Clamping mechanism for semiconductor processing

Abstract

The utility model provides a clamping mechanism for semiconductor processing. The clamping mechanism for semiconductor processing comprises a fixing table, the top of the fixing table is fixedly connected with a supporting column, the side face of the supporting column is fixedly connected with a limiting rod, and the limiting rod is movably sleeved with a sliding base. According to the clamping mechanism for semiconductor processing, the first motor and the second motor are arranged, when the position of a semiconductor is adjusted after the semiconductor is fixed, the semiconductor is fixed to the top of the mounting base, and at the moment, the first motor and the second motor are started; the first motor drives the mounting base to reciprocate through the threaded column, namely, the semiconductor is driven to reciprocate, and at the moment, the second motor drives the sliding base to horizontally move through the gear, namely, the mounting base is driven to horizontally move, so that the effect of adjusting the positions of the semiconductor in multiple directions is achieved; and the practicability of the semiconductor clamping mechanism is improved.

Description

Technical Field

[0001] The utility model relates to the field of clamping mechanisms, in particular to a clamping mechanism for semiconductor processing. Background Art

[0002] Semiconductor is a material with conductive properties between conductors and insulators. Semiconductors are widely used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous; most electronic products, such as computers, mobile phones or the core units of digital recorders are closely related to semiconductors.

[0003] In the existing technology, such as the "A clamping mechanism for semiconductor processing" with Chinese authorization announcement number: CN220699307U, it includes a base plate, a supporting leg fixedly installed at the bottom of the base plate, and an adjusting clamping mechanism arranged above the base plate, a groove is opened on the top of the base plate, the adjusting clamping mechanism includes an adjusting positioning mechanism installed above the slide groove, and a clamping mechanism is installed above the adjusting positioning mechanism. The ring plate is driven to move by pulling the lifting plate, so that the ring plate drives the first slide bar to move. At the same time, when the ring plate moves, the spring is stretched and the connecting plate fixedly connected to the outer wall of the ring plate moves. When the connecting plate moves, it drives the positioning column to move, so that the positioning column is disengaged from the positioning hole, thereby releasing the positioning relationship of the movable plate, and then the handle is manually pulled, and the handle drives the movable plate to move, so as to adjust the position of the semiconductor being clamped.

[0004] In the prior art, when semiconductor processing is performed, the position adjustment of the clamping mechanism is limited, so the position adjustment of the fixed semiconductor is restricted, which leads to the problem of inconvenience in semiconductor processing.

[0005] Therefore, it is necessary to provide a clamping mechanism for semiconductor processing to solve the above technical problems. Utility Model Content

[0006] The utility model provides a clamping mechanism for semiconductor processing, which solves the problem that the position adjustment of the fixed semiconductor is restricted due to the limited position adjustment of the clamping mechanism, thereby causing the semiconductor processing to be inconvenient.

[0007] In order to solve the above technical problems, the utility model provides a clamping mechanism for semiconductor processing, including a fixed table, the top of the fixed table is fixedly connected to a support column, the side of the support column is fixedly connected to a limit rod, the outer movably sleeved of the limit rod is provided with a sliding seat, the front of the sliding seat is fixedly installed with a No. 1 motor, the output shaft of the No. 1 motor is fixedly connected with a threaded column, the inner movably sleeved of the sliding seat is provided with a mounting seat, the bottom of the sliding seat is provided with a moving mechanism, the inner movably sleeved of the mounting seat is provided with a sliding block, the top of the sliding block is fixedly connected to an extrusion plate, the inner thread of the sliding block is sleeved with a bidirectional threaded rod, the side of the extrusion plate is provided with a protective mechanism, the bottom of the fixed table is provided with a fixing mechanism, and the bottom of the inner cavity of the sliding seat is movably sleeved with a sliding ball.

[0008] Preferably, the mounting seat is threadedly sleeved on the outside of the threaded column, and the front shape of the mounting seat is T-shaped.

[0009] Preferably, the moving mechanism includes a No. 2 motor, which is fixedly mounted on the bottom of the sliding seat, a gear is fixedly sleeved on the output shaft of the No. 2 motor, a toothed plate is fixedly connected to the top of the fixed platform, and the toothed plate is meshingly connected to the gear.

[0010] Preferably, the limiting rod and the sliding seat are perpendicular to each other, and there are two limiting rods.

[0011] Preferably, the number of the extrusion plates is two, and the two extrusion plates are symmetrically distributed with the threaded column as the axis of symmetry.

[0012] Preferably, the protection mechanism comprises a limiting sleeve, the limiting sleeve is fixedly connected to the side of the extrusion plate, the interior of the limiting sleeve is fixedly sleeved with a protective sleeve, and the material of the protective sleeve is rubber material.

[0013] Preferably, the fixing mechanism comprises a support plate, the support plate is fixedly connected to the bottom of the fixing platform, the front shape of the support plate is L-shaped, and the bottom thread of the support plate is sleeved with bolts.

[0014] Preferably, there are a plurality of sliding balls, and the plurality of sliding balls are evenly distributed at the bottom of the inner cavity of the sliding seat.

[0015] Compared with the related art, the semiconductor processing clamping mechanism provided by the utility model has the following beneficial effects:

[0016] The utility model provides a clamping mechanism for semiconductor processing, which is provided with a No. 1 motor and a No. 2 motor. When the semiconductor is fixed and the position is adjusted, the semiconductor is fixed on the top of the mounting seat. At this time, the No. 1 motor and the No. 2 motor are started, so that the No. 1 motor can drive the mounting seat to reciprocate through the threaded column, that is, drive the semiconductor to reciprocate. At this time, the No. 2 motor can drive the sliding seat to move horizontally through the gear, that is, drive the mounting seat to move horizontally, thereby achieving the effect of adjusting the position of the semiconductor in multiple directions, thereby improving the practicality of the semiconductor clamping mechanism;

[0017] By setting up the squeezing plate, when the semiconductor needs to be clamped and fixed, the semiconductor is placed on the top of the mounting seat. At this time, the bidirectional threaded rod is rotated so that the bidirectional threaded rod can drive the two sliding blocks to move horizontally, that is, drive the two squeezing plates to tightly squeeze the sides of the semiconductor, thereby achieving the effect of clamping and fixing the semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic structural diagram of a preferred embodiment of a semiconductor processing clamping mechanism provided by the utility model;

[0019] Figure 2 for Figure 1 A front view of a fixing table in a clamping mechanism for semiconductor processing;

[0020] Figure 3 for Figure 1 A bottom view of a sliding seat in a clamping mechanism for semiconductor processing;

[0021] Figure 4 for Figure 1 A front view of a mounting seat in a clamping mechanism for semiconductor processing is shown.

[0022] Numbers in the figure: 1. fixed platform; 2. support column; 3. limit rod; 4. sliding seat; 5. No. 1 motor; 6. threaded column; 7. mounting seat; 8. moving mechanism; 81. No. 2 motor; 82. gear; 83. gear plate; 9. sliding block; 10. extrusion plate; 11. bidirectional threaded rod; 12. protective mechanism; 121. limit sleeve; 122. protective sleeve; 13. fixing mechanism; 131. support plate; 132. bolt; 14. sliding ball. DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0024] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 ,in, Figure 1A schematic structural diagram of a preferred embodiment of a semiconductor processing clamping mechanism provided by the utility model; Figure 2 for Figure 1 A front view of a fixing table in a clamping mechanism for semiconductor processing; Figure 3 for Figure 1 A bottom view of a sliding seat in a clamping mechanism for semiconductor processing; Figure 4 for Figure 1 A front view of a mounting seat in a clamping mechanism for semiconductor processing is shown. A clamping mechanism for semiconductor processing comprises a fixed table 1, a support column 2 is fixedly connected to the top of the fixed table 1, a limit rod 3 is fixedly connected to the side of the support column 2, a sliding seat 4 is movably sleeved on the outside of the limit rod 3, a No. 1 motor 5 is fixedly installed on the front of the sliding seat 4, a threaded column 6 is fixedly connected to the output shaft of the No. 1 motor 5, a mounting seat 7 is movably sleeved inside the sliding seat 4, a moving mechanism 8 is provided at the bottom of the sliding seat 4, a sliding block 9 is movably sleeved inside the mounting seat 7, an extrusion plate 10 is fixedly connected to the top of the sliding block 9, a bidirectional threaded rod 11 is sleeved on the internal thread of the sliding block 9, a protective mechanism 12 is provided on the side of the extrusion plate 10, a fixing mechanism 13 is provided at the bottom of the fixed table 1, and a sliding ball 14 is movably sleeved at the bottom of the inner cavity of the sliding seat 4.

[0025] The mounting seat 7 is threadedly sleeved on the outside of the threaded column 6, and the front shape of the mounting seat 7 is T-shaped; by setting the mounting seat 7, when semiconductor processing is carried out, the semiconductor is fixed on the top of the mounting seat 7, and the No. 1 motor 5 is started at this time, so that the No. 1 motor 5 can drive the mounting seat 7 to reciprocate through the threaded column 6, that is, drive the semiconductor to reciprocate, thereby achieving the effect of adjusting the position of the semiconductor after clamping and fixing.

[0026] The moving mechanism 8 includes a No. 2 motor 81, which is fixedly installed at the bottom of the sliding seat 4. A gear 82 is fixedly sleeved on the output shaft of the No. 2 motor 81. A toothed plate 83 is fixedly connected to the top of the fixed platform 1, and the toothed plate 83 is meshed with the gear 82. By setting up the moving mechanism 8, when it is necessary to adjust the position of the semiconductor after fixing, the No. 2 motor 81 is started, so that the No. 2 motor 81 can drive the sliding seat 4 to move horizontally through the gear 82, that is, drive the mounting seat 7 to move horizontally, thereby achieving the effect of adjusting the position of the semiconductor in the horizontal direction.

[0027] The limit rod 3 and the sliding seat 4 are perpendicular to each other, and there are two limit rods 3; by setting the limit rod 3, when the position of the sliding seat 4 is adjusted, the limit rod 3 can limit the position of the horizontally movable mounting seat 7, thereby avoiding the problem of tilting and offsetting when the mounting seat 7 moves horizontally, that is, avoiding the problem of tilting and offsetting when the semiconductor position is adjusted, thereby improving the stability of the semiconductor position during adjustment.

[0028] There are two squeezing plates 10, and the two squeezing plates 10 are symmetrically distributed with the threaded column 6 as the symmetry axis; by setting the squeezing plates 10, when the semiconductor needs to be clamped and fixed, the semiconductor is placed on the top of the mounting seat 7, and the bidirectional threaded rod 11 is rotated at this time, so that the bidirectional threaded rod 11 can drive the two sliding blocks 9 to move horizontally, that is, drive the two squeezing plates 10 to be tightly squeezed on the side of the semiconductor, thereby achieving the effect of clamping and fixing the semiconductor.

[0029] The protective mechanism 12 includes a limiting sleeve 121, which is fixedly connected to the side of the extrusion plate 10. The internal part of the limiting sleeve 121 is fixedly sleeved with a protective sleeve 122, which is made of rubber material. By setting the protective mechanism 12, when the semiconductor is clamped and fixed, the semiconductor is sleeved inside the limiting sleeve 121. At this time, the protective sleeve 122 can protect the semiconductor inside the limiting sleeve 121, thereby avoiding the problem that the extrusion plate 10 is relatively hard and causes damage to the semiconductor during clamping.

[0030] The fixing mechanism 13 includes a support plate 131, which is fixedly connected to the bottom of the fixing table 1, the front shape of the support plate 131 is L-shaped, and the bottom thread of the support plate 131 is sleeved with a bolt 132; by setting the fixing mechanism 13, when the clamping mechanism is installed and fixed, the bolt 132 is rotated so that the bolt 132 can tightly squeeze and fix the support plate 131 on the surface of the workbench, that is, the fixing table 1 is fixed on the surface of the workbench, thereby achieving the limiting and fixing effect of the clamping mechanism.

[0031] There are several sliding balls 14, which are evenly distributed at the bottom of the inner cavity of the sliding seat 4. By setting the sliding balls 14, when the position of the mounting seat 7 is adjusted, the sliding balls 14 can support and limit the reciprocating mounting seat 7, thereby avoiding the problem of long-term friction between the mounting seat 7 and the bottom of the sliding seat 4 when the mounting seat 7 moves back and forth, thereby improving the smoothness of the movement of the mounting seat 7.

[0032] The working principle of a clamping mechanism for semiconductor processing provided by the utility model is as follows:

[0033] Step 1: First, when performing semiconductor processing, fix the semiconductor on the top of the mounting seat 7. At this time, start the No. 1 motor 5, so that the No. 1 motor 5 can drive the mounting seat 7 to reciprocate through the threaded column 6, that is, drive the semiconductor to reciprocate, thereby achieving the effect of adjusting the position of the semiconductor after clamping and fixing. When it is necessary to adjust the position of the semiconductor after fixing, start the No. 2 motor 81, so that the No. 2 motor 81 can drive the sliding seat 4 to move horizontally through the gear 82, that is, drive the mounting seat 7 to move horizontally, thereby achieving the effect of adjusting the position of the semiconductor in the horizontal direction. When adjusting the position of the sliding seat 4, the limit rod 3 can limit the position of the horizontally moving mounting seat 7, thereby avoiding the problem of tilting and offsetting when the mounting seat 7 moves horizontally, that is, avoiding the problem of tilting and offsetting when the semiconductor position is adjusted, thereby improving the stability of the semiconductor position adjustment. When it is necessary to clamp and fix the semiconductor, place the semiconductor on the top of the mounting seat 7, and rotate the bidirectional threaded rod 11 at this time, so that the bidirectional threaded rod 11 can drive the two sliding blocks 9 to move horizontally, that is, drive the two extrusion plates 10 to squeeze tightly on the side of the semiconductor, thereby achieving the effect of semiconductor clamping and fixing;

[0034] Step 2: When clamping and fixing the semiconductor, the semiconductor sleeve is connected inside the limiting sleeve 121. At this time, the protective sleeve 122 can protect the semiconductor inside the limiting sleeve 121, so as to avoid the problem that the extrusion plate 10 is relatively hard and causes damage to the semiconductor during clamping. When installing and fixing the clamping mechanism, the bolt 132 is rotated so that the bolt 132 can tightly squeeze and fix the support plate 131 on the surface of the workbench, that is, the fixed table 1 is fixed on the surface of the workbench, thereby achieving the limiting and fixing effect of the clamping mechanism. When adjusting the position of the mounting seat 7, the sliding ball 14 can support and limit the reciprocating mounting seat 7, so as to avoid the problem of long-term friction between the mounting seat 7 and the bottom of the sliding seat 4 during reciprocating movement, thereby improving the smoothness of the movement of the mounting seat 7.

[0035] Compared with the related art, the semiconductor processing clamping mechanism provided by the utility model has the following beneficial effects:

[0036] By setting the No. 1 motor 5 and the No. 2 motor 81, when the position of the semiconductor is adjusted after being fixed, the semiconductor is fixed on the top of the mounting seat 7. At this time, the No. 1 motor 5 and the No. 2 motor 81 are started, so that the No. 1 motor 5 can drive the mounting seat 7 to reciprocate through the threaded column 6, that is, drive the semiconductor to reciprocate. At this time, the No. 2 motor 81 can drive the sliding seat 4 to move horizontally through the gear 82, that is, drive the mounting seat 7 to move horizontally, thereby achieving the effect of adjusting the position of the semiconductor in multiple directions, thereby improving the practicality of the semiconductor clamping mechanism.

[0037] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A clamping mechanism for semiconductor processing, comprising a fixing table (1), characterized in that: The top of the fixed platform (1) is fixedly connected to a support column (2), the side of the support column (2) is fixedly connected to a limit rod (3), the outer part of the limit rod (3) is movably sleeved with a sliding seat (4), a No. 1 motor (5) is fixedly mounted on the front of the sliding seat (4), a threaded column (6) is fixedly connected to the output shaft of the No. 1 motor (5), the interior of the sliding seat (4) is movably sleeved with a mounting seat (7), a moving mechanism (8) is provided at the bottom of the sliding seat (4), a sliding block (9) is movably sleeved inside the mounting seat (7), an extrusion plate (10) is fixedly connected to the top of the sliding block (9), a bidirectional threaded rod (11) is sleeved on the inner thread of the sliding block (9), a protective mechanism (12) is provided on the side of the extrusion plate (10), a fixing mechanism (13) is provided at the bottom of the fixed platform (1), and a sliding ball (14) is movably sleeved at the bottom of the inner cavity of the sliding seat (4).

2. A semiconductor processing clamping mechanism according to claim 1, characterized in that: The mounting seat (7) is threadedly sleeved on the outside of the threaded column (6), and the front face of the mounting seat (7) is in a T-shape.

3. A semiconductor processing clamping mechanism according to claim 1, characterized in that: The moving mechanism (8) comprises a No. 2 motor (81), the No. 2 motor (81) being fixedly mounted on the bottom of the sliding seat (4), a gear (82) being fixedly sleeved on the output shaft of the No. 2 motor (81), a toothed plate (83) being fixedly connected to the top of the fixed platform (1), and the toothed plate (83) being meshingly connected to the gear (82).

4. A semiconductor processing clamping mechanism according to claim 1, characterized in that: The limiting rod (3) and the sliding seat (4) are perpendicular to each other, and there are two limiting rods (3).

5. A semiconductor processing clamping mechanism according to claim 1, characterized in that: The number of the extrusion plates (10) is two, and the two extrusion plates (10) are symmetrically distributed with the threaded column (6) as a symmetry axis.

6. A semiconductor processing clamping mechanism according to claim 1, characterized in that: The protection mechanism (12) comprises a limiting sleeve (121), the limiting sleeve (121) being fixedly connected to the side of the extrusion plate (10), the interior of the limiting sleeve (121) being fixedly sleeved with a protection sleeve (122), the material of the protection sleeve (122) being a rubber material.

7. A semiconductor processing clamping mechanism according to claim 1, characterized in that: The fixing mechanism (13) comprises a support plate (131), the support plate (131) being fixedly connected to the bottom of the fixing platform (1), the front face of the support plate (131) being L-shaped, and the bottom thread of the support plate (131) being sleeved with a bolt (132).

8. The semiconductor processing clamping mechanism according to claim 1, characterized in that: The number of the sliding balls (14) is a plurality, and the plurality of sliding balls (14) are evenly distributed at the bottom of the inner cavity of the sliding seat (4).

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