Power module device of power electronic transformer

Abstract

The utility model discloses a power module device of a power electronic transformer, which belongs to the technical field of power electronic transformers and comprises a shell, a PMC (permanent magnet synchronous controller) board card assembly module, a switch radiator assembly module and a direct-current capacitor, the PMC board card assembly module, the switch radiator assembly module and the direct-current capacitor are positioned in the shell, and both the PMC board card assembly module and the switch radiator assembly module are positioned above the direct-current capacitor. The switch radiator assembly module comprises a switch assembly, a fin radiator and an air duct cover; the switch assembly is installed on the side wall of the fin radiator. Holes formed in the air channel cover, the side wall of the fin radiator and the shell form an air channel. The heat management problem of the power module is fully considered, the electric device is directly assembled on the heat radiator, the heat radiation efficiency is improved, the power module can work normally at high temperature, the service life of the power module is prolonged, and the reliability of the power module is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of power electronic transformers, and in particular relates to a power electronic transformer power module device. Background Art

[0002] As the demand for renewable energy grows, photovoltaic power generation, as a clean and renewable energy source, is increasingly being used. Photovoltaic power stations are important facilities that use solar panels to convert sunlight into electrical energy, and high-voltage direct-mounted power electronic transformers are one of the key equipment in photovoltaic power stations. Its main function is to convert the direct current generated by photovoltaic panels into alternating current and then transmit it to the power grid. The power module is the core part of the high-voltage direct-mounted power electronic transformer, and its performance directly affects the efficiency and stability of the entire transformer.

[0003] The design of the existing high-voltage direct-mounted power electronic transformer power module is mainly based on traditional power electronics technology and power transformer technology. This design mainly uses silicon-based semiconductor materials to improve the efficiency and stability of the power module by optimizing the circuit topology and control strategy. At the same time, in order to save design space, some designs use high-density integrated circuit technology to integrate multiple power devices and electronic components in a small space.

[0004] However, there are still some problems in the design of the existing high-voltage direct-mounted power electronic transformer power module. The existing design often ignores the thermal management problem of the power module, which may cause the power module to work at high temperature, thereby reducing its life and reliability. For example, CN110880485A is a high-power density integrated packaging module, in which the heat sink device of the power module is fixed at the bottom and is not directly connected to the heat-generating electrical components, so the heat dissipation effect is poor. When dissipating heat, the heat sink cannot directly and effectively dissipate the heat of the highest heat part of the entire power module, which easily causes the power module to malfunction. Summary of the invention

[0005] The utility model provides a power module device of a power electronic transformer, which effectively solves the thermal management problem of the power module and improves its working life at high temperatures.

[0006] To achieve the above-mentioned purpose, the utility model discloses a power electronic transformer power module device, comprising a shell and a PMC board assembly module, a switch radiator assembly module and a DC capacitor located in the shell, wherein the PMC board assembly module and the switch radiator assembly module are both located above the DC capacitor, and the switch radiator assembly module comprises a switch assembly and a radiator; the switch assembly is mounted on the side wall of the radiator.

[0007] Furthermore, the radiator is a fin radiator, a side of the fin radiator where the switch assembly is not installed is fixedly connected to the air duct cover, and the air duct cover, the side wall of the fin radiator and the holes opened on the shell form an air duct.

[0008] Furthermore, a diode assembly and a voltage-equalizing resistor assembly are installed on the side wall of the radiator, and the switch assembly and the diode assembly are symmetrically arranged on the side wall of the radiator.

[0009] Furthermore, the switch assembly, the diode assembly and the DC capacitor are connected in parallel via a composite busbar.

[0010] Furthermore, the composite busbar is located above the DC capacitor and below the PMC board assembly module and the switch heat sink assembly module.

[0011] Furthermore, a branch formed by the switch component, the diode component and the DC capacitor in parallel is connected in series with the voltage-equalizing resistor component, and the voltage-equalizing resistor component and the switch component are mounted on the same side wall of the heat sink.

[0012] Furthermore, the PMC board assembly module includes a PMC board support, a PMC board and an energy-taking power supply; the PMC board and the energy-taking power supply are fixed on the side of the PMC board support.

[0013] Furthermore, the switch assembly is connected to the vacuum contactor via a protruding copper busbar.

[0014] Furthermore, the lower end of the DC capacitor is mounted on the bottom plate of the shell.

[0015] Furthermore, the switch components adopt IGBTs or MOSFETs.

[0016] Compared with the prior art, the utility model has at least the following beneficial technical effects:

[0017] 1. Improved thermal management: The utility model fully considers the thermal management problem of the power module, directly assembles the electrical components on the radiator, improves the heat dissipation efficiency, and enables the power module to work normally at high temperatures, thereby increasing its life and reliability.

[0018] 2. The PMC board assembly module, switch heat sink assembly module and DC capacitor adopt a layered design to further save design space. While ensuring the performance of the power module, this technical solution has the potential to achieve higher power density in a smaller space, thereby greatly saving design space. This is something that existing high-density integrated circuit technology cannot do.

[0019] 3. Use high-frequency switching devices to reduce conduction loss and switching loss and improve efficiency.

[0020] In general, compared with the prior art, this technical solution not only improves thermal management and saves design space, but also improves the performance of the power module, and has obvious advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is the overall axonometric view of the power module exterior;

[0022] Figure 2 This is the internal axonometric view of the power module;

[0023] Figure 3 This is the internal axonometric view of the power module;

[0024] Figure 4 Assemble the isometric view of the PMC board;

[0025] Figure 5 Axonometric view of the IGBT diode heat sink assembly.

[0026] In the attached drawings: 1. Power module top plate; 2. Power module front panel; 3. Power module rear panel; 4. Power module side panel; 5. Power module bottom plate; 6. PMC board assembly module; 6.1. PMC board support; 6.2. PMC board; 6.3. Energy supply; 7. Switch radiator assembly module; 7.1. Switch assembly; 7.2. Diode assembly; 7.3. Fin radiator; 7.4. Duct cover; 7.5. Equalizing resistor assembly; 8. DC capacitor; 9. Vacuum contactor; 10. Composite busbar; 11. Diode extending copper busbar; 12. First contactor connected copper busbar; 13. Second contactor connected copper busbar; 14. First IGBT extending copper busbar; 15. Second IGBT extending copper busbar. DETAILED DESCRIPTION

[0027] The utility model is described in detail below with reference to the accompanying drawings and specific implementation modes.

[0028] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0029] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or there may be another element centered thereon. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be another element centered thereon at the same time. The terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc. used herein indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0031] Reference Figure 1 A power electronic transformer power module device includes a shell and a PMC board assembly module 6 located in the shell, a switch heat sink assembly module 7, a DC capacitor 8, a vacuum contactor 9, a composite busbar 10, a diode extending copper bar 11, a first contactor connecting copper bar 12, a second contactor connecting copper bar 13, a first IGBT extending copper bar 14 and a second IGBT extending copper bar 15.

[0032] The housing is a hexahedron consisting of a power module top plate 1, a power module front panel 5, a power module rear panel 2, two power module side panels 3 and a power module bottom plate 4. Rectangular holes are provided on the power module front panel 5 and the power module rear panel 2 for setting up air ducts to facilitate heat dissipation of the fin heat sink. The rectangular holes of the power module rear panel 2 are bent to facilitate the installation of the sealing strip, thereby ensuring excellent heat dissipation performance. During maintenance and inspection, the interior of the power module can be inspected by removing the frame panel.

[0033] Reference Figure 2 , DC capacitor 8 and vacuum contactor 9 are located at the bottom of the shell, a composite busbar 10 is arranged at the upper end of the power module bottom plate 4, and a PMC board assembly module 6 and a switch radiator assembly module 7 are arranged along the width direction of the composite busbar 10. The PMC board assembly module 6 and the switch radiator assembly module 7 are arranged in front and back layers to achieve a layered arrangement of control and primary, and also save a lot of space.

[0034] Reference Figure 3The vacuum contactor 9 is connected to the first IGBT extended copper bar 14 and the second IGBT extended copper bar 15 through the first contactor connecting copper bar 12 and the second contactor connecting copper bar 13, respectively. The first IGBT extended copper bar 14 and the second IGBT extended copper bar 15 are connected to two IGBTs respectively. The vacuum contactor 9 is arranged at the first IGBT extended copper bar 14 and the second IGBT extended copper bar 15, which can realize the module fault self-bypass function and increase the stability of the product.

[0035] Reference Figure 4 The PMC board assembly module 6 includes a PMC board support 6.1, a PMC board 6.2 and an energy source 6.3. The PMC board 6.2 and the energy source 6.3 are fixed to the side of the PMC board support 6.1, and the PMC board support 6.1 is fixed and assembled inside the power module to perform a space-saving optimization design. The PMC board 6.2 and the switch assembly 7.1 are connected via an optical fiber, and the energy source 6.3 is used to supply power to the PMC board 6.2.

[0036] Reference Figure 5 , the switch radiator assembly module 7 includes a switch component 7.1, a diode component 7.2, a fin radiator 7.3, an air duct cover 7.4 and a voltage-equalizing resistor component 7.5. The switch component 7.1, the diode component 7.2 and the voltage-equalizing resistor component 7.5 are all fixed on the side wall of the fin radiator 7.3, and the switch component 7.1 and the diode component 7.2 are symmetrically arranged on the side wall of the fin radiator 7.3, which improves the current uniformity and reduces the stray inductance of the composite busbar 10. The switch component 7.1, the diode component 7.2 and the DC capacitor 8 are connected in parallel through the composite busbar 10, and the formed branch is connected in series with the voltage-equalizing resistor component 7.5. The air duct cover 7.4 includes three side walls connected in sequence, and the three side walls respectively cover the upper end, the lower end and the side where the switch component 7.1 is not installed of the fin radiator 7.3, and the air duct cover 7.4 is fixedly connected to the fin radiator 7.3. The front and rear ends of the fin heat sink 7.3 are respectively opposite to the rectangular holes opened on the front panel 5 and the rear panel 2, and the air duct cover 7.4, the two rectangular holes and the side panels of the fin heat sink form an air duct.

[0037] Preferably, a high-efficiency power electronic device is selected as the switch component 7.1 to improve the efficiency and stability of the power module of the high-voltage direct-mounted power electronic transformer of the photovoltaic power station. Specifically, a high-frequency switch device such as IGBTs or MOSFETs can be used to reduce conduction loss and switching loss and improve efficiency.

[0038] The modular design and integrated design concept are adopted to further save design space while ensuring the performance of the power module. Specifically, the various parts of the power module, such as PMC board assembly, heat sink assembly, and composite busbar connection between electrical appliances, are modularly designed to facilitate production, maintenance and replacement; at the same time, through integrated design, such as Heat dissipation Device Integrate with power switching devices to reduce size and weight.

[0039] The utility model adopts effective thermal management technology to solve the thermal management problem of the power module and improve its working life and reliability at high temperatures. Specifically, the power module can be cooled by liquid cooling or air cooling; when liquid cooling is used for heat dissipation, the finned heat sink 7.3 is replaced with a liquid cooling heat sink, and the air duct cover 7.4 is removed; at the same time, by optimizing the internal structure of the power module, such as changing the layout of the power switch device, the heat flow path is improved, and the heat dissipation effect is improved. The electrical components are directly assembled on the heat sink and the air duct is set to effectively dissipate heat.

[0040] In one embodiment, the power module is cooled by air cooling, the wind speed is 4m / s, and a finned heat sink is used. The photovoltaic power station high-voltage direct-mounted power electronic transformer power module in this embodiment has an efficiency of up to 98%, a volume of only 50% of the traditional design, and can work stably in a high temperature environment.

[0041] The term "consisting of..." describing a combination should include the identified elements, ingredients, components or steps and other elements, ingredients, components or steps that do not substantially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe a combination of elements, ingredients, components or steps herein also contemplates an embodiment consisting essentially of these elements, ingredients, components or steps.

[0042] Multiple elements, ingredients, parts or steps can be provided by a single integrated element, ingredient, part or step. Alternatively, a single integrated element, ingredient, part or step can be divided into separate multiple elements, ingredients, parts or steps. The disclosure "one" or "an" used to describe an element, ingredient, part or step is not intended to exclude other elements, ingredients, parts or steps.

[0043] It should be understood that the above description is for illustration and not for limitation. Many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the present teachings should not be determined with reference to the above description, but rather with reference to the foregoing claims and the full scope of equivalents to which such claims are entitled. For the purpose of comprehensiveness, all articles and references, including disclosures of patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the foregoing claims is not intended to be a waiver of the subject matter, nor should it be considered that the applicant has not considered the subject matter as part of the disclosed utility model subject matter.

Claims

1. A power electronic transformer power module device, characterized in that: The invention comprises a housing and a PMC board assembly module (6), a switch radiator assembly module (7) and a DC capacitor (8) located inside the housing. The PMC board assembly module (6) and the switch radiator assembly module (7) are both located above the DC capacitor (8). The switch radiator assembly module (7) comprises a switch assembly (7.1) and a radiator. The switch assembly (7.1) is mounted on a side wall of the radiator.

2. A power electronic transformer power module device according to claim 1, characterized in that: The radiator is a fin radiator (7.3), and a side of the fin radiator (7.3) not mounted with the switch assembly (7.1) is fixedly connected to an air duct cover (7.4), and the air duct cover (7.4), the side wall of the fin radiator (7.3) and the holes provided on the housing form an air duct.

3. A power electronic transformer power module device according to claim 1, characterized in that: The side wall of the radiator is also equipped with a diode assembly (7.2) and a voltage-equalizing resistor assembly (7.5), and the switch assembly (7.1) and the diode assembly (7.2) are symmetrically arranged on the side wall of the radiator.

4. A power electronic transformer power module device according to claim 3, characterized in that: The switch assembly (7.1), the diode assembly (7.2) and the DC capacitor (8) are connected in parallel via a composite busbar (10).

5. A power electronic transformer power module device according to claim 4, characterized in that: The composite busbar (10) is located above the DC capacitor (8) and below the PMC board assembly module (6) and the switch heat sink assembly module (7).

6. A power electronic transformer power module device according to claim 4, characterized in that: The branch formed by the switch component (7.1), the diode component (7.2) and the DC capacitor (8) connected in parallel is connected in series with the voltage-equalizing resistor component (7.5), and the voltage-equalizing resistor component (7.5) and the switch component (7.1) are mounted on the same side wall of the radiator.

7. The power electronic transformer power module device according to claim 1, characterized in that: The PMC board assembly module (6) comprises a PMC board support (6.1), a PMC board (6.2) and an energy-taking power source (6.3); the PMC board (6.2) and the energy-taking power source (6.3) are fixed on the side of the PMC board support (6.1).

8. The power electronic transformer power module device according to claim 1, characterized in that: The switch assembly (7.1) is connected to the vacuum contactor (9) via a protruding copper busbar.

9. The power electronic transformer power module device according to claim 1, characterized in that: The lower end of the DC capacitor (8) is mounted on the bottom plate of the housing.

10. The power electronic transformer power module device according to claim 1, characterized in that: The switch component (7.1) adopts IGBTs or MOSFETs.

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