LED packaging structure for protecting welding spots and electronic equipment
By setting up a boss between the bracket substrate and the pad of the LED packaging structure, the problem of welding joint fracture caused by water vapor infiltration is solved, and the stability of the welding joint and the service life of the LED are improved.
Patent Information
- Application Number
- CN202420632041.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-03-29
AI Technical Summary
In the existing LED packaging structure, the solder joints are prone to break due to water vapor penetration after the chip is packaged, resulting in LED failure.
By setting up a boss between the bracket substrate and the pad of the LED packaging structure, the distance between the substrate and the pad is increased, the impact of water vapor on the solder joint is reduced, and the contact area between the bracket and the packaging glue is increased after the packaging glue is filled, thereby increasing the bonding strength.
It effectively reduces the infiltration of water vapor, enhances the stability of the solder joints, avoids the breakage of the solder joints, and extends the service life of the LED.
Smart Images
Figure CN222639019U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED packaging structures, in particular to an LED packaging structure and electronic equipment for protecting solder joint breakage. Background Art
[0002] The LED packaging structure includes a chip, a conductive wire, a bracket and a pad arranged on the bracket. LED packaging refers to fixing the chip on the pad, electrically connecting the two through a conductive part or a conductive wire, and finally protecting the chip with a packaging glue.
[0003] With the rapid development of indoor and outdoor LED display application technology, the integration of chips has led to smaller and smaller sizes, and the area of the pads that can be used is more limited. The chip is electrically connected to the pads through conductive wires, and the solder joints formed by the conductive wires on the pads are relatively fragile. In the prior art, after the glue is sealed, water vapor infiltration under the influence of the environment will make the solder joints more fragile and easy to break, thus causing the LED to fail. Utility Model Content
[0004] In view of the deficiencies of the prior art, the purpose of the present invention is to provide an LED packaging structure and electronic equipment for protecting solder joints, aiming to solve the problem in the prior art that the solder joints on the pads are easily broken due to water vapor penetration after chip packaging.
[0005] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:
[0006] A LED packaging structure for protecting solder joints comprises a bracket, a chip, and a conductive wire. The bracket comprises a substrate and a solder pad arranged on the substrate. The solder pad comprises a first solder pad and a second solder pad of different polarities. Bosses are arranged between the first solder pad and the second solder pad and the substrate. The height of the bosses is 50 microns to 200 microns. The chip is arranged on a side of the second solder pad facing away from the bosses. The chip comprises a first chip and a second chip. The first chip is a single-electrode chip. A conductive portion is arranged on a side of the first chip facing the second solder pad. The first chip is electrically connected to the second solder pad through the conductive portion. The first chip is electrically connected to the first solder pad through the conductive wire. The second chip is a dual-electrode chip. The second chip is electrically connected to the first solder pad and the second solder pad respectively through the conductive wire.
[0007] Compared with the prior art, the beneficial effect of the utility model lies in that: after the chip is connected to the first pad and the second pad through the conductive wire, the conductive wire forms a solder joint at the connection with the first pad and the second pad, and after the bracket is filled with packaging glue, water vapor penetrates and sinks to the substrate due to environmental influences, and the boss is provided between the substrate and the first pad and between the substrate and the second pad, the distance between the substrate and the first pad and between the substrate and the second pad is increased to reduce the influence of water vapor on the solder joint; due to the provision of the boss, after the packaging glue is filled into the bracket, the contact area between the bracket and the packaging glue can be increased, thereby improving the bonding strength between the bracket and the packaging glue to reduce the infiltration of water vapor.
[0008] Further, the first pad includes a first sub-pad, a second sub-pad and a third sub-pad, the first sub-pad, the second sub-pad and the third sub-pad are located at the corners of the outer edge of the substrate, the first chip and the second chip are fixedly soldered on the second pad, the second chip includes a first sub-chip and a second sub-chip, the conductive wire includes a first conductive wire, a second conductive wire, a third conductive wire, a fourth conductive wire and a fifth conductive wire, the conductive part is connected to the second pad through a conductive glue, the first chip is electrically connected to the first sub-pad through the first conductive wire, the first sub-chip is electrically connected to the second sub-pad and the second pad through the second conductive wire and the third conductive wire, respectively, and the second sub-chip is electrically connected to the third sub-pad and the second pad through the fourth conductive wire and the fifth conductive wire, respectively.
[0009] Furthermore, the conductive glue is silver glue, and the first sub-chip and the second sub-chip are fixedly soldered on the second pad by insulating glue.
[0010] Furthermore, the first chip is a red light chip, the first sub-chip is a green light chip, and the second sub-chip is a blue light chip.
[0011] Furthermore, a first insulating portion is arranged between the first sub-pad and the second pad, a second insulating portion is arranged between the second sub-pad and the second pad, the second insulating portion extends between the third sub-pad and the second pad, a third insulating portion is arranged between the second sub-pad and the third sub-pad, and the third insulating portion is connected to the second insulating portion.
[0012] Furthermore, the first insulating part, the second insulating part and the third insulating part are made of plastic material.
[0013] Furthermore, the boss and the bracket are made of iron.
[0014] Furthermore, the boss is connected to the pad by metal stamping.
[0015] Furthermore, an embodiment of the utility model also provides an electronic device, including the LED packaging structure described in the above technical solution. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a cross-sectional view of the LED packaging structure of an embodiment of the utility model;
[0017] Figure 2 A top view of the LED packaging structure of an embodiment of the utility model;
[0018] Among them: 1. bracket; 2. solder pad; 211. first sub-pad; 212. second sub-pad; 213. third sub-pad; 22. second solder pad; 31. first chip; 321. first sub-chip; 322. second sub-chip; 4. conductive wire 41. first conductive wire; 42. second conductive wire; 43. third conductive wire; 44. fourth conductive wire; 45. fifth conductive wire; 51. first insulating part; 52. second insulating part; 53. third insulating part; 6. boss; 7. substrate; 8. packaging glue.
[0019] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0020] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0021] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0023] See also Figure 1 and Figure 2 The LED packaging structure for protecting solder joints in the embodiment of the utility model includes a bracket 1, a chip, and a conductive wire 4. The bracket 1 includes a substrate 7 and a soldering pad 2 arranged on the substrate 7. The bracket 1 is made of iron. The soldering pad 2 includes a first soldering pad and a second soldering pad 22 of different polarities. A boss 6 is arranged between the first soldering pad and the second soldering pad 22 and the substrate 7 in a metal stamping manner. The material of the boss 6 is iron and the height is 50 microns to 200 microns. In this embodiment, the height of the boss 6 is 100 microns.
[0024] The chip is arranged on a side of the second pad 22 facing away from the boss 6, and the chip includes a first chip 31 and a second chip. The first chip 31 is a red light single-electrode chip. A conductive portion is arranged on a side of the first chip 31 facing the second pad 22, and the conductive portion is fixedly soldered on the second pad 22 by silver glue. The first chip 31 is electrically connected to the second pad 22 by the silver glue, and the first chip 31 is electrically connected to the first pad by the conductive wire. The second chip includes a first sub-chip 321 and a second sub-chip 322. The first sub-chip 321 is a green light dual-electrode chip, and the second sub-chip 322 is a blue light dual-electrode chip. The first sub-chip 321 and the second sub-chip 322 are fixedly soldered on the second pad 22 by insulating glue.
[0025] The first pad includes a first sub-pad 211, a second sub-pad 212 and a third sub-pad 213. The first sub-pad 211, the second sub-pad 212 and the third sub-pad 213 are located at the corners of the outer edge of the substrate 7. The purpose of reducing the use of the conductive wire is achieved by taking the second pad 22 as the center and surrounding the first sub-pad 211, the second sub-pad 212 and the third sub-pad 213. The conductive wires include a first conductive wire 41, a second conductive wire 42, a third conductive wire 43, a fourth conductive wire 44, and a fifth conductive wire 45. The first conductive wire 41, the second conductive wire 42, the third conductive wire 43, the fourth conductive wire 44, and the fifth conductive wire 45 are all gold wires or copper wires. The first chip is electrically connected to the second pad 22 and the first sub-pad 211 respectively through the conductive portion and the first conductive wire 41. The first sub-chip 321 is electrically connected to the second sub-pad 212 and the second pad 22 respectively through the second conductive wire 42 and the third conductive wire 43. The second sub-chip 322 is electrically connected to the third sub-pad 213 and the second pad 22 respectively through the fourth conductive wire 44 and the fifth conductive wire 45.
[0026] A first insulating portion 51 is disposed between the first sub-pad 211 and the second pad 22, a second insulating portion 52 is disposed between the second sub-pad 212 and the second pad 22, the second insulating portion 52 extends to between the third sub-pad 213 and the second pad 22, a third insulating portion 53 is disposed between the second sub-pad 212 and the third sub-pad 213, the third insulating portion 53 is connected to the second insulating portion 52, the first insulating portion 51, the second insulating portion 52, and the third insulating portion 53 are all made of plastic material, and the first insulating portion 52 is provided between the third sub-pad 213 and the second pad 22. 1. The second insulating portion 52 and the third insulating portion 53 prevent the first sub-pad 211 and the second pad 22, the second sub-pad 212 and the second pad 22, the second sub-pad 212 and the third sub-pad 213 of different polarities from being connected when the first chip is fixedly soldered to the second pad 22, or the second sub-pad 212 and the second pad 22, or the second sub-pad 212 and the third sub-pad 213 are connected to cause a short circuit.
[0027] After the chip is connected to the first pad and the second pad 22 through the conductive wire, the conductive wire will form a solder joint at the connection between the first pad and the second pad 22. After the bracket is filled with the packaging glue 8, water vapor penetrates into the substrate 7 due to the environment. By setting the boss 6 between the substrate 7 and the first pad and between the substrate and the second pad 22, the distance between the substrate 7 and the first pad, the distance between the substrate and the second pad 22 is increased to reduce the influence of water vapor on the solder joint. Due to the setting of the boss 6, after the packaging glue 8 is filled into the bracket 1, the contact area between the bracket 1 and the packaging glue 8 can be increased, thereby improving the bonding strength between the bracket 1 and the packaging glue 8 and reducing the penetration of water vapor. In the process of wire bonding, the chip and the pad 2 are connected through the conductive wire 4, and the conductive wire 4 and the pad 2 form an angle θ. Due to the setting of the boss 6, the angle θ becomes smaller, which can reduce the loss of the conductive wire 4.
[0028] The embodiment of the utility model further provides an electronic device, comprising the LED packaging structure described in the above embodiment.
[0029] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0030] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. An LED packaging structure for protecting solder joints, comprising a bracket, a chip, and a conductive wire, characterized in that: The bracket includes a substrate and a solder pad arranged on the substrate, the solder pad includes a first solder pad and a second solder pad of different polarities, a boss is arranged between the first solder pad and the second solder pad and the substrate, the height of the boss is 50 microns to 200 microns, the chip is arranged on the side of the second solder pad facing away from the boss, the chip includes a first chip and a second chip, the first chip is a single-electrode chip, a conductive part is arranged on the side of the first chip facing the second solder pad, the first chip is electrically connected to the second solder pad through the conductive part, the first chip is electrically connected to the first solder pad through the conductive wire, the second chip is a dual-electrode chip, and the second chip is electrically connected to the first solder pad and the second solder pad respectively through the conductive wire.
2. The LED packaging structure for protecting solder joints according to claim 1, characterized in that: The first pad includes a first sub-pad, a second sub-pad and a third sub-pad, the first sub-pad, the second sub-pad and the third sub-pad are located at corners of the outer edge of the substrate, the first chip and the second chip are fixedly soldered on the second pad, the second chip includes a first sub-chip and a second sub-chip, the conductive wire includes a first conductive wire, a second conductive wire, a third conductive wire, a fourth conductive wire and a fifth conductive wire, the conductive part is connected to the second pad through a conductive glue, the first chip is electrically connected to the first sub-pad through the first conductive wire, the first sub-chip is electrically connected to the second sub-pad and the second pad through the second conductive wire and the third conductive wire, respectively, and the second sub-chip is electrically connected to the third sub-pad and the second pad through the fourth conductive wire and the fifth conductive wire, respectively.
3. The LED packaging structure for protecting solder joints according to claim 2, characterized in that: The conductive glue is silver glue, and the first sub-chip and the second sub-chip are fixedly soldered on the second pad by insulating glue.
4. The LED packaging structure for protecting solder joints according to claim 2, characterized in that: The first chip is a red light chip, the first sub-chip is a green light chip, and the second sub-chip is a blue light chip.
5. The LED packaging structure for protecting solder joints according to claim 2, characterized in that: A first insulating portion is arranged between the first sub-pad and the second pad, a second insulating portion is arranged between the second sub-pad and the second pad, the second insulating portion extends to between the third sub-pad and the second pad, a third insulating portion is arranged between the second sub-pad and the third sub-pad, and the third insulating portion is connected to the second insulating portion.
6. The LED packaging structure for protecting solder joints according to claim 5, characterized in that: The first insulating part, the second insulating part and the third insulating part are all made of plastic material.
7. The LED packaging structure for protecting solder joints according to claim 1, characterized in that: The boss and the bracket are made of iron.
8. The LED packaging structure for protecting solder joints according to claim 1, characterized in that: The boss is connected to the pad by metal stamping.
9. An electronic device, characterized in that: The LED packaging structure comprises the LED packaging structure according to any one of claims 1 to 8.