NPN type transistor chip

Abstract

The utility model relates to the field of transistor chips, in particular to an NPN type transistor chip, which comprises a chip main body, a pin interface embedded in the outer wall of the chip main body, a wide-mouth pin embedded in the inner wall of the pin interface, and a bottom support pad attached to the back of the chip main body, ventilation holes are formed in the bottom supporting pad in a penetrating mode, a blocking pad is attached to the inner wall of the bottom supporting pad, and heat conduction glue is attached to the periphery of the blocking pad. When in use, the whole width of the wide-mouth pin is larger, the contact area between the wide-mouth pin and air is larger, the gap between the wide-mouth pin and the chip main body is increased, the air can better circulate, the heat dissipation efficiency of the wide-mouth pin is further improved, and meanwhile, the ventilation holes and the heat-conducting glue are arranged in the bottom supporting pad, so that the heat dissipation efficiency of the wide-mouth pin is improved. And meanwhile, the air flow can take away the led-out heat through the ventilation holes, so that the heat dissipation effect of the chip main body is improved.

Description

Technical Field

[0001] The utility model relates to the field of transistor chips, and more specifically, to an NPN transistor chip. Background Art

[0002] NPN transistor is a kind of transistor. When the potential of base point b is higher than the potential of emitter point e by a few tenths of a volt, the emitter junction is in a forward biased state, and when the potential of collector point C is higher than the potential of point b by a few volts, the collector junction is in a reverse biased state, and the collector power supply Ec is higher than the base power supply Ebo.

[0003] However, the chip inside the NPN transistor generates a lot of heat when it is working. If the heat cannot circulate, it is easy to cause the chip to be damaged or slow down at high temperature, resulting in poor durability of the NPN transistor chip, which has certain limitations.

[0004] Therefore, in order to solve the above problems, an NPN transistor chip is proposed. Utility Model Content

[0005] In order to overcome the above defects of the prior art, the utility model provides an NPN transistor chip to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an NPN transistor chip, comprising a chip body, a pin interface is embedded and installed on the outer wall of the chip body, a wide-mouth pin is embedded and installed on the inner wall of the pin interface, a bottom support pad is fitted and installed on the back of the chip body, a ventilation hole is installed through the inside of the bottom support pad, a barrier pad is fitted and installed on the inner wall of the bottom support pad, and a thermal conductive adhesive is fitted and installed on the periphery of the barrier pad;

[0007] Preferably, a mounting hole is installed through the interior of the chip body.

[0008] Preferably, a transistor is fixedly mounted on the front of the chip body.

[0009] Preferably, the wide-mouth pin has a large overall width and a large gap is retained between the wide-mouth pin and the chip body.

[0010] Preferably, the bottom support pad is soft in texture and can achieve a certain shock-absorbing effect.

[0011] Preferably, the thermally conductive adhesive has excellent thermal conductivity, and ten groups of ventilation holes are provided in total and are evenly arranged.

[0012] Preferably, there are four groups of mounting holes, which are arranged at the four corners of the chip body.

[0013] Preferably, the transistor is an NPN-type semiconductor triode.

[0014] Technical effects and advantages of the utility model:

[0015] 1. Compared with the prior art, when this type of NPN transistor chip is in use, the overall width of the wide-mouth pin is larger, and its contact area with the air is larger, thereby increasing the gap between the wide-mouth pin and the chip body, so that air can circulate better, thereby further improving the heat dissipation efficiency of the wide-mouth pin. At the same time, ventilation holes and thermal conductive adhesive are provided inside the bottom support pad, and heat can be exported through the thermal conductive adhesive. At the same time, the airflow can take away the exported heat through the ventilation holes, thereby improving the heat dissipation effect of the chip body. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0017] Figure 2 It is an enlarged structural schematic diagram of point A of the utility model as a whole.

[0018] Figure 3 It is a schematic structural diagram of the overall bottom support pad of the utility model.

[0019] Figure 4 It is a schematic structural diagram of the overall transistor of the utility model.

[0020] The accompanying drawings are marked as follows: 1. chip body; 2. pin interface; 3. wide-mouth pin; 4. bottom support pad; 5. ventilation hole; 6. barrier pad; 7. thermal conductive adhesive; 8. mounting hole; 9. transistor. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Embodiment 1

[0023] As attached Figure 1-4 An NPN transistor chip is shown, comprising a chip body 1, an outer wall of the chip body 1 having a pin interface 2 embedded therein, an inner wall of the pin interface 2 having a wide-mouth pin 3 embedded therein, a bottom support pad 4 fitted on the back of the chip body 1, a ventilation hole 5 penetrating therein, a barrier pad 6 fitted therein on the inner wall of the barrier pad 4, a thermal conductive adhesive 7 fitted thereon, and a mounting hole 8 penetrating therein.

[0024] Among them: when the chip body 1 is in operation, the overall width of the wide-mouth pin 3 is larger, and the contact area with the air is larger, so that the heat dissipation efficiency is also improved, and the gap between the wide-mouth pin 3 and the chip body 1 is increased, so that the air can circulate better, thereby further improving the heat dissipation efficiency of the wide-mouth pin 3. At the same time, the bottom support pad 4 is provided with ventilation holes 5 and thermal conductive adhesive 7 inside, and the heat can be exported through the thermal conductive adhesive 7. At the same time, the airflow can take away the exported heat through the ventilation holes 5, thereby improving the heat dissipation effect of the chip body 1, and the bottom support pad 4 is soft in texture, which can achieve a certain vibration reduction effect. Therefore, this device can not only optimize the heat dissipation capacity of the chip, but also provide a certain protection by means of a drag pad, and it has excellent practical effects.

[0025] Embodiment 2

[0026] Based on the first embodiment, the solution in the first embodiment is further detailed in combination with the following specific working method, as described below:

[0027] like Figure 1 As shown, as a preferred embodiment; a transistor 9 is fixedly mounted on the front of the chip body 1, and further, the transistor 9 is an NPN type semiconductor triode which can amplify current and act as a switch.

[0028] The working process of the utility model is as follows:

[0029] When this type of NPN transistor chip is in use, the overall width of the wide-mouth pin 3 is larger, and its contact area with the air is larger, so that its heat dissipation efficiency is also improved. The gap between the wide-mouth pin 3 and the chip body 1 is increased, so that air can circulate better, thereby further improving the heat dissipation efficiency of the wide-mouth pin 3. At the same time, the bottom support pad 4 is provided with ventilation holes 5 and thermal conductive adhesive 7 inside, and heat can be exported through the thermal conductive adhesive 7. At the same time, the air flow can take away the exported heat through the ventilation holes 5, thereby improving the heat dissipation effect of the chip body 1. The bottom support pad 4 is soft in texture, which can achieve a certain vibration reduction effect. This is the working process and working principle of the device.

[0030] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0031] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0032] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. An NPN transistor chip, comprising a chip body (1), characterized in that: A pin interface (2) is embedded and installed on the outer wall of the chip body (1); A wide-mouth pin (3) is embedded in the inner wall of the pin interface (2), a bottom support pad (4) is fitted on the back of the chip body (1), a ventilation hole (5) is installed through the interior of the bottom support pad (4), a barrier pad (6) is fitted on the inner wall of the bottom support pad (4), and a thermal conductive adhesive (7) is fitted on the periphery of the barrier pad (6).

2. The NPN transistor chip according to claim 1, characterized in that: A mounting hole (8) is installed through the interior of the chip body (1).

3. The NPN transistor chip according to claim 1, characterized in that: A transistor (9) is fixedly mounted on the front of the chip body (1).

4. The NPN transistor chip according to claim 1, characterized in that: The wide-mouth pin (3) has a large overall width, and a large gap is retained between it and the chip body (1).

5. The NPN transistor chip according to claim 1, characterized in that: The bottom support pad (4) is soft in texture and can achieve a certain shock-absorbing effect.

6. The NPN transistor chip according to claim 1, characterized in that: The thermally conductive adhesive (7) has excellent thermal conductivity, and ten groups of ventilation holes (5) are provided in total and are evenly arranged.

7. The NPN transistor chip according to claim 2, characterized in that: There are four groups of mounting holes (8) in total, and they are arranged at the four corners of the chip body (1).

8. The NPN transistor chip according to claim 3, characterized in that: The transistor (9) is an NPN type semiconductor triode.

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