Auxiliary device for bonding ceramic plate and substrate of electrostatic chuck

Abstract

The utility model discloses an auxiliary device for bonding a ceramic plate and a substrate of an electrostatic chuck, which belongs to the technical field of electrostatic chucks and comprises a supporting substrate for placing the ceramic plate of the electrostatic chuck, and the supporting substrate is provided with a first supporting assembly and a second supporting assembly which are used for supporting the substrate of the electrostatic chuck. The electrostatic chuck ceramic plate is provided with a glue layer used for bonding an electrostatic chuck substrate, the first supporting assembly is arranged on one side of the electrostatic chuck ceramic plate, the second supporting assembly is arranged on the other side of the electrostatic chuck ceramic plate, the first supporting assembly comprises a first adsorption assembly used for adsorbing the electrostatic chuck substrate, and the second supporting assembly comprises a second adsorption assembly used for adsorbing the electrostatic chuck substrate. The first adsorption assembly is rotationally connected with the supporting rod and comprises a first suction cup, a first movable supporting rod is arranged at the bottom of the first suction cup and connected with the supporting rod, a positioning rod is further arranged at the bottom of the first suction cup, a positioning mark is arranged on the supporting rod, and the positioning rod and the first movable supporting rod are arranged in parallel.

Description

Technical Field

[0001] The utility model relates to the technical field of electrostatic chucks, in particular to an auxiliary device for bonding a ceramic plate and a substrate of an electrostatic chuck. Background Art

[0002] When the electrostatic chuck ceramic plate is bonded to the electrostatic chuck substrate, if the electrostatic chuck ceramic plate is directly bonded to the electrostatic chuck substrate, bubbles are easily generated between the electrostatic chuck ceramic plate and the electrostatic chuck substrate, which will affect the connection between the electrostatic chuck substrate and the electrostatic chuck ceramic plate. In order to reduce the generation of bubbles as much as possible, the utility model designs an auxiliary device for bonding the electrostatic chuck ceramic plate and the substrate. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide an auxiliary device for bonding an electrostatic chuck ceramic plate and a substrate, which can reduce bubbles generated when the electrostatic chuck ceramic plate and the electrostatic chuck substrate are bonded.

[0004] In order to solve the above technical problems, the technical solution of the utility model is:

[0005] The electrostatic chuck ceramic plate and substrate bonding auxiliary device comprises a supporting substrate for placing the electrostatic chuck ceramic plate, the supporting substrate being provided with a first supporting assembly and a second supporting assembly for supporting the electrostatic chuck substrate, the electrostatic chuck ceramic plate being provided with a glue layer for bonding the electrostatic chuck substrate, the first supporting assembly being arranged on one side of the electrostatic chuck ceramic plate, the second supporting assembly being arranged on the other side of the electrostatic chuck ceramic plate, the first supporting assembly comprising a first adsorption assembly for adsorbing the electrostatic chuck substrate, the first adsorption assembly being rotatably connected to the support rod, the first adsorption assembly comprising a first suction cup, a first movable support rod being arranged at the bottom of the first suction cup, the first movable support rod being connected to the support rod, a positioning rod being further arranged at the bottom of the first suction cup, a positioning mark being arranged on the support rod, the positioning rod being arranged parallel to the first movable support rod, and when the electrostatic chuck substrate is adjusted to be horizontal, the positioning rod is aligned with the positioning mark.

[0006] Preferably, the support rod and the support base plate are connected via a first telescopic rod.

[0007] Preferably, the second supporting assembly includes a second suction cup for adsorbing the electrostatic chuck substrate, a second movable supporting rod is provided at the bottom of the second suction cup, the second movable supporting rod is connected to the supporting substrate via a second telescopic rod, and the second movable supporting rod is movably connected to the second telescopic rod.

[0008] Preferably, when the electrostatic chuck substrate is adjusted to a horizontal position, the first suction cup and the second suction cup are symmetrical about the electric chuck ceramic plate.

[0009] The above technical solution has the following beneficial effects:

[0010] By setting the first supporting assembly and the second supporting assembly, when in use, one side of the electrostatic chuck substrate contacts the glue layer first, and the other side slowly approaches the glue layer, so as to avoid the electrostatic chuck substrate directly bonding to generate a large number of bubbles, and reduce the generation of bubbles during bonding;

[0011] By providing the first suction cup and the second suction cup, one side of the electrostatic chuck substrate can be better contacted with the glue layer first, and the other side can be contacted with the glue layer slowly;

[0012] By setting the positioning rod and the positioning mark, the position requirement of the electrostatic chuck substrate and the electrostatic chuck ceramic plate after bonding is guaranteed, and the electrostatic chuck ceramic plate and the electrostatic chuck substrate can be kept parallel after bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a structural schematic diagram of an auxiliary device for bonding an electrostatic chuck ceramic plate and a substrate according to the utility model;

[0014] Figure 2 This is a schematic diagram of the enlarged structure of A in Tu 1. DETAILED DESCRIPTION

[0015] The specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these implementation methods is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each implementation method of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0016] refer to Figure 1 , Figure 2, including a supporting substrate 1 for placing an electrostatic chuck ceramic plate 2, a first supporting assembly and a second supporting assembly for supporting an electrostatic chuck substrate 4 are provided on the supporting substrate 1, a glue layer 3 for bonding the electrostatic chuck substrate 4 is provided on the electrostatic chuck ceramic plate 2, the first supporting assembly is arranged on one side of the electrostatic chuck ceramic plate 2, and the second supporting assembly is arranged on the other side of the electrostatic chuck ceramic plate 2, the first supporting assembly includes a first adsorption assembly for adsorbing the electrostatic chuck substrate 4, the first adsorption assembly is rotatably connected to a support rod 13, the first adsorption assembly includes a first suction cup 5, a first movable support rod 7 is provided at the bottom of the first suction cup 5, the first movable support rod 7 is connected to the support rod 13, a positioning rod 9 is also provided at the bottom of the first suction cup 5, a positioning mark 10 is provided on the support rod 13, the positioning rod 9 is arranged parallel to the first movable support rod 7, and when the electrostatic chuck substrate 4 is adjusted to a horizontal state, the positioning rod 9 is aligned with the positioning mark 10;

[0017] When in use, the first support assembly and the second support assembly support the edge of the electrostatic chuck substrate 4, and the electrostatic chuck substrate 4 is adsorbed by the first suction cup 5 and the second suction cup 6. The adsorption positions of the first suction cup 5 and the second suction cup 6 will not interfere with the electrostatic chuck ceramic plate 2. A glue layer 3 is applied to the electrostatic chuck ceramic plate 2. In the initial state, the electrostatic chuck substrate 4 is lower on one side of the first support assembly than on one side of the second support assembly. By controlling the first telescopic rod 8, the side of the electrostatic chuck substrate 4 close to the first support assembly is first in contact with the glue layer 3, and then the other side is slowly in contact with the glue layer 3. 3, until the electrostatic chuck substrate 4 is flat. This method of bonding solves the problem of bubbles generated between the electrostatic chuck substrate 4 and the glue layer in the prior art when the electrostatic chuck substrate 4 is directly bonded. When the electrostatic chuck substrate 4 is in the horizontal position, the positioning rod 9 rotates with the first suction cup 5 and finally aligns with the positioning mark 10. Through the positioning rod 9 and the positioning mark 10, it can be judged whether the electrostatic chuck substrate 4 is parallel. The positioning mark 10 can be a short rod with the same size as the positioning rod 9. When the two coincide, it can be judged that the electrostatic chuck substrate 4 is horizontal.

[0018] The support rod 13 is connected to the support substrate 1 through a first telescopic rod 8, which is convenient for telescoping and adjusting the position of the electrostatic chuck substrate 4;

[0019] The second support assembly includes a second suction cup 6 for adsorbing the electrostatic chuck substrate 4, a second movable support rod 11 is provided at the bottom of the second suction cup 6, the second movable support rod 11 is connected to the support substrate through a second telescopic rod 12, the second movable support rod 11 is movably connected to the second telescopic rod 12, and the second support assembly cooperates with the first support assembly to better adjust the position of the electrostatic chuck substrate 4, so that it is bonded to the glue layer, and finally completes the bonding with the electrostatic chuck ceramic plate;

[0020] When the electrostatic chuck substrate 4 is adjusted to a horizontal position, the first suction cup 5 and the second suction cup 6 are symmetrical with respect to the electric chuck ceramic plate 2. At this time, the electrostatic chuck substrate 4 is in its position, and the glue layer is dried to complete the bonding;

[0021] By setting the first supporting assembly and the second supporting assembly, when in use, one side of the electrostatic chuck substrate 4 contacts the glue layer first, and the other side slowly approaches the glue layer 3, so as to avoid the electrostatic chuck substrate 4 directly bonding to generate a large number of bubbles, and reduce the generation of bubbles during bonding;

[0022] By providing the first suction cup 5 and the second suction cup 6, it is possible to better allow one side of the electrostatic chuck substrate 4 to first contact with the glue layer 3, and then the other side to slowly contact with the glue layer 3;

[0023] By providing the positioning rod 9 and the positioning mark 10, the position requirement of the electrostatic chuck substrate 4 and the electrostatic chuck ceramic plate 2 after bonding is ensured, and the electrostatic chuck ceramic plate 2 and the electrostatic chuck substrate 4 can be kept parallel after bonding.

[0024] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.

Claims

1. An electrostatic chuck ceramic plate and substrate bonding auxiliary device, characterized in that: The invention comprises a support substrate (1) for placing an electrostatic chuck ceramic plate (2), the support substrate (1) being provided with a first support component and a second support component for supporting an electrostatic chuck substrate (4), the electrostatic chuck ceramic plate (2) being provided with a glue layer (3) for bonding the electrostatic chuck substrate (4), the first support component being arranged on one side of the electrostatic chuck ceramic plate (2), the second support component being arranged on the other side of the electrostatic chuck ceramic plate (2), the first support component comprising a first adsorption component for adsorbing the electrostatic chuck substrate (4), the The first adsorption component is rotatably connected to the support rod (13), and the first adsorption component includes a first suction cup (5). A first movable support rod (7) is provided at the bottom of the first suction cup (5), and the first movable support rod (7) is connected to the support rod (13). A positioning rod (9) is also provided at the bottom of the first suction cup (5), and a positioning mark (10) is provided on the support rod (13). The positioning rod (9) is arranged parallel to the first movable support rod (7), and when the electrostatic chuck substrate (4) is adjusted to be horizontal, the positioning rod (9) is aligned with the positioning mark (10).

2. The electrostatic chuck ceramic plate and substrate bonding auxiliary device according to claim 1, characterized in that: The support rod (13) is connected to the support base plate (1) via a first telescopic rod (8).

3. The electrostatic chuck ceramic plate and substrate bonding auxiliary device according to claim 1, characterized in that: The second support assembly comprises a second suction cup (6) for adsorbing the electrostatic chuck substrate (4); a second movable support rod (11) is provided at the bottom of the second suction cup (6); the second movable support rod (11) is connected to the support substrate via a second telescopic rod (12); and the second movable support rod (11) is movably connected to the second telescopic rod (12).

4. The electrostatic chuck ceramic plate and substrate bonding auxiliary device according to claim 3, characterized in that: When the electrostatic chuck base plate (4) is adjusted to a horizontal position, the first suction cup (5) and the second suction cup (6) are symmetrical with respect to the electric chuck ceramic plate (2).

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