Wafer non-contact vacuum film pasting device

Abstract

The utility model discloses a wafer non-contact vacuum film pasting device which comprises an upper vacuum cavity mechanism and a lower vacuum cavity mechanism which are arranged up and down, the upper vacuum cavity mechanism comprises a first fixing frame, a first air cylinder is installed on the first fixing frame, the piston rod end of the first air cylinder is connected with a lifting plate, the lower portion of the lifting plate is connected with an upper cover, and the upper cover is connected with a lower cover. A circular upper cavity is formed in the lower surface of the upper cover; the lower vacuum cavity mechanism comprises a second fixing frame, a lower cover is arranged on the second fixing frame, a lower cavity is formed in the lower cover, a non-contact carrying table is arranged in the lower cavity, a second air cylinder is connected to the lower portion of the non-contact carrying table, and the upper cover and the lower cover are both connected with vacuum generators. The non-contact carrying table is circular, the edge of the non-contact carrying table is of a stepped annular structure, and a plurality of through holes are formed in the non-contact carrying table. The beneficial effects of the utility model are that the non-contact type bearing of the wafer is realized, only the edge of the wafer is contacted, the non-contact platform deck is ensured not to be contacted with the sensitive area of the wafer, no physical damage is caused to the wafer, and the film pasting quality of the wafer is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafers, in particular to a wafer non-contact vacuum film pasting device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.

[0003] During the production process, wafers need to be filmed to protect the circuit structure on them and to protect the wafer surface from damage and contamination. The filming of wafers is mostly done manually, and manual filming can easily damage and contaminate the wafer. Mechanical filming is also used, and a rubber-coated roller is used to film the wafer in a vacuum environment. If the roller filming pressure is not well controlled, it will damage the product and bubbles will be generated due to poor pasting; in addition, the product surface may contain sensitive areas, and if it contacts the carrier, the product will be directly defective. The vacuum device for wafer filming disclosed by patent publication number CN218849428U, although it uses vacuum pressure difference to achieve wafer filming, its non-contact filming only avoids the pressure of the rubber-coated roller, and the wafer and the wafer adsorption table are in contact, and it still contacts the wafer itself, which is easy to touch the sensitive area of ​​the wafer and cause physical damage to the wafer. Utility Model Content

[0004] The utility model aims to provide a wafer non-contact vacuum film laminating device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer non-contact vacuum film bonding device, comprising an upper vacuum chamber mechanism and a lower vacuum chamber mechanism arranged up and down, the upper vacuum chamber mechanism comprising a first fixed frame, a first cylinder arranged vertically downward is installed on the first fixed frame, the lower piston rod end of the first cylinder is connected to a lifting plate, the lower part of the lifting plate is connected to an upper cover, and the lower surface of the upper cover is provided with a circular upper chamber; the lower vacuum chamber mechanism comprises a second fixed frame, a lower cover matching with the upper cover is provided on the second fixed frame, a lower chamber matching with the upper chamber is provided on the lower cover, a non-contact carrier in the lower chamber, a vertically arranged second cylinder is connected below the non-contact carrier, the upper cover and the lower cover are both connected with a vacuum piping joint and are connected to a vacuum generator through the vacuum piping joint; the non-contact carrier is circular, and its edge is a stepped ring structure, and a plurality of through holes are provided on the non-contact carrier.

[0006] Further preferably, the upper cover is provided with a first vacuum gauge to measure the pressure in the upper cavity; and the lower cover is provided with a second vacuum gauge to measure the pressure in the lower cavity.

[0007] Further preferably, the upper cover is provided with an upper cover surface, and the lower cover is provided with a lower cover surface, and the upper cover surface and the lower cover surface cooperate with each other and are both flat, thereby ensuring a sealing effect when the upper cover and the lower cover are closed.

[0008] Further preferably, the lower cover surface is provided with an annular groove surrounding the lower cavity, and a sealing ring is embedded in the annular groove of the lower cover surface, so that the sealing effect when the upper cover and the lower cover are closed is ensured by the sealing ring.

[0009] Further preferably, a plurality of first guide members are connected between the first fixing frame and the lifting plate to ensure accurate lifting of the lifting plate; a plurality of second guide members are connected between the lifting plate and the upper cover to achieve connection between the lifting plate and the upper cover to ensure accurate lifting of the upper cover relative to the lifting plate.

[0010] Further preferably, the first guide member and the second guide member are both guide rod and linear bearing structures, and the guiding is precise; the linear bearing of the second guide member is fixed on the lifting plate, and a spring is sleeved on the guide rod of the second guide member and the spring is arranged above the linear bearing. The spring has a buffering effect and can reduce the recoil force when the upper cover and the lower cover are closed, thereby ensuring smooth closing of the cover.

[0011] Further preferably, a vertically arranged mounting plate is provided below the second fixing frame for mounting the second cylinder; a vertically arranged linear guide rail is connected between the mounting plate and the second cylinder to facilitate adjustment of the mounting position of the second cylinder.

[0012] Beneficial effects: The utility model provides a wafer non-contact vacuum film laminating device, which realizes position adjustment of the product adsorption mechanism through a horizontal linear module and a lifting module, realizes film laminating in a vacuum environment through an upper vacuum chamber mechanism and a lower vacuum chamber mechanism, and realizes non-contact carrying of the wafer through a non-contact carrier, which only contacts the edge of the wafer to ensure that the non-contact carrier will not contact the sensitive area of ​​the wafer and will not cause physical damage to the wafer, thereby ensuring the film laminating quality of the wafer; the non-contact vacuum film laminating device realizes wafer laminating under the condition of vacuum pressure difference, which can effectively ensure the film laminating environment and quality of the wafer, and the automatic film laminating can effectively avoid damage and pollution caused by manual film laminating. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the axial structure of the wafer non-contact vacuum lamination device disclosed in an embodiment of the utility model;

[0014] Figure 2It is a schematic diagram of the front view structure of the wafer non-contact vacuum lamination device disclosed in an embodiment of the utility model;

[0015] Figure 3 This is a schematic diagram of the axial structure of the upper vacuum chamber mechanism disclosed in the embodiment of the utility model;

[0016] Figure 4 It is a schematic diagram of the upper visual axis structure of the lower vacuum chamber mechanism disclosed in the embodiment of the utility model;

[0017] Figure 5 It is a schematic diagram of the lower visual axis side structure of the lower vacuum chamber mechanism disclosed in the embodiment of the utility model;

[0018] Figure 6 This is a schematic diagram of the axial structure of the non-contact carrier disclosed in an embodiment of the utility model.

[0019] Figure markings: 1-upper vacuum chamber mechanism, 11-first fixed frame, 12-first cylinder, 13-lifting plate, 14-upper cover, 141-upper cover surface, 142-upper chamber, 15-first vacuum gauge, 16-first guide member, 17-second guide member, 2-lower vacuum chamber mechanism, 21-second fixed frame, 22-lower cover, 221-lower cover surface, 222-lower chamber, 23-non-contact carrier, 24-second cylinder, 25-second vacuum gauge, 26-sealing ring, 27-mounting plate. DETAILED DESCRIPTION

[0020] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0021] like Figure 1-6 As shown, a wafer non-contact vacuum film laminating device can realize film laminating without touching the sensitive area of ​​the wafer and without causing physical damage to the wafer. The non-contact vacuum film laminating device includes an upper vacuum chamber mechanism 1 and a lower vacuum chamber mechanism 2 arranged up and down. The upper vacuum chamber mechanism 1 and the lower vacuum chamber mechanism 2 can realize automatic film laminating of the wafer in a vacuum environment, and the film laminating is performed through the pressure difference of the vacuum chamber.

[0022] In the present application, the upper vacuum chamber mechanism 1 includes a first fixed frame 11, on which a first cylinder 12 arranged vertically downward is installed, and the lower piston rod end of the first cylinder 12 is connected to a lifting plate 13, and an upper cover 14 is connected below the lifting plate 13, and a circular upper chamber 142 is provided on the lower surface of the upper cover 14; wherein, the first fixed frame 11 is used for the installation and fixation of the upper vacuum chamber mechanism 1, and the first cylinder 12 can drive the lifting plate 13 to rise and fall, thereby driving the upper cover 14 to rise and fall, and then realizing the covering of the upper cover 14 and the lower cover 22, realizing a vacuum chamber environment, and facilitating film pasting in a vacuum environment.

[0023] In the present application, the lower vacuum chamber mechanism 2 includes a second fixed frame 21, on which is provided a lower cover 22 which cooperates with the upper cover 14, on which is provided a lower cavity 222 which cooperates with the upper cavity 142, in which is a non-contact stage 23 in the lower cavity 222, and below which is connected a vertically arranged second cylinder 24, and both the upper cover 14 and the lower cover 22 are connected with a vacuum piping joint and are connected with a vacuum generator through the vacuum piping joint. Among them, the second fixing frame 21 is used for installing the lower cover 22, the non-contact carrier 23 is used for placing the wafer, and the second cylinder 24 can drive the non-contact carrier 23 to rise and fall. When sticking the film, first place the wafer on the non-contact carrier 23, and then put the wafer iron ring with the empty film on the platform in the lower cavity 222 of the lower cover 22, and then the upper vacuum chamber mechanism 1 and the lower vacuum chamber mechanism 2 are in contact, and the upper cover 14 and the lower cover 22 are closed and sealed to form a cavity, and the vacuum generator starts to evacuate the upper cavity 142 of the upper cover 14 and the lower cavity 222 of the lower cover 22 through the vacuum piping joint, so that the upper and lower vacuum cavities reach the set values, and then the second cylinder 24 drives the non-contact carrier 23 to rise, so that the wafer on the non-contact carrier 23 contacts with the empty film, and the wafer and the empty film are stuck under the pressure difference between the upper and lower vacuum cavities.

[0024] In the present application, a first vacuum gauge 15 is provided on the upper cover 14 for measuring the pressure in the upper cavity 142; a second vacuum gauge 25 is provided on the lower cover 22 for measuring the pressure in the lower cavity 222. By controlling the pressure in the upper cavity 142 and the pressure in the lower cavity 222, the wafer and the empty film are bonded.

[0025] In the present application, an upper cover 14 is provided with an upper cover surface 141, and a lower cover 221 is provided with a lower cover surface 221. The upper cover surface 141 and the lower cover surface 221 cooperate with each other and are both planes. Through the design of the upper cover surface 141 and the lower cover surface 221, the sealing between the upper cover 14 and the lower cover 22 is achieved. An annular groove surrounding the lower cavity 222 is provided on the lower cover surface 221, and a sealing ring 26 is embedded in the annular groove of the lower cover surface 221. Through the provision of the annular groove and the sealing ring 26, the sealing effect of the upper cover 14 and the lower cover 22 is ensured, the sealing effect of the vacuum cavity formed by the upper cavity 142 and the lower cavity 222 is ensured, and the accuracy of the vacuum pressure in the upper cavity 142 and the lower cavity 222 is ensured.

[0026] In the present application, the non-contact stage 23 is circular, and its edge is a stepped ring structure, so that only the edge of the wafer contacts the non-contact stage 23. The edge stepped structure of the non-contact stage 23 of the present application contacts the edge of the wafer by only 3 mm, and the rest of the middle part does not contact the non-contact stage 23, so that no external objects contact the wafer itself when the wafer is film-bonded; a plurality of through holes are provided on the non-contact stage 23, that is, the non-contact stage 23 is hollow, which is convenient for vacuuming the lower side of the wafer.

[0027] In the present application, a plurality of first guide members 16 are connected between the first fixed frame 11 and the lifting plate 13 to realize the precise lifting and lowering of the lifting plate 13 and the upper cover 14; a plurality of second guide members 17 are connected between the lifting plate 13 and the upper cover 14 to realize the precise micro-movement of the upper cover 14 relative to the lifting plate 13. Among them, the first guide member 16 and the second guide member 17 are both guide rod and linear bearing structures, which have simple structures and precise guiding. The linear bearing of the second guide member 17 is fixed on the lifting plate 13, and a spring is sleeved on the guide rod of the second guide member 17 and the spring is arranged above the linear bearing, so as to ensure that the lifting plate 13 has a buffering effect when driving the upper cover 14 to move downward and the upper cover 14 and the lower cover 22 are closed, and can offset the reverse force when the upper cover 14 and the lower cover 22 are closed, so as to ensure the smooth closing; at the same time, the spring is arranged above the linear bearing, and when the lifting plate 13 and the upper cover 14 move upward, it can drive the upper cover 14 to reset.

[0028] In the present application, a vertically arranged mounting plate 27 is provided below the second fixing frame 21 for mounting the second cylinder 24 ; a vertically arranged linear guide rail is connected between the mounting plate 27 and the second cylinder 24 to facilitate adjustment of the mounting position of the second cylinder 24 .

[0029] In the present application, the working process of the non-contact vacuum film laminating device is as follows: 1. Place the wafer on the non-contact carrier 23 first, and then place the wafer iron ring with the empty film on the platform in the lower cavity 222 of the lower cover 22; 2. The upper vacuum cavity mechanism 1 is actuated, and the first cylinder 12 drives the lifting plate 13 to descend, driving the upper cover 14 to descend synchronously, until the upper cover surface 141 of the upper cover 14 and the lower cover surface 221 of the lower cover 22 are in contact, so as to realize the sealing of the upper cover 14 and the lower cover 22; 3. The wafer iron ring and the empty film are placed on the platform in the lower cavity 222 of the lower cover 22; 4. The upper cavity 142 and the lower cavity 222 are separated, and the vacuum generator connected to the upper cover 14 and the lower cover 22 begins to evacuate the upper cavity 142 of the upper cover 14 and the lower cavity 222 of the lower cover 22, so that the pressures in the upper cavity 142 and the lower cavity 222 reach the set values ​​respectively; Fourth, the second cylinder 24 drives the non-contact stage 23 to rise, so that the wafer on the non-contact stage 23 contacts the empty film in the lower cavity 222, and the wafer and the empty film are attached under the pressure difference between the upper cavity 142 and the lower cavity 22.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions recorded in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the utility model content within the protection scope of the utility model.

Claims

1. A wafer non-contact vacuum lamination device, characterized in that: The invention comprises an upper vacuum chamber mechanism (1) and a lower vacuum chamber mechanism (2) which are arranged in a vertical direction, wherein the upper vacuum chamber mechanism (1) comprises a first fixing frame (11), on which a first cylinder (12) arranged vertically downward is installed, and a lifting plate (13) is connected to the piston rod end at the lower end of the first cylinder (12), and an upper cover (14) is connected below the lifting plate (13), and a circular upper chamber (142) is provided on the lower surface of the upper cover (14); the lower vacuum chamber mechanism (2) comprises a second fixing frame (21), and the second fixing frame (21) is provided with a first cylinder (12) arranged vertically downward; the piston rod end at the lower end of the first cylinder (12) is connected to a lifting plate (13), and an upper cover (14) is connected below the lifting plate (13), and a circular upper chamber (142) is provided on the lower surface of the upper cover (14); ) is provided with a lower cover (22) matched with the upper cover (14), the lower cover (22) is provided with a lower cavity (222) matched with the upper cavity (142), a non-contact carrier (23) is provided in the lower cavity (222), a vertically arranged second cylinder (24) is connected below the non-contact carrier (23), the upper cover (14) and the lower cover (22) are both connected with a vacuum piping joint and connected to a vacuum generator through the vacuum piping joint; the non-contact carrier (23) is circular, and its edge is a stepped ring structure, and a plurality of through holes are provided on the non-contact carrier (23).

2. The wafer non-contact vacuum lamination device according to claim 1, characterized in that: The upper cover (14) is provided with a first vacuum gauge (15), and the lower cover (22) is provided with a second vacuum gauge (25).

3. The wafer non-contact vacuum lamination device according to claim 1, characterized in that: The upper cover (14) is provided with an upper cover surface (141), and the lower cover (22) is provided with a lower cover surface (221); the upper cover surface (141) and the lower cover surface (221) cooperate with each other and are both flat surfaces.

4. The wafer non-contact vacuum lamination device according to claim 3, characterized in that: An annular groove surrounding the lower cavity (222) is provided on the lower cover surface (221), and a sealing ring (26) is embedded in the annular groove of the lower cover surface (221).

5. The wafer non-contact vacuum lamination device according to claim 1, characterized in that: A plurality of first guide members (16) are connected between the first fixing frame (11) and the lifting plate (13), and a plurality of second guide members (17) are connected between the lifting plate (13) and the upper cover (14).

6. The wafer non-contact vacuum lamination device according to claim 5, characterized in that: The first guide member (16) and the second guide member (17) are both guide rod and linear bearing structures; the linear bearing of the second guide member (17) is fixed on the lifting plate (13); a spring is sleeved on the guide rod of the second guide member (17) and the spring is arranged above the linear bearing.

7. The wafer non-contact vacuum lamination device according to claim 1, characterized in that: A vertically arranged mounting plate (27) is provided below the second fixing frame (21), and a vertically arranged linear guide rail is connected between the mounting plate (27) and the second cylinder (24).

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