Ultrathin wafer test tray

Abstract

The utility model aims to provide an ultrathin wafer test tray, and belongs to the technical field of wafer processing and testing. The ultrathin wafer test tray comprises a bottom plate and at least two push blocks. The upper surface of the bottom plate is a bearing surface and is used for bearing a wafer; the push blocks are arranged on the bearing face in a circumferential sliding mode with the geometric center of the bottom plate as the symmetry center. When a wafer is placed on the bearing surface, the push block abuts against the edge of the wafer in the radial direction of the wafer, so that the wafer is fixed. According to the utility model, the wafer is fixed in different radial directions through the push blocks, so that the problem that the wafer cannot be adsorbed and fixed under negative pressure after being deformed is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing and testing, in particular to an ultra-thin wafer testing tray. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor circuits. Ultra-thin wafers are now widely used.

[0003] When testing various indicators of the wafer, the wafer needs to be placed on the wafer chuck on the workbench, and the wafer can be adsorbed and fixed by the wafer chuck for subsequent testing. However, ultra-thin wafers are easy to deform (for example, the middle area of ​​the wafer is warped) due to their thickness between 50 microns and 100 microns, so the existing wafer chuck has a poor fixing effect on deformed ultra-thin wafers. Utility Model Content

[0004] The utility model aims to provide an ultra-thin wafer test tray, which fixes the wafer from different radial directions by pushing blocks, solving the problem that the wafer cannot be fixed by negative pressure adsorption after deformation.

[0005] The technical solution adopted by the utility model is:

[0006] An ultra-thin wafer test tray, comprising:

[0007] A bottom plate, the upper surface of which is a supporting surface for supporting the wafer;

[0008] At least two push blocks, the push blocks are slidably arranged on the supporting surface in a circular manner with the geometric center of the bottom plate as the symmetric center;

[0009] When the wafer is placed on the supporting surface, the push block presses against the edge of the wafer along the radial direction of the wafer to fix the wafer.

[0010] Furthermore, the supporting surface is provided with mounting grooves whose number is the same as that of the push blocks; the mounting grooves are arranged in a circular manner with the geometric center of the base plate as the symmetry center; and the push blocks are slidably arranged in the mounting grooves one by one.

[0011] Further, the mounting groove includes a radial groove portion and a longitudinal groove portion; the length center direction of the radial groove portion is the radial direction of the wafer; the length center direction of the longitudinal groove portion is a direction perpendicular to the length center direction of the radial groove portion; the radial groove portion and the longitudinal groove portion are cross-connected;

[0012] The push block includes a radial plate portion, a longitudinal plate portion and a tongue-pressing portion; the radial plate portion is arranged in the radial groove portion, and its thickness is consistent with the thickness of the radial groove portion; the longitudinal plate portion is arranged in the longitudinal groove portion; the radial plate portion and the longitudinal plate portion are cross-connected, and the two can slide synchronously along the length direction of the radial groove portion; the tongue-pressing portion is arranged on one end of the radial plate portion facing the geometric center direction of the bottom plate, and the tongue-pressing portion is higher than the supporting surface; wherein, when the wafer is placed on the supporting surface, the tongue-pressing portion presses the upper surface of the wafer edge and at the same time presses against the circumferential side wall of the wafer.

[0013] Furthermore, an elastic element is arranged in the longitudinal groove; the elastic element can allow the push block to maintain a tendency to move toward the geometric center of the bottom plate.

[0014] Furthermore, the elastic element is a torsion spring with a "V"-shaped structure; the torsion spring is located between the side of the longitudinal groove portion away from the geometric center of the bottom plate and the adjacent side wall of the longitudinal plate portion; one elastic arm of the torsion spring presses against the side wall of the longitudinal groove portion, and the other elastic arm presses against the side wall of the longitudinal plate portion.

[0015] Furthermore, a positioning column is arranged in the longitudinal groove; and the spiral part of the torsion spring is sleeved on the positioning column.

[0016] Furthermore, each of the mounting grooves is covered with a pressing plate; the pressing plate is detachably connected to the bottom plate, and at least a portion of the push block except the tongue-pressing portion is confined within the mounting groove.

[0017] Furthermore, the inner side of the pressure plate is adapted to the standard wafer edge and has a notch; the pressure plate completely seals the remaining portion of the radial plate portion and the longitudinal plate portion outside the pressing tongue portion in the mounting groove, and the pressing tongue portion is located in the notch.

[0018] Furthermore, a first through hole is formed on the radial plate portion or the longitudinal plate portion, and a second through hole is formed on the corresponding radial groove portion or the longitudinal groove portion; the axial centers of the first through hole and the second through hole do not overlap.

[0019] Furthermore, the supporting surface is provided with one or more annular negative pressure grooves arranged in a concentric circle manner; a plurality of through adsorption holes are provided at the bottom of the annular negative pressure groove and on the supporting surface area where the annular negative pressure groove is not provided.

[0020] The beneficial effects of the utility model are:

[0021] The utility model provides an ultra-thin wafer test tray to solve the problem that the existing wafer chuck has poor fixing effect on deformed ultra-thin wafers. The test tray includes a bottom plate and a push block, etc., and the push block is used to fix the wafer from different radial directions. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 FIG. 4 is a front view of an ultra-thin wafer test tray in an embodiment.

[0024] Figure 2 This is a three-dimensional structural view of the base plate in this embodiment.

[0025] Figure 3 Schematic diagram of the combined structure of the push block and the elastic element in this embodiment.

[0026] Figure 4 FIG. 1 is a front view of the ultra-thin wafer test tray when some of the pressing plates in the embodiment are not installed.

[0027] Figure 5 FIG. 1 is a front view of an ultra-thin wafer fixed on a test tray in an embodiment.

[0028] Figure 6 FIG. 1 is a front view of an ultra-thin wafer fixed on a test tray in an embodiment.

[0029] The accompanying drawings are marked as follows:

[0030] 100-base plate, 200-wafer, 300-push block, 400-elastic element, 500-pressing plate;

[0031] 110-supporting surface, 111-annular negative pressure groove, 112-adsorption hole;

[0032] 120 - mounting groove, 121 - radial groove, 122 - longitudinal groove, 123 - positioning column, 124 - second through hole;

[0033] 310- radial plate portion, 320- longitudinal plate portion, 330- tongue pressing portion, 340- first through hole;

[0034] 510-Gap. DETAILED DESCRIPTION

[0035] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0036] The disclosure below provides many different embodiments or examples to implement different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present invention.

[0037] The embodiments of the utility model are described in detail below with reference to the accompanying drawings.

[0038] The present embodiment aims to provide an ultra-thin wafer test tray to fix ultra-thin wafers, especially deformed ultra-thin wafers, to facilitate the implementation of subsequent testing procedures of the ultra-thin wafers.

[0039] Figure 1 FIG. 4 is a front view of an ultra-thin wafer test tray in an embodiment. Figure 2 is a front view of the bottom plate in this embodiment. Figure 1 As shown in , the ultra-thin wafer test tray includes a base plate 100. The base plate 100 is roughly in the shape of a circular plate. The upper surface of the base plate 100 is a supporting surface 110, which is used to support the wafer 200. When the wafer 200 is placed on the supporting surface 110, the geometric center of the wafer 200 roughly coincides with the geometric center of the base plate 100, and the radial direction of the wafer 200 is also the radial direction of the base plate 100. At least two or more mounting grooves 120 are provided at the edge of the supporting surface 110. The two or more mounting grooves 120 are evenly arranged in a circular manner with the geometric center of the base plate 100 as the symmetrical center. As shown in the attached Figure 2 As shown in the figure, there are three mounting grooves 120 in total, and the three mounting grooves 120 are evenly arranged in a circular manner with the geometric center of the base plate 100 as the symmetric center. Each mounting groove 120 includes a radial groove portion 121 and a longitudinal groove portion 122. The length center direction of the radial groove portion 121 is the radial direction of the base plate 100. The length center direction of the longitudinal groove portion 122 is a direction perpendicular to the length center direction of the radial groove portion 121. The radial groove portion 121 and the longitudinal groove portion 122 are cross-connected to form a "cross"-like structure. Figure 3Schematic diagram of the combined structure of the push block and the elastic element in this embodiment. Figure 4 FIG. 1 is a front view of the ultra-thin wafer test tray when some of the pressing plates in the embodiment are not installed. Figure 3 As shown, a push block 300 is disposed in each mounting groove 120. Figure 4 As shown in , the push block 300 includes a radial plate portion 310, a longitudinal plate portion 320 and a tongue pressing portion 330. The radial plate portion 310 is arranged in the radial groove portion 121, and its length is less than the length of the radial groove portion 121, its thickness is roughly consistent with the depth of the radial groove portion 121, and its width is roughly consistent with the width of the radial groove portion 121. The longitudinal plate portion 320 is arranged in the longitudinal groove portion 122, and its length is roughly consistent with the length of the longitudinal groove portion 122, its thickness is roughly consistent with the depth of the longitudinal groove portion 122, and its width is less than the width of the longitudinal groove portion 122. The radial plate portion 310 and the longitudinal plate portion 320 are cross-connected to form a "cross"-shaped structure. At the same time, the size relationship between the longitudinal plate portion 320 and the longitudinal groove portion 122 allows the entirety formed by the longitudinal plate portion 320 and the radial plate portion 310 to slide along the length direction of the radial groove portion 121 (i.e., the radial direction of the base 100). The tongue-pressing portion 330 is arranged on one end of the radial plate portion 310 in the direction of the geometric center of the base plate 100. The tongue-pressing portion 330 is higher than the top of the mounting groove 120 (that is, the tongue-pressing portion 330 is higher than the supporting surface 110), and cooperates with the end of the radial plate portion 310 to form a structure similar to an inverted "L" shape. When the wafer 200 is placed on the supporting surface 110, the tongue-pressing portion 330 presses the upper surface of the edge of the wafer 200 and presses against the circumferential side wall of the wafer 200. The sliding fit between the push block 300 and the base plate 100, especially the sliding fit between the push block 300 and the mounting groove 120, makes the wafer fixing more convenient. At the same time, the tongue-pressing portions 330 of the multiple push blocks 300 fix the wafer 200 from different radial directions respectively, solving the problem that the wafer cannot be fixed by negative pressure adsorption after deformation.

[0040] In this embodiment, in addition to the installation groove of the "cross" structure shown in the drawings, other installation grooves such as the inverted "T" structure and the "L" structure can also be applied. The radial plate portion and the longitudinal plate portion of the corresponding push block can be obtained by adaptively adjusting the structure of the installation groove, and those skilled in the art do not need to make creative efforts.

[0041] In this embodiment, an elastic element 400 is provided in the longitudinal groove 122, and the elastic element 400 can make the push block 300 have a tendency to move toward the geometric center of the bottom plate 100, so as to ensure the clamping effect of the push block 300 on the wafer 200. At the same time, the number of elastic elements 400 can be set according to demand and position. Specifically, the elastic element may include a coil spring, a torsion spring, etc. For example, as shown in the attached Figure 4As shown in , the elastic element 400 adopts a torsion spring with a "V"-shaped structure. The torsion spring is located between the side wall of the longitudinal groove portion 122 away from the geometric center of the bottom plate 100 and the side wall of the adjacent longitudinal plate portion 320, and one elastic arm of the torsion spring abuts against the side wall of the longitudinal plate portion 320, and the other elastic arm abuts against the side wall of the longitudinal groove portion 122. The two torsion springs are symmetrically arranged on both sides of the longitudinal groove portion 122 in the length direction, and apply force to the push block 300 from both sides of the longitudinal plate portion 320. Furthermore, in order to prevent the torsion spring from moving, a positioning column 123 is provided in the longitudinal groove portion 122. The spiral part of the torsion spring is sleeved on the positioning column 123.

[0042] In this embodiment, in addition to using elastic elements to make the push block move toward the geometric center of the bottom plate, other linear motion mechanisms such as electric cylinders and linear modules can also achieve radial movement and maintenance of the push block. The corresponding connection structure between the linear motion mechanism and the push block can adopt a common connection structure in the art, and those skilled in the art do not need to make creative efforts.

[0043] In this embodiment, in order to prevent the push block from falling out of the mounting groove, a pressing plate 500 is covered in the area of ​​each mounting groove 120 on the bottom plate 100, and at least a part of the push block 300 except the tongue pressing portion 330 is restricted in the mounting groove 120. Figure 1 and attached Figure 4 As described in the figure, the pressing plate 500 is detachably connected to the base plate 100, and its lower surface is attached to the push block 300, and its outer side (the side facing the outer side of the base plate 100) is flush with the edge of the base plate 100. The inner side (the side facing the geometric center of the base plate 100) edge of the pressing plate 500 has a notch 510. The pressing plate 500 completely seals the remaining part of the radial plate portion 310 outside the pressing tongue portion 330, the longitudinal plate portion 320 and the elastic element 400 in the mounting groove 120, and the pressing tongue portion 330 is located in the notch 510. Therefore, when the radial plate portion 310 and the longitudinal plate portion 320 move radially in the mounting groove 120, the radial movement of the pressing tongue portion 330 is not affected by the notch 510 of the pressing plate 500. Multiple pressing plates effectively prevent the push block from falling out of the mounting groove. At the same time, the inner side of the pressing plate 500 matches the shape of the standard wafer 200 (not deformed). Figure 5 FIG. 1 is a front view of an ultra-thin wafer fixed on a test tray in an embodiment. Figure 5 As shown in , since most standard wafers 200 have a straight cut edge on one side, the inner side of one pressing plate 500 is a straight edge that can be used for positioning; the inner sides of the other two pressing plates 500 are arc-shaped edges. The inner edge enclosed area of ​​the multiple pressing plates can also be used as the initial positioning area of ​​the wafer, and the standard wafer can roughly rest against the inner edge of the pressing plate.

[0044] In this embodiment, a first through hole 340 is provided on the radial plate portion 310 or the longitudinal plate portion 320, preferably the radial plate portion 310. A second through hole 124 is provided on the corresponding radial groove portion 121 or the longitudinal groove portion 122, preferably the radial groove portion 121. Figure 4 As shown in , the axial centers of the first through hole 340 and the second through hole 124 do not coincide, and are preferably offset along the radial direction of the base plate 100 , thereby facilitating the pushing block 300 to load the wafer 200 .

[0045] In this embodiment, one or more annular negative pressure grooves 111 arranged in a concentric manner are provided on the supporting surface 110 of the bottom plate 100. A plurality of through adsorption holes 112 are provided on the bottom of the annular negative pressure groove 111 and on the supporting surface 110 region where the annular negative pressure groove 111 is not provided. At the same time, the adsorption holes 112 provided on the supporting surface 110 region where the annular negative pressure groove 111 is not provided are uniformly arranged in a concentric manner with the asymmetric center of the geometry of the bottom plate 100. Similarly, the adsorption holes 112 provided on the bottom of the annular negative pressure groove 111 are also uniformly arranged in a circumferential manner. When the other side opposite to the supporting surface 110 of the bottom plate 100 is subjected to suction, the annular negative pressure groove 111 and the adsorption holes 112 generate negative pressure, and the undeformed wafer 200 can be fixed on the supporting surface 110 by the negative pressure adsorption of the annular negative pressure groove 111 and the adsorption holes 112, thereby further expanding the scope of application of the tray.

[0046] Figure 5 FIG. 1 is a front view of an ultra-thin wafer fixed on a test tray in an embodiment. Figure 6 FIG. 1 is a front view of an ultra-thin wafer fixed on a test tray in an embodiment. Figure 5 and attached Figure 6 As shown in , when the deformed wafer 200 needs to be fixed, the push block 300 is first moved away from the geometric center of the bottom plate 100 by using the position between the first through hole 340 and the second through hole 124, and then the wafer 200 is placed, and then the push block 300 is gradually loosened and moved toward the geometric center of the bottom plate 100, and the tongue pressing portion 330 of the push block 300 presses the upper surface of the wafer 200 and abuts against the circumferential side wall of the wafer 200. The force of the elastic element 400 makes the tongue pressing portion 330 maintain the trend of moving toward the center of the bottom plate 100, so as to ensure the clamping effect of the tongue pressing portion 330 on the wafer 200.

Claims

1. An ultra-thin wafer test tray, characterized in that: include: A bottom plate, the upper surface of which is a supporting surface for supporting the wafer; At least two push blocks, the push blocks are slidably arranged on the supporting surface in a circular manner with the geometric center of the bottom plate as the symmetric center; When the wafer is placed on the supporting surface, the push block presses against the edge of the wafer along the radial direction of the wafer to fix the wafer.

2. The ultra-thin wafer test tray according to claim 1, characterized in that: The supporting surface is provided with installation grooves having the same number as the push blocks; the installation grooves are arranged in a circular manner with the geometric center of the bottom plate as the symmetric center; and the push blocks are slidably arranged in the installation grooves one by one.

3. The ultra-thin wafer test tray according to claim 2, characterized in that: The mounting groove comprises a radial groove portion and a longitudinal groove portion; the length center direction of the radial groove portion is the radial direction of the wafer; the length center direction of the longitudinal groove portion is a direction perpendicular to the length center direction of the radial groove portion; the radial groove portion and the longitudinal groove portion are cross-connected; The push block includes a radial plate portion, a longitudinal plate portion and a tongue-pressing portion; the radial plate portion is arranged in the radial groove portion, and its thickness is consistent with the thickness of the radial groove portion; the longitudinal plate portion is arranged in the longitudinal groove portion; the radial plate portion and the longitudinal plate portion are cross-connected, and the two can slide synchronously along the length direction of the radial groove portion; the tongue-pressing portion is arranged on one end of the radial plate portion facing the geometric center direction of the bottom plate, and the tongue-pressing portion is higher than the supporting surface; wherein, when the wafer is placed on the supporting surface, the tongue-pressing portion presses the upper surface of the wafer edge and at the same time presses against the circumferential side wall of the wafer.

4. The ultra-thin wafer test tray according to claim 3, characterized in that: An elastic element is arranged in the longitudinal groove; the elastic element can allow the push block to maintain a tendency to move toward the geometric center of the bottom plate.

5. The ultra-thin wafer test tray according to claim 4, characterized in that: The elastic element is a torsion spring with a "V"-shaped structure; the torsion spring is located between the side of the longitudinal groove away from the geometric center of the bottom plate and the adjacent side wall of the longitudinal plate; one elastic arm of the torsion spring presses against the side wall of the longitudinal groove, and the other elastic arm presses against the side wall of the longitudinal plate.

6. The ultra-thin wafer test tray according to claim 5, characterized in that: A positioning column is arranged in the longitudinal groove; and the spiral part of the torsion spring is sleeved on the positioning column.

7. The ultra-thin wafer test tray according to any one of claims 3 to 6, characterized in that: Each of the installation grooves is covered with a pressing plate; the pressing plate is detachably connected to the bottom plate and at least partially restricts the push block except the tongue-pressing portion within the installation groove.

8. The ultra-thin wafer test tray according to claim 7, characterized in that: The inner side of the pressure plate is adapted to the standard wafer edge and has a notch; the pressure plate completely seals the remaining portion of the radial plate portion and the longitudinal plate portion outside the pressure tongue portion in the mounting groove, and the pressure tongue portion is located in the notch.

9. The ultra-thin wafer test tray according to any one of claims 3 to 6 and 8, characterized in that: A first through hole is formed on the radial plate portion or the longitudinal plate portion, and a second through hole is formed on the corresponding radial groove portion or the longitudinal groove portion; the axial centers of the first through hole and the second through hole do not overlap.

10. The ultra-thin wafer test tray according to any one of claims 1 to 6 and 8, characterized in that: The supporting surface is provided with one or more annular negative pressure grooves arranged in a concentric circle manner; a plurality of through adsorption holes are provided at the bottom of the annular negative pressure groove and on the supporting surface area where the annular negative pressure groove is not provided.

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