Electromechanical equipment heat dissipation device
By designing a heat dissipation device of electromechanical equipment including semiconductor refrigeration sheets and automated control systems, the problems of poor heat dissipation and difficulty in dust handling in the prior art are solved, and the comprehensive cooling and cooling and dust removal functions are achieved, which improves the operation reliability and maintenance convenience of the equipment.
Patent Information
- Application Number
- CN202420968313.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-05-07
AI Technical Summary
The existing heat dissipation device has poor heat dissipation effect on electromechanical equipment and cannot effectively deal with dust generated during work, affecting the normal operation of the equipment.
A heat dissipation device for electromechanical equipment is designed, including two heat dissipation chambers, each cavity is equipped with a semiconductor refrigeration plate, a first fan and a second fan. Combined with a connecting block, a connecting board, an installation block and a dust removal device, it realizes all-round cooling, heat dissipation and dust removal functions, and realizes automatic control through a temperature sensor and a dust sensor.
It improves the heat dissipation effect of electromechanical equipment to ensure the normal operation of the equipment for a long time; through all-round heat dissipation and dust removal functions, the flexibility of the equipment and the quality of the working environment are improved; the automation of cooling, heat dissipation and dust removal work is realized, and the reliability and maintenance convenience of the equipment are improved.
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Figure CN222638944U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of heat dissipation devices, and more specifically, to a heat dissipation device for electromechanical equipment. Background Art
[0002] Electromechanical equipment generally refers to machinery, electrical appliances and electrical automation equipment. With the continuous improvement of people's living standards, people have more and more demands for electromechanical equipment in their daily lives. From transportation to various household appliances, computers, printers, etc., they have become indispensable electromechanical products in people's lives. Electromechanical equipment will generate a lot of heat during operation. If the heat is not dissipated in time, it will be detrimental to the long-term operation of the electromechanical equipment.
[0003] Existing heat dissipation devices are generally simply provided with heat dissipation holes and heat dissipation fans, and most of them can only dissipate heat from the top and sides of the electromechanical equipment, but not from the bottom of the electromechanical equipment, resulting in poor heat dissipation effect. In addition, as the electromechanical equipment works, dust will accumulate. If the dust is not cleaned in time, it will easily affect the normal operation of the electromechanical equipment. Utility Model Content
[0004] In order to solve the technical problems that the existing heat dissipation device has poor heat dissipation effect on electromechanical equipment and cannot handle the dust generated during work, a heat dissipation device for electromechanical equipment with good heat dissipation effect and capable of dust removal is provided.
[0005] To achieve the above-mentioned purpose, the technical solution adopted in the present application is: a heat dissipation device for electromechanical equipment, which is provided with a body, and two heat dissipation cavities are relatively arranged in the body, and each heat dissipation cavity is provided with a heat dissipation component, and the heat dissipation component includes a semiconductor refrigeration plate, and the semiconductor refrigeration plate is arranged in the side wall of the heat dissipation cavity, and the cold end of the semiconductor refrigeration plate is connected to the first fan, and the hot end of the semiconductor refrigeration plate is connected to the second fan, and a plurality of heat dissipation holes are provided on the side wall of the heat dissipation cavity close to the inside of the body, and a connecting block is also connected to the body, and a connecting plate is detachably matched with the connecting block, and mounting blocks are provided on the upper and lower surfaces of the connecting plate, and a plurality of mounting grooves are provided on the mounting block, and a dust removal cavity is also provided on the top of the body, and a plurality of through holes are provided on the surface of the uppermost connecting plate, and a dust removal device is also provided on one side of the body.
[0006] Preferably, the dust removal device includes a dust removal fan, which is connected to the dust removal chamber through a connecting pipe, and the dust removal fan is also connected to a collection box.
[0007] Preferably, the inner walls of the body are connected with a thermal insulation layer.
[0008] Preferably, the front side wall of the machine body is rotatably connected to the machine body.
[0009] Preferably, a temperature sensor is also provided in the body.
[0010] Preferably, a dust sensor is also provided in the machine body.
[0011] Preferably, it is also provided with a controller, which is electrically connected to the temperature sensor, the dust sensor, the first fan, the second fan and the dust removal fan.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] The utility model cools down and dissipates heat inside the machine body by arranging a heat dissipation component, thereby ensuring the working temperature of the electromechanical equipment, thereby ensuring the normal operation of the electromechanical equipment for a long time; the electromechanical equipment can be flexibly installed by arranging a connecting plate, a mounting block and a mounting groove, thereby improving the flexibility of use of the device, and at the same time, the electromechanical equipment can be padded by the mounting block, thereby achieving all-round cooling and heat dissipation of the electromechanical equipment; the dust removal device can be arranged to suck out the dust in the machine body, thereby providing a good working environment for the electromechanical equipment; the controller, the temperature sensor and the dust sensor can be arranged to realize the automation of cooling and heat dissipation and dust removal. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0016] Figure 2 It is a side structural schematic diagram of the utility model.
[0017] Explanation of symbols in the figure:
[0018] 1. Machine body; 2. Heat dissipation cavity; 3. Semiconductor refrigeration sheet; 4. First fan; 5. Second fan; 6. Heat dissipation hole; 7. Connection block; 8. Connection plate; 9. Mounting block; 10. Mounting slot; 11. Dust removal cavity; 12. Through hole; 13. Dust removal fan; 14. Connecting pipe; 15. Collection box; 16. Temperature sensor; 17. Dust sensor. DETAILED DESCRIPTION
[0019] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0020] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0021] like Figure 1-2 As shown, the present application provides a heat dissipation device for electromechanical equipment, which is provided with a body 1, and two heat dissipation cavities 2 are relatively arranged in the body 1, and each heat dissipation cavity 2 is provided with a heat dissipation component, and the heat dissipation component includes a semiconductor refrigeration plate 3, and the semiconductor refrigeration plate 3 is arranged in the side wall of the heat dissipation cavity 2, and the cold end of the semiconductor refrigeration plate 3 is connected to the first fan 4, and the hot end of the semiconductor refrigeration plate 3 is connected to the second fan 5, and the side wall of the heat dissipation cavity 2 close to the inside of the body 1 is provided with a plurality of heat dissipation holes 6, and a connecting block 7 is also connected to the body 1, and a connecting plate 8 is detachably matched on the connecting block 7, and mounting blocks 9 are provided on the upper and lower surfaces of the connecting plate 8, and a plurality of mounting grooves 10 are provided on the mounting block 9, and a dust removal cavity 11 is also provided on the top of the body 1, and a plurality of through holes 12 are provided on the surface of the uppermost connecting plate 8, and a dust removal device is also provided on one side of the body 1.
[0022] In the technical solution adopted in this embodiment, the heat dissipation cavity 2 is cooled and dissipated by the heat dissipation component, thereby cooling and dissipating the inside of the machine body 1. Specifically, by energizing the semiconductor refrigeration sheet 3, the cold end of the semiconductor refrigeration sheet 3 absorbs heat to reduce the temperature, and the cold air can be blown into the heat dissipation cavity 2 through the first fan 4. The cold air in the heat dissipation cavity 2 enters the machine body 1 through the heat dissipation hole 6 to cool and dissipate the electromechanical equipment in the machine body 1, and the heat generated by the hot end of the semiconductor refrigeration sheet 3 is blown into the air outside the machine body 1 by the second fan 5; by detachably matching the connecting plate 8 on the connecting block 7 and installing the mounting block 9 on the connecting plate 8, the electromechanical equipment can be conveniently connected. It is connected to the connecting plate 8, specifically by matching the electromechanical equipment with the mounting groove 10 on the mounting block 9. It should be noted that the electromechanical equipment can also be padded by the mounting block 9, so that the bottom of the electromechanical equipment can also be in contact with the cold air, thereby achieving all-round cooling and heat dissipation of the electromechanical equipment. It should also be noted that the detachable connection between the connecting plate 8 and the connecting block 7, and the provision of multiple mounting grooves 10 on the mounting block 9 can achieve flexible installation of the electromechanical equipment, thereby improving the flexibility of the use of the device; by providing a dust removal device, the inside of the body 1 can be dusted, thereby ensuring the working environment of the electromechanical equipment, which is beneficial to improving the working quality of the electromechanical equipment.
[0023] It should be noted that the present embodiment adopts a semiconductor refrigeration sheet 3 as a heat dissipation device, which is characterized in that it utilizes the Peltier effect of semiconductor materials, that is, when direct current passes through a couple formed by two different semiconductor materials connected in series, heat can be absorbed and released at both ends of the couple respectively, thereby achieving the purpose of refrigeration. When a certain temperature difference is reached between the hot and cold ends, an equilibrium point is reached, at which time the temperatures of the hot and cold ends will not continue to change. In order for the cold end to reach a lower temperature, heat dissipation and other methods can be used to reduce the temperature of the hot end to achieve this. Therefore, the present embodiment sets a second fan 5 to dissipate heat from the hot end, so that the cold end can achieve better cooling and heat dissipation effects on the inside of the body 1.
[0024] Furthermore, in the present embodiment, the dust removal device comprises a dust removal fan 13 , the dust removal fan 13 is connected to the dust removal chamber 11 via a connecting pipe 14 , and the dust removal fan 13 is also connected to a collection box 15 .
[0025] In the technical solution adopted in this embodiment, the dust removal fan 13 can provide suction to suck out the dust in the dust removal chamber 11. Since a plurality of through holes 12 are provided on the surface of the uppermost connecting plate 8, the dust in the body 1 can enter the dust removal chamber 11 through the through holes 12, and enter the collection box 15 through the connecting pipe 14 and the dust removal fan 13. The collection box 15 can be provided to collect dust.
[0026] Furthermore, in this embodiment, the inner walls of the body 1 are connected with a thermal insulation layer.
[0027] In the technical solution adopted in this embodiment, because the cold end of the semiconductor refrigeration plate 3 blows cold air into the interior of the body 1 under the action of the first fan 4, the electromechanical equipment inside the body 1 is cooled and dissipated. The provision of an insulation layer can prevent the cold air from escaping, thereby ensuring the cooling and heat dissipation effect of the electromechanical equipment.
[0028] Furthermore, in this embodiment, the front side wall of the body 1 is rotatably connected to the body 1 .
[0029] In the technical solution adopted in this embodiment, the front side wall of the body 1 is rotatably connected to the body 1, which can facilitate the opening of the front side wall to install the electromechanical equipment into the body 1. At the same time, the front side wall can also be easily opened to inspect and maintain the electromechanical equipment.
[0030] Furthermore, in this embodiment, a temperature sensor 16 is also provided in the machine body 1 .
[0031] Furthermore, in this embodiment, a dust sensor 17 is also provided in the machine body 1 .
[0032] Furthermore, in this embodiment, a controller is also provided, and the controller is electrically connected to the temperature sensor 16 , the dust sensor 17 , the first fan 4 , the second fan 5 and the dust removal fan 13 .
[0033] In the technical solution adopted in this embodiment, a temperature sensor 16 is set to detect the temperature inside the body 1. When the temperature inside the body 1 exceeds the set temperature, it means that cooling and heat dissipation are required at this time. The temperature sensor 16 sends a signal to the controller, and the controller controls the first fan 4 and the second fan 5 to rotate, and blow cold air into the body 1 to cool down and dissipate the electromechanical equipment in the body 1, thereby realizing the automation of cooling and heat dissipation; by setting a dust sensor 17, the amount of dust in the body 1 can be detected. When the amount of dust in the body 1 exceeds the set value, it means that there is too much dust in the body 1 and dust removal work needs to be performed. At this time, the dust sensor 17 sends a signal to the controller, and the controller controls the dust removal fan 13 to start, suck out the dust in the body 1, realize dust removal work, provide a good working environment for the electromechanical equipment, and realize the automation of dust removal work.
[0034] The working principle of the utility model is as follows: first open the front side wall of the machine body 1, connect the electromechanical equipment to the connecting plate 8 through the mounting groove 10 and the mounting block 9 according to work needs, and then close the front side wall of the machine body 1. When the electromechanical equipment is working, the temperature sensor 16 continuously detects the temperature inside the machine body 1. When the temperature inside the machine body 1 exceeds the set temperature, a signal is sent to energize the semiconductor refrigeration plate 3, and the first fan 4 and the second fan 5 are started at the same time. The first fan 4 blows cold air into the inside of the machine body 1 to cool down and dissipate heat for the electromechanical equipment. The dust sensor 17 continuously detects the amount of dust in the machine body 1. When it is detected that the amount of dust in the machine body 1 exceeds the set value, a signal is sent to start the dust removal fan 13 to suck out the dust in the machine body 1, thereby realizing dust removal work inside the machine body 1.
[0035] The utility model cools down and dissipates the heat inside the body 1 by arranging a heat dissipation component, thereby ensuring the working temperature of the electromechanical equipment, thereby ensuring the normal operation of the electromechanical equipment for a long time; the electromechanical equipment can be flexibly installed by arranging a connecting plate 8, a mounting block 9 and a mounting groove 10, thereby improving the flexibility of the use of the device, and at the same time, the electromechanical equipment can be padded by the mounting block 9, thereby achieving all-round cooling and heat dissipation of the electromechanical equipment; the dust in the body 1 can be sucked out by arranging a dust removal device, thereby providing a good working environment for the electromechanical equipment; the cooling and heat dissipation work and the dust removal work can be automated by arranging a controller, a temperature sensor 16 and a dust sensor 17.
[0036] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, in the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.
[0037] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.
Claims
1. A heat dissipation device for electromechanical equipment, comprising a body, characterized in that: Two heat dissipation cavities are relatively arranged in the body, and each of the heat dissipation cavities is provided with a heat dissipation component, and the heat dissipation component includes a semiconductor refrigeration plate, and the semiconductor refrigeration plate is arranged in the side wall of the heat dissipation cavity, the cold end of the semiconductor refrigeration plate is connected to the first fan, and the hot end of the semiconductor refrigeration plate is connected to the second fan. A plurality of heat dissipation holes are arranged on the side wall of the heat dissipation cavity close to the inside of the body, and a connecting block is also connected to the body, and a connecting plate is detachably matched with the connecting block, and mounting blocks are arranged on the upper and lower surfaces of the connecting plate, and a plurality of mounting grooves are arranged on the mounting block. A dust removal cavity is also arranged on the top of the body, and a plurality of through holes are arranged on the surface of the uppermost connecting plate, and a dust removal device is also arranged on one side of the body.
2. The electromechanical equipment heat dissipation device according to claim 1, characterized in that: The dust removal device comprises a dust removal fan, which is connected to the dust removal chamber through a connecting pipe, and the dust removal fan is also connected to a collection box.
3. The electromechanical equipment heat dissipation device according to claim 1, characterized in that: The inner walls of the machine body are all connected with a heat-insulating layer.
4. The electromechanical equipment heat dissipation device according to claim 1, characterized in that: The front side wall of the machine body is rotatably connected to the machine body.
5. The electromechanical equipment heat dissipation device according to claim 2, characterized in that: A temperature sensor is also arranged in the body.
6. The electromechanical equipment heat dissipation device according to claim 5, characterized in that: A dust sensor is also arranged in the machine body.
7. The electromechanical equipment heat dissipation device according to claim 6, characterized in that: It is also provided with a controller, which is electrically connected with the temperature sensor, the dust sensor, the first fan, the second fan and the dust removal fan.