Antistatic sheet for chip protection
By setting up multiple antistatic layers and compressive components on the antistatic sheet for chip protection, the problem of poor antistatic performance of the sheet main body is solved, and better electrostatic protection and chip protection effects are achieved.
Patent Information
- Application Number
- CN202421086176.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-18
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-05-18
AI Technical Summary
During the use of the existing anti-static sheet for chip protection, the anti-static performance of the sheet main body is poor, resulting in static electricity generation and damage to the internal circuit of the chip.
By providing an antistatic layer A, an antistatic layer B, an antistatic layer C and an antistatic layer D on the sheet body, and adding a compressive component, including a reinforcing layer A and a reinforcing layer B, is made of carbon fiber and glass fiber, to improve the antistatic and compressive properties of the sheet body.
It effectively improves the anti-static performance of the sheet body, prevents local accumulation and accumulation of static electricity, enhances the protection ability of the chip, and improves the wear and compression resistance of the sheet body.
Smart Images
Figure CN222645544U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip protection, in particular to an antistatic sheet material for chip protection. Background Art
[0002] Antistatic sheet, also known as antistatic sheet, is made by adding a certain conductive medium to ordinary blister raw material sheets, so that the sheets have a certain conductivity and do not generate static electricity. According to the amount of conductive medium added and the actual measured surface resistance of the product, sheet products with a surface resistance value of 10 to the 9th power to 10 to the 11th power ohms are generally called antistatic sheets, also known as antistatic sheets.
[0003] However, when the existing antistatic sheet for chip protection is used, the chip is usually protected and transported by the antistatic sheet. However, the antistatic sheet only has an antistatic coating on the surface of the sheet body. As the sheet body is used, the antistatic layer on the surface of the sheet body will be damaged, and the antistatic performance of the sheet body will decrease. Static electricity will be generated on the sheet body, causing damage to the internal circuit of the chip, causing the chip to fail to work normally or even be damaged. Therefore, an antistatic sheet for chip protection is provided. Utility Model Content
[0004] The main purpose of the utility model is to provide an antistatic sheet for chip protection. The utility model solves the problem that the antistatic performance of the existing antistatic sheet for chip protection is poor when in use, making it inconvenient to protect the chip, by arranging an antistatic layer A, a sheet base layer, an antistatic layer B, an antistatic layer C and an antistatic layer D.
[0005] The technical solution adopted by the utility model to solve its technical problems is an antistatic sheet for chip protection, comprising a sheet body and a sheet base layer, the sheet body surface is sprayed with a wear-resistant layer for improving the wear resistance of the sheet body, the wear-resistant layer surface is sprayed with an antistatic layer D for improving the antistatic performance of the sheet body, the sheet body comprises an antistatic layer A, an antistatic layer B, an antistatic layer C, a pressure-resistant component and a sheet base layer, one side of the sheet base layer is provided with a pressure-resistant component for improving the pressure resistance of the sheet body, one side of the pressure-resistant component is bonded with the antistatic layer C for improving the antistatic performance of the sheet body, the outer side of the antistatic layer C is bonded with the antistatic layer B for enhancing the antistatic performance of the sheet body, and one side of the antistatic layer B is provided with an antistatic layer A for protecting the chip.
[0006] By adopting the above technical solution, when the chip is placed in the sheet body, the antistatic layer A in the sheet body is made of short-cut conductive fibers, which can make the static electricity on the sheet body leak and disperse faster, and can prevent the local accumulation of static electricity. The antistatic layer B of the antistatic layer A is filled with conductive mica powder, and the flaky structure of the conductive mica powder is conducive to forming a conductive network in the sheet body. The antistatic layer C of the antistatic layer B is made of antistatic fibers, which effectively prevent the accumulation of static electricity inside the sheet body. At the same time, the antistatic layer D is sprayed with an antistatic agent on the outside of the sheet body to prevent the formation and accumulation of static electricity on the surface of the sheet body, thereby improving the antistatic performance of the sheet body and facilitating the protection of the chip.
[0007] Specifically, the pressure-resistant component includes a reinforcement layer A and a reinforcement layer B. The reinforcement layer B for chip protection is glued to one side of the sheet body, and the reinforcement layer A for improving the strength of the sheet body is glued to the outer side of the reinforcement layer B.
[0008] By adopting the above technical solution, when the sheet body protects and transports the chip, the reinforcing layer A in the pressure-resistant component is made of carbon fiber, which has excellent mechanical properties and chemical stability, and has the characteristics of hard texture and light weight. At the same time, the reinforcing layer B on one side of the reinforcing layer A is made of glass fiber. The tight and orderly structure of the glass fiber makes the glass fiber have high strength and rigidity, thereby improving the strength of the sheet body, thereby facilitating the protection of the chip.
[0009] Specifically, the wear-resistant layer is made by spraying polyurethane resin.
[0010] By adopting the above technical solution, the wear-resistant layer sprayed on the surface of the sheet body is made of polyurethane resin, which makes the surface of the sheet body smooth and reduces friction, thereby improving the wear resistance of the sheet body.
[0011] Specifically, the antistatic layer D is made by spraying an antistatic agent.
[0012] By adopting the above technical solution, the antistatic layer D outside the wear-resistant layer is sprayed with an antistatic agent, which forms a water film on the surface of the sheet body through adsorption to prevent the formation and accumulation of static electricity, thereby improving the antistatic performance of the sheet body.
[0013] Specifically, the reinforcement layer A is made of carbon fiber, and the reinforcement layer B is made of glass fiber.
[0014] By adopting the above technical solution, the carbon fiber of the reinforcing layer A made of carbon fiber has excellent mechanical properties and chemical stability, and has the characteristics of hard texture and light weight. At the same time, the compact and orderly structure of the glass fiber in the reinforcing layer B made of glass fiber makes the glass fiber have high strength and rigidity, thereby improving the strength of the sheet body.
[0015] Beneficial effects of the utility model:
[0016] (1) The utility model discloses an antistatic sheet material for chip protection. When a chip is placed in the sheet body, the antistatic layer A in the sheet body is made of short-cut conductive fibers. The short-cut conductive fibers enable the static electricity on the sheet body to leak and disperse faster, thereby preventing the local accumulation of static electricity. The antistatic layer B of the antistatic layer A is filled with conductive mica powder. The flaky structure of the conductive mica powder is conducive to forming a conductive network in the sheet body. The antistatic layer C of the antistatic layer B is made of antistatic fibers. The antistatic fibers effectively prevent the accumulation of static electricity inside the sheet body. At the same time, the antistatic layer D is sprayed with an antistatic agent on the outside of the sheet body to prevent the formation and accumulation of static electricity on the surface of the sheet body, thereby improving the antistatic performance of the sheet body and facilitating the protection of the chip.
[0017] (2) The utility model discloses an antistatic sheet material for chip protection. When the sheet material body is used to protect and transport the chip, the reinforcing layer A in the pressure-resistant component is made of carbon fiber. The carbon fiber has excellent mechanical properties and chemical stability, and is hard and light in weight. At the same time, the reinforcing layer B on one side of the reinforcing layer A is made of glass fiber. The compact and orderly structure of the glass fiber makes the glass fiber have high strength and rigidity, thereby improving the strength of the sheet material body and facilitating the protection of the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The utility model is further described below in conjunction with the accompanying drawings and embodiments.
[0019] Figure 1 This is a schematic diagram of the overall structure of an antistatic sheet for chip protection according to the utility model;
[0020] Figure 2 This is a schematic cross-sectional structure diagram of an antistatic sheet for chip protection according to the utility model;
[0021] Figure 3 This is a schematic diagram of the structure of a compression-resistant component of an antistatic sheet for chip protection according to the utility model;
[0022] In the figure: 1. Sheet body; 2. Wear-resistant layer; 3. Antistatic layer A; 4. Antistatic layer B; 5. Antistatic layer C; 6. Sheet base layer; 7. Compression-resistant component; 8. Reinforcement layer A; 9. Reinforcement layer B; 10. Antistatic layer D. DETAILED DESCRIPTION
[0023] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.
[0024] In order to improve the antistatic performance of the sheet body 1, as an embodiment of the utility model, Figure 1 , Figure 2 and Figure 3 As shown, the utility model discloses an antistatic sheet for chip protection, comprising a sheet body 1 and a sheet base layer 6, wherein the surface of the sheet body 1 is sprayed with a wear-resistant layer 2 for improving the wear resistance of the sheet body 1, the surface of the wear-resistant layer 2 is sprayed with an antistatic layer D10 for improving the antistatic performance of the sheet body 1, the sheet body 1 internally comprises an antistatic layer A3, an antistatic layer B4, an antistatic layer C5, an anti-pressure component 7 and a sheet base layer 6, one side of the sheet base layer 6 is provided with an anti-pressure component 7 for improving the anti-pressure performance of the sheet body 1, one side of the anti-pressure component 7 is bonded with the anti-static layer C5 for improving the anti-static performance of the sheet body 1, the outer side of the anti-static layer C5 is bonded with an anti-static layer B4 for enhancing the anti-static performance of the sheet body 1, and one side of the anti-static layer B4 is provided with an anti-static layer A3 for protecting the chip.
[0025] During use, when the chip is placed in the sheet body 1, the antistatic layer A3 in the sheet body 1 is made of short-cut conductive fibers. The short-cut conductive fibers enable the static electricity on the sheet body 1 to leak and disperse faster, and can prevent the local accumulation of static electricity. The antistatic layer B4 of the antistatic layer A3 is filled with conductive mica powder. The flaky structure of the conductive mica powder is conducive to forming a conductive network in the sheet body 1. The antistatic layer C5 of the antistatic layer B4 is made of antistatic fibers. The antistatic fibers effectively prevent the accumulation of static electricity inside the sheet body 1. At the same time, the antistatic layer D10 is sprayed with an antistatic agent on the outside of the sheet body 1 to prevent the formation and accumulation of static electricity on the surface of the sheet body 1, thereby improving the antistatic performance of the sheet body 1 and facilitating the protection of the chip.
[0026] In order to improve the strength of the sheet body 1, for example, Figure 2 and Figure 3 As shown, the utility model also includes that the pressure-resistant component 7 includes a reinforcing layer A8 and a reinforcing layer B9, a reinforcing layer B9 for chip protection is glued to one side of the sheet body 1, and a reinforcing layer A8 for increasing the strength of the sheet body 1 is glued to the outer side of the reinforcing layer B9.
[0027] When in use, when the sheet body 1 is used to protect and transport the chip, the reinforcing layer A8 in the pressure-resistant component 7 is made of carbon fiber, which has excellent mechanical properties and chemical stability, and has the characteristics of hard texture and light weight. At the same time, the reinforcing layer B9 on one side of the reinforcing layer A8 is made of glass fiber. The tight and orderly structure of the glass fiber makes the glass fiber have high strength and rigidity, thereby improving the strength of the sheet body 1, thereby facilitating the protection of the chip.
[0028] In order to improve the wear resistance of the sheet body 1, for example, Figure 1 As shown, the utility model also includes that the wear-resistant layer 2 is made by spraying polyurethane resin.
[0029] When in use, the wear-resistant layer 2 sprayed on the surface of the sheet body 1 is made of polyurethane resin, which makes the surface of the sheet body 1 smooth and reduces friction, thereby improving the wear resistance of the sheet body 1.
[0030] In order to improve the antistatic performance of the sheet body 1, for example, Figure 1 As shown, the utility model also includes that the antistatic layer D10 is made by spraying an antistatic agent.
[0031] When in use, the antistatic layer D10 outside the wear-resistant layer 2 is sprayed with an antistatic agent, which forms a water film on the surface of the sheet body 1 through adsorption to prevent the formation and accumulation of static electricity, thereby improving the antistatic performance of the sheet body 1.
[0032] In order to improve the strength of the sheet body 1, for example, Figure 3 As shown, the utility model also includes that the reinforcement layer A8 is made of carbon fiber, and the reinforcement layer B9 is made of glass fiber.
[0033] When in use, the carbon fiber of the reinforcing layer A8 made of carbon fiber has excellent mechanical properties and chemical stability, and has the characteristics of hard texture and light weight. At the same time, the tight and ordered structure of the glass fiber in the reinforcing layer B9 made of glass fiber makes the glass fiber have high strength and rigidity, thereby improving the strength of the sheet body 1.
[0034] When the utility model is in use, when the chip is placed in the sheet body 1, the antistatic layer A3 in the sheet body 1 is made of short-cut conductive fibers, which can make the static electricity on the sheet body 1 leak and disperse faster, and can prevent the local accumulation of static electricity. The antistatic layer B4 of the antistatic layer A3 is filled with conductive mica powder, and the flaky structure of the conductive mica powder is conducive to forming a conductive network in the sheet body 1. The antistatic layer C5 of the antistatic layer B4 is made of antistatic fibers, which effectively prevent the accumulation of static electricity inside the sheet body 1. At the same time, the antistatic layer D10 is sprayed with an antistatic agent on the outside of the sheet body 1 to prevent the formation and accumulation of static electricity on the surface of the sheet body 1, thereby improving the antistatic performance of the sheet body 1 and facilitating the protection of the chip.
[0035] When the sheet body 1 is used to protect and transport the chip, the reinforcing layer A8 in the pressure-resistant component 7 is made of carbon fiber, which has excellent mechanical properties and chemical stability, and is hard and light in weight. At the same time, the reinforcing layer B9 on one side of the reinforcing layer A8 is made of glass fiber, and the tight and orderly structure of the glass fiber makes the glass fiber have high strength and rigidity, thereby improving the strength of the sheet body 1, thereby facilitating the protection of the chip.
[0036] The wear-resistant layer 2 sprayed on the surface of the sheet body 1 is made of polyurethane resin, which makes the surface of the sheet body 1 smooth and reduces friction, thereby improving the wear resistance of the sheet body 1;
[0037] The antistatic layer D10 outside the wear-resistant layer 2 is sprayed with an antistatic agent, which forms a water film on the surface of the sheet body 1 through adsorption to prevent the formation and accumulation of static electricity, thereby improving the antistatic performance of the sheet body 1;
[0038] The carbon fiber of the reinforcing layer A8 made of carbon fiber has excellent mechanical properties and chemical stability, and has the characteristics of hard texture and light weight. At the same time, the compact and orderly structure of the glass fiber in the reinforcing layer B9 made of glass fiber makes the glass fiber have high strength and rigidity, thereby improving the strength of the sheet body 1.
[0039] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions in the specification are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the protection required by the utility model. The scope of protection required by the utility model is defined by the attached claims and their equivalents.
Claims
1. An antistatic sheet for chip protection, characterized in that: The invention comprises a sheet body (1) and a sheet base layer (6), wherein the surface of the sheet body (1) is sprayed with a wear-resistant layer (2) for improving the wear resistance of the sheet body (1), and the surface of the wear-resistant layer (2) is sprayed with an antistatic layer D (10) for improving the antistatic performance of the sheet body (1), and the sheet body (1) comprises an antistatic layer A (3), an antistatic layer B (4), an antistatic layer C (5), an anti-pressure component (7) and a sheet base layer (6), one side of the sheet base layer (6) is provided with an anti-pressure component (7) for improving the anti-pressure performance of the sheet body (1), one side of the anti-pressure component (7) is bonded with an anti-static layer C (5) for improving the anti-static performance of the sheet body (1), the outer side of the anti-static layer C (5) is bonded with an anti-static layer B (4) for enhancing the anti-static performance of the sheet body (1), and one side of the anti-static layer B (4) is provided with an anti-static layer A (3) for protecting a chip.
2. The antistatic sheet for chip protection according to claim 1, characterized in that: The pressure-resistant component (7) comprises a reinforcing layer A (8) and a reinforcing layer B (9); a reinforcing layer B (9) for chip protection is glued to one side of the sheet body (1); and a reinforcing layer A (8) for increasing the strength of the sheet body (1) is glued to the outer side of the reinforcing layer B (9).
3. The antistatic sheet for chip protection according to claim 1, characterized in that: The wear-resistant layer (2) is made by spraying polyurethane resin.
4. The antistatic sheet for chip protection according to claim 1, characterized in that: The antistatic layer D (10) is made by spraying an antistatic agent.
5. The antistatic sheet for chip protection according to claim 2, characterized in that: The reinforcement layer A (8) is made of carbon fiber, and the reinforcement layer B (9) is made of glass fiber.