Diode chip packaging structure

Abstract

The utility model relates to the technical field of diode chip processing, in particular to a diode chip packaging structure, which comprises an upper cover shell, a lower cover plate is connected below the upper cover shell, a diode chip is arranged in the upper cover shell, and a pressing mechanism is arranged between the upper cover shell and the diode chip. The pressing mechanism comprises limiting grooves, and the limiting grooves are formed in the corresponding positions of the upper cover shell and the lower cover plate. When the upper cover shell covers the lower cover plate, the pressing plate and the attaching plate are elastically pushed through the spring to press the diode chip, limiting and clamping are achieved under supporting of the lower cover plate, the spring is attached to the connecting column to slide to avoid stress bending, the diode chip is limited from the two sides through the supporting rod, and the phenomenon that pins are affected or damaged due to offset movement is avoided. Under the supporting of the carrying block, the pressing plate presses the pins to avoid shaking or deviation, the pins are limited and stabilized again in cooperation with the limiting groove and the insulation pad, protection of the pins is improved, and the situation of electric leakage is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of diode chip processing, in particular to a diode chip packaging structure. Background Art

[0002] A diode is an electronic device made of semiconductor materials (silicon, selenium, germanium, etc.). It has unidirectional conductivity, that is, when a forward voltage is applied to the anode of the diode, the diode is turned on. When a reverse voltage is applied to the anode and cathode, the diode is turned off. Therefore, the conduction and cutoff of the diode are equivalent to the on and off of the switch. The diode is one of the earliest semiconductor devices and is widely used. In particular, in various electronic circuits, diodes and components such as resistors, capacitors, and inductors are reasonably connected to form circuits with different functions, which can realize various functions such as rectification of AC power, detection of modulated signals, limiting and clamping, and stabilization of power supply voltage.

[0003] The patent specification with announcement number CN218447838U discloses a light-emitting diode chip packaging structure, including a mounting seat, a mounting groove is provided on the upper surface of the mounting seat, a sealing cover with a lower end opening is slidably connected in the mounting groove, a supporting block is fixedly connected to the bottom of the mounting groove corresponding to the lower end opening position of the sealing cover, and the upper end of the supporting block extends through the sealing cover. When in use, the light-emitting diode chip can be installed on the supporting block, and then the sealing cover is covered on the supporting block and the light-emitting diode chip, and then glue can be injected into the movable groove through the filling hole, and the glue will push the sealing block and the positioning block to move, so that the positioning block is inserted into the positioning groove and the sealing cover is reinforced, and then the glue can be injected into the mounting groove through the connecting hole and fill the gap between the mounting groove and the sealing cover, so that the light-emitting diode chip can be packaged.

[0004] However, in the implementation of relevant technologies, it was found that the above-designed light-emitting diode chip packaging structure has the following problems: in the prior art, the diode chip is fixed and packaged through the cooperation of components such as a support block and a sealing cover, but this fixing and packaging method lacks the compression and limitation of the pins of the diode chip, which makes it easy for the pins and the chip body to be offset during the packaging process, resulting in easy damage to the pins. In view of this, a diode chip packaging structure is provided to overcome the above-mentioned defects. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes a diode chip packaging structure.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solution: a diode chip packaging structure, comprising an upper cover shell, a lower cover plate is connected to the lower part of the upper cover shell, a diode chip is arranged inside the upper cover shell, and a pressing mechanism is arranged between the upper cover shell and the diode chip;

[0007] The clamping mechanism includes a limiting groove, which is opened at the corresponding position of the upper cover shell and the lower cover plate, and the inner wall of the limiting groove is connected with an insulating pad, a connecting column is fixed on the upper inner part of the upper cover shell, and the outer wall of the connecting column is slidably connected with a spring, a pressing plate is fixed at the bottom end of the spring, and a limiting hole is opened at the position of the top end of the pressing plate corresponding to the connecting column, a fitting plate is fixed between the two pressing plates, and a supporting rod is fixed at the bottom end of the pressing plate, and a clamping plate is connected under the supporting rod. After the upper cover shell and the lower cover plate are connected, the pins of the diode chip are initially limited by the limiting groove, and leakage is avoided by the insulating pad, and the pressing plate is pushed with the elasticity of the spring to drive the supporting rod, so that the clamping plate presses the pins again to avoid shaking, and at the same time, the diode chip is limited by the supporting rod to avoid offset.

[0008] As a further description of the above technical solution: the bonding plate and the pressing plate are perpendicular to each other, and the bonding plates are evenly distributed with respect to the outer wall of the pressing plate. A plurality of groups of bonding plates are arranged to press the diode chip from above, thereby achieving the effect of pressing and limiting, and avoiding shaking during packaging, which may cause damage to the pins.

[0009] As a further description of the above technical solution: a supporting block is fixed to the top of the lower cover plate located inside the upper cover shell, and a flexible pad is connected to the outer wall of the supporting block. The pin end is clamped by the cooperation of the supporting block and the clamping plate to improve the stability during packaging, while the flexible pad avoids damage caused by excessive clamping.

[0010] As a further description of the above technical solution: a heat dissipation mechanism is arranged inside the lower cover plate, and the heat dissipation mechanism includes ventilation grooves. The ventilation grooves are opened on the inner wall of the lower cover plate, and filter screens are embedded at both ends of the ventilation grooves. The arranged ventilation grooves facilitate air circulation, avoid the lower cover plate being too thick to affect the heat dissipation of the diode chip, and prevent dust from entering through the filter screen to make it difficult to clean.

[0011] As a further description of the above technical solution: the heat dissipation mechanism also includes a support block, two of the support blocks are fixed on one side of the supporting block at the top of the lower cover plate, and a heat sink is arranged between the two support blocks. The heat sink is made of a high-efficiency thermal conductive metal material, which is convenient for guiding the heat of the diode chip into the ventilation groove to avoid internal overheating affecting use.

[0012] As a further description of the above technical solution: the heat sink penetrates into the interior of the ventilation slot, and the ventilation slot is detachably connected to the filter screen by bolts. The detachable filter screen facilitates cleaning of the filter screen or the ventilation slot.

[0013] As a further description of the above technical solution: the outer walls of the upper cover shell and the lower cover plate are connected with rubber strips, and a mounting hole is opened at the top of the upper cover shell. The rubber strips of the upper cover shell and the lower cover plate have an anti-collision effect. At the same time, the mounting holes facilitate long bolts to fix the upper cover shell and the lower cover plate.

[0014] The utility model has the following beneficial effects:

[0015] The utility model designs a diode chip packaging structure. When the upper cover shell covers the lower cover plate, the pressing plate and the bonding plate are pushed by the spring elasticity to press the diode chip. Under the support of the lower cover plate, they play a limiting clamping role. The spring fits the connecting column to slide to avoid bending due to force. The diode chip is limited from both sides through the support rod to avoid the occurrence of offset movement affecting or damaging the pins. Under the support of the supporting block, the clamping plate presses the pins to avoid shaking or offset. The limiting groove and the insulating pad are used to limit and stabilize the pins again, thereby improving the protection of the pins and avoiding leakage.

[0016] The utility model designs a diode chip packaging structure, which uses a support block to prevent the diode chip from being too close to the lower cover plate so that the heat cannot be dissipated, and cooperates with a heat sink made of a high-efficiency thermally conductive metal material to facilitate the transfer of heat from the diode chip, and at the same time transfers the heat outward through the ventilation slots to achieve a heat dissipation effect, and cooperates with a filter to prevent external dust from entering the ventilation slots and causing adsorption on the heat sink, thereby affecting the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the diode chip of the utility model;

[0019] Figure 3 This is a schematic diagram of the installation structure of the pressing plate of the utility model;

[0020] Figure 4 It is a schematic diagram of the installation structure of the heat sink of the utility model.

[0021] Legend:

[0022] 1. Upper cover shell; 2. Lower cover plate; 3. Diode chip; 4. Clamping mechanism; 401. Limiting groove; 402. Connecting column; 403. Spring; 404. Pressing plate; 405. Limiting hole; 406. Support rod; 407. Clamping plate; 408. Laminating plate; 409. Insulating pad; 5. Support block; 6. Flexible pad; 7. Heat dissipation mechanism; 701. Ventilation groove; 702. Filter; 703. Heat sink; 704. Support block; 8. Mounting hole; 9. Rubber strip. DETAILED DESCRIPTION

[0023] Reference Figure 1-4 The utility model provides a diode chip packaging structure: comprising an upper cover shell 1, a lower cover plate 2 is connected to the lower part of the upper cover shell 1, a diode chip 3 is arranged inside the upper cover shell 1, and a clamping mechanism 4 is arranged between the upper cover shell 1 and the diode chip 3; the clamping mechanism 4 comprises a limiting groove 401, the limiting groove 401 is arranged at the corresponding position of the upper cover shell 1 and the lower cover plate 2, an insulating pad 409 is connected to the inner wall of the limiting groove 401, a connecting column 402 is fixed to the upper part of the upper cover shell 1, a spring 403 is slidably connected to the outer wall of the connecting column 402, a pressing plate 404 is fixed to the bottom end of the spring 403, and the top end of the pressing plate 404 corresponds to the connecting column 402 A limiting hole 405 is provided at the position, a fitting plate 408 is fixed between the two pressing plates 404, a supporting rod 406 is fixed to the bottom end of the pressing plate 404, and a clamping plate 407 is connected below the supporting rod 406. After the upper cover shell 1 and the lower cover plate 2 are connected, the pins of the diode chip 3 are initially limited by the limiting groove 401, and the insulating pad 409 is used to avoid leakage. The spring 403 elastically pushes the pressing plate 404, so that the pressing plate 404 drives the supporting rod 406, so that the clamping plate 407 clamps the pins again to avoid shaking, and at the same time, the diode chip 3 is limited by the supporting rod 406 to avoid deviation.

[0024] As a further implementation scheme of the above technical scheme: the bonding plate 408 and the pressing plate 404 are perpendicular to each other, and the bonding plates 408 are evenly distributed with respect to the outer wall of the pressing plate 404. A plurality of groups of bonding plates 408 are provided to press the diode chip 3 from above, thereby achieving the effect of pressing and limiting and avoiding shaking during packaging, which may cause damage to the pins.

[0025] As a further implementation scheme of the above technical scheme: a supporting block 5 is fixed to the top of the lower cover plate 2 located inside the upper cover shell 1, and the outer wall of the supporting block 5 is connected to a flexible pad 6. The support block 5 and the clamping plate 407 cooperate to clamp the pin end to improve the stability during packaging, and at the same time, the flexible pad 6 avoids damage caused by excessive clamping.

[0026] During specific implementation, when the upper cover shell 1 and the lower cover plate 2 cover the encapsulated diode chip 3, the pressing plate 404 and the bonding plate 408 press the diode chip 3 under the elastic push of the spring 403, and cooperate with the support rod 406 to limit the position, and the supporting block 5 and the pressing plate 407 clamp and limit the pins of the diode chip 3. The flexible pad 6 is provided to prevent damage caused by excessive clamping, and the pins are further limited through the limiting groove 401 and the insulating pad 409 to avoid leakage. The spring 403 is fixed between the upper cover shell 1 and the pressing plate 404, and the upper cover shell 1 fixes the connecting column 402. When the spring 403 is subjected to force, the connecting column 402 penetrates into the limiting hole 405 to support the spring 403 to avoid bending and twisting.

[0027] As a further implementation scheme of the above technical scheme: a heat dissipation mechanism 7 is arranged inside the lower cover plate 2, and the heat dissipation mechanism 7 includes a ventilation slot 701, and the ventilation slot 701 is opened on the inner wall of the lower cover plate 2, and filter screens 702 are embedded at both ends of the ventilation slot 701. The ventilation slot 701 is arranged to facilitate air circulation, prevent the lower cover plate 2 from being too thick to affect the heat dissipation of the diode chip 3, and prevent dust from entering through the filter screen 702 to make it difficult to clean.

[0028] As a further implementation scheme of the above technical scheme: the heat dissipation mechanism 7 also includes a support block 704, two support blocks 704 are fixed on one side of the supporting block 5 at the top of the lower cover plate 2, and a heat sink 703 is arranged between the two support blocks 704. The heat sink 703 is made of a high-efficiency thermal conductive metal material, which is convenient for guiding the heat of the diode chip 3 into the ventilation groove 701 to avoid internal overheating affecting use.

[0029] As a further implementation scheme of the above technical scheme: the heat sink 703 penetrates into the interior of the ventilation slot 701, and the ventilation slot 701 is detachably connected to the filter screen 702 by bolts. The detachable filter screen 702 facilitates the cleaning of the filter screen 702 or the ventilation slot 701.

[0030] As a further implementation scheme of the above technical scheme: the outer walls of the upper cover shell 1 and the lower cover plate 2 are connected with rubber strips 9, and a mounting hole 8 is opened at the top of the upper cover shell 1. The rubber strips 9 of the upper cover shell 1 and the lower cover plate 2 have an anti-collision effect. At the same time, the mounting hole 8 is convenient for fixing the upper cover shell 1 and the lower cover plate 2 with long bolts.

[0031] During specific implementation, the ventilation slots 701 are opened in the lower cover plate 2, and the heat sink 703 is inserted and embedded to prevent the lower cover plate 2 from being too thick and affecting the heat dissipation. At the same time, the heat sink 703 improves the heat dissipation efficiency, and the filter 702 prevents dust and impurities from entering and being difficult to clean, or adsorbing the heat sink 703 and affecting the heat dissipation. The support block 704 is set to avoid excessive fit with the lower cover plate 2 to cause heat accumulation.

[0032] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A diode chip packaging structure, characterized in that: It comprises an upper cover shell (1), a lower cover plate (2) is connected to the lower part of the upper cover shell (1), a diode chip (3) is arranged inside the upper cover shell (1), and a pressing mechanism (4) is arranged between the upper cover shell (1) and the diode chip (3); The clamping mechanism (4) comprises a limiting groove (401), wherein the limiting groove (401) is provided at corresponding positions of the upper cover shell (1) and the lower cover plate (2), and the inner wall of the limiting groove (401) is connected to an insulating pad (409), a connecting column (402) is fixed to the upper part of the interior of the upper cover shell (1), and the outer wall of the connecting column (402) is slidably connected to a spring (403), a pressing plate (404) is fixed to the bottom end of the spring (403), and a limiting hole (405) is provided at the top end of the pressing plate (404) corresponding to the position of the connecting column (402), a fitting plate (408) is fixed between the two pressing plates (404), and a supporting rod (406) is fixed to the bottom end of the pressing plate (404), and a clamping plate (407) is connected below the supporting rod (406).

2. The diode chip packaging structure according to claim 1, characterized in that: The laminating plate (408) and the pressing plate (404) are perpendicular to each other, and the laminating plates (408) are evenly distributed at equal distances with respect to the outer wall of the pressing plate (404).

3. The diode chip packaging structure according to claim 1, characterized in that: A supporting block (5) is fixed to the top end of the lower cover plate (2) located inside the upper cover shell (1), and a flexible pad (6) is connected to the outer wall of the supporting block (5).

4. The diode chip packaging structure according to claim 1, characterized in that: A heat dissipation mechanism (7) is arranged inside the lower cover plate (2), and the heat dissipation mechanism (7) comprises a ventilation slot (701). The ventilation slot (701) is opened on the inner wall of the lower cover plate (2), and filter screens (702) are embedded at both ends of the ventilation slot (701).

5. The diode chip packaging structure according to claim 4, characterized in that: The heat dissipation mechanism (7) further comprises a support block (704), wherein two support blocks (704) are fixed on one side of the supporting block (5) at the top end of the lower cover plate (2), and a heat dissipation fin (703) is arranged between the two support blocks (704).

6. The diode chip packaging structure according to claim 5, characterized in that: The heat sink (703) penetrates into the interior of the ventilation slot (701), and the ventilation slot (701) is detachably connected to the filter screen (702) via bolts.

7. The diode chip packaging structure according to claim 1, characterized in that: The outer walls of the upper cover shell (1) and the lower cover plate (2) are both connected with rubber strips (9), and a mounting hole (8) is provided at the top end of the upper cover shell (1).

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