth heat pipe segment 920 in sequence, or it can be formed by bending a heat pipe. The second heat-scaling tube 900 includes a working fluid, and the second heat-scaling tube 900 has a cavity, and the working fluid can be located in the cavity. Furthermore, the working fluid can flow back and forth between the eleventh heat pipe segment 910, the sixth bend segment 930 and the twelfth heat pipe segment 920 of the second heat-scaling tube 900, and the working fluid can speed up the transmission speed of heat in the second heat-scaling tube 900, thereby speeding up the heat exchange efficiency between the second heat-scaling tube 900 and the substrate 100. Of course, there can also be three or more heat-scaling tubes.

[0078] like Fig.15 As shown, two heat-balancing tubes for evenly distributing heat to the substrate 100 are distributed in a cross U shape on the substrate 100, that is, both heat-balancing tubes are U-shaped structures, and the U-shaped opening of the first heat-balancing tube 800 faces the positive direction of the X-axis, and the U-shaped opening of the second heat-balancing tube 900 faces the negative direction of the X-axis, and the tenth heat pipe segment 820 of the first heat-balancing tube 800 is inserted into the U-shaped structure of the second heat-balancing tube 900, and the eleventh heat pipe segment 910 of the second heat-balancing tube 900 is inserted into the U-shaped structure of the first heat-balancing tube 800, which can further improve the heat-balancing efficiency of the entire heat-balancing tube, so that the heat is distributed as evenly as possible on the substrate 100.

[0079] like Fig.16As shown, heat pipes with different directions can ensure that when the laser projection equipment is arranged and used at various angles, the reflux process of the condensed working fluid in the heat pipe is along the direction of gravity, so that the heat pipe is in a favorable heat transfer direction, maintaining the superconducting heat transfer performance, and exporting heat to the cooling fins to meet the heat transfer requirements.

[0080] like Fig.17 As shown, the orthographic projection of the second heat sink 300 on the second surface 120 of the substrate 100 is L-shaped, and the opening of the L-shape faces the mounting seat 121 for mounting the laser 1010, that is, the second heat sink 300 is located outside the laser 1010 in a semi-enclosed manner, so that the heat generated by the laser 1010 can be dissipated into the air as quickly as possible.

[0081] In some embodiments, the first surface 110 has a plurality of first grooves 111 for fixing a plurality of heat pipes. All heat pipes in the heat sink can be embedded in the first grooves 111, which increases the contact area between the heat pipes and the substrate 100, increases the heat transfer efficiency between the substrate 100 and the heat pipes, and makes the connection between the heat pipes and the substrate 100 more reliable. Figure 9-Figure 14 As shown, along the positive direction of the Y-axis, the seventh heat pipe segment 710, the first heat pipe segment 410, the ninth heat pipe segment 810, the first heat pipe segment 410, the third heat pipe segment 510, the eleventh heat pipe segment 910, the tenth heat pipe segment 820, the fifth heat pipe segment 610 and the twelfth heat pipe segment 920 are respectively embedded in the multiple first grooves 111 of the first surface 110 in sequence, wherein the third heat pipe segment 510 and the ninth heat pipe segment 810 of the second heat pipe 500 facing the negative direction of the Y-axis of the two second heat pipes 500 share a first groove 111.

[0082] In some embodiments, the first heat sink 200 has a second groove 230 that matches the first groove 111 on the side facing the first surface 110 , and a plurality of heat pipes are fixed in the accommodation space formed by the first groove 111 and the second groove 230 .

[0083] like Fig.18 and Fig.19 As shown, and refer to Fig.14 and Fig.15 The first surface 110 of the substrate 100 has a plurality of first grooves 111, and the first heat sink 200 has second grooves 230 corresponding to the first grooves 111. The corresponding first grooves 111 and second grooves 230 cooperate to form a receiving space, and the heat pipe can be embedded in the receiving space. In this way, the contact area between the heat pipe and the substrate 100 and the first heat sink 200 can be larger, the efficiency of heat conduction between the heat pipe and the substrate 100 and the first heat sink 200 can be improved, and the connection between the heat pipe and the substrate 100 can be more stable.

[0084] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A laser projection device, characterized in that: It includes a light source, a light valve, a lens and a radiator; the light source includes a laser; The heat sink comprises: a substrate, a first heat sink, a second heat sink and a plurality of heat pipes; The substrate comprises a first surface and a second surface opposite to each other, the first heat sink is in contact with and connected to the first surface, and the second heat sink is in contact with and connected to the second surface; the second surface is provided with a mounting seat for mounting the laser; The plurality of heat-conducting pipes include a first heat-conducting pipe and a second heat-conducting pipe; one end of the first heat-conducting pipe is fixedly arranged on the first surface, and the other end is inserted into the first heat sink; the first heat-conducting pipe is arranged to be inclined relative to the first surface; One end of the second heat pipe is fixed to the first surface, and the other end is inserted into the second heat sink; the second heat pipe is configured to be inclined relative to the first surface, and the inclination direction of the first heat pipe is opposite to the inclination direction of the second heat pipe.

2. The laser projection device according to claim 1, characterized in that: The first heat pipe comprises a first heat pipe section, a second heat pipe section and a first bent pipe section connecting the first heat pipe section and the second heat pipe section, the first heat pipe section and the second heat pipe section both extend along a first direction; the first heat pipe section is fixed on the first surface, and the second heat pipe section is inserted into a first heat dissipation hole on the first heat sink; the orthographic projection of the first heat pipe section on the first surface and the orthographic projection of the second heat pipe section on the first surface are arranged along a second direction; And / or, the second heat pipe comprises a third heat pipe segment, a fourth heat pipe segment and a second bent pipe segment connecting the third heat pipe segment and the fourth heat pipe segment, the third heat pipe segment and the fourth heat pipe segment both extend along the first direction; the third heat pipe segment is fixed on the first surface, and the fourth heat pipe segment is inserted into the second heat dissipation hole on the second heat sink; the orthographic projection of the third heat pipe segment on the first surface and the orthographic projection of the fourth heat pipe segment on the first surface are arranged along the second direction; The second direction has an included angle with the first direction.

3. The laser projection device according to claim 2, characterized in that: The first heat dissipation hole is a through hole, and there are at least two first heat pipes; There are at least two first heat-conducting pipes respectively inserted into the first heat-dissipating hole from two ends of the same first heat-dissipating hole, and / or there is at least one first heat-conducting pipe passing through one first heat-dissipating hole.

4. The laser projection device according to claim 2, characterized in that: The second heat dissipation hole is a through hole, and the second heat conduction pipe runs through the second heat dissipation hole; And / or, there are at least two second heat-conducting pipes, and the number of the second heat-dissipating holes corresponds one-to-one to the number of the second heat-conducting pipes.

5. The laser projection device according to claim 1, characterized in that: The plurality of heat-conducting pipes further include a third heat-conducting pipe and a fourth heat-conducting pipe, one end of the third heat-conducting pipe is fixedly arranged on the first surface, and the other end is inserted into the first heat sink; the third heat-conducting pipe is arranged perpendicular to the first surface; One end of the fourth heat conducting pipe is fixed to the first surface, and the other end is inserted into the second heat sink; The fourth heat pipe is arranged perpendicular to the first surface.

6. The laser projection device according to claim 5, characterized in that: The third heat pipe comprises a fifth heat pipe segment, a sixth heat pipe segment and a third bent pipe segment connecting the fifth heat pipe segment and the sixth heat pipe segment, the fifth heat pipe segment and the sixth heat pipe segment both extend along the first direction; the fifth heat pipe segment is fixed on the first surface, and the sixth heat pipe segment is inserted into the third heat dissipation hole on the first heat sink; And / or, the fourth heat pipe includes a seventh heat pipe segment, an eighth heat pipe segment and a fourth bent pipe segment connecting the seventh heat pipe segment and the eighth heat pipe segment, the seventh heat pipe segment and the eighth heat pipe segment both extend along the first direction; the seventh heat pipe segment is fixed on the first surface, and the eighth heat pipe segment is inserted into the fourth heat dissipation hole on the second heat sink.

7. The laser projection device according to any one of claims 1 to 5, characterized in that: The plurality of heat-conducting pipes further include at least one heat-averaging pipe; the at least one heat-averaging pipe is fixedly disposed on the first surface.

8. The laser projection device according to claim 7, characterized in that: The at least one heat equalizing pipe includes a first heat equalizing pipe and a second heat equalizing pipe, the first heat equalizing pipe includes a ninth heat pipe segment, a tenth heat pipe segment, and a fifth bent pipe segment connecting the ninth heat pipe segment and the tenth heat pipe segment, the second heat equalizing pipe includes an eleventh heat pipe segment, a twelfth heat pipe segment, and a sixth bent pipe segment connecting the eleventh heat pipe segment and the twelfth heat pipe segment; along the second direction, the eleventh heat pipe segment is located between the ninth heat pipe segment and the tenth heat pipe segment, and the tenth heat pipe segment is located between the eleventh heat pipe segment and the twelfth heat pipe segment.

9. The laser projection device according to claim 7, characterized in that: The first surface has a plurality of first grooves for fixing the plurality of heat-conducting pipes.

10. The laser projection device according to claim 9, characterized in that: The first heat sink has a second groove matched with the first groove on one side facing the first surface, and the plurality of heat pipes are fixed in a receiving space formed by the first groove and the second groove.

Images