Electroplating bath for semiconductor wafer

Abstract

The utility model relates to the technical field of wafer electroplating equipment, and discloses an electroplating bath for a semiconductor wafer, which comprises a bath body, a spraying mechanism and a backflow mechanism, a containing groove is formed in the upper surface of the groove body, and the containing groove is used for storing electroplating liquid and containing a base material to be plated; the spraying mechanism is arranged on the tank body, and the spraying end of the spraying mechanism is used for continuously spraying electroplating liquid to the to-be-plated base material located in the containing tank; the backflow mechanism comprises a backflow pipe, the input end of the backflow pipe is arranged at the groove bottom of the containing groove, and the output end of the backflow pipe is connected with the input end of the spraying mechanism; the number of the backflow pipes is four, and the input ends of the four backflow pipes are arranged at the bottom of the containing groove in a rectangular array mode. According to the electroplating bath for the semiconductor wafer, the electroplating ion replacement efficiency is improved, and meanwhile, the electroplating liquid can be conveniently recycled and reused.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer electroplating equipment, in particular to an electroplating tank for semiconductor wafers. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to adhere a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhancing aesthetics.

[0003] In a general wafer electroplating process, the wafer is clamped in a wafer fixture, and a robotic arm moves the wafer fixture to a plating tank and suspends it there, where it is then placed in the plating solution for electroplating.

[0004] However, the efficiency of ion replacement in the static electroplating method is low, and it is inconvenient to recycle and reuse the electroplating solution. Utility Model Content

[0005] The utility model aims to provide an electroplating tank for semiconductor wafers, which improves the efficiency of electroplating ion replacement and facilitates the recycling of electroplating liquid.

[0006] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0007] Design a semiconductor wafer electroplating tank, including a tank body, a spray mechanism and a reflow mechanism;

[0008] The upper surface of the tank body is provided with a receiving groove, and the receiving groove is used to store the electroplating solution and to receive the substrate to be plated;

[0009] The spray mechanism is arranged on the tank body, and the spray end of the spray mechanism is used to continuously spray the plating liquid to the substrate to be plated in the containing tank;

[0010] The reflux mechanism comprises a reflux pipe, the input end of the reflux pipe is arranged at the bottom of the containing tank, and the output end of the reflux pipe is connected to the input end of the spray mechanism;

[0011] There are four reflux pipes, and the input ends of the four reflux pipes are arranged in a rectangular array at the bottom of the containing tank.

[0012] Optionally, the reflux mechanism also includes a main pipeline, a reflux pump and a replenishing shell. The reflux pipe is arranged in a spiral shape in the tank body. The output end of the reflux pipe is connected to the main pipeline, the output end of the main pipeline is connected to the input end of the reflux pump, the output end of the reflux pump is connected to the input end of the replenishing shell, the output end of the replenishing shell is connected to the input end of the spray mechanism, and the replenishing shell is used to store and replace the replenishing ions of the plating solution.

[0013] Optionally, it also includes a suspension mechanism, which is arranged in the receiving tank and is used to accommodate, suspend and fix the substrate to be plated. The spray mechanism includes a vibrating member and a spraying member. The spraying member is arranged in the receiving tank, and the vibrating member is arranged on the tank body. The vibrating member is at least partially located in the receiving tank, and the portion of the vibrating member located in the receiving tank is fixedly connected to the spraying member.

[0014] Optionally, the spray component includes a diverter plate, a liquid inlet pipe and a plurality of nozzles, the number of the diverter plates is two, the two diverter plates are respectively arranged on both sides of the suspension mechanism, the two diverter plates are interconnected through a connecting pipe, and the plurality of nozzles are respectively arranged on opposite surfaces of the two diverter plates, one of the diverter plates is connected to the output end of the liquid inlet pipe, and the input end of the liquid inlet pipe is connected to the output end of the replenishing shell.

[0015] Optionally, the vibration member includes a driving motor, a turntable, a rocking arm and a connecting member, the driving motor is arranged on the slot body, the turntable is fixedly installed on the output end of the driving motor, one end of the rocking arm is rotatably connected to the surface of the turntable away from the driving motor, and is eccentrically arranged, the other end of the rocking arm is hinged to the connecting member, the connecting member is at least partially located in the accommodating slot, and the part of the connecting member located in the accommodating slot is fixedly connected to the diverter plate.

[0016] Optionally, the connecting member includes a connecting plate, a mounting rod and a fixing seat, the other end of the rocking rod is hinged to the connecting plate, the surface of the connecting plate facing the accommodating groove is fixedly connected to the mounting rod, the number of the mounting rods and the diverter plates corresponds to each other, and the mounting rod is located on the surface of the accommodating groove and is fixedly connected to the diverter plate through the fixing seat.

[0017] Optionally, an electrode plate is also provided in the containing tank.

[0018] The utility model provides a semiconductor wafer electroplating tank, which has the following beneficial effects:

[0019] The electroplating tank of the semiconductor wafer can make the coating uniform and improve the efficiency of ion replacement by continuously spraying the electroplating liquid on the substrate. The distribution of the four reflux tube matrix arrays can make the liquid flow out evenly through the four reflux tubes, reduce the vortex formed by the liquid outflow from a single pipe that affects the liquid outflow, and also reduce the influence of the formed vortex on the stability of ion replacement, increase the amount of replenishing liquid entering the holding tank and the amount of liquid out of the holding tank, avoid pollution caused by overflow of the electroplating liquid, and ensure the quality of ion replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the electroplating tank for semiconductor wafers in the utility model;

[0021] Figure 2 It is a top view of the three-dimensional structure of the electroplating tank for semiconductor wafers in the utility model.

[0022] In the figure: 1. tank body; 2. containing tank; 3. reflux pipe; 4. main pipeline; 5. reflux pump; 6. replenishing shell; 7. diverter plate; 9. nozzle; 10. turntable; 11. connecting plate; 12. mounting rod; 13. fixing seat; 14. electrode plate. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. All other embodiments obtained by ordinary technicians in the field without creative work based on the embodiments of the utility model shall fall within the scope of protection of the utility model.

[0024] See also Figure 1 to Figure 2 , the utility model provides a technical solution: a semiconductor wafer electroplating tank, including a tank body 1, a spray mechanism and a reflow mechanism;

[0025] The upper surface of the tank body 1 is provided with a receiving tank 2, and the receiving tank 2 is used to store the electroplating solution and to receive the substrate to be plated;

[0026] The spray mechanism is arranged on the tank body 1, and the spray end of the spray mechanism is used to continuously spray the plating liquid to the substrate to be plated located in the containing tank 2;

[0027] The reflux mechanism includes a reflux pipe 3, the input end of the reflux pipe 3 is arranged at the bottom of the containing tank 2, and the output end of the reflux pipe 3 is connected to the input end of the spray mechanism;

[0028] There are four return pipes 3, and the input ends of the four return pipes 3 are arranged in a rectangular array at the bottom of the receiving tank 2;

[0029] By setting the spray mechanism, continuous spraying of the substrate to be plated can improve the efficiency of ion replacement, and the position and number of the reflux pipe 3 can increase the amount of liquid discharged from the receiving tank 2, and the inner bottom wall set at the four corners of the receiving tank 2 can avoid affecting the liquid sprayed with the electroplating liquid in the central part of the receiving tank 2. After the liquid sprayed with the electroplating liquid impacts the surface of the substrate to be plated, it is diverted and flows to the two sides of the substrate to be plated and then flows to the four corners of the receiving tank 2, and then discharged through the reflux pipe 3. After replacing the supplementary ions in the supplementary shell 6, it enters the diverter plate 7 for spraying, which can improve the utilization rate of the electroplating solution, save costs, and also improve the replacement quality of the substrate to be plated.

[0030] The reflux mechanism also includes a main pipeline 4, a reflux pump 5 and a replenishing shell 6. The reflux pipe 3 is arranged in a spiral shape in the tank body 1. The output end of the reflux pipe 3 is connected to the main pipeline 4, the output end of the main pipeline 4 is connected to the input end of the reflux pump 5, the output end of the reflux pump 5 is connected to the input end of the replenishing shell 6, the output end of the replenishing shell 6 is connected to the input end of the spray mechanism, and the replenishing shell 6 is used to store and replace the replenishing ions of the plating solution.

[0031] It also includes a suspension mechanism, which is arranged in the receiving tank 2 and is used to hold, suspend and fix the substrate to be plated. The spray mechanism includes a vibrating member and a spraying member, the spraying member is arranged in the receiving tank 2, the vibrating member is arranged on the tank body 1, and the vibrating member is at least partially located in the receiving tank 2. The portion of the vibrating member located in the receiving tank 2 is fixedly connected to the spraying member.

[0032] Through the connection between the vibration element and the spray element, the vibration element can drive the spray element to move back and forth, generating a certain vibration frequency, the purpose of which is to improve the efficiency of replacing ions.

[0033] The spraying part includes a diverter plate 7, a liquid inlet pipe and a plurality of nozzles 9. There are two diverter plates 7, which are respectively arranged on both sides of the suspension mechanism. The two diverter plates 7 are connected to each other through a connecting pipe. The plurality of nozzles 9 are respectively arranged on the opposite surfaces of the two diverter plates 7. One of the diverter plates 7 is connected to the output end of the liquid inlet pipe, and the input end of the liquid inlet pipe is connected to the output end of the replenishment shell 6.

[0034] Through the action of the diverter plate 7, the liquid transported to the diverter plate 7 through the liquid inlet pipe can be distributed on the diverter plate 7. Through the connection between the diverter plate 7 and the nozzle 9, the liquid in the diverter plate 7 is sprayed out through the nozzle 9. Through the action of the nozzle 9, which is a conventional technical means, the liquid is sprayed on the surface of the substrate to be plated.

[0035] The vibrating member includes a driving motor, a rotating disk 10, a rocking arm and a connecting member. The driving motor is arranged on the tank body 1. The rotating disk 10 is fixedly installed at the output end of the driving motor. One end of the rocking arm is rotatably connected to the surface of the rotating disk 10 away from the driving motor and is eccentrically arranged. The other end of the rocking arm is hinged to the connecting member. The connecting member is at least partially located in the receiving tank 2. The part of the connecting member located in the receiving tank 2 is fixedly connected to the diverter plate 7.

[0036] Through the connection between the driving motor and the turntable 10, the driving motor can drive the turntable 10 to rotate. Through the connection between the rocking arm and the turntable 10, one end of the rocking arm swings back and forth with the rotation of the turntable 10, and the other end of the rocking arm is hinged with the connecting piece. The other end of the rocking arm rotates on the connecting piece and drives the connecting piece to reciprocate, thereby forming vibration through reciprocating movement of a stable frequency.

[0037] The connecting member includes a connecting plate 11, a mounting rod 12 and a fixing seat 13. The other end of the rocking rod is hinged to the connecting plate 11. The surface of the connecting plate 11 facing the receiving groove 2 is fixedly connected to the mounting rod 12. The number of the mounting rods 12 and the diverter plate 7 corresponds to each other. The mounting rod 12 is located on the surface of the receiving groove 2 and is fixedly connected to the diverter plate 7 through the fixing seat 13.

[0038] The slide rail provided on the trough body 1 is slidably connected to the connecting plate 11, which limits the moving direction of the connecting plate 11. Through the connection between the rocking arm and the connecting plate 11 (not shown in the figure), one end of the rocking arm rotates on the connecting plate 11, and drives the connecting plate 11 to reciprocate along the length direction of the slide rail. Through the connection between the connecting plate 11 and the mounting rod 12, the connecting plate 11 drives the mounting rod 12 to reciprocate. Through the connection between the mounting rod 12 and the fixed seat 13, the mounting rod 12 can drive the diverter plate 7 to reciprocate through the fixed seat 13.

[0039] An electrode plate 14 is also provided in the receiving tank 2. The electrode plate 14 is a well-known technology and is used in the conventional technical field of electroplating, and will not be described in detail here.

[0040] The electrical components mentioned in this article are all connected to an external main controller and 220V mains electricity, and the main controller can be a conventional known device for controlling a computer or the like.

[0041] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer electroplating tank, characterized in that: It comprises a tank body (1), a spray mechanism and a reflux mechanism; The upper surface of the tank body (1) is provided with a receiving tank (2), and the receiving tank (2) is used to store the electroplating solution and to receive the substrate to be plated; The spray mechanism is arranged on the tank body (1), and the spray end of the spray mechanism is used to continuously spray the electroplating liquid on the substrate to be plated located in the containing tank (2); The reflux mechanism comprises a reflux pipe (3), the input end of the reflux pipe (3) is arranged at the bottom of the containing tank (2), and the output end of the reflux pipe (3) is connected to the input end of the spray mechanism; There are four reflux pipes (3), and the input ends of the four reflux pipes (3) are arranged in a rectangular array at the bottom of the containing tank (2).

2. The electroplating tank for semiconductor wafers according to claim 1, characterized in that: The reflux mechanism further comprises a main pipeline (4), a reflux pump (5) and a replenishing shell (6); the reflux pipe (3) is arranged in a spiral shape in the tank body (1); the output end of the reflux pipe (3) is connected to the main pipeline (4); the output end of the main pipeline (4) is connected to the input end of the reflux pump (5); the output end of the reflux pump (5) is connected to the input end of the replenishing shell (6); the output end of the replenishing shell (6) is connected to the input end of the spray mechanism; the replenishing shell (6) is used to store and replace the replenishing ions of the electroplating solution.

3. The electroplating tank for semiconductor wafers according to claim 1, characterized in that: It also comprises a suspension mechanism, which is arranged in the receiving groove (2) and is used to receive, suspend and fix the substrate to be plated; the spray mechanism comprises a vibrating member and a spraying member, the spraying member is arranged in the receiving groove (2), the vibrating member is arranged on the groove body (1), the vibrating member is at least partially located in the receiving groove (2), and the portion of the vibrating member located in the receiving groove (2) is fixedly connected to the spraying member.

4. The electroplating tank for semiconductor wafers according to claim 3, characterized in that: The spraying member comprises a diverter plate (7), a liquid inlet pipe and a plurality of nozzles (9), the number of the diverter plates (7) is two, the two diverter plates (7) are respectively arranged on both sides of the suspension mechanism, the two diverter plates (7) are connected to each other through a connecting pipe, the plurality of nozzles (9) are respectively arranged on opposite surfaces of the two diverter plates (7), one of the diverter plates (7) is connected to the output end of the liquid inlet pipe, and the input end of the liquid inlet pipe is connected to the output end of the replenishing shell (6).

5. The electroplating tank for semiconductor wafers according to claim 4, characterized in that: The vibration member comprises a driving motor, a rotating disk (10), a rocking arm and a connecting member, wherein the driving motor is arranged on the slot body (1), the rotating disk (10) is fixedly mounted on the output end of the driving motor, one end of the rocking arm is rotatably connected to a surface of the rotating disk (10) away from the driving motor and is eccentrically arranged, and the other end of the rocking arm is hinged to the connecting member, the connecting member is at least partially located in the receiving slot (2), and the portion of the connecting member located in the receiving slot (2) is fixedly connected to the diverter plate (7).

6. The electroplating tank for semiconductor wafers according to claim 5, characterized in that: The connecting member comprises a connecting plate (11), a mounting rod (12) and a fixing seat (13); the other end of the rocking rod is hinged to the connecting plate (11); the surface of the connecting plate (11) facing the receiving groove (2) is fixedly connected to the mounting rod (12); the number of the mounting rods (12) and the diverter plate (7) corresponds to each other; the mounting rod (12) is located on the surface of the receiving groove (2) and is fixedly connected to the diverter plate (7) via the fixing seat (13).

7. The electroplating tank for semiconductor wafers according to claim 1, characterized in that: An electrode plate (14) is also provided in the containing tank (2).

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