Temperature sensing protection structure, temperature sampling module and flexible circuit board of power battery

Abstract

A flexible circuit board of a temperature sensing protection structure, a temperature sampling module and a power battery belongs to the technical field of an auxiliary structure of a temperature acquisition position in an FPC, and comprises a temperature sensor arranged at a sampling position on a circuit substrate, and a protection piece fixed with the circuit substrate and used for coating the temperature sensor in all directions is arranged at the sampling position. The utility model provides a structure for protecting a temperature sensor by bonding a protection piece on a circuit substrate to wrap the temperature sensor in all directions, and the structure is applied to a modularized temperature sampling circuit and a power battery flexible circuit board matched with the temperature sampling circuit module. And the power battery flexible circuit board is directly matched with the protection structure.

Description

Technical Field

[0001] The present application belongs to the technical field of auxiliary structures at temperature collection positions in FPC, and in particular relates to a temperature sensing protection structure, a temperature sampling module and a flexible circuit board of a power battery. Background Art

[0002] The traditional temperature collection structure on the automotive power battery is to embed a silicone thermal pad on the isolation plate, and the temperature sensor is set on the silicone thermal pad. The temperature sensor usually adopts an NTC thermistor. The NTC thermistor transfers heat through the silicone thermal pad to measure and collect the temperature of the battery cell on the power battery.

[0003] In general, if Figure 1 and Figure 2 In the conventional structure shown, an NTC thermistor is welded on one surface of the flexible circuit board connection pin, and the NTC thermistor is surrounded by a protective frame made of Fr-4 epoxy glass cloth laminate material, and the frame is attached to the flexible circuit board, and then thermosetting epoxy glue is filled in the frame and heated and cured to achieve protection of the NTC thermistor. The above temperature sampling structure is used on the FPC of cylindrical batteries or square batteries, and the general conventional structure is mainly used to prevent moisture from impacting the NTC thermistor.

[0004] In some special FPC structures, such as the FPC collection device on a power battery with the prior art publication number CN216529024U, a collection area is set on the isolation plate above the power battery and the side of the isolation plate close to the power battery. A temperature sensor is set in the collection area. The lower surface of the temperature sensor is in contact with the power battery, and a flexible circuit board is connected to the temperature sensor. There is a horizontal plate body in the collection area, and an insulating part is connected to the lower surface of the horizontal plate body. The insulating part and the horizontal plate body are bonded to each other with double-sided tape. In the structure of this FPC, the problem of sensitive response of NTC thermistor is mainly solved.

[0005] The manufacturing process of the above structure is complicated, including a glue dispensing process, and needs to be directly operated on a very long flexible circuit board. Once an error occurs, the entire flexible circuit board will be scrapped, and the cost is relatively high. Utility Model Content

[0006] The purpose of the utility model is to address the problems existing in the prior art and to provide a structure for protecting the temperature sensor by bonding a protective member to a circuit substrate to fully cover the temperature sensor. The structure is applied to a modular temperature sampling circuit, a power battery flexible circuit board that cooperates with the temperature sampling circuit module, and a power battery flexible circuit board that directly cooperates with the protective structure.

[0007] In order to achieve the above technical objectives, the following first technical solution is provided: a temperature sensing protection structure, including a temperature sensor arranged at a sampling position on a circuit substrate, and a protective member fixed to the circuit substrate and fully covering the temperature sensor is arranged at the sampling position.

[0008] In this technical solution, the protective member covers the entire temperature sensor, and it is only necessary to bond the protective member to the circuit substrate, eliminating the step of dispensing glue. Because the step of dispensing glue is omitted, the applicant eliminates the dispensing glue equipment and raw materials for dispensing glue in production, which greatly reduces the cost of the enterprise compared with the existing technology.

[0009] In an practicable manner, the protective member is in a regular geometric shape, and its projected area on the sampling position is less than or equal to the area of ​​the sampling position.

[0010] The regular geometric shape is convenient for manufacturing using existing production processes, and the projected area is less than or equal to the area of ​​the sampling position in order to facilitate the bonding of the protective part.

[0011] In an practicable manner, the thickness H of the protective member is less than 8 mm, and a groove is provided in the thickness direction thereof, wherein the temperature sensor is accommodated in the groove.

[0012] In an practicable manner, after the protective member and the circuit substrate are bonded together by thermosetting adhesive or pressure-sensitive adhesive, the groove and the circuit substrate form a receiving space; in the receiving space, there is a gap between the temperature sensor and the inner wall of the groove.

[0013] The existence of a gap between the temperature sensor and the accommodation space overcomes the problem in the prior art of the dispensing process that the colloid squeezes the temperature sensor during the cooling process, thereby causing the temperature sensor to be subjected to a contraction force and be easily damaged.

[0014] In an embodied manner, the temperature sensor is an NTC thermistor.

[0015] In a second aspect, a temperature sampling module comprises a sampling circuit unit, wherein one side of the sampling circuit unit comprises any one of the temperature sensing protection structures in the first technical solution.

[0016] In an implementable manner, a PI reinforcement plate is disposed on the other side of the sampling circuit unit.

[0017] The sampling circuit unit is made into a modular unit, which can be adapted to various types of circuit boards.

[0018] In this technical solution, the acquisition circuit can be made into a standardized component and can be applied to circuit boards of different power batteries.

[0019] In a third aspect, a flexible circuit board of a power battery is provided, on which any temperature sampling module in the second aspect is fixed. In this technical solution, the temperature sampling module is applied in the flexible circuit board.

[0020] Compared with the prior art, the utility model has the following beneficial effects:

[0021] The protective structure of the first technical solution of the present application is mainly aimed at the FPC temperature sampling module in the power and energy storage battery. In addition, the manufacturing process of this structure reduces the glue dispensing processing steps, achieving energy saving and cost reduction. Moreover, compared with the problem of extrusion force caused by the temperature sensor being cooled and contracted by the glue after dispensing in the traditional manufacturing process, the hollow setting between the accommodation space and the temperature sensor of this technical solution can prevent the temperature sensor from being subjected to extrusion force. The function of preventing moisture from impacting the NTC thermistor is also retained. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] 1 circuit board, 11 sampling position, 2 temperature sensor, 3 protection part, 4 groove, 5 PI reinforcement board

[0023] Figure 1 It is a schematic diagram of an explosion structure in general in the background technology;

[0024] Figure 2 It is a side view schematic diagram of a general clear picture in the background technology;

[0025] Figure 3 It is a schematic diagram of the explosion structure of Embodiment 1, Embodiment 2, Embodiment 3 and Embodiment 4;

[0026] Figure 4 It is a side view schematic diagram of Embodiment 1, Embodiment 2, Embodiment 3 and Embodiment 4;

[0027] Figure 5 It is a side view schematic diagram of Embodiment 5; DETAILED DESCRIPTION

[0028] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] like Figure 3 and Figure 4The first embodiment shown is a temperature sensing protection structure, comprising a temperature sensor 2 disposed at a sampling position 11 on a circuit substrate 1, and a protective member 3 fixed to the circuit substrate 1 and fully covering the temperature sensor 2 is disposed on the sampling position 11. In this embodiment, the temperature sensor 2 is an NTC thermistor.

[0030] In this embodiment, the protective member 3 is a FR-4 epoxy glass cloth laminate, which is finally formed into a regular geometric shape, and its projection area on the sampling position 11 is less than or equal to the area of ​​the sampling position 11. The thickness H of the protective member 3 is less than 8 mm, and the preferred height H is 2.2 mm.

[0031] A groove 4 is provided in the thickness direction thereof, and the temperature sensor 2 is accommodated in the groove 4. After the protective member 3 and the circuit substrate 1 are bonded by thermosetting adhesive, the groove 4 and the circuit substrate 1 form an accommodating space; in the accommodating space, there is a gap between the temperature sensor 2 and the inner wall of the groove 4. The preferred thermosetting adhesive is Sony D series D3450 glue for bonding.

[0032] like Figure 3 and Figure 4 The second embodiment shown is a temperature sensing protection structure, comprising a temperature sensor 2 disposed at a sampling position 11 on a circuit substrate 1, and a protective member 3 fixed to the circuit substrate 1 and fully covering the temperature sensor 2 is disposed on the sampling position 11. In this embodiment, the temperature sensor 2 is an NTC thermistor.

[0033] In this embodiment, the protective member 3 is a PPS injection molded part, and is finally molded into a regular geometric shape, and its projection area on the sampling position 11 is less than or equal to the area of ​​the sampling position 11. The thickness H of the protective member 3 is less than 8 mm, and the preferred height H is 2.2 mm.

[0034] A groove 4 is provided in the thickness direction thereof, and the temperature sensor 2 is accommodated in the groove 4. After the protective member 3 and the circuit substrate 1 are bonded by thermosetting adhesive, the groove 4 and the circuit substrate 1 form an accommodating space; in the accommodating space, there is a gap between the temperature sensor 2 and the inner wall of the groove 4. The preferred thermosetting adhesive is Sony D series D3450 glue for bonding.

[0035] The above-mentioned embodiments 1 and 2 use thermosetting adhesive, so the bonding process of the protective component 3 and the circuit substrate 1 in the above-mentioned embodiments 1 and 2 is: the first step is bonding, which is placed by a hot plate false bonding method; the second step is pressing, which is hot pressing using a point press machine; the third step is aging, which is placed at a temperature of 160°C for 1 hour.

[0036] like Figure 3 and Figure 4The third embodiment shown is a temperature sensing protection structure, comprising a temperature sensor 2 disposed at a sampling position 11 on a circuit substrate 1, and a protective member 3 fixed to the circuit substrate 1 and fully covering the temperature sensor 2 is disposed on the sampling position 11. In this embodiment, the temperature sensor 2 is an NTC thermistor.

[0037] In this embodiment, the protective member 3 is a FR-4 epoxy glass cloth laminate, which is finally formed into a regular geometric shape, and its projection area on the sampling position 11 is less than or equal to the area of ​​the sampling position 11. The thickness H of the protective member 3 is less than 8 mm, and the preferred height H is 2.2 mm.

[0038] A groove 4 is provided in the thickness direction thereof, and the temperature sensor 2 is accommodated in the groove 4. After the protective member 3 and the circuit substrate 1 are bonded with pressure-sensitive adhesive, the groove 4 and the circuit substrate 1 form an accommodating space; in the accommodating space, there is a gap between the temperature sensor 2 and the inner wall of the groove 4.

[0039] like Figure 3 and Figure 4 The fourth embodiment shown is a temperature sensing protection structure, comprising a temperature sensor 2 disposed at a sampling position 11 on a circuit substrate 1, and a protective member 3 fixed to the circuit substrate 1 and fully covering the temperature sensor 2 is disposed on the sampling position 11. In this embodiment, the temperature sensor 2 is an NTC thermistor.

[0040] In this embodiment, the protective member 3 is a PPS injection molded part, and is finally molded into a regular geometric shape, and its projection area on the sampling position 11 is less than or equal to the area of ​​the sampling position 11. The thickness H of the protective member 3 is less than 8 mm, and the preferred height H is 2.2 mm.

[0041] A groove 4 is provided in the thickness direction thereof, and the temperature sensor 2 is accommodated in the groove 4. After the protective member 3 and the circuit substrate 1 are bonded with pressure-sensitive adhesive, the groove 4 and the circuit substrate 1 form an accommodating space; in the accommodating space, there is a gap between the temperature sensor 2 and the inner wall of the groove 4.

[0042] The third and fourth embodiments above use pressure-sensitive adhesive, so the bonding process of the protective member 3 and the flexible circuit substrate 1 in the third and fourth embodiments above is: the first step is lamination, which is placed by false lamination at room temperature; the second step is pressing, which is done by manual cold pressing at room temperature.

[0043] like Figure 5The fifth embodiment shown is a temperature sampling module, which has a sampling circuit unit, and one side of the sampling circuit unit has a temperature sensing protection structure in embodiment one, embodiment two, embodiment three, or embodiment four. A PI reinforcement plate 5 is provided on the other side of the sampling circuit unit. The sampling circuit unit also has pins for connection. After the above design, the sampling circuit unit becomes a standardized component, so it can be applied to circuit boards of different power batteries. The PI reinforcement plate 5 is in contact with heat-generating components such as battery packs.

[0044] Embodiment 6 is a flexible circuit board of a power battery, on which a temperature sampling module in embodiment 5 is fixed. In this embodiment, the temperature sampling module is welded to the flexible circuit board by laser welding of the pins of the sampling circuit unit.

[0045] The above will clearly and completely describe the concept, specific structure and technical effects of the utility model in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, other embodiments obtained by technicians in this field without creative work are all within the scope of protection of the utility model. In addition, all the connection / connection relationships mentioned in the text do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation.

[0046] The specific description of the present invention in the above embodiments is only used to further illustrate the present invention and cannot be understood as limiting the scope of protection of the present invention. Technical engineers in this field may make some non-essential improvements and adjustments to the present invention based on the contents of the above-mentioned utility model, which fall within the scope of protection of the present invention.

Claims

1. A temperature sensing protection structure, comprising a temperature sensor (2) arranged at a sampling position (11) on a circuit substrate (1), characterized in that: The sampling position (11) is provided with a protective member (3) fixed to the circuit substrate (1) and covering the temperature sensor (2) in all directions.

2. The temperature sensing protection structure according to claim 1, characterized in that: The protective member (3) is in a regular geometric shape, and its projection area on the sampling position (11) is less than or equal to the area of ​​the sampling position (11).

3. The temperature sensing protection structure according to claim 2, characterized in that: The thickness H of the protective member (3) is less than 8 mm, and a groove (4) is provided in the thickness direction thereof, wherein the temperature sensor (2) is accommodated in the groove (4).

4. The temperature sensing protection structure according to claim 3, characterized in that: After the protective component (3) and the circuit substrate (1) are bonded together by thermosetting adhesive or pressure-sensitive adhesive, the groove (4) and the circuit substrate (1) form a receiving space; in the receiving space, there is a gap between the temperature sensor (2) and the inner wall of the groove (4).

5. The temperature sensing protection structure according to claim 1, 2, 3 or 4, characterized in that: The temperature sensor (2) is an NTC thermistor.

6. A temperature sampling module, characterized in that: The invention comprises a sampling circuit unit, wherein one side of the sampling circuit unit comprises a temperature sensing protection structure according to any one of claims 1 to 5.

7. The temperature sampling module according to claim 6, characterized in that: A PI reinforcing plate (5) is arranged on the other side of the sampling circuit unit.

8. A flexible circuit board for a power battery, characterized in that: A temperature sampling module as claimed in any one of claims 6 to 7 is fixed on the flexible circuit board.

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